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T33 Module Datasheet

Last Updated on : 2021-07-03 03:45:47download

T33 is a fully integrated single chip that integrates all peripheral devices. The chip integrates complete hardware and software resources required by Wi-Fi and Bluetooth applications, can support AP and STA dual-role connections, and support Bluetooth connections at the same time.

Overview

A 32-bit MCU with a running speed of up to 120 MHz and a built-in 256 KB RAM can enable the chip to support multi-cloud connections, and the MCU’s special instructions for signal processing can effectively implement audio encoding and decoding.

T33 integrates crystals, RF matching circuits and all peripheral devices, and has rich peripherals, such as PWM, I2C, UART, SPI, SDIO, USB and IrDA Up to six 32-bit PWM outputs, making the chip very suitable for high-quality LED control.

Features

  • Embedded low-power 32-bit CPU, which can also function as an application processor
  • The maximum clock rate: 120 MHz
  • Working voltage: 3.3 ± 0.3V
  • Peripherals: 6 PWMs, 2 I2Cs, 2 UARTs, 1 SPI, and 1 USB
  • Wi-Fi connectivity
    • 802.11 b/g/n
    • Channels 1 to 14 at 2.4 Ghz
    • Support WEP,WPA/WPA2,WPA/WPA2 PSK (AES) security modes
    • Up to +17 dBm output power in 802.11b mode
    • Support STA/AP/STA+AP working mode
    • Support SmartConfig and AP network configuration manners for Android and iOS devices
    • Working temperature: -40 to 105℃
  • Bluetooth connectivity
    • Up to 20 dBm transmit power in bluetooth mode
    • Bluetooth coexistence interface

Applications

  • Intelligent building
  • Smart household and home appliances
  • Smart socket and light
  • Industrial wireless control
  • Baby monitor
  • Network camera
  • Intelligent bus

Module interfaces

Dimensions and footprint

T33 is packaged in the form of LGA 6.5x6.5 48-pin.
The T33 dimensions are 6.5±0.1 mm (W)×6.5±0.1 mm (L) ×0.98±0.1 mm (H).
The dimensions of T33 are as follows:

