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Tuya IoT Development Platform

TYZS1L Module Datasheet

Last Updated on : 2021-09-28 06:36:40download

TYZS1L is a low power-consumption embedded Zigbee module developed by Tuya. It consists of a highly integrated wireless RF processor chip (EFR32MG13P732IM48-C) and several peripherals. TYZS1L is embedded with a low power-consumption 32-bit ARM Cortex-M4 core, 512-KB flash memory, 64-KB RAM, and rich peripheral resources.

Overview

TYZS1L is a silicon module for developing Zigbee applications. Its hardware is built-in with the PA and DC-DC, and its software provides basic Zigbee APIs. Based on these, users can develop embedded Zigbee products as needed.

Schematic diagram of TYZS1L
TYZS1L Module Datasheet

Features

  • Built-in low power-consumption 32-bit ARM Cortex-M4 core with DSP instructions and floating-point unit functioning as an application processor
    Clock rate: 40 MHz
  • Wide operating voltage: 1.8 V to 3.8 V
  • Peripherals: 9 GPIOs, 1 UART, and 1 ADC
  • White ink, black silkscreen, patch or plug-in
  • Zigbee operating feature
    • 802.15.4 MAC/PHY supported
    • Working channel: 11 to 26 @2.400 GHz to 2.483 GHz, with an air interface rate of 250 kbit/s
    • Built-in DC-DC circuit, maximizing the power supply efficiency
    • Maximum output power: +19 dBm
    • Power consumption when TYZS1L is working: 63 μA/MHz; current when TYZS1L is in sleep mode: 1.4 μA
    • Proactive network configuration for terminals
    • Built-in onboard PCB antenna/External high-gain antenna used with the I-PEX connector
    • Operating temperature: -40°C to +125°C
    • AES 128/256-based hardware encryption

Scenario

  • Intelligent building

  • Intelligent home and household applications

  • Intelligent socket and smart lighting

  • Industrial wireless control

  • Healthcare and measurement

  • Asset tracing

Module interfaces

Dimensions and pin layout

TYZS1L provides two lines of pins with a distance of 2 mm between every two pins.
TYZS1L dimension:16±0.35mm (W)×24±0.35mm (L) ×1.8±0.15mm (H).
Dimensions of TYZS1L:
TYZS1L Module Datasheet
TYZS1L Module Datasheet

Pin definition

The following table shows pins of the module:

Pin number Symbol Type Function
1 nRST I Hardware reset pin. The chip is reset when the level is low. TYZS1L has a power-on reset function, and this pin is not necessary in the actual situation.
2 ADC AI Interface 1 of the ADC (a 12-bit precision SAR analog-to-digital converter), corresponding to the PB11 pin of the IC.
3 NC - NC pin. External processing is not required.
4 GPIO0 I/O Functions as a GPIO, corresponding to the PA3 pin of the IC.
5 SWO I/O Functions as a GPIO or an output pin in the JLINK communication state, corresponding to the PF2 pin of the IC.
6 PWM3 I/O Functions as a GPIO, corresponding to the PF4 pin of the internal IC.
7 PWM1 I/O Functions as a GPIO, corresponding to the PF5 pin of the internal IC.
8 VCC P Power-supply pin of TYZS1L (typical power-supply voltage: 3.3 V).
9 GND P Module reference ground pin.
10 GPIO2 I/O Functions as a GPIO, corresponding to the PA5 pin of the IC.
11 SWDI I/O JLINK SWDIO programming pin. It can also be used as a GPIO in common programs, corresponding to the PF1 pin of the IC.
12 SWCL K I/O JLINK SWCLK programming pin. It can also be used as a GPIO in common programs, corresponding to the PF0 pin of the IC.
13 PWM2 I/O Functions as a GPIO, corresponding to the PA2 pin of the IC.
14 GPIO3 I/O Functions as a GPIO, corresponding to the PD15 pin of the IC.
15 RXD I/O UART0_RXD pin, corresponding to the PA1 pin of the IC.
16 TXD O UART0_TXD pin, corresponding to the PA0 pin of the IC.

Note:

  • P indicates power-supply pins, I/O indicates input/output pins, and AI indicates analog input pins.
  • nRST is only a module hardware reset pin, which cannot clear the Zigbee network configuration.
  • The No.2 pin can only be used as an ADC interface and cannot be used as a common I/O pin. If this pin is not used, it must be disconnected. When this pin is used as the ADC input interface, the input voltage range must be 0-AVDD, which can be configured using the software.

