Last Updated on : 2021-10-09 09:30:46download
TYZS2R is a low power-consuming embedded Zigbee module developed by Hangzhou Tuya Information Technology Co., Ltd. It consists of the highly integrated wireless radio processor chip, EFR32MG13P732, and several peripherals, with a built-in 802.15.4 PHY/MAC Zigbee network protocol stack and robust library functions.
TYZS2R is embedded with a low power-consuming 32-bit ARM Cortex-M4 core, 512 KB flash, 64 KB RAM data memory, and robust peripheral resources.
TYZS2R provides two rows of pins with the pin pitch of 2.0 mm. There are 14 external pins.
Dimensions of TYZS2R are as follows: 14.8 mm (W) x 20.4 mm (L) x 2 mm (H). Figure 2 shows the overall pin layout of TYZS2R.
YZS2R interface pins:
|Pin No.||Symbol||I/O Type||Functions|
|1||PWM1/ F_RX||I/O||Light drive interface or GPIO, which is used as a serial port RX in production test mode, corresponding to the PA4 pin of the internal IC|
|2||PWM2/ F_TX||I/O||Light drive interface or GPIO, which is used as a serial port TX in production test mode, corresponding to the PA3 pin of the internal IC|
|3||UART_ TX||I/O||UART0_TXD, which can be configured as a GPIO corresponding to the PF5 pin of the internal IC|
|4||UART_ RX||I/O||UART0_RXD, which can be used as a GPIO corresponding to the PA1 pin of the internal IC|
|5||VCC||P||Power-supply pin of TYZS2R (typical power supply voltage: 3.3 V)|
|6||ADC||AI||Interface 1 of the ADC (a 12-bit precision SAR analog-to-digital converter), corresponding to the PD15 pin of the internal IC|
|7||GND||P||Module reference ground pin|
|0||SWDI O||I/O||JLINK SWDIO programming pin, which can also be used as a GPIO in common programs, corresponding to the PF1 pin of the internal IC|
|00||SWCLK||I/O||JLINK SWCLK programming pin, which can also be used as a GPIO in common programs, corresponding to the PF0 pin of the internal IC|
|8||I2C_S CL||I/O||GPIO, which can be configured as an IIC interface, corresponding to the PF2 pin of the internal IC|
|9||VCC||P||Power-supply pin of TYZS2R (typical power supply voltage: 3.3 V); because it is internally connected to the network with a voltage of 3.3 V, no external processing is required.|
|10||GND||P||Module reference ground pin that is internally connected to the ground terminal, and no external processing is required.|
|11||NC||N/A||NC pin with no function|
|12||nRST||I||Module resetting input pin|
Note: P indicates power-supply pins, I/O indicates input/output pins, and AI indicates analog input pins.
nRST is only a module hardware reset pin, which cannot be used to clear the Zigbee network configuration.
nRST can be used only as an ADC port and not a common I/O port. When not being used, nRST must be disconnected.
When nRST is used as an ADC input port, the input voltage range is 0 V to the AVdd, which is configurable using software.
TYZS2R test pin:
|Pin No.||Symbol||I/O type||Functions|
|N/A||TEST||I||Used for the module production test|
Note: You are not advised to use the test pin.
Absolute electrical characteristics:
|Parameter||Description||Minimum Value||Maximum Value||Unit|
|Static electricity voltage (human model)||Tamb –25°C||N/A||2.5||kV|
|Static electricity voltage (machine model)||Tamb –25°C||N/A||0.5||kV|
Normal electrical conditions:
|Parameter||Description||Typical Value||Minimum Value||Maximum Value||Unit|
|VIL||I/O low-level input||N/A||–0.3||VCC x 0.25||V|
|VIH||I/O high-level input||N/A||VCC x 0.75||VCC||V|
|VOL||I/O low-level output||N/A||N/A||VCC x 0.1||V|
|VOH||I/O high-level output||N/A||VCC x 0.8||VCC||V|
|Imax||I/O drive current||N/A||N/A||12||mA|
TX power consumption during constant emission:
|Symbol||Rate||TX power||Typical Value||Unit|
|IRF||250 kbit/s||+10 dBm||32||mA|
|IRF||250 kbit/s||+4 dBm||17||mA|
|IRF||250 kbit/s||+1 dBm||11.8||mA|
Note: When the preceding data is being tested, the duty cycle is set to 100%.
RX power consumption during constant receiving:
Note: When the UART is in the active state, the current is 8 mA in constant receiving mode.
