GUC600 Module Datasheet

Last Updated on : 2024-06-14 13:02:53download

GUC600 is a GNSS positioning module that Tuya has developed. It applies to vehicle navigation, outdoor positioning, and survey and mapping products.


GUC600 is a dual-system GNSS series module that is constituted of a highly integrated multi-system, low-power, and high-performance SoC chip UFirebird-UC6226NIS and peripheral circuits. It is built-in with a surface acoustic wave (SAW) filter, an LNA, 26 MHz TCXO, and other components. It supports BDS B1+GPS L1 dual-system positioning or single-system independent positioning to ensure fast and precise positioning, offering users an efficient and convenient positioning experience. GUC600 has a compact size, adopts SMT soldering, and supports suction and placement of components to the mounting position based on standard process requirements and automatic integration of reflow soldering. It applies to fields that require low costs and low power consumption.


  • Features of the positioning engine:
    • 64-channel synchronous track
    • Hot start: < 1.2s
    • Cold start sensitivity: -145 dBm, tracking sensitivity: -158 dBm
    • Data update rate: up to 10 Hz
  • Support GPS and BDS
    • Use the broad frequency band for RF, and the central frequency for input signals is 1575 MHz.
    • Can receive and track 1575.42 MHz GPS L1 signals.
    • Can receive and track 1561.098 MHz BDS B1 signals.
    • By default, GUC600 is configured to receive GPS and BDS signals. It can be configured as GPS+BDS, GPS+GLONASS, or a single system through commands. For other system configurations, please contact Tuya technical support to obtain the GNSS firmware.
  • Working voltage: 2.8 to 3.6V, typical voltage: 3.3V
  • Built-in with a 26 MHz TCXO
  • Protocol and interface: The data protocol of GUC600 complies with the Unicore Protocol Specification. It communicates with the host device based on the UART.
  • Working temperature: -40°C to +85°C

Change history

Update date Updated content Version after update
February 14, 2022 The first release. V1.0.0
June 15, 2022 Optimized data. V1.0.1

Module interfaces

Pin distribution

GUC600 has two rows of pins with a 1.10 mm pin spacing. Each row has nine pins.

  • The dimensions of GUC600:

    • 9.70±0.35 mm (W)
    • 10.10±0.35 mm (L)
    • 2.20±0.15 mm (H)
  • The thickness of PCB: 0.8±0.1 mm

    GUC600 Module Datasheet

Pin definition

Pin No. Symbol Signal type Description
1 GND Ground
2 TX O Serial interface for data transmission, which is used to output NMEA sentences
3 RX I Serial interface for data reception, which is used to input PMTK/PQ commands and upgrade the firmware
4 1PPS O PPS stands for Pulse Per Second
5 NC Pulled up and not connected
6 VB PI Input of standby electric source
7 NC Pulled up and not connected
8 VCC PI Main power input
9 RST I Reset pin, active low
10 GND Ground
11 RF I GNSS signal input pin (BDS B1+GPS L1)
12 GND Ground
13 NC Pulled up and not connected
14 VRF PO Active antenna feed output
15 NC Pulled up and not connected
16 NC Pulled up and not connected
17 NC Pulled up and not connected
18 NC Pulled up and not connected

P indicates power-supply pins, and I/O indicates input/output pins.

Electrical parameters

Absolute electrical parameters

Parameter Description Minimum value Maximum value Unit
Ts Storage temperature -40 90 °C
VCC Power supply voltage -0.2 3.6 V
Electrostatic discharge voltage (human body model) TAMB-25℃ TBD kV
Electrostatic discharge voltage (machine model) TAMB-25℃ TBD kV

Normal working conditions

Parameter Description Minimum value Typical value Maximum value Unit
Ta Working temperature -40 25 85 °C
VCC Power supply voltage 2.8 3.3 3.6 V
V_BCKP Standby voltage 1.4 3.3 3.6 V

Power consumption in working mode

Working mode Project type Average value Peak value (typical value) Unit
Capture VDCDC_IN current 26.5 28.3 mA
Track VDCDC_IN current 26.5 31.5 mA

When a power consumption test is conducted, the test voltage VDCDC_IN is 3.3V, and the firmware version is R3.2.10.0 Build 8016. The evaluation kit (EVK) of GUC600 is used as a test board. A passive ceramic antenna is used.

Main performance parameters

Parameter Project conditions Indicator Unit
CN0 test value The signal strength of the stimulator: -130 dBm (AVG) 40±2 dBc
TTFF (the module is static in the open environment) Cold start/hot start/recapture 30/1.2/2 second
Sensitivity test Capture sensitivity/tracking sensitivity -145/-158 dBm
Positioning precision Remain static in the open environment CEP 50 2.5 meter
Antenna performance Antenna provided by the third party with the characteristic impedance of 50 Ω

Antenna information

GUC600 receives signals at the GPS L1 frequency band (1575.42 MHz) and BDS B1 frequency band (1561 MHz) by default. Its RF signals are input through the RF pin, and the characteristic impedance of the RF pin must be within 50 ohms. The cable needs to be as short as possible.

Antenna parameters

GUC600 receives satellite signals through a dedicated active or passive antenna. The antenna performance affects the receiving sensitivity of the entire GNSS system. The following table describes the recommended antenna specifications.