Test pin definition

The following table shows test pins:

Symbol Type Functions
- I Used for the module production test.

Note: The test pins are prohibited from being used.

Electrical parameters

Absolute electrical parameters

Parameter Description Minimum value Maximum value Unit
Ts Storage temperature -50 150 °C
VCC Supply voltage -0.3 3.8 V
ESD voltage (human body model) TAMB -25°C - 2.5 kV
ESD voltage (machine model) TAMB -25°C - 0.5 kV

Electrical conditions

Parameter Description Minimum value Typical value Maximum value Unit
Ta Operating temperature -40 - 125 °C
VCC Operating voltage 1.8 3.3 3.8 V
VIL I/O low-level input -0.3 - VCC x 0.25 V
VIH I/O high-level input VCC x 0.75 - VCC V
VOL I/O low-level output - - VCC x 0.1 V
VOH I/O high-level output VCC x 0.8 - VCC V
Imax I/O drive current - - 12 mA

Zigbee TX power consumption

Symbol Rate Transmit power Typical value Unit
IRF 250Kbps +19dBm 120 mA
IRF 250Kbps +13dBm 50 mA
IRF 250Kbps +10dBm 32 mA
IRF 250Kbps +4dBm 17 mA
IRF 250Kbps +1dBm 11.8 mA

Note: When the preceding data is being tested, the duty cycle is set to 100%.

Zigbee RX power consumption

Symbol Rate Typical value Unit
IRF 250Kbps 8 mA

Note: When the UART is in active state, the received current is 14 mA.

Power consumption in working mode

Working mode Working status (Ta = 25°C) Average value Maximum value Unit
EZ mode The module is in the EZ state. 10 40 mA
Operation mode The module is in the connected state. 3 5 mA
Deep sleep mode The module is in the deep sleep mode, with the 64 KB flash. 3.5 6 μA

RF features

Basic RF features

Parameter Description
Frequency band 2.400 GHz to 2.483 GHz
Physical layer standard IEEE 802.15.4
Data transmission rate 250 kbit/s
Antenna type PCB antenna/External antenna used with the I-PEX connector
Line-of-sight transmission distance > 150 m

Zigbee output performance

Parameter Minimum value Typical value Maximum value Unit
Maximum output power - +19 - dBm
Minimum output power - -30 - dBm
Output power adjustment step - 0.5 1 dB
Frequency error -15 - +15 ppm
Output spectrum adjacent-channel rejection ratio -31 dBc

Note: The maximum output power can reach +19 dBm. The power output can be adjusted under normal use. The high-power output can be used for overlay transmission in extremely complex conditions, such as modules embedded in a wall.

Zigbee RX sensitivity

Parameter Minimum value Typical value Maximum value Unit
PER < 10%, RX sensitivity, 250 kbit/s@OQPSK - -101 - dBm

Antenna

Antenna types

By default, the onboard PCB antenna is used. In addition, external antennas can be connected through I-PEX connectors, which are applied to extend the coverage in complex installation environments.

Antenna interference reduction

When you use an onboard PCB antenna on a Zigbee module, make sure that the antenna on the module is at least 15 mm away from other metal parts to ensure optimal wireless performance. It is recommended that the antenna location on the PCB be hollowed out.
To prevent a negative effect on antenna radiation performance, do not route copper or cable wires along the antenna area of the user PCB board.
For details about the area of the onboard PCB antenna on a module, see Figure 3.

Packaging information and production instructions

Mechanical dimensions

TYZS1L Module Datasheet

Recommended PCB footprint

The diagram of pins of TYZS1L:

TYZS1L Module Datasheet

TYZS1L PCB footprint:

TYZS1L Module Datasheet

Production instructions

  • The stamp-hole module must be mounted by the SMT machine. After being unpacked, it must be soldered within 24 hours. Otherwise, it must be put into the drying cupboard where the RH is not greater than 10%, or it needs to be packaged under vacuum again and the exposure time needs to be recorded (the total exposure time cannot exceed 168 hours).

