TYZS7 Module Datasheet

TYZS7 is a low-power-consumption embedded Zigbee module developed by Tuya. It consists of a highly integrated RF chip (EFR32MG13P732) and several peripherals, with rich library functions. TYZS7 also contains a low-power-consumption 32-bit ARM Cortex-M4 core, 512-KB flash memory, 64-KB RAM, and various peripheral resources.

Product overview

Features

Built-in low power-consuming 32-bit ARM Cortex-M4 processor, which provides DSP instructions and floating-point units and can also be used as an application processor

• Basic frequency: 40 MHz supported

• Working voltage: 2.2 V to 3.8 V

• Peripherals: nine GPIOs, one UART, one ADC, and one nRST

• Zigbee features

  • 802.15.4 MAC/PHY supported

  • Working channel: 11–26 @2.400–2.483 GHz, air interface rate: 250 kbit/s

  • Built-in DC-DC circuit, maximizing the power supply efficiency

  • Maximum output power: +19 dBm

  • Runtime power consumption: 63 µA/MHz, current in sleep mode: 2.0 µA

  • Antenna with the IPEX connector

  • Working temperature: –40°C to +85°C

  • AES 128/256-based hardware encryption

Use cases

• Intelligent building
• Intelligent home and household applications
• Intelligent socket and light
• Industrial wireless control
• Health care and measurement
• Asset tracing

Module interfaces

Dimensions and footprint

TYZS7 provides two lines of pins, 16 pins in total, with a distance of 1.5 mm between every two pins.

TYZS7 dimensions: 15.5±0.35 mm (L) x 13.8±0.35 mm (W) x 2.0±0.15 mm (H)

Pin definition

The following table describes the interface pins.

No.	Symbol	I/O type	Functions
1	NC	NC	NC, not used as the external pin
2	ADC	AI	ADC interface (1), used for the 12-bit SAR ADC
3	nRST	I	Hardware reset pin, used to reset the chip in the low level. The module provides the power-on reset function so that you can ignore this pin as required.
4	GPIO3	I/O	Used as the GPIO
5	PWM2	I/O	Used as the light drive interface or GPIO
6	PWM3	I/O	Used as the light drive interface or GPIO
7	PWM1	I/O	Used as the light drive interface or GPIO
8	VCC	P	Module power supply pin (typical power supply voltage: 3.3 V)
9	GND	P	Module reference ground pin
10	GPIO2	I/O	Used as the GPIO
11	SWO	I/O	Used as the GPIO or the output pin in JLINK connection mode
12	GPIO0	I/O	Used as the GPIO
13	SWDIO	I/O	JLINK SWDIO programming pin, which can also be used as the GPIO in normal programs
14	SWCLK	I/O	JLINK SWCLK programming pin, which can also be used as the GPIO in normal programs
15	RXD	I/O	UART0_RXD, used for serial port receiving
16	TXD	O	UART0_TXD, used for serial port transmitting

Note: P indicates power-supply pins, I/O indicates input/output pins, and AI indicates analog input pins.

The nRST is only a module hardware reset pin, which cannot clear the Zigbee network configuration.

(1): This pin can only be used as the ADC interface and cannot be used as the common I/O pin. If this pin is not used, it must be disconnected.
When this pin is used as the ADC input interface, the input voltage range must be 0–AVDD, which can be configured using the software.

Test Pin Definition

The following table describes the test pins.

No.	Symbol	I/O type	Functions
-	-	I	Used for the module production test

Note: The test pins are used only on the bottom pad and not recommended.

Electrical characteristics

Absolute electrical characteristics

The following table describes the absolute electrical characteristics.

Parameter	Description	Minimum value	Maximum value	Unit
Ts	Storage temperature	–50	150	°C
VCC	Power supply voltage	–0.3	3.8	V
ESD voltage (human model)	TAMB – 25°C	-	2.5	KV
ESD voltage (machine model)	TAMB – 25°C	-	0.5	KV

Electrical conditions

The following table describes the normal electrical conditions.

