Last Updated on : 2021-09-28 06:36:40download
TYZS1L is a low power-consumption embedded Zigbee module developed by Tuya. It consists of a highly integrated wireless RF processor chip (EFR32MG13P732IM48-C) and several peripherals. TYZS1L is embedded with a low power-consumption 32-bit ARM Cortex-M4 core, 512-KB flash memory, 64-KB RAM, and rich peripheral resources.
TYZS1L is a silicon module for developing Zigbee applications. Its hardware is built-in with the PA and DC-DC, and its software provides basic Zigbee APIs. Based on these, users can develop embedded Zigbee products as needed.
Schematic diagram of TYZS1L
Intelligent home and household applications
Intelligent socket and smart lighting
Industrial wireless control
Healthcare and measurement
TYZS1L provides two lines of pins with a distance of 2 mm between every two pins.
TYZS1L dimension:16±0.35mm (W)×24±0.35mm (L) ×1.8±0.15mm (H).
Dimensions of TYZS1L:
The following table shows pins of the module:
|1||nRST||I||Hardware reset pin. The chip is reset when the level is low. TYZS1L has a power-on reset function, and this pin is not necessary in the actual situation.|
|2||ADC||AI||Interface 1 of the ADC (a 12-bit precision SAR analog-to-digital converter), corresponding to the PB11 pin of the IC.|
|3||NC||-||NC pin. External processing is not required.|
|4||GPIO0||I/O||Functions as a GPIO, corresponding to the PA3 pin of the IC.|
|5||SWO||I/O||Functions as a GPIO or an output pin in the JLINK communication state, corresponding to the PF2 pin of the IC.|
|6||PWM3||I/O||Functions as a GPIO, corresponding to the PF4 pin of the internal IC.|
|7||PWM1||I/O||Functions as a GPIO, corresponding to the PF5 pin of the internal IC.|
|8||VCC||P||Power-supply pin of TYZS1L (typical power-supply voltage: 3.3 V).|
|9||GND||P||Module reference ground pin.|
|10||GPIO2||I/O||Functions as a GPIO, corresponding to the PA5 pin of the IC.|
|11||SWDI||I/O||JLINK SWDIO programming pin. It can also be used as a GPIO in common programs, corresponding to the PF1 pin of the IC.|
|12||SWCL K||I/O||JLINK SWCLK programming pin. It can also be used as a GPIO in common programs, corresponding to the PF0 pin of the IC.|
|13||PWM2||I/O||Functions as a GPIO, corresponding to the PA2 pin of the IC.|
|14||GPIO3||I/O||Functions as a GPIO, corresponding to the PD15 pin of the IC.|
|15||RXD||I/O||UART0_RXD pin, corresponding to the PA1 pin of the IC.|
|16||TXD||O||UART0_TXD pin, corresponding to the PA0 pin of the IC.|
- P indicates power-supply pins, I/O indicates input/output pins, and AI indicates analog input pins.
- nRST is only a module hardware reset pin, which cannot clear the Zigbee network configuration.
- The No.2 pin can only be used as an ADC interface and cannot be used as a common I/O pin. If this pin is not used, it must be disconnected. When this pin is used as the ADC input interface, the input voltage range must be 0-AVDD, which can be configured using the software.
The following table shows test pins:
|-||I||Used for the module production test.|
Note: The test pins are prohibited from being used.
|Parameter||Description||Minimum value||Maximum value||Unit|
|ESD voltage (human body model)||TAMB -25°C||-||2.5||kV|
|ESD voltage (machine model)||TAMB -25°C||-||0.5||kV|
|Parameter||Description||Minimum value||Typical value||Maximum value||Unit|
|VIL||I/O low-level input||-0.3||-||VCC x 0.25||V|
|VIH||I/O high-level input||VCC x 0.75||-||VCC||V|
|VOL||I/O low-level output||-||-||VCC x 0.1||V|
|VOH||I/O high-level output||VCC x 0.8||-||VCC||V|
|Imax||I/O drive current||-||-||12||mA|
|Symbol||Rate||Transmit power||Typical value||Unit|
Note: When the preceding data is being tested, the duty cycle is set to 100%.