    • SMT equipment:
      • Mounter
      • SPI
      • Reflow soldering machine
      • Oven temperature tester
      • Automated optical inspection (AOI) equipment
    • Baking equipment:
      • Cabinet oven
      • Anti-static heat-resistant pallets
      • Anti-static heat-resistant gloves
  • Storage conditions for a delivered module are as follows:

    • The moisture-proof bag must be placed in an environment where the temperature is below 40°C and the relative humidity is lower than 90%.
    • The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed.
    • The package contains a humidity indicator card (HIC).
      TYZS1L Module Datasheet
  • The module needs to be baked in the following cases:

    • Vacuum packing bag was found to be damaged before being unpacked.
    • There is no humidity indicator card (HIC) in the vacuum packing bag.
    • After being unpacked, 10% and above circles on the HIC become pink.
    • The total exposure time has been more than 168 hours since unpacking.
    • More than 12 months have passed since the sealing date of the bag.
  • Baking settings:

    • Temperature: 60°C and ≤ 5%RH for reelizing and 125°C and ≤5%RH for palletizing (please use heat-resistant pallet rather than plastic pallet)
    • Time: 48 hours for reelizing and 12 hours for palletizing
    • Alarm temperature: 65°C for reelizing and 135°C for palletizing
    • Production ready temperature after natural cooling: < 36°C
    • The number of drying times: 1
    • Re-baking condition: If a module remains unused for 168 hours after being unpacked, it must be baked again.

      Important: If this batch of modules is not baked within 168 hours, do not use the wave soldering to solder them. Because these modules are 3-level moisture-sensitive components, they are very likely to get damp when exposed outside. In this case, if they are soldered at high temperatures, it may result in component failure or poor soldering.

  • In the whole production process, take electrostatic discharge (ESD) protective measures.

  • To guarantee the passing rate, it is recommended that you use the SPI and AOI to monitor the quality of solder paste printing and mounting.

Recommended oven temperature curve

Perform mounting with the SMT based on the following reflow oven temperature curve. The highest temperature is 245°C. The reflow temperature curve is as below:

TYZS1L Module Datasheet

  • A: Temperature axis

  • B: Time axis

  • C: Liquidus temperature: 217 to 220°C

  • D: Ramp-up slope: 1 to 3°C/s

  • E: Duration of constant temperature: 60 to 120s; the range of constant temperature: 150 to 200°C

  • F: Duration above the liquidus: 50 to 70s

  • G: Peak temperature: 235 to 245°C

  • H: Ramp-down slope: 1 to 4°C/s

    Note: The above curve is just an example of the solder paste SAC305. For more details about other solder pastes, please refer to Recommended oven temperature curve in the solder paste specifications.

Storage conditions

TYZS1L Module Datasheet

Appendix: Statement

FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this device.

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

Note: This device has been tested and found to comply with the limits for a Class B digital device, according to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This device generates, uses, and can radiate radio frequency energy and, if not installed and used following the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation.

If this device does cause harmful interference to radio or television reception, which can be determined by turning the device off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

  • Reorient or relocate the receiving antenna.
  • Increase the separation between the device and receiver.
  • Connect the device into an outlet on a circuit different from that to which the receiver is connected.
  • Consult the dealer or an experienced radio/TV technician for help.

Radiation Exposure Statement

This device complies with FCC radiation exposure limits set forth for an uncontrolled rolled environment. This device should be installed and operated with a minimum distance of 20cm between the radiator and your body.

Important Note

This radio module must not be installed to co-locate and operating simultaneously with other radios in the host system except following FCC multi-transmitter product procedures. Additional testing and device authorization may be required to operate simultaneously with other radios.

The availability of some specific channels and/or operational frequency bands are country dependent and are firmware programmed at the factory to match the intended destination. The firmware setting is not accessible by the end-user.

The host product manufacturer is responsible for compliance with any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.

The end-user manual shall include all required regulatory information/warnings as shown in this manual, including “This product must be installed and operated with a minimum distance of 20 cm between the radiator and user body”.

This device has got an FCC ID: 2ANDL-TYZS1L. The end product must be labeled in a visible area with the following: “Contains Transmitter Module FCC ID: 2ANDL-TYZS1L”.

This device is intended only for OEM integrators under the following conditions:

The antenna must be installed such that 20cm is maintained between the antenna and users, and the transmitter module may not be co-located with any other transmitter or antenna.

As long as the 2 conditions above are met, further transmitter tests will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed.

Declaration of Conformity European Notice

TYZS1L Module Datasheet

Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module product is in compliance with essential requirements and other relevant provisions of Directive 2014/53/EU,2011/65/EU. A copy of the Declaration of conformity can be found at https://www.tuya.com.

TYZS1L Module Datasheet

This product must not be disposed of as normal household waste, in accordance with the EU directive for waste electrical and electronic equipment (WEEE-2012/19/EU). Instead, it should be disposed of by returning it to the point of sale, or to a municipal recycling collection point.

The device could be used with a separation distance of 20cm to the human body.