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Tuya Sandwich Environment Sensor Board

Last Updated on : 2022-10-26 07:00:46download

The Tuya Sandwich temperature and humidity sensor function board is the application part of the Sandwich development board, which helps you quickly implement various smart hardware prototypes. The function board contains a SENSIRION temperature and humidity sensor—SHT30-DIS, communicating through the I2C protocol. And the I2C clock frequency supports up to 1 MHz. The Tuya Sandwich temperature and humidity sensor function board needs to be used together with the control board and the power board.

Tuya Sandwich Environment Sensor Board

Introduction to key components

Components Description
U1 (SHT30-DIS) The SENSIRION temperature and humidity sensor works under a voltage of 2.4–5.5V. Its humidity accuracy is ±2% RH and temperature accuracy is ±0.3 °C. It uses the 8-pin DFN package.

Introduction to I/O ports

See the following table for the pins that are used in the Tuya Sandwich temperature and humidity sensor board:

I/O Description
VCC Power supply pin
GND Power ground
SCL I2C clock signal
SDA I2C data signal
INT Alert signal, reserved

Technical requirements

  • The power supply voltage refers to the operating voltage range of the sensor: 2.4–5.5V.
  • Typical current in non-measurement status: 0.2 uA.
  • Typical current in low power consecutive measurement mode: 800 uA.

Schematic diagram and PCB

  • Schematic diagram of Tuya Sandwich temperature and humidity sensor board:

    Tuya Sandwich Environment Sensor Board

  • PCBof Tuya Sandwich temperature and humidity sensor board:

    Tuya Sandwich Environment Sensor Board

Things to note

  • The function board needs to be used with the control board and the power supply board.
  • Do not insert the I/O pin into the power port to prevent a breakdown of the corresponding I/O port of the module.
  • Dust and oil stains attached to the sensor body will cause a decrease in measurement accuracy.
  • Do not use cleaners to wash the sensor body, such as the circuit board cleaner.
  • Do not use packaging materials that release chemical molecules, otherwise, it may be contaminated and cause data drift or complete damage.

Reference