Parameter	Description	Minimum value	Typical value	Maximum value	Unit
Ta	Working temperature	–40	-	85	°C
VCC	Working voltage	1.8	3.3	3.8	V
VIL	I/O low-level input	–0.3	-	VCC*0.25	V
VIH	I/O high-level input	VCC*0.75	-	VCC	V
VOL	I/O low-level output	-	-	VCC*0.1	V
VOH	I/O high-level output	VCC*0.8	-	VCC	V
Imax	I/O drive current	-	-	12	mA

Zigbee TX power consumption

The following table describes the TX power consumption during constant emission.

Symbol	Rate	TX power	Typical value	Unit
IRF	250 Kbps	+19 dBm	118	mA
IRF	250 Kbps	+10 dBm	32	mA
IRF	250 Kbps	+4 dBm	17	mA
IRF	250 Kbps	+1 dBm	11.8	mA

Note: When the preceding data is used for testing, the amount of constantly emitted data (duty cycle) is 100%.

Zigbee RX power consumption

The following table describes the RX power consumption during constant emission.

Symbol	Rate	Typical value	Unit
IRF	250 Kbps	8	mA

Note: When the UART is inactive state, the current in constant receiving mode is 8 mA.

Power consumption in operating mode

The following table describes the TYZS7 working currently.

Working mode	Working status (Ta = 25°C)	Average value	Maximum value	Unit
EZ mode	The module is in EZ state.	12	40	mA
Operation mode	The module is in connected state.	3	5	mA
Deep sleep mode	The module is in deep sleep mode, with the 64 KB RAM.	3	6	uA

RF Features

Basic RF Features

The following table describes the basic RF features.

Parameter	Description
Frequency band	2.400–2.483 GHz
Physical-layer standard	IEEE 802.15.4
Data transmitting rate	250 kbit/s
Antenna type	External antenna connected through the IPEX connector
Line-of-sight transmission distance	> 120 m

Zigbee output power

The following table describes the TX performance during constant emission.

Parameter	Minimum value	Typical value	Maximum value	Unit
Maximum output power	-	+19	-	dBm
Minimum output power	-	–30	-	dBm
Output power adjustment step	-	0.5	1	dB
Frequency error	–15	-	+15	ppm
Output spectrum adjacent-channel rejection ratio		–32		dBc

Zigbee RX sensitivity

The following table describes the RX sensitivity.

Parameter	Minimum value	Typical value	Maximum value	Unit
RX sensitivity, 250 kbit/s@OQPSK	-	-101	–	dBm

Antenna

Antenna type

The module is connected to the external antenna through an IPEX connector (female).

The dimension for IPEX fixture:

Customers can choose one of these antennas: 1.17.01.00219, 1.17.01.00200, 1.17.01.00199.

Antenna interference reduction

To ensure optimal radio performance when the IPEX external antenna is used, it is recommended that there be a space of at least 15 mm between the module antenna and other metal parts.

Do not wrap metal parts around the antenna to avoid impact on the antenna radiation performance. You are advised to hollow out the conversion board in the antenna area.

Packaging information and production instructions

Mechanical dimensions and size of the back pad

Recommended PCB encapsulation

Note: Pin13 and pin14 are the JLINK programming interfaces, which can also be used as the common I/O interfaces in applications after programming.

Pin15 and pin16 are configured as the UART communication interfaces by default.

Production instructions

1. The Tuya SMT module should be mounted by the SMT device. After being unpacked, it should be soldered within 24 hours. Otherwise, it should be put into the drying cupboard where the RH is not greater than 10%; or it needs to be packaged under vacuum again and the exposure time needs to be recorded (the total exposure time cannot exceed 168 hours).
   • SMT devices:
     • Mounter
     • SPI
     • Reflow soldering machine
     • Thermal profiler
     • Automated optical inspection (AOI) equipment
   • Baking devices:
     • Cabinet oven
     • Anti-electrostatic and heat-resistant trays
     • Anti-electrostatic and heat-resistant gloves
2. Storage conditions for a delivered module:

   • The moisture-proof bag must be placed in an environment where the temperature is below 40°C and the relative humidity is lower than 90%.