T33 Module Datasheet

Pin definition

Pin number Symbol I/O type Function
1, 3, 5, 43, 44, 45, 46, 47 and 48 GND P ground
2 ANT I/O External antenna with 2.4 GHz RF output/input
4 NC / No connection
6 VCCPA P RF PA power input, voltage is 3.0 to 3.6V, 3.3 V recommended
7 VCCPA P RF PA power input, voltage is 3.0 to 3.6V, 3.3 V recommended
8 VSYS O System power output, voltage is about 2.7 to 3.0 V, not connected by default
9 VDDDIG O Digital power output, voltage is around 1.2 V
10 VBAT P Chip main power input, voltage is 3.0 to 3.6V, 3.3 V recommended
11 CEN I Enable a chip, high effective
12 P28/RXEN/USBDN I/O Set high or USBDN during receiving of a universal IO interface or RF
13 P25/TXEN/USBDP I/O Set high or USBDN during transmission of a universal IO interface or RF
14 P13/RTS/ADC7/MICN I/O A universal IO interface, RTS of UART1, ADC or the input negative end of a microphone
15 P12/CTS/ADC6/MICP I/O A universal IO interface, CTS of UART1, ADC or the input positive end of a microphone
16 P33/MISO1 I/O A universal IO interface or MISO of SPI1
17 P32/MOSI1 I/O A universal IO interface or MOSI of SPI1
18 P30/SCK1 I/O A universal IO interface or SCK of SPI1
19 P31/CSN1 I/O A universal IO interface or MISO of SPI1
20 P14/SD_CLK/SCK0 I/O A universal IO interface, CLK of SD, or SCK of SPI0
21 P16/SD_CMD/MOSI0 I/O A universal IO interface, CMD of SD, or MOSI of SPI0
22 P15/CSN0 I/O A universal IO interface or CSN of SPI0
23 P17/SD_D0/MISO0 I/O A universal IO interface, D0 of SD, MISO of SPI0
24 P18 I/O A universal IO interface
25 P24/LPO_CLK/PWM4/RAM_CLK I/O A universal IO interface or low-power clock 32.768-K output or PWM 4 or CLK of an external RAM
26 P26/IRDA/PWM5/RAM_CSN I/O A universal IO interface, infrared, PWM5, CSN of an external RAM
27 P23/ADC3/TDO/IO0/F_SO I/O A universal IO interface, ADC, TDO of JTAG, IO0 of QSPI, data output during flash download
28 P22/XHOUT/TDI/IO1/F_SI I/O A universal IO interface, crystal frequency output, TDO of JTAG, IO1 of QSPI, or data input during flash download
29 P21/I2C1_SDA/TMS/IO2/F_CSN I/O A universal IO interface, SDA of I2C1, TMS of JTAG, IO2 of QSPI, or chip selection during flash download
30 P20/I2C1_SCL/TCK/IO3/F_SCK I/O A universal IO interface, SCL of I2C1, TCK of JTAG, IO3 of QSPI, or clock during flash download
31 VRAM O Supply power to external RAM 1.8 V, 2.5 V, or 3.3 V
32 P6/XHDIV/PWM0 I/O A universal IO interface, 1, 2, 4, and 8 frequency division output of crystal clock or PWM0
33 P7/WIFI_ACT/PWM1 I/O A universal IO interface or WIFI_ACTIVE or PWM1 with WIFI coexistence
34 P8/BT_ACT/PWM2 I/O A universal IO interface, BT_ACTIVE coexisting with Wi-Fi or PWM 2
35 P9/BT_PRIO/PWM3 I/O A universal IO interface, BT_PRIORITY coexisting with Wi-Fi or PWM 3
36 P10/UART1_RXD I/O A universal IO interface or RXD of a serial interface UART 1
37 P11/UART1_TXD I/O A universal IO interface or TXD of a serial interface UART 1
38 P1/UART2_RXD/I2C2_SDA I/O A universal IO interface, RXD of a serial interface UART 2 or I2C2_SDA
39 P0/UART2_TXD/I2C2_SCL I/O A universal IO interface, TXD of a serial interface UART 2 or I2C2_SCL
40 XO O 26 MHz crystal output terminal, not connected by default
41 XI I 26 MHz crystal input terminal, not connected by default
42 VSYS I System power output voltage is about 2.7 to 3.0 V

Note: P indicates power supply pins and I/O indicates input/output pins.

Electrical parameters

Absolute electrical parameters

Parameter Description Minimum value Maximum value Unit
Ts Storage temperature -55 125
VBAT Power supply voltage -0.3 3.9 V
ESD voltage (human body model) TAMB-25℃ -2 2 KV
ESD voltage (machine model) TAMB-25℃ -200 200 V

Normal working conditions

Parameter Description Minimum value Typical value Maximum value Unit
Ta Working temperature -40 - 105
VBAT Power supply voltage 3.0 3.3 3.6 V
VIL IO low-level input -0.3 - VCC*0.25 V
VIH IO high-level input VCC*0.75 - VCC V
VOL IO low-level output VSS - VSS+0.3 V
VOH IO high-level output VCC-0.3 - VCC V
Imax IO drive current - 6 20 mA

RF power consumption

Working status Mode Rate Transmit power/Receive Average value Peak value (Typical value)) Unit
Transmit 11 b 11 Mbps +17 dBm 295 304 mA
Transmit 11 g 54 Mbps +13.5 dBm 257 306 mA
Transmit 11 n MCS 7 +13 dBm 260 251 mA
Receive 11b 11 Mbps Constantly receive 98 150 mA
Receive 11g 54 Mbps Constantly receive 98 147 mA
Receive 11n MCS 7 Constantly receive 98 147 mA

