TYZS13 Module

Scope of application

This topic describes relevant information about the TYZS13 module during MCU connection development.

TYZS13 is a low power embedded Zigbee module developed by Tuya Smart. The module consists of a highly integrated radio-frequency identification (RFID) chip EFR32MG13P732F512GM48 and a few peripheral components, with a built-in 802.15.4 PHY/MAC Zigbee network protocol stack and various library functions. TYZS13 also has a low power 32-bit ARM Cortex-M4 processor, 512 KB flash, 64 KB RAM, and rich peripheral resources.

As a FreeRTOS platform, TYZS13 integrates all function libraries of Zigbee MAC. You can develop your own embedded Zigbee products.

For more information, see TYZS13 Module Datasheet.

Typical application diagram

• Reference diagram of coordinated processing mode of the module and 3.3 V MCU

  

• Reference diagram of coordinated processing mode of the module and 5 V MCU

  

Design specification

• Module power supply:

  • When the module is in the continuous transmitting (TX) status, the maximum current reaches 120 mA. It is recommended that the supply current of the module should exceed 200 mA, and the total capacity of the external filter capacitor should exceed 10 uF.
  • In the PCB layout, the filter capacitor at the power input pin shall be arranged near the power supply pin.

• Module pin:

  • The nRST pin only resets the module hardware, but cannot clear Zigbee pairing information.
  • The ADC port cannot be used as an ordinary I/O port. When not in use, the pin can float. As the ADC input port, the input voltage ranges from 0 V to AVDD, which is configured in the software.

• Radio frequency (RF) of the module:

  • It can be connected with a copper rod antenna through through-hole welding. An external antenna can be connected through the IPEX connector for extended coverage in complex installation.
  • When a copper rod antenna is used in the Zigbee module, it is recommended that the distance between the module antenna and other metal parts should be at least 15 mm, in order to optimize the wireless performance. The antenna area corresponding to the adapter board should be hollowed out, while wiring and copper pour are not allowed in the antenna area of the PCB, in order not to affect the antenna performance.