WRG1 Module Datasheet

Last Updated on : 2024-06-14 03:14:31download

WRG1 is a low power-consuming built-in Wi-Fi module developed by Hangzhou Tuya Inc. It consists of a highly integrated RF microchip RTL8711AM and an external flash chip, with a built-in Wi-Fi network protocol stack and robust library functions.

Overview

WRG1 also contains a low power-consuming ARM-Cortex M3 MCU, WLAN MAC, 1T1R WLAN, and the maximum basic frequency of 166 MHz, and is embedded with a 2MB SDRAM, a 4 MB flash, and rich peripheral resources.

WRG1 is an RTOS platform that integrates all the function libraries of the Wi-Fi MAC and TCP/IP protocols. You can develop built-in Wi-Fi products as required.

Features

  • Built-in low power-consuming 32-bit CPU functioning as an application processor
  • Basic frequency: 166 MHz
  • Operating voltage: 3.0 V to 3.6 V
  • Peripherals: ten GPIOs, two UART, one ADC
  • Wi-Fi connectivity
    • 802.11b/g/n20/n40
    • Channels 1 to 14 at 2.4 GHz
    • Support WEP/WPA/WPA2/WPA2 PSK (AES) security mode
    • +20 dBm output power in 802.11b mode
    • Smart network configuration function (for Android and iOS devices)
    • Onboard PCB antenna or the external IPEX connector
    • Operating temperature: -20°C to +85°C

Applications

  • Intelligent building
  • Smart home and household appliances
  • Healthcare
  • Industrial wireless control
  • Baby monitor
  • Network camera
  • Intelligent bus

Module interfaces

Dimensions and footprint

WRG1 has three rows of pins with a 1.5 mm pin pitch.

Dimensions (H x W x D) of WRG1 are as follows: 19±0.35 mm (W)×25.7±0.35 mm (L) ×3.6±0.1 mm (H) PCB thickness is 0.8mm±0.1 mm.

WRG1 Module Datasheet

WRG1 Module Datasheet

Interface pin definition

Pin No. Symbol I/O type Function
1 GND P Power supply reference ground pin.
2 SWD_TMS AI GPIOE_3, JTAG_TMS, used as JLink download pin.
3 E_2 I GPIOE_2, If E3/E4 is configured as JTAG. This pin can’t be configured as GPIO.
4 SWD_CLK I/O GPIOE_4, JTAG_CLK, used as JLink download pin.
5 I2C2_SDA I/O GPIOE_1. If E3/E4 is configured as JTAG, this pin can’t be configured as GPIO.
6 I2C2_SCL I/O GPIOE_0. If E3/E4 is configured as JTAG, this pin can’t be configured as GPIO.
7 ADC AI ADC pin (1), 16-bit precision ADC.
8 EN P Enable pin, which needs to be connected to 3.3V. The module has been pulled up internally.
9 GND P Power supply reference ground pin.
10 RTS I/O GPIOA_3, the request pin of data streaming. It can’t be configured as GPIO if A6/A7 is configured as UART0.
11 RX I/O GPIOA_6, UART0_Rx. Connect to the MCU TX.
12 CTS I/O GPIOA_5, the permission pin of data streaming. It can’t be configured as GPIO if A6/A7 is configured as UART0.
13 TX I/O GPIOA_7, UART0_Tx. Connect to the MCU RX.
14 C_3 I/O GPIOC_3, hardware PWM3.
15 C_2 I/O GPIOC_2, hardware PWM2.
16 GND P Power supply reference ground pin.
17 3.3V P Module power supply pin (3.3V).
18 C_1 I/O GPIOC_1, hardware PWM1.
19 C_0 I/O GPIOC_0, hardware PWM0.
20 I2C1_SDA I/O GPIO_4, which can be configured as I2C or GPIO pin.
21 I2C1_SCL I/O GPIO_5, which can be configured as I2C or GPIO pin.
22 Log_Tx I/O GPIOB_0, Log Tx. Print the module log, which can’t be pulled up.
23 Log_Rx I/O GPIOB_1, Log Rx. Print the module log, which can’t be pulled up.
24 I2C3_SCL I/O GPIOB_2, which can be configured as I2C or GPIO pin.
25 I2C3_SDA I/O GPIOB_3, which can be configured as I2C or GPIO pin.
1 GPIOA_22 I/O GPIOA_22, hardware PWM (IC Pin31).
2 GND P Power supply reference ground pin.
3 VIN P Module power supply pin.
4 3.3V P Module power output is 3.3V.
5 GPIOA_12 I/O GPIOA_12, hardware PWM (IC Pin17).
6 GPIOA_5 I/O GPIOA_5, hardware PWM (IC Pin28).
7 GPIOA_14 I/O GPIOA_14, hardware PWM (IC Pin13).
8 GPIOA_15 I/O GPIOA_15, hardware PWM (IC Pin14).

Note: P indicates power-supply pins, I/O indicates input and output pins, and AI indicates analog input pins.