Note: When the UART is in active state, the received current is 14 mA.
|Working mode||Working status (Ta = 25°C)||Average value||Maximum value||Unit|
|EZ mode||The module is in the EZ state.||10||40||mA|
|Operation mode||The module is in the connected state.||3||5||mA|
|Deep sleep mode||The module is in the deep sleep mode, with the 64 KB flash.||3.5||6||μA|
|Frequency band||2.400 GHz to 2.483 GHz|
|Physical layer standard||IEEE 802.15.4|
|Data transmission rate||250 kbit/s|
|Antenna type||PCB antenna/External antenna used with the I-PEX connector|
|Line-of-sight transmission distance||> 150 m|
|Parameter||Minimum value||Typical value||Maximum value||Unit|
|Maximum output power||-||+19||-||dBm|
|Minimum output power||-||-30||-||dBm|
|Output power adjustment step||-||0.5||1||dB|
|Output spectrum adjacent-channel rejection ratio||-31||dBc|
Note: The maximum output power can reach +19 dBm. The power output can be adjusted under normal use. The high-power output can be used for overlay transmission in extremely complex conditions, such as modules embedded in a wall.
|Parameter||Minimum value||Typical value||Maximum value||Unit|
|PER < 10%, RX sensitivity, 250 kbit/s@OQPSK||-||-101||-||dBm|
By default, the onboard PCB antenna is used. In addition, external antennas can be connected through I-PEX connectors, which are applied to extend the coverage in complex installation environments.
When you use an onboard PCB antenna on a Zigbee module, make sure that the antenna on the module is at least 15 mm away from other metal parts to ensure optimal wireless performance. It is recommended that the antenna location on the PCB be hollowed out.
To prevent a negative effect on antenna radiation performance, do not route copper or cable wires along the antenna area of the user PCB board.
For details about the area of the onboard PCB antenna on a module, see Figure 3.
The diagram of pins of TYZS1L:
TYZS1L PCB footprint:
The stamp-hole module must be mounted by the SMT machine. After being unpacked, it must be soldered within 24 hours. Otherwise, it must be put into the drying cupboard where the RH is not greater than 10%, or it needs to be packaged under vacuum again and the exposure time needs to be recorded (the total exposure time cannot exceed 168 hours).
Storage conditions for a delivered module are as follows:
The module needs to be baked in the following cases:
Important: If this batch of modules is not baked within 168 hours, do not use the wave soldering to solder them. Because these modules are 3-level moisture-sensitive components, they are very likely to get damp when exposed outside. In this case, if they are soldered at high temperatures, it may result in component failure or poor soldering.
In the whole production process, take electrostatic discharge (ESD) protective measures.
To guarantee the passing rate, it is recommended that you use the SPI and AOI to monitor the quality of solder paste printing and mounting.
Perform mounting with the SMT based on the following reﬂow oven temperature curve. The highest temperature is 245°C. The reflow temperature curve is as below:
A: Temperature axis
B: Time axis
C: Liquidus temperature: 217 to 220°C
D: Ramp-up slope: 1 to 3°C/s
E: Duration of constant temperature: 60 to 120s; the range of constant temperature: 150 to 200°C
F: Duration above the liquidus: 50 to 70s
G: Peak temperature: 235 to 245°C
H: Ramp-down slope: 1 to 4°C/s
Note: The above curve is just an example of the solder paste SAC305. For more details about other solder pastes, please refer to Recommended oven temperature curve in the solder paste specifications.
FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this device.
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.
Note: This device has been tested and found to comply with the limits for a Class B digital device, according to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This device generates, uses, and can radiate radio frequency energy and, if not installed and used following the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation.
If this device does cause harmful interference to radio or television reception, which can be determined by turning the device off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
Radiation Exposure Statement
This device complies with FCC radiation exposure limits set forth for an uncontrolled rolled environment. This device should be installed and operated with a minimum distance of 20cm between the radiator and your body.
This radio module must not be installed to co-locate and operating simultaneously with other radios in the host system except following FCC multi-transmitter product procedures. Additional testing and device authorization may be required to operate simultaneously with other radios.
The availability of some specific channels and/or operational frequency bands are country dependent and are firmware programmed at the factory to match the intended destination. The firmware setting is not accessible by the end-user.
The host product manufacturer is responsible for compliance with any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.
The end-user manual shall include all required regulatory information/warnings as shown in this manual, including “This product must be installed and operated with a minimum distance of 20 cm between the radiator and user body”.
This device has got an FCC ID: 2ANDL-TYZS1L. The end product must be labeled in a visible area with the following: “Contains Transmitter Module FCC ID: 2ANDL-TYZS1L”.
This device is intended only for OEM integrators under the following conditions:
The antenna must be installed such that 20cm is maintained between the antenna and users, and the transmitter module may not be co-located with any other transmitter or antenna.
As long as the 2 conditions above are met, further transmitter tests will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed.
Declaration of Conformity European Notice
Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module product is in compliance with essential requirements and other relevant provisions of Directive 2014/53/EU,2011/65/EU. A copy of the Declaration of conformity can be found at https://www.tuya.com.
This product must not be disposed of as normal household waste, in accordance with the EU directive for waste electrical and electronic equipment (WEEE-2012/19/EU). Instead, it should be disposed of by returning it to the point of sale, or to a municipal recycling collection point.
The device could be used with a separation distance of 20cm to the human body.
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