TYZS6 Module Datasheet

TYZS6 is a low-power, embedded Zigbee module developed by Tuya. It consists of one EFR32MG1B132 highly integrated wireless RF processor chip and a small number of peripheral devices. It has a built-in 802.15.4 PHY/MAC Zigbee network protocol and a large number of library functions.

Overview

The TYZS6 embeds a low-power 32-bit ARM Cortex-M4 core, 256-KB flash memory, 32-KB RAM, and rich peripheral resources.

Features

A built-in low-power 32-bit ARM Cortex-M4 processor with a DSP instruction set and floating point unit that doubles as an application processor

• Supports main frequency of 40MHz
  • Wide operating voltage: 2.0V-3.8V
  • Peripherals: 5xGPIOs, 1xURT, 1xADC
• Zigbee operating characteristics
  • Supports 802.15.4 MAC/PHY
  • Operating channels 11 to 26 @2.400-2.483GHz and an air-interface rate of 250Kbps
  • A built-in DC-DC circuit for maximum power efficiency and +10dBm maximum output.
  • 63μA/MHz operating power consumption; 3μA sleep current
  • Built-in PCB onboard antenna
  • Operating temperature: -40℃ to 85℃
  • Supports hardware encryption, supports AES 128/256

Applications

• Smart buildings
• Smart homes/appliances
• Smart plugs, smart lighting
• Industrial wireless control
• Health and measurements
• Asset tracking

Change history

Update date	Updated content	Version after the change
2018.7.3	First release	V1.0.0
2019.4.16	Updated the working temperature and serial number of the primary chip	V1.0.1
2021.7.1	Updated the production instructions	V2.1
2022.7.29	Updated baking parameters	V2.2

Module interfaces

Package dimensions

The TYZS6 has 2 lines of pins, 11 pins in total on the front and rear with a 2-mm gap.

TYZS6 dimensions: 17.95±0.35mm (L) x 15.00±0.35mm (W) x 2.0±0.15mm (H). The TYZS6 dimensions are as shown in the following figure:

The following figure shows pins of the module:

Pin definition

TYZS6 interface pins and TP arrangement:

Pin	Symbol	I/O type	Function
1	3.3V	P	Module power supply pin (common supply voltage: 3.3V)
2	PWM1	I/O	Light driver port/ GPIO pin usage.
3	GND	P	The reference ground of the module.
4	PWM3	I/O	Light driver port/ GPIO pin usage.
5	RXD	I/O	UART_RXD
6	GPIO3	I/O	GPIO port.
7	TXD	O	UART0_TXD
8	ADC	I/O	ADC analog input.
9	GPIO0	I/O	GPIO port.
10	nRST	I	Hardware reset pin, the chip is reset when the pin is LOW. The module comes with a power-on reset, and the user can use this pin as needed
11	GPIO2	I/O	GPIO port.
TP1	Test point	SWCLK	JLINK SWCLK programming pin. It can be used as a GPIO pin in normal applications.
TP2	Test point	SWDIO	JLINK SWCLK programming pin. It can be used as a GPIO pin in normal applications.
TP3	Test point	SWO	JLINK SWO output pin. It can be used as GPIO port in normal applications.

Note:

• P indicates the power pin, I/O indicates the input/output pin, and AI indicates the analog input pin.
• RST is only the module hardware reset pin; it cannot clear Zigbee net-pairing information.
• The second pin can only be used as an ADC port. It cannot be used as a normal IO port. If it is not used, it needs to be left floating. As an ADC input, the input voltage range is limited to 0-AVDD and can be configured by software.

Test point definition

Pin	Symbol	I/O type	Function
-	TEST	I	For module production testing

Note: This test pin is not recommended for use.

Electrical parameters

Absolute electrical parameters

Absolute parameters:

Parameters	Description	Minimum value	Maximum value	Unit
Ts	Storage temperature	-50	150	℃
VCC	Input voltage	-0.3	3.8	V
ESD voltage (human-body model)	TAMB-25℃	-	2.5	KV
ESD voltage (machine model)	TAMB-25℃	-	0.5	KV

Operating conditions

Normal operating conditions:

Parameters	Description	Min	Type	Max	Unit
Ta	Operating temperature	-40	-	85	℃
VCC	Operating voltage	1.8	3.3	3.8	V
VIL	I/O low input	-0.3	-	VCC*0.25	V
VIH	I/O high input	VDD*0.75	-	VCC	V
VOL	I/O low output	-	-	VCC*0.1	V
VOH	I/O high output	VDD*0.8	-	VCC	V
Imax	I/O drive current	-	-	12	mA

Zigbee TX power consumption

Power consumption during continuous TX:

Symbol	Rate	power	Type	Unit
IRF	250Kbps	+10dBm	32	mA
IRF	250Kbps	+4dBm	17	mA
IRF	250Kbps	+1dBm	11.8	mA

Note: When testing the above data, continuous transmission duty cycle=100%.

Zigbee RX power consumption

RX continuous power:

Symbol	Rate	Type	Unit
IRF	250Kbps	8	mA

Note: When UART is active, the RX mode current is 8mA.

Power consumption in operating

TYZS6 operating current:

Operation Mode	Operating condition, TA=25℃	Ave	Max	Unit
Quick configuration	Module in quick configuration state	10	40	mA
Network connection idle	Connected to a network	3	5	mA
Deep sleep mode	Deep-sleep mode and retains 64KB RAM	2.7	4	μA

RF characteristics

Basic RF characteristics

Basic RF characteristics:

Parameter	Description
Operating frequency	2.400-2.484GHz
Physical layer standard	IEEE 802.15.4
Data transfer rate	250Kbps
Antenna type	PCB antenna
Line of sight	>100m

Zigbee output performance

Continuous TX performance:

Parameter	Min	Type	Max	Unit
Maximum output	-	+10	-	dBm
Minimum output	-	-30	-	dBm
Output power adjustment step	-	0.5	1	dB
Frequency error	-15	-	+15	ppm
Output adjacent channel suppression		-31		dBc

Note: The maximum output power of a typical module is limited to +10dBm by software.