  • This pin can only be used as an ADC interface and cannot be used as a common I/O pin. If this pin is not used, it must be disconnected. When this pin is used as the ADC input interface, the input voltage range is 0 V to 2.0 V.
  • The UART pins are user-side serial interfaces, When the module is powered on and started, the serial port has information output, which can be ignored

Electrical parameters

Absolute electrical parameters

Parameter Description Minimum Value Maximum Value Unit
Ts Storage temperature -40 125 °C
VCC Power supply voltage -0.3 40 V
ESD voltage (human body model) Tamb = 25°C N/A 2 kV
ESD voltage (machine model) Tamb = 25°C N/A 0.5 kV

Electrical conditions

Parameter Description Minimum value Typical value Maximum value Unit
Ta Operating temperature -20 N/A 105 °C
VCC Power supply voltage 3.0 3.3 3.6 V
VIL I/O low-level input -0.3 N/A 0.8 V
VIH I/O high-level input 2.47 N/A 3.6 V
VOL I/O low-level output N/A N/A 0.34 V
VoH I/O high-level output 2.64 N/A 3.4 V
Imax I/O drive current N/A - 16 mA
Cpad Input pin capacitance - 2 - pF

Continuous TX power dissipation

|Working status| Mode| Rate | TX power| Typical value| Peak value (Typical)| Unit|
|—|—|—|—|—|—|—|------- |—|
|TX |11b| 11Mbps| +18dBm |343| - |mA
|TX |11g| 6Mbps| +18dBm |331| - |mA
|TX |11g| 54Mbps| +15dBm |282| - |mA
|TX |11n BW20 |MCS0 |+18dBm |337| - |mA
|TX |11n BW20 |MCS7 |+13dBm |267| - |mA
|TX |11n BW40 |MCS0 |+18dBm |337| - |mA
|TX |11n BW40 |MCS7 |+13dBm |267| - |mA

Continuous RX power dissipation

Working status Mode Rate Receiving Typical salue Unit
RX CPU Sleep 11Mbps Continuous RX 90 mA
RX CPU Active MCS7 BW20 Continuous RX 120 mA

Operating current

Working mode Working status (Ta = 25°C) Average Value Peak value*(Typical value) Unit
Quick configuration Module in the quick net-pairing state, Wi-Fi indicator blinking 135 170 mA
Network connection idle Module connected to the network, Wi-Fi indicator constantly on 70 140 mA
Network connection active Module connected to the network, Wi-Fi indicator constantly on 143 295 mA
Disconnected Module not connected to the network, Wi-Fi indicator always off 52 115 mA

Note: The preceding parameter values vary depending on the firmware functions.

RF features

Basic RF features

Parameter Description
Frequency band 2.412 GHz to 2.484 GHz
Wi-Fi standard IEEE 802.11b/g/n (channels 1 to 14)
Data transmission rate 11b: 1,2,5.5, 11 (Mbps)
11g: 6,9,12,18,24,36,48,54(Mbps)
11n: HT20 MCS0~7
11n: HT40 MCS0~7
Antenna type PCB On Board antenna (default)

TX performance

Parameter Minimum Value Typical Value Maximum Value Unit
Average RF output power, 802.11b CCK mode 11 Mbit/s N/A 17.5 N/A dBm
Average RF output power, 802.11g OFDM mode 54 Mbit/s N/A 14.5 N/A dBm
Average RF output power, 802.11n OFDM mode MCS7 N/A 13.5 N/A dBm
Frequency error -20 N/A +20 ppm

RX performance

Parameter Minimum Value Typical Value Maximum Value Unit
PER < 8%, 802.11b CCK mode 1 Mbit/s N/A -91 N/A dBm
PER < 10%, 802.11g OFDM mode 54 Mbit/s N/A -76 N/A dBm
PER < 10%, 802.11n OFDM mode MCS7 N/A -73 N/A dBm

Antenna

Antenna type

By default, the module uses an onboard PCB antenna.

The resistance position of the onboard antenna is shown in the figure below:

WRG1 Module Datasheet

Antenna interference reduction

To ensure optimal Wi-Fi performance when the Wi-Fi module uses an onboard PCB antenna, it is recommended that the antenna be at least 15 mm away from other metal parts. To prevent an adverse impact on the antenna radiation performance, avoid copper or traces along the antenna area on the PCB.

WRG1 Module Datasheet

WRG1 Module Datasheet

U.FL RF connector

U.FL RF connector parameter as below:

WRG1 Module Datasheet

Packaging information and production instructions

Mechanical dimensions

PCB Size: 19±0.35mm (W)×25.7±0.35mm (L) ×0.8±0.15mm (H).
WRG1 Module Datasheet

Note: PCB outer frame tolerance ±0.35mm, PCB thickness tolerance ±0.1mm.

PCB dimensions

WRG1 Module Datasheet

Production instructions

  1. Use an SMT placement machine to mount the stamp hole module that Tuya produces onto the PCB within 24 hours after the module is unpacked and the firmware is burned. If not, vacuum pack the module again. Bake the module before mounting it onto the PCB.

