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BT3L Module Datasheet

Last Updated on : 2020-09-29 02:16:24download

Product Overview

BT3L is an embedded Bluetooth low energy (BLE) module that Tuya has developed. It consists of a highly integrated Bluetooth chip (TLSR8250F512ET32) and several peripheral components, with an embedded Bluetooth network protocol stack and robust library functions. BT3L also contains a low-power 32-bit multipoint control unit (MCU), BLE 5.0 component, 2.4 GHz radio component, 4 Mbits flash memory, 48 KB static random-access memory (SRAM), and nine multiplexing I/O interfaces.

Features

  • Embedded low-power 32-bit MCU, which can also function as an application processor
    • Dominant frequency: 48 MHz
  • Working voltage: 1.8 V to 3.6 V (Under 1.8 V to 2.7 V, the module can start but the RF performance is not guaranteed. Under 2.8 V to 3.6 V, the module performance is normal.)
  • Peripherals: nine pulse width modulation (PWM) interfaces
  • BLE RF features
    • BLE 4.2/5.0
    • Up to 2 Mbit/s RF data rate
    • TX power: +10 dBm
    • RX sensitivity: –94.5 dBm at BLE 1 Mbit/s
    • Embedded advanced encryption standard (AES) hardware encryption
    • Onboard PCB antenna with 2.5 dBi gain
    • Working temperature: –40°C to +85°C

Applications

  • Smart LED lights
  • Smart households
  • Smart low-power sensors

Change History

Date Change Description Version After Change
20190309 This is the first release. V1.0.0
20190723 Optimized the pin definition,Standardized the dimensional tolerances,Updated the temperature range, oven temperature, and working voltage settings, Added packing methods. V2.0.0
20191012 Delete the diagram of architecture V2.0.1

Module Interfaces

Dimensions and Footprint

BT3L has two rows of pins with a 2 mm pin spacing。
The BT3L dimensions (H x W x D) are 3.3±0.15 mm x 16±0.35 mm x 24±0.35 mm. The PCB thickness is 0.8±0.1 mm. The BT3L pins show as below

BT3L Module Datasheet
BT3L Module Datasheet

Interface Pin Definition

Pin No. Symbol I/O Type Function
1 RST I/O Hardware reset pin, which is active at a low level and is connected to pin RESETB on the IC
2 ADC AI 12-bit ADC, which is connected to pin TL_C4 on the IC
3 NC NC NC
4 TL_D7 I/O Common I/O, which is connected to pin TL_D7 on the IC
5 TL_D2 I/O Common I/O, which can be used as a PWM output of the LED drive and is connected to pin TL_D2 on the IC
6 TL_C3 I/O Common I/O, which can be used as a PWM output of the LED drive and is connected to pin TL_C3 on the IC
7 TL_C2 I/O Common I/O, which can be used as a PWM output of the LED drive and is connected to pin TL_C2 on the IC
8 VDD_BAT P Power supply pin (3.3 V)
9 GND P Power supply reference ground pin
10 TL_C0 I/O GPIO, which is connected topin TL_C0 on the IC
11 SWS I Programming pin, which is connected to pin TL_A7 on the IC
12 TL_A0 I/O GPIO, which is connected to pin TL_A0 on the IC
13 TL_B4 I/O Common I/O, which can be used as a PWM output of the LED drive and is connected to pin TL_B4 on the IC
14 TL_B5 I/O Common I/O, which can be used as a PWM output of the LED drive and is connected to pin TL_B5 on the IC
15 TL_B7 I/O Serial interface receiving pin (UART RX), which is connected to pin TL_B7 on the IC
16 TL_B1 I/O Serial interface transmission pin (UART TX), which is connected to pin TL_B1on the IC

Note:

  1. P indicates power supply pins, I/O indicates input/output pins, and AI indicates analog input pins.
  2. If you have special requirements for light colors controlled by PWM outputs, contact Tuya business personnel.

Electrical Parameters

Absolute Electrical Parameters

Parameter Description Minimum Value Maximum Value Unit
Ts Storage temperature -65 150
VCC Power supply voltage -0.3 3.9 V
Static electricity voltage (human body model) TAMB-25℃ - 2 KV
Static electricity voltage (machine model) TAMB-25℃ - 0.5 KV

Electrical Conditions

Parameter Description Minimum Value Typical Value Maximum Value Unit
Ta Working temperature -40 - 85
VCC Working voltage 2.8 3.3 3.6 V
VIL I/O low-level input VSS - VCC*0.3 V
VIH I/O high-level input VCC*0.7 - VCC V
VOL I/O low-level output VSS - VCC*0.1 V
VOH I/O high-level output VCC*0.9 - VCC V

Working Current

Symbol Condition Minimum Value(Typical) Unit
Itx Constant transmission, 10dBm output power 23 mA
Irx Constant receiving 6.3 mA
IDC Connected to a mesh network(Average) 6.6 mA
IDC Connected to a mesh network(Peak) 24.9 mA
Ideepsleep1 Deep sleep mode 1 (16 KB RAM is reserved.) 1.2 μA
Ideepsleep2 Deep sleep mode 2 (No RAM is reserved.) 0.4 μA

RF Features

Basic RF Features

Parameter Description
Frequency band 2.4GHz ISM band
Wireless standard BLE 4.2/5.0
Data transmission rate 1Mbps,2Mbps
Antenna type Onboard PCB antenna

RF Output Power

Parameter Minimum Value Typical Value Maximum Value Unit
Average RF output power -22 10 10.5 dBm
20 dB modulation signal bandwidth (1 Mbit/s) - 2500 - KHz
20 dB modulation signal bandwidth (2 Mbit/s) - 1400 - KHz

RF RX Sensitivity

Parameter Minimum Value Typical Value Maximum Value Unit
RX sensitivity 1Mbps - -94.5 - dBm
RX sensitivity 2Mbps - -91 - dBm
Frequency offset 1Mbps -250 - +300 KHz
Frequency offset 2Mbps -300 - +200 KHz
Co-channel interference suppression - -10 - dB

Antenna Information

Antenna Type

BT3L uses an onboard PCB antenna, antenna gain is 2.5dBi.

