TYZS2R Module Datasheet

Last Updated on : 2021-10-09 09:30:46download

TYZS2R is a low power-consuming embedded Zigbee module developed by Hangzhou Tuya Information Technology Co., Ltd. It consists of the highly integrated wireless radio processor chip, EFR32MG13P732, and several peripherals, with a built-in 802.15.4 PHY/MAC Zigbee network protocol stack and robust library functions.


TYZS2R is embedded with a low power-consuming 32-bit ARM Cortex-M4 core, 512 KB flash, 64 KB RAM data memory, and robust peripheral resources.


  • Built-in low power-consuming 32-bit ARM Cortex-M4 core with DSP instructions and floating-point unit functioning as an application processor
    Basic frequency: 40 MHz
  • Wide working voltage range: 1.8 V to 3.8 V
  • Peripherals: six GPIOs, one UART, and one ADC
  • Zigbee features
    • 802.15.4 MAC/PHY
    • Working channel: channels 11 to 26 on 2.400 GHz to 2.483 GHz, with an air interface rate of 250 kbit/s
    • Built-in DC-DC circuit, maximizing the power supply efficiency
    • Maximum output power: +19 dBm
    • Power consumption when TYZS2R is working: 63 μA/MHz; current when TYZS2R is in sleep mode: 1.4 μA
    • Proactive network configuration for terminals
    • Built-in onboard PCB antenna
    • Working temperature: –40°C to +85°C
    • AES 128/256-based hardware encryption

Major application fields

  • Smart building
  • Smart home and household applications
  • Smart socket and lighting
  • Industrial wireless control
  • Health care and measurement
  • Asset tracing

Module interfaces

Dimensions and footprint

TYZS2R provides two rows of pins with the pin pitch of 2.0 mm. There are 14 external pins.

Dimensions of TYZS2R are as follows: 14.8 mm (W) x 20.4 mm (L) x 2 mm (H). Figure 2 shows the overall pin layout of TYZS2R.

TYZS2R Module Datasheet

TYZS2R Module Datasheet

Pin definition

YZS2R interface pins:

Pin No. Symbol I/O Type Functions
1 PWM1/ F_RX I/O Light drive interface or GPIO, which is used as a serial port RX in production test mode, corresponding to the PA4 pin of the internal IC
2 PWM2/ F_TX I/O Light drive interface or GPIO, which is used as a serial port TX in production test mode, corresponding to the PA3 pin of the internal IC
3 UART_ TX I/O UART0_TXD, which can be configured as a GPIO corresponding to the PF5 pin of the internal IC
4 UART_ RX I/O UART0_RXD, which can be used as a GPIO corresponding to the PA1 pin of the internal IC
5 VCC P Power-supply pin of TYZS2R (typical power supply voltage: 3.3 V)
6 ADC AI Interface 1 of the ADC (a 12-bit precision SAR analog-to-digital converter), corresponding to the PD15 pin of the internal IC
7 GND P Module reference ground pin
0 SWDI O I/O JLINK SWDIO programming pin, which can also be used as a GPIO in common programs, corresponding to the PF1 pin of the internal IC
00 SWCLK I/O JLINK SWCLK programming pin, which can also be used as a GPIO in common programs, corresponding to the PF0 pin of the internal IC
8 I2C_S CL I/O GPIO, which can be configured as an IIC interface, corresponding to the PF2 pin of the internal IC
9 VCC P Power-supply pin of TYZS2R (typical power supply voltage: 3.3 V); because it is internally connected to the network with a voltage of 3.3 V, no external processing is required.
10 GND P Module reference ground pin that is internally connected to the ground terminal, and no external processing is required.
11 NC N/A NC pin with no function
12 nRST I Module resetting input pin

Note: P indicates power-supply pins, I/O indicates input/output pins, and AI indicates analog input pins.
nRST is only a module hardware reset pin, which cannot be used to clear the Zigbee network configuration.
nRST can be used only as an ADC port and not a common I/O port. When not being used, nRST must be disconnected.
When nRST is used as an ADC input port, the input voltage range is 0 V to the AVdd, which is configurable using software.

Test pin definition

TYZS2R test pin:

Pin No. Symbol I/O type Functions
N/A TEST I Used for the module production test

Note: You are not advised to use the test pin.