Zigbee RX sensitivity

RX sensitivity:

Parameter	Min	TypMin	MaxTyp	Unit
PER<10%, RX sensitivity, 250Kbps@OQPSK	-	-101	-	dBm

Antenna

Antenna type

Default PCB onboard antenna connection.

Antenna interference reduction

To optimize the Zigbee performance of the wireless module in combination with the PCB onboard antenna, it is recommended to keep the antenna at least 15mm from other metal parts.

The user PCB board should not be routed around the antenna area and should not be covered with copper to avoid affecting the antenna radiation performance. It is recommended that

Packaging information and production guidance

Mechanical dimensions

Recommended PCB footprint

Note: Pin 2/4/6/8/10 pair. The row of pins on the front of the module; pins 1/3/5/7/9/11 correspond to the row of pins on the back of the module.

Production instructions

1. For the Tuya in-line module, wave soldering is most preferred and manual soldering is less preferred. After being unpacked, the module must be soldered within 24 hours. Otherwise, it must be put into the drying cupboard where the RH is not greater than 10%; or it needs to be packaged under vacuum again and record the exposure time (the total exposure time cannot exceed 168 hours).
2. Wave soldering devices and materials:
   • Wave soldering equipment
   • Wave soldering fixture
   • Constant-temperature soldering iron
   • Tin bar, tin wire, and flux
   • Thermal profiler
3. Baking devices:
   • Cabinet oven
   • Anti-electrostatic and heat-resistant trays
   • Anti-electrostatic and heat-resistant gloves
4. The module needs to be baked in the following cases:
   • The packaging bag is damaged before unpacking.
   • There is no humidity indicator card (HIC) in the packaging bag.
   • After unpacking, circles of 10% and above on the HIC become pink.
   • The total exposure time has lasted for over 168 hours since unpacking.
   • More than 12 months have passed since the sealing of the bag.
5. Baking settings:
   • Temperature: 40°C and ≤ 5% RH for reel package and 125°C and ≤5% RH for tray package (please use the heat-resistant tray rather than plastic container).
   • Time: 168 hours for reel package and 12 hours for tray package.
   • Alarm temperature: 50°C for reel package and 135°C for tray package.
   • Production-ready temperature after natural cooling: < 36°C.
   • Re-baking situation: If a module remains unused for over 168 hours after being baked, it needs to be baked again.
   • If a batch of modules is not baked within 168 hours, do not use the wave soldering to solder them. Because these modules are Level-3 moisture-sensitive devices, they are very likely to get damp when exposed beyond the allowable time. In this case, if they are soldered at high temperatures, it may result in device failure or poor soldering.
6. In the whole production process, take electrostatic discharge (ESD) protective measures.
7. To guarantee the quality of products, you must pay attention to the following items: The amount of soldering flux, the height of the wave peak, whether the tin slag and copper content in the wave soldering tank exceed standards, whether the window and thickness of the wave soldering fixture are appropriate, and whether the wave soldering oven temperature curve is appropriate.

Recommended oven temperature curve and temperature

Set oven temperatures according to the following temperature curve of wave soldering. The peak temperature is 260°C±5°C.

Recommended soldering temperature:

Suggestions on oven temperature curve of wave soldering		Suggestions on manual soldering temperature
Preheat temperature	80 to 130 °C	Soldering temperature	360±20°C
Preheat time	75 to 100s	Soldering time	＜3s/point
Peak contact time	3 to 5s	NA	NA
Temperature of tin cylinder	260±5°C	NA	NA
Ramp-up slope	≤2°C/s	NA	NA
Ramp-down slope	≤6°C/s	NA	NA

MOQ and packaging information

Product model	MOQ (pcs)	Packing method	Number of modules per reel	Number of reels per carton
TYZS6	4800	Tape reel	1200	4

Appendix: Statement

FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this equipment.

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and receiver.
• Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help.

Radiation Exposure Statement

This equipment complies with FCC radiation exposure limits set forth for an uncontrolled rolled environment. This equipment should be installed and operated with a minimum distance of 20cm between the radiator and your body.

Important Note

This radio module must not be installed to co-locate and operating simultaneously with other radios in the host system except in accordance with FCC multi-transmitter product procedures. Additional testing and equipment authorization may be required to operate simultaneously with other radios.

The availability of some specific channels and/or operational frequency bands are country dependent and are firmware programmed at the factory to match the intended destination. The firmware setting is not accessible by the end-user.

The host product manufacturer is responsible for compliance to any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.

The end-user manual shall include all required regulatory information/warning as shown in this manual, including: This product must be installed and operated with a minimum distance of 20 cm between the radiator and user body.

The RF module is considered as a limited modular transmitter according to FCC rules. Even though the RF module gets an FCC ID, the host product manufacturer can not use the FCC ID on the final product directly. In these circumstances, the host product manufacturer integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining the FCC authorization by a Class II permissive change application or a new application.

Declaration of Conformity European notice

Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module product is in compliance with essential requirements and other relevant provisions of Directive 2014/53/EU,2011/65/EU. A copy of the Declaration of conformity can be found at https://www.tuya.com

This product must not be disposed of as normal household waste, in accordance with the EU directive for waste electrical and electronic equipment (WEEE-2012/19/EU). Instead, it should be disposed of by returning it to the point of sale, or to a municipal recycling collection point.

The device could be used with a separation distance of 20cm to the human body.