Antenna Interference Reduction

To ensure optimal RF performance, it is recommended that the antenna be at least 15 mm away from other metal parts. If metal materials are wrapped around the antenna, the wireless signals will be reduced greatly, deteriorating the RF performance. Because BT3L is inserted to the PCB, sufficient space needs to be reserved for the antenna.
BT3L Module Datasheet

Packaging Information and Production Instructions

Mechanical Dimensions

BT3L Module Datasheet

Note:
The default dimensional tolerance is ±0.35 mm, and the tolerance for some measurements is ±0.1 mm. If a customer has other requirements, clearly specify them in the datasheet after communication.

Production Instructions

  1. Use an SMT placement machine to mount components to the stamp hole module that Tuya produces within 24 hours after the module is unpacked and the firmware is burned. If not, vacuum pack the module again. Bake the module before mounting components to the module.
    A. SMT placement equipment
    a) Reflow soldering machine
    b) Automated optical inspection (AOI) equipment
    c) Nozzle with a 6 mm to 8 mm diameter
    B. Baking equipment
    a) Cabinet oven
    b) Anti-static heat-resistant trays
    c) Anti-static heat-resistant gloves
  2. Storage conditions for a delivered module are as follows:
    A. The moisture-proof bag is placed in an environment where the temperature is below 30°C and the relative humidity is lower than 70%.
    B. The shelf life of a dry-packaged product is six months from the date when the product is packaged and sealed.
    C. The package contains a humidity indicator card (HIC).
    BT3L Module Datasheet
  3. Bake a module based on HIC status as follows when you unpack the module package:
    A. If the 30%, 40%, and 50% circles are blue, bake the module for 2 consecutive hours.
    B. If the 30% circle is pink, bake the module for 4 consecutive hours.
    C. If the 30% and 40% circles are pink, bake the module for 6 consecutive hours.
    D. If the 30%, 40%, and 50% circles are pink, bake the module for 12 consecutive hours.
  4. Baking settings:
    A. Baking temperature: 125±5°C
    B. Alarm temperature: 130°C
    C. SMT placement ready temperature after natural cooling: < 36°C
    D. Number of drying times: 1
    E. Rebaking condition: The module is not soldered within 12 hours after baking.
  5. Do not use SMT to process modules that have unpacked for over three months. Electroless nickel immersion gold (ENIG) is used for the PCBs. If the solder pads are exposed to the air for over three months, they will be oxidized severely and dry joints or solder skips may occur. Tuya is not liable for such problems and consequences.
  6. Before SMT placement, take electrostatic discharge (ESD) protective measures.
  7. To reduce the reflow defect rate, draw 10% of the products for visual inspection and AOI before first SMT placement to determine a proper oven temperature and component placement method. Draw 5 to 10 modules every hour from subsequent batches for visual inspection and AOI.

Recommended Oven Temperature Curve

Perform SMT placement based on the following reflow oven temperature curve. The highest temperature is 245°C.
Refer to IPC/JEDEC standard;Peak Temperature:<245℃;Number of Times:≤2 times
BT3L Module Datasheet

Storage Conditions

BT3L Module Datasheet

MOQ and Packing Information

Product Model MOQ(pcs) Packing Method Number of Modules in Each Reel Pack Number of Reel Packs in Each Box
BT3L 3600 Carrier tape and reel packing 900 4

Appendix: Statement

FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this equipment.
This device complies with Part 15 of the FCC Rules.Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.
Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules.These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

  • Reorient or relocate the receiving antenna.
  • Increase the separation between the equipment and receiver.
  • Connect the equipment into an outlet on a circuit different from that to which
    the receiver is connected.
  • Consult the dealer or an experienced radio/TV technician for help.

Radiation Exposure Statement

This equipment complies with FCC radiation exposure limits set forth for an uncontrolled rolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator and your body.

Important Note

This radio module must not installed to co-locate and operating simultaneously with other radios in host system except in accordance with FCC multi-transmitter product procedures. Additional testing and equipment authorization may be required to operating simultaneously with other radio.
The availability of some specific channels and/or operational frequency bands are country dependent and are firmware programmed at the factory to match the intended destination. The firmware setting is not accessible by the end user.
The host product manufacturer is responsible for compliance to any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.
The end user manual shall include all required regulatory information/warning as shown in this manual, including: This product must be installed and operated with a minimum distance of 20 cm between the radiator and user body.
This device have got a FCC ID:2ANDL-BT3L.The final end product must be labeled in a visible area with the following: “Contains Transmitter Module FCC ID: 2ANDL-BT3L”
This device is intended only for OEM integrators under the following conditions:
1)The antenna must be installed such that 20cm is maintained between the antenna and users, and
2) The transmitter module may not be co-located with any other transmitter or antenna.
As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed.
Declaration of Conformity European notice

BT3L Module Datasheet

Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module product is in compliance with essential requirements and other relevant provisions of Directive 2014/53/EU,2011/65/EU.A copy of the Declaration of conformity can be found at https://www.tuya.com

BT3L Module Datasheet

This product must not be disposed of as normal household waste, in accordance with EU directive for waste electrical and electronic equipment (WEEE- 2012/19/EU). Instead,it should be disposed of by returning it to the point of sale, or to a municipal recycling collection point.

The device could be used with a separation distance of 20cm to the human body.

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