TYZS2R working current:
|Working Mode||Working Status (Ta = 25°C)||Average Value||Maximum Value||Unit|
|EZ mode||The module is in the EZ state.||10||40||mA|
|Operation mode||The module is connected to the network.||5||10||mA|
|Deep sleep mode||The module is in the deep sleep mode, with the 64 KB flash.||1.4||3||μA|
Basic RF features:
|Frequency band||2.400 GHz to 2.484 GHz|
|Physical-layer standard||IEEE 802.15.4|
|Data transmitting rate||250 kbit/s|
|Antenna type||PCB antenna|
|Line-of-sight transmission distance||> 100 m|
TX continuous transmission performance:
|Parameter||Minimum Value||Typical Value||Maximum Value||Unit|
|Maximum output power||N/A||+19||N/A||dBm|
|Minimum output power||N/A||–30||N/A||dBm|
|Output power adjustment step||N/A||0.5||1||dB|
|Output spectrum adjacent-channel rejection ratio||–31||dBc|
Note: The maximum output power can reach +10 dBm after BOM modification.
|Parameter||Minimum Value||Typical Value||Maximum Value||Unit|
|PER < 10%, RX sensitivity, 250 kbit/s (OQPSK)||N/A||–101||N/A||dBm|
By default, the onboard PCB antenna is used.
When you use an onboard PCB antenna on a Zigbee module, ensure that the antenna on the module is at least 15 mm away from other metal parts for optimal wireless performance.
To prevent negative impact on antenna radiation performance, do not route copper or cable wires along the antenna area of the user PCB board. It is recommended that the antenna location on the PCB be hollowed out.
Note: By default, pins 3 and 4 are configured as UART connection communication interfaces. Pins 0 and 00 are JLINK programming interfaces, which can also be used as common I/O interfaces after programming. Pins 1 and 2 are configured as UART communication interfaces in the production test mode.
The stamp-hole module must be mounted by the SMT machine. After being unpacked, it must be soldered within 24 hours. Otherwise, it must be put into the drying cupboard where the RH is not greater than 10%, or it needs to be packaged under vacuum again and the exposure time needs to be recorded (the total exposure time cannot exceed 168 hours).
Storage conditions for a delivered module are as follows:
The module needs to be baked in the following cases:
Important: If this batch of modules is not baked within 168 hours, do not use the wave soldering to solder them. Because these modules are 3-level moisture-sensitive components, they are very likely to get damp when exposed outside. In this case, if they are soldered at high temperatures, it may result in component failure or poor soldering.
In the whole production process, take electrostatic discharge (ESD) protective measures.
To guarantee the passing rate, it is recommended that you use the SPI and AOI to monitor the quality of solder paste printing and mounting.
Perform mounting with the SMT based on the following reﬂow oven temperature curve. The highest temperature is 245°C. The reflow temperature curve is as below:
A: Temperature axis
B: Time axis
C: Liquidus temperature: 217 to 220°C
D: Ramp-up slope: 1 to 3°C/s
E: Duration of constant temperature: 60 to 120s; the range of constant temperature: 150 to 200°C
F: Duration above the liquidus: 50 to 70s
G: Peak temperature: 235 to 245°C
H: Ramp-down slope: 1 to 4°C/s
Note: The above curve is just an example of the solder paste SAC305. For more details about other solder pastes, please refer to Recommended oven temperature curve in the solder paste specifications.
FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this device.
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.
Note: This device has been tested and found to comply with the limits for a Class B digital device, according to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This device generates, uses, and can radiate radio frequency energy and, if not installed and used following the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation.
If this device does cause harmful interference to radio or television reception, which can be determined by turning the device off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
Radiation Exposure Statement
This device complies with FCC radiation exposure limits set forth for an uncontrolled rolled environment. This device should be installed and operated with a minimum distance of 20cm between the radiator and your body.
This radio module must not be installed to co-locate and operating simultaneously with other radios in the host system except following FCC multi-transmitter product procedures. Additional testing and device authorization may be required to operate simultaneously with other radios.
The availability of some specific channels and/or operational frequency bands are country dependent and are firmware programmed at the factory to match the intended destination. The firmware setting is not accessible by the end-user.
The host product manufacturer is responsible for compliance with any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.
The end-user manual shall include all required regulatory information/warnings as shown in this manual, including “This product must be installed and operated with a minimum distance of 20 cm between the radiator and user body”.
This device has got an FCC ID: 2ANDL-TYZS2R. The end product must be labeled in a visible area with the following: “Contains Transmitter Module FCC ID: 2ANDL-TYZS2R”.
This device is intended only for OEM integrators under the following conditions:
The antenna must be installed such that 20cm is maintained between the antenna and users, and the transmitter module may not be co-located with any other transmitter or antenna.
As long as the 2 conditions above are met, further transmitter tests will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed.
Declaration of Conformity European Notice
Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module product is in compliance with essential requirements and other relevant provisions of Directive 2014/53/EU,2011/65/EU. A copy of the Declaration of conformity can be found at https://www.tuya.com.
This product must not be disposed of as normal household waste, in accordance with the EU directive for waste electrical and electronic equipment (WEEE-2012/19/EU). Instead, it should be disposed of by returning it to the point of sale, or to a municipal recycling collection point.
The device could be used with a separation distance of 20cm to the human body.
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