Working current

Working mode Working status, Ta = 25°C Average value Maximum value (Typical value) Unit
Quick connection state (Bluetooth) The module is in the fast network connection state and the Wi-Fi indicator always flashes 88 196 mA
Quick connection state (AP ) The module is in the hotspot network configuration state and the Wi-Fi indicator flashes slowly 95 240 mA
Quick connection state (EZ) The module is in the fast network connection state and the Wi-Fi indicator always flashes 105 232 mA
Connected The module is connected to the network and the Wi-Fi indicator is always on 55 192 mA
Disconnected The module is disconnected and the Wi-Fi indicator is dark 41 200 mA

RF parameters

Basic RF features

Parameter Description
Working frequency 2.412 to 2.484GHz
Wi-Fi standard IEEE 802.11 b/g/n (channels 1 to 14)
Data transmission rate 11b: 1, 2, 5.5, 11 (Mbps); 11g: 6, 9, 12, 18, 24, 36, 48, 54 (Mbps); 11n: HT20 MCS 0 to 7
Antenna type PCB antenna, FPC antenna or ceramic antenna

Wi-Fi transmission performance

Parameter Minimum value Typical value Maximum value Unit
Average RF output power, 802.11b CCK Mode 11M - 16 - dBm
Average RF output power, 802.11g OFDM Mode 54M - 14 - dBm
Average RF output power, 802.11n OFDM Mode MCS7 - 12 - dBm
Frequency error -10 - 10 ppm

Wi-Fi reception performance

Parameter Minimum value Typical value Maximum value Unit
PER<8%, RX sensitivity, 802.11b DSSS Mode 11M - -85 - dBm
PER<10%, RX sensitivity, 802.11g OFDM Mode 54M - -72 - dBm
PER<10%, RX sensitivity, 802.11n OFDM Mode MCS7 - -68 - dBm
PER<10%, RX sensitivity, Bluetooth 1M - -94 - dBm

Bluetooth transmission performance

Parameter Minimum value Typical value Maximum value Unit
Working frequency 2402 - 2480 MHz
Air rate - 1 - Mbps
TX power -20 6 20 dBm
Frequency error -150 - 150 KHz

Bluetooth reception performance

Parameter Minimum value Typical value Maximum value Unit
RX sensitivity - -93 - dBm
Maximum RF signal input -10 - - dBm
Intermodulation - - -23 dBm
Co-channel suppression ratio - 10 - dB

Antenna

Antenna type

T33 can choose an antenna according to the actual space and environment.

Antenna interference reduction

To ensure optimal Wi-Fi performance when the Wi-Fi module uses an onboard PCB antenna, it is recommended that the antenna be at least 15 mm away from other metal parts.

To ensure antenna performance, the PCB should not be routed or clad with copper in the antenna area.

Packaging information and production instructions

Mechanical dimensions

T33 Module Datasheet

Schematic diagram

T33 Module Datasheet

Production instructions

  1. The Tuya SMT module should be mounted by the SMT device. After being unpacked, it should be soldered within 24 hours. Otherwise, it should be put into the drying cupboard where the RH is not greater than 10%; or it needs to be packaged under vacuum again and the exposure time needs to be recorded (the total exposure time cannot exceed 168 hours).
    • SMT devices:
      • Mounter
      • SPI
      • Reflow soldering machine
      • Thermal profiler
      • Automated optical inspection (AOI) equipment
    • Baking devices:
      • Cabinet oven
      • Anti-electrostatic and heat-resistant trays
      • Anti-electrostatic and heat-resistant gloves
  2. Storage conditions for a delivered module:
    • The moisture-proof bag must be placed in an environment where the temperature is below 40°C and the relative humidity is lower than 90%.

    • The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed.

    • There is a humidity indicator card (HIC) in the packaging bag.