Passive antenna parameter Specification Remarks
Dimensions 25 mm × 25 mm × 4 mm
Receiving frequency range 1561–1575 MHz Central frequency: 1561±3 MHz; 1575±3 MHz
Characteristic impedance 50 Ω
Bandwidth 15 MHz (minimum value) Return loss ≤ -10 dB
Temperature coefficient of frequency (TCF) 0 ± 10 ppm/°C -40°C to +85°C
Polarization mode RHCP RHCP stands for right-hand circular polarization
Gain 1.5 dBi (typical value)
Axial ratio 5 dB (maximum value)
VSWR 1.5 (maximum value)
Active antenna parameter Specification Remarks
Receiving frequency range L1: 1575.42±1.023 MHz; B1: 1561±2.046 MHz
Bandwidth 20 MHz (minimum value) Return loss ≤ -10 dB
VSWR 2.0 (maximum value)
Polarization mode RHCP
Characteristic impedance 50 Ω
Noise figure 1.5 (maximum value)
Gain (ceramic antenna) 5 dBiC On a 70 mm × 70 mm test board
Gain (built-in LNA) 28±3 dB
Consumed current 9±3 mA 3.3V power supply

Passive antenna reference design

GUC600 Module Datasheet

The preceding figure shows the circuit for connecting a standard passive antenna to the module. R1, C1, and C2 are reserved pins of the antenna for impedance matching. By default, C1 and C2 are in the NC state, and the default resistance value of R1 is 0R. The impedance of the RF signal cable must be within 50 ohms, and the cable needs to be as short as possible.

Active antenna reference design

The following figure shows the circuit for connecting a standard active antenna to the module. C1 is a DC blocking capacitor. R1, C1, and C2 are reserved pins of the antenna for impedance matching. By default, C1 and C2 are in the NC state, and the default resistance value of R1 is 0R. During PCB layout, L1 and C4 must near the antenna interface, and the near end of the L1 solder pad is connected to the RF cable.

GUC600 Module Datasheet

Packaging information and production instructions

Mechanical dimensions

Top and side views of GUC600 (unit: mm)

GUC600 Module Datasheet

The default outline dimension tolerance is ±0.35 mm, and the critical dimension tolerance is ±0.1 mm. If you have specific requirements on dimensions, make them clear in the module datasheet after communication.

Bottom view and recommended package

Bottom view of GUC600 (unit: mm) GUC600 Module Datasheet

Recommended package (unit: mm)

GUC600 Module Datasheet

Production instructions

  1. The Tuya SMT module should be mounted by the SMT device. After being unpacked, it should be soldered within 24 hours. Otherwise, it should be put into the drying cupboard where the RH is not greater than 10%; or it needs to be packaged under vacuum again and the exposure time needs to be recorded (the total exposure time cannot exceed 168 hours).
    • SMT devices:
      • Mounter
      • Serial peripheral interface (SPI)
      • Reflow soldering machine
      • Thermal profiler
      • Automated optical inspection (AOI) equipment
    • Baking devices:
      • Cabinet oven
      • Anti-electrostatic and heat-resistant trays
      • Anti-electrostatic and heat-resistant gloves
  2. Storage conditions for a delivered module:
    • The moisture-proof bag must be placed in an environment where the temperature is below 40°C and the relative humidity is lower than 90%.

    • The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed.

    • There is a humidity indicator card (HIC) in the packaging bag.

      GUC600 Module Datasheet

  3. The module needs to be baked in the following cases:
    • The packaging bag is damaged before unpacking.
    • There is no HIC in the packaging bag.
    • After unpacking, circles of 10% and above on the HIC become pink.
    • The total exposure time has lasted for over 168 hours since unpacking.
    • More than 12 months have passed since the sealing of the bag.
  4. Baking settings:
    • Temperature: 40°C and ≤ 5% RH for reel package and 125°C and ≤5% RH for tray package (please use the heat-resistant tray rather than plastic container)
    • Time: 168 hours for reel package and 12 hours for tray package
    • Alarm temperature: 50°C for reel package and 135°C for tray package
    • Production-ready temperature after natural cooling: < 36°C
    • Re-baking situation: If a module remains unused for over 168 hours after being baked, it needs to be baked again.
    • If a batch of modules is not baked within 168 hours, do not use the wave soldering to solder them. Because these modules are Level-3 moisture-sensitive devices, they are very likely to get damp when exposed beyond the allowable time. In this case, if they are soldered at high temperatures, it may result in device failure or poor soldering.
  5. In the whole production process, take electrostatic discharge (ESD) protective measures.
  6. To guarantee the passing rate, it is recommended that you use the SPI and AOI to monitor the quality of solder paste printing and mounting.

Recommended oven temperature curve

Set oven temperatures according to the following temperature curve of reflow soldering. The peak temperature is 245°C.

GUC600 Module Datasheet

  • A: Temperature axis

  • B: Time axis

  • C: Liquidus temperature: 217°C to 220°C

  • D: Ramp-up slope: 1°C/s to 3°C/s

  • E: Duration of constant temperature: 60s to 120s; the range of constant temperature: 150°C to 200°C

  • F: Duration above the liquidus: 50s to 70s

  • G: Peak temperature: 235°C to 245°C

  • H: Ramp-down slope: 1°C/s to 4°C/s

The above curve is just an example of the solder paste SAC305. For more details about other solder pastes, please refer to Recommended oven temperature curve in the solder paste specifications.

Storage conditions

GUC600 Module Datasheet

MOQ and packaging information

Product model MOQ (pcs) Shipping packaging method The number of modules per reel The number of reels per carton
GUC600 4800 Tape reel 1200 4