    • SMT placement equipment
      • Reflow soldering machine
      • Automated optical inspection (AOI) equipment
      • Nozzle with a 6 mm to 8 mm diameter
    • Baking equipment
      • Cabinet oven
      • Anti-static heat-resistant trays
      • Anti-static heat-resistant gloves
  2. Storage conditions for a delivered module are as follows:

    • The moisture-proof bag is placed in an environment where the temperature is below 30°C and the relative humidity is lower than 85%.
    • The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed.
    • The package contains a humidity indicator card (HIC).
      WRG1 Module Datasheet
  3. Bake a module based on HIC status as follows when you unpack the module package:

    • If the 30%, 40%, and 50% circles are blue, bake the module for 2 consecutive hours.
    • If the 30% circle is pink, bake the module for 4 consecutive hours.
    • If the 30% and 40% circles are pink, bake the module for 6 consecutive hours.
    • If the 30%, 40%, and 50% circles are pink, bake the module for 12 consecutive hours.
  4. Baking settings:

    • Temperature: 40°C and ≤ 5% RH for reel package and 125°C and ≤5% RH for tray package (please use the heat-resistant tray rather than a plastic container)
    • Time: 168 hours for reel package and 12 hours for tray package
    • Alarm temperature: 50°C for reel package and 135°C for tray package
    • Production-ready temperature after natural cooling: < 36°C
    • Re-baking situation: If a module remains unused for over 168 hours after being baked, it needs to be baked again.
    • If a batch of modules is not baked within 168 hours, do not use the wave soldering to solder them. Because these modules are Level-3 moisture-sensitive devices, they are very likely to get damp when exposed beyond the allowable time. In this case, if they are soldered at high temperatures, it may result in device failure or poor soldering.
  5. Do not use SMT to process modules that have been unpacked for over three months. Electroless nickel immersion gold (ENIG) is used for the PCBs. If the solder pads are exposed to the air for over three months, they will be oxidized severely and dry joints or solder skips may occur. Tuya is not liable for such problems and consequences.

  6. Before SMT placement, take electrostatic discharge (ESD) protective measures.

  7. To reduce the reflow defect rate, draw 10% of the products for visual inspection and AOI before the first SMT placement to determine a proper oven temperature and component placement method. Draw 5 to 10 modules every hour from subsequent batches for visual inspection and AOI.

Recommended oven temperature curve

Perform SMT placement based on the following reflow oven temperature curve. The highest temperature is 245°C.

WRG1 Module Datasheet

Storage conditions

WRG1 Module Datasheet

MOQ and packaging information

Product model MOQ (pcs) Shipping packaging method Modules per reel Packaging reels per box
WRG1 3600 Tape reel 900 4

Appendix: Statement

FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this device.

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

Note: This device has been tested and found to comply with the limits for a Class B digital device, according to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This device generates, uses, and can radiate radio frequency energy and, if not installed and used following the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation.

If this device does cause harmful interference to radio or television reception, which can be determined by turning the device off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

  • Reorient or relocate the receiving antenna.
  • Increase the separation between the device and receiver.
  • Connect the device into an outlet on a circuit different from that to which the receiver is connected.
  • Consult the dealer or an experienced radio/TV technician for help.

Radiation Exposure Statement

This device complies with FCC radiation exposure limits set forth for an uncontrolled rolled environment. This device should be installed and operated with a minimum distance of 20cm between the radiator and your body.

Important Note

This radio module must not be installed to co-locate and operating simultaneously with other radios in the host system except following FCC multi-transmitter product procedures. Additional testing and device authorization may be required to operate simultaneously with other radios.

The availability of some specific channels and/or operational frequency bands are country dependent and are firmware programmed at the factory to match the intended destination. The firmware setting is not accessible by the end-user.

The host product manufacturer is responsible for compliance with any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.

The end-user manual shall include all required regulatory information/warnings as shown in this manual, including “This product must be installed and operated with a minimum distance of 20 cm between the radiator and user body”.

This device has got an FCC ID: 2ANDL-WRG1. The end product must be labelled in a visible area with the following: “Contains Transmitter Module FCC ID: 2ANDL-WRG1”.

This device is intended only for OEM integrators under the following conditions:

The antenna must be installed such that 20cm is maintained between the antenna and users, and the transmitter module may not be co-located with any other transmitter or antenna.

As long as the 2 conditions above are met, further transmitter tests will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed.

Declaration of Conformity European Notice

WRG1 Module Datasheet

Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module product is in compliance with essential requirements and other relevant provisions of Directive 2014/53/EU,2011/65/EU. A copy of the Declaration of conformity can be found at https://www.tuya.com.

WRG1 Module Datasheet

This product must not be disposed of as normal household waste, in accordance with the EU directive for waste electrical and electronic equipment (WEEE-2012/19/EU). Instead, it should be disposed of by returning it to the point of sale, or to a municipal recycling collection point.

The device could be used with a separation distance of 20cm to the human body.