      T33 Module Datasheet

  3. The module needs to be baked in the following cases:
    • The packaging bag is damaged before unpacking.
    • There is no HIC in the packaging bag.
    • After unpacking, circles of 10% and above on the HIC become pink.
    • The total exposure time has lasted for over 168 hours since unpacking.
    • More than 12 months have passed since the sealing of the bag.
  4. Baking settings:
    • Temperature: 60°C and ≤ 5% RH for reel package and 125°C and ≤5% RH for tray package (please use the heat-resistant tray rather than plastic container)
    • Time: 48 hours for reel package and 12 hours for tray package
    • Alarm temperature: 65°C for reel package and 135°C for tray package
    • Production-ready temperature after natural cooling: < 36°C
    • Re-baking situation: If a module remains unused for over 168 hours after being baked, it needs to be baked again.
    • If a batch of modules is not baked within 168 hours, do not use the reflow soldering to solder them. Because these modules are Level-3 moisture-sensitive devices, they are very likely to get damp when exposed beyond the allowable time. In this case, if they are soldered at high temperatures, it may result in device failure or poor soldering.
  5. In the whole production process, take electrostatic discharge (ESD) protective measures.
  6. To guarantee the passing rate, it is recommended that you use the SPI and AOI to monitor the quality of solder paste printing and mounting.

Recommended oven temperature curve

Set oven temperatures according to the following temperature curve of reflow soldering. The peak temperature is 245°C.

T33 Module Datasheet

  • A: Temperature axis

  • B: Time axis

  • C: Liquidus temperature: 217 to 220°C

  • D: Ramp-up slope: 1 to 3°C/s

  • E: Duration of constant temperature: 60 to 120s; the range of constant temperature: 150 to 200°C

  • F: Duration above the liquidus: 50 to 70s

  • G: Peak temperature: 235 to 245°C

  • H: Ramp-down slope: 1 to 4°C/s

    Note: The above curve is just an example of the solder paste SAC305. For more details about other solder pastes, please refer to Recommended oven temperature curve in the solder paste specifications.

Storage conditions

T33 Module Datasheet

Storage conditions

T33 Module Datasheet

MOQ and packing method

Product number Package Packing method MOQ
T33 LGA48_6.5X6.5 Tape reel 3000

Appendix: Statement

FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this device.

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

Note: This device has been tested and found to comply with the limits for a Class B digital device, according to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This device generates, uses, and can radiate radio frequency energy and, if not installed and used following the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation.

If this device does cause harmful interference to radio or television reception, which can be determined by turning the device off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

  • Reorient or relocate the receiving antenna.
  • Increase the separation between the device and receiver.
  • Connect the device into an outlet on a circuit different from that to which the receiver is connected.
  • Consult the dealer or an experienced radio/TV technician for help.

Radiation Exposure Statement

This device complies with FCC radiation exposure limits set forth for an uncontrolled rolled environment. This device should be installed and operated with a minimum distance of 20cm between the radiator and your body.

Important Note

This radio module must not be installed to co-locate and operating simultaneously with other radios in the host system except following FCC multi-transmitter product procedures. Additional testing and device authorization may be required to operate simultaneously with other radios.

The availability of some specific channels and/or operational frequency bands are country dependent and are firmware programmed at the factory to match the intended destination. The firmware setting is not accessible by the end-user.

The host product manufacturer is responsible for compliance with any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.

The end-user manual shall include all required regulatory information/warnings as shown in this manual, including “This product must be installed and operated with a minimum distance of 20 cm between the radiator and user body”.

This device has got an FCC ID: 2ANDL-T33. The end product must be labeled in a visible area with the following: “Contains Transmitter Module FCC ID: 2ANDL-T33”.

This device is intended only for OEM integrators under the following conditions:

The antenna must be installed such that 20cm is maintained between the antenna and users, and the transmitter module may not be co-located with any other transmitter or antenna.

As long as the 2 conditions above are met, further transmitter tests will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed.

Declaration of Conformity European Notice

T33 Module Datasheet

Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module product is in compliance with essential requirements and other relevant provisions of Directive 2014/53/EU,2011/65/EU. A copy of the Declaration of conformity can be found at https://www.tuya.com.

T33 Module Datasheet

This product must not be disposed of as normal household waste, in accordance with the EU directive for waste electrical and electronic equipment (WEEE-2012/19/EU). Instead, it should be disposed of by returning it to the point of sale, or to a municipal recycling collection point.

The device could be used with a separation distance of 20cm to the human body.