Electrical characteristics

Absolute electrical characteristics

Absolute electrical characteristics:

Parameter Description Minimum Value Maximum Value Unit
Ts Storage temperature –50 +150 °C
VCC Power-supply voltage –0.3 3.8 V
Static electricity voltage (human model) Tamb –25°C N/A 2.5 kV
Static electricity voltage (machine model) Tamb –25°C N/A 0.5 kV

Electrical conditions

Normal electrical conditions:

Parameter Description Typical Value Minimum Value Maximum Value Unit
Ta Working temperature N/A –40 +85 °C
VCC Working voltage 3.3 1.8 3.8 V
VIL I/O low-level input N/A –0.3 VCC x 0.25 V
VIH I/O high-level input N/A VCC x 0.75 VCC V
VOL I/O low-level output N/A N/A VCC x 0.1 V
VOH I/O high-level output N/A VCC x 0.8 VCC V
Imax I/O drive current N/A N/A 12 mA

Zigbee TX power consumption

TX power consumption during constant emission:

Symbol Rate TX power Typical Value Unit
IRF 250 kbit/s +10 dBm 32 mA
IRF 250 kbit/s +4 dBm 17 mA
IRF 250 kbit/s +1 dBm 11.8 mA

Note: When the preceding data is being tested, the duty cycle is set to 100%.

Zigbee RX power consumption

RX power consumption during constant receiving:

Symbol Rate Typical Value Unit
IRF 250 kbit/s 8 mA

Note: When the UART is in the active state, the current is 8 mA in constant receiving mode.

Power consumption in operating mode

TYZS2R working current:

Working Mode Working Status (Ta = 25°C) Average Value Maximum Value Unit
EZ mode The module is in the EZ state. 10 40 mA
Operation mode The module is connected to the network. 5 10 mA
Deep sleep mode The module is in the deep sleep mode, with the 64 KB flash. 1.4 3 μA

RF features

Basic RF features

Basic RF features:

Parameter Description
Frequency band 2.400 GHz to 2.484 GHz
Physical-layer standard IEEE 802.15.4
Data transmitting rate 250 kbit/s
Antenna type PCB antenna
Line-of-sight transmission distance > 100 m

Zigbee output performance

TX continuous transmission performance:

Parameter Minimum Value Typical Value Maximum Value Unit
Maximum output power N/A +19 N/A dBm
Minimum output power N/A –30 N/A dBm
Output power adjustment step N/A 0.5 1 dB
Frequency error –15 N/A +15 ppm
Output spectrum adjacent-channel rejection ratio –31 dBc

Note: The maximum output power can reach +10 dBm after BOM modification.

Zigbee RX sensitivity

RX sensitivity:

Parameter Minimum Value Typical Value Maximum Value Unit
PER < 10%, RX sensitivity, 250 kbit/s (OQPSK) N/A –101 N/A dBm


Antenna types

By default, the onboard PCB antenna is used.

Antenna interference reduction

When you use an onboard PCB antenna on a Zigbee module, ensure that the antenna on the module is at least 15 mm away from other metal parts for optimal wireless performance.

To prevent negative impact on antenna radiation performance, do not route copper or cable wires along the antenna area of the user PCB board. It is recommended that the antenna location on the PCB be hollowed out.

Packaging information and production instructions

Mechanical dimensions

TYZS2R Module Datasheet

Recommended PCB encapsulation

TYZS2R Module Datasheet

Note: By default, pins 3 and 4 are configured as UART connection communication interfaces. Pins 0 and 00 are JLINK programming interfaces, which can also be used as common I/O interfaces after programming. Pins 1 and 2 are configured as UART communication interfaces in the production test mode.

Production instructions

  • The stamp-hole module must be mounted by the SMT machine. After being unpacked, it must be soldered within 24 hours. Otherwise, it must be put into the drying cupboard where the RH is not greater than 10%, or it needs to be packaged under vacuum again and the exposure time needs to be recorded (the total exposure time cannot exceed 168 hours).