   • The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed.

   • There is a humidity indicator card (HIC) in the packaging bag.

     

3. The module needs to be baked in the following cases:
   • The packaging bag is damaged before unpacking.
   • There is no HIC in the packaging bag.
   • After unpacking, circles of 10% and above on the HIC become pink.
   • The total exposure time has lasted for over 168 hours since unpacking.
   • More than 12 months has passed since the sealing of the bag.
4. Baking settings:
   • Temperature: 60°C and ≤ 5% RH for reel package and 125°C and ≤5% RH for tray package (please use the heat-resistant tray rather than plastic container)
   • Time: 48 hours for reel package and 12 hours for tray package
   • Alarm temperature: 65°C for reel package and 135°C for tray package
   • Production-ready temperature after natural cooling: < 36°C
   • Re-baking situation: If a module remains unused for over 168 hours after being baked, it needs to be baked again.
   • If a batch of modules is not baked within 168 hours, do not use the reflow soldering to solder them. Because these modules are Level-3 moisture-sensitive devices, they are very likely to get damp when exposed beyond the allowable time. In this case, if they are soldered at high temperatures, it may result in device failure or poor soldering.
5. In the whole production process, take electrostatic discharge (ESD) protective measures.
6. To guarantee the passing rate, it is recommended that you use the SPI and AOI to monitor the quality of solder paste printing and mounting.

Recommended oven temperature curve

Set oven temperatures according to the following temperature curve of reflow soldering. The peak temperature is 245°C.

• A: Temperature axis

• B: Time axis

• C: Liquidus temperature: 217 to 220°C

• D: Ramp-up slope: 1 to 3°C/s

• E: Duration of constant temperature: 60 to 120s; the range of constant temperature: 150 to 200°C

• F: Duration above the liquidus: 50 to 70s

• G: Peak temperature: 235 to 245°C

• H: Ramp-down slope: 1 to 4°C/s

  Note: The above curve is just an example of the solder paste SAC305. For more details about other solder pastes, please refer to Recommended oven temperature curve in the solder paste specifications.

Storage conditions

MOQ and packaging information

Product model	MOQ (pcs)	Packing method	Modules per reel	Reels per carton
TYZS7	6000	Tape reel	1500	4

Appendix: Statement

FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this equipment.

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and receiver.
• Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help.

Radiation Exposure Statement

This equipment complies with FCC radiation exposure limits set forth for an uncontrolled rolled environment. This equipment should be installed and operated with a minimum distance of 20cm between the radiator and your body.

Important Note

This radio module must not be installed to co-locate and operating simultaneously with other radios in the host system except in accordance with FCC multi-transmitter product procedures. Additional testing and equipment authorization may be required to operate simultaneously with other radios.

The availability of some specific channels and/or operational frequency bands are country dependent and are firmware programmed at the factory to match the intended destination. The firmware setting is not accessible by the end-user.

The host product manufacturer is responsible for compliance to any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.

The end-user manual shall include all required regulatory information/warning as shown in this manual, including: This product must be installed and operated with a minimum distance of 20 cm between the radiator and user body.

The RF module is considered as a limited modular transmitter according to FCC rules. Even though the RF module gets an FCC ID, the host product manufacturer can not use the FCC ID on the final product directly. In these circumstances, the host product manufacturer integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining the FCC authorization by a Class II permissive change application or a new application.

Declaration of Conformity European notice

Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module product is in compliance with essential requirements and other relevant provisions of Directive 2014/53/EU,2011/65/EU. A copy of the Declaration of conformity can be found at https://www.tuya.com

This product must not be disposed of as normal household waste, in accordance with the EU directive for waste electrical and electronic equipment (WEEE-2012/19/EU). Instead, it should be disposed of by returning it to the point of sale, or to a municipal recycling collection point.

The device could be used with a separation distance of 20cm to the human body.