    • SMT equipment:
      • Mounter
      • SPI
      • Reflow soldering machine
      • Oven temperature tester
      • Automated optical inspection (AOI) equipment
    • Baking equipment:
      • Cabinet oven
      • Anti-static heat-resistant pallets
      • Anti-static heat-resistant gloves
  • Storage conditions for a delivered module are as follows:

    • The moisture-proof bag must be placed in an environment where the temperature is below 40°C and the relative humidity is lower than 90%.
    • The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed.
    • The package contains a humidity indicator card (HIC).
      TYZS2R Module Datasheet
  • The module needs to be baked in the following cases:

    • Vacuum packing bag was found to be damaged before being unpacked.
    • There is no humidity indicator card (HIC) in the vacuum packing bag.
    • After being unpacked, 10% and above circles on the HIC become pink.
    • The total exposure time has been more than 168 hours since unpacking.
    • More than 12 months have passed since the sealing date of the bag.
  • Baking settings:

    • Temperature: 60°C and ≤ 5%RH for reelizing and 125°C and ≤5%RH for palletizing (please use heat-resistant pallet rather than plastic pallet)
    • Time: 48 hours for reelizing and 12 hours for palletizing
    • Alarm temperature: 65°C for reelizing and 135°C for palletizing
    • Production ready temperature after natural cooling: < 36°C
    • The number of drying times: 1
    • Re-baking condition: If a module remains unused for 168 hours after being unpacked, it must be baked again.

      Important: If this batch of modules is not baked within 168 hours, do not use the wave soldering to solder them. Because these modules are 3-level moisture-sensitive components, they are very likely to get damp when exposed outside. In this case, if they are soldered at high temperatures, it may result in component failure or poor soldering.

  • In the whole production process, take electrostatic discharge (ESD) protective measures.

  • To guarantee the passing rate, it is recommended that you use the SPI and AOI to monitor the quality of solder paste printing and mounting.

Recommended oven temperature curve

Perform mounting with the SMT based on the following reflow oven temperature curve. The highest temperature is 245°C. The reflow temperature curve is as below:

TYZS2R Module Datasheet

  • A: Temperature axis

  • B: Time axis

  • C: Liquidus temperature: 217 to 220°C

  • D: Ramp-up slope: 1 to 3°C/s

  • E: Duration of constant temperature: 60 to 120s; the range of constant temperature: 150 to 200°C

  • F: Duration above the liquidus: 50 to 70s

  • G: Peak temperature: 235 to 245°C

  • H: Ramp-down slope: 1 to 4°C/s

    Note: The above curve is just an example of the solder paste SAC305. For more details about other solder pastes, please refer to Recommended oven temperature curve in the solder paste specifications.

Storage conditions

TYZS2R Module Datasheet

Appendix: Statement

FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this device.

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

Note: This device has been tested and found to comply with the limits for a Class B digital device, according to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This device generates, uses, and can radiate radio frequency energy and, if not installed and used following the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation.

If this device does cause harmful interference to radio or television reception, which can be determined by turning the device off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

  • Reorient or relocate the receiving antenna.
  • Increase the separation between the device and receiver.
  • Connect the device into an outlet on a circuit different from that to which the receiver is connected.
  • Consult the dealer or an experienced radio/TV technician for help.

Radiation Exposure Statement

This device complies with FCC radiation exposure limits set forth for an uncontrolled rolled environment. This device should be installed and operated with a minimum distance of 20cm between the radiator and your body.

Important Note

This radio module must not be installed to co-locate and operating simultaneously with other radios in the host system except following FCC multi-transmitter product procedures. Additional testing and device authorization may be required to operate simultaneously with other radios.

The availability of some specific channels and/or operational frequency bands are country dependent and are firmware programmed at the factory to match the intended destination. The firmware setting is not accessible by the end-user.

The host product manufacturer is responsible for compliance with any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.

The end-user manual shall include all required regulatory information/warnings as shown in this manual, including “This product must be installed and operated with a minimum distance of 20 cm between the radiator and user body”.

This device has got an FCC ID: 2ANDL-TYZS2R. The end product must be labeled in a visible area with the following: “Contains Transmitter Module FCC ID: 2ANDL-TYZS2R”.

This device is intended only for OEM integrators under the following conditions:

The antenna must be installed such that 20cm is maintained between the antenna and users, and the transmitter module may not be co-located with any other transmitter or antenna.

As long as the 2 conditions above are met, further transmitter tests will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed.

Declaration of Conformity European Notice

TYZS2R Module Datasheet

Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module product is in compliance with essential requirements and other relevant provisions of Directive 2014/53/EU,2011/65/EU. A copy of the Declaration of conformity can be found at https://www.tuya.com.

TYZS2R Module Datasheet

This product must not be disposed of as normal household waste, in accordance with the EU directive for waste electrical and electronic equipment (WEEE-2012/19/EU). Instead, it should be disposed of by returning it to the point of sale, or to a municipal recycling collection point.

The device could be used with a separation distance of 20cm to the human body.