Last Updated on : 2022-08-04 06:39:22download
BPU is a low-power-consumption embedded Bluetooth module that Tuya has developed. Embedded with the Bluetooth communication protocol stack and rich library functions, it mainly consists of a highly integrated Bluetooth chip (PHY6222) and a few peripheral circuits.
BPU includes a low-power-consumption 32-bit MCU, a Bluetooth LE 5.1/2.4-G Radio, 512-KB flash memory, 64-KB SRAM, and 18 reusable I/O pins.
BPU has 3 lines, 21 pins in total. The spacing of pins at the two sides is 1.4±0.1 mm, and the spacing of pins at the bottom is 1.8±0.1 mm.
The dimensions of BPU are 20.3±0.35 mm (L)×15.8±0.35 mm (W) ×3.0±0.15 mm (H). The thickness of the PCB is 1.0±0.1 mm, which are shown below:
The definitions of pins are shown in the following table:
|Pin number||Symbol||Pin type||Function|
|1||P3||I/O||Common I/O interface, which can be used as SCK of the SPI interface and corresponds to P3 of the IC chip|
|2||P7||I/O||Common I/O pin, which can be used as MOSI of the SPI interface and corresponds to P7 of the IC|
|3||P15||I/O||Common I/O interface, which corresponds to P15 of the IC chip|
|4||P16||I/O||Common I/O interface, which corresponds to P16 of the IC chip|
|5||P11||I/O||ADC port, 12 bit/s, which can also be used as a common I/O pin and corresponds to P11 of the IC chip|
|6||RXD2||I/O||Serial port UART2_RX, which can also be used as a common I/O pin and corresponds to P0 of the IC chip|
|7||TXD2||I/O||Serial port UART2_TX, which can also be used as a common I/O pin and corresponds to P2 of the IC chip. It can be used to output logs.|
|8||P26||I/O||Common I/O interface, which can be used as PWM output of the LED drive and corresponds to P26 of the IC chip|
|9||P31||I/O||Common I/O interface, which can be used as PWM output of the LED drive and corresponds to P31 of the IC chip|
|10||P32||I/O||Common I/O interface, which can be used as PWM output of the LED drive and corresponds to P32 of the IC chip|
|11||P33||I/O||Common I/O interface, which can be used as PWM output of the LED drive and corresponds to P33 of the IC chip|
|12||P34||I/O||Common I/O interface, which can be used as PWM output of the LED drive and corresponds to P34 of the IC chip|
|13||GND||P||Power supply reference ground|
|14||VCC||P||Power supply pin (Typical value: 3.3V)|
|15||TXD1||I/O||UART1_TX, which can also be used as a common I/O pin and corresponds to P9 of the IC chip|
|16||RXD1||I/O||UART1_RX, which can also be used as a common I/O pin and corresponds to P10 of the IC chip|
|17||P14||I/O||ADC port, 12 bit/s, which can also be used as a common I/O interface and corresponds to P14 of the IC chip|
|18||RESET_N||I/O||Reset pin (low active), correspond to RESET_N of the IC chip.|
|19||P17||I/O||Common I/O interface, which corresponds to P17 of the IC chip|
|20||P20||I/O||Common I/O interface, which can be used as MISO of the SPI interface and corresponds to P20 of the IC chip|
|21||P18||I/O||Common I/O interface, which can be used as CS of the SPI interface and corresponds to P18 of the IC chip|
|Test pin||TM||I||Mode selection pin, which is pulled high in burning mode, but pulled down or not connected to anything in other modes.|
- P indicates a power supply pin and I/O indicates an input/output pin.
- If you have any special requirements on the light colour controlled by the PWM output, please contact Tuya business personnel.
|Parameter||Description||Minimum value||Maximum value||Unit|
|VCC||Power supply voltage||-0.3||3.9||V|
|ESD voltage (human body model)||TAMB-25℃||-||2||kV|
|ESD voltage (machine model)||TAMB-25℃||-||0.5||kV|
|Parameter||Description||Minimum value||Typical value||Maximum value||Unit|
|VIL||Voltage input low||VSS||-||VCC*0.3||V|
|VIH||Voltage input high||VCC*0.7||-||VCC||V|
|VOL||Voltage output low||VSS||-||VCC*0.1||V|
|VOH||Voltage output high||VCC*0.9||-||VCC||V|
|Symbol||Conditions||Maximum value (Typical value)||Unit|
|Itx||Constantly transmit with the output power of 6 dBm||10.9||mA|
|IDC||Average value in mesh networking state||9.4||mA|
|IDC||Peak value in mesh networking state||11.4||mA|
|Ideepsleep||Average value at common sleep mode||1||μA|
|Operating frequency||2.4 GHz ISM band|
|Wireless standard||Bluetooth LE 5.1|
|Data transmission rate||1 Mbps|
|Antenna type||PCB antenna|
|Parameter||Minimum value||Typical value||Maximum value||Unit|
|Average RF output power||-20||6||7||dBm|
|Bandwidth of 20-dB modulation signal (1M)||-||2500||-||KHz|
|Parameter||Minimum value||Typical value||Maximum value||Unit|
|RX sensitivity 1 Mbps||-||-97||-||dBm|
|Frequency offset error 1 Mbps||-250||-||+300||KHz|
|Co-channel interference suppression||-||-10||-||dB|
BPU uses the PCB antenna with a gain of 2.19 dBi.
To ensure the best RF performance, it is recommended that the antenna be at least 15 mm away from other metal parts. If metal materials are wrapped around the antenna, the wireless signal will be greatly attenuated, thereby deteriorating the RF performance. When designing the finished product, please leave enough space for the antenna.
The following figure is a schematic diagram of BPU:
Recommended PCB footprint
The default outline dimension tolerance is ±0.35 mm, and the critical dimension tolerance is ±0.1 mm. If you have specific requirements on dimensions, specify them clearly in the datasheet after communication.
The moisture-proof bag must be placed in an environment in which the temperature is below 40°C and the relative humidity is lower than 90%.
The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed.
There is a humidity indicator card (HIC) in the packaging bag.
Select a proper soldering manner according to the process. For the SMT process, please refer to the recommended oven temperature curve of reflow soldering. For the wave soldering process, please refer to the recommended oven temperature curve of wave soldering. There are some differences between the set temperatures and the actual temperatures. All the temperatures shown in this module datasheet are obtained through actual measurements.
Manner 1: SMT process (Recommended oven temperature curve of reflow soldering)
Set oven temperatures according to the following curve.
A: Temperature axis
B: Time axis
C: Liquidus temperature: 217 to 220°C
D: Ramp-up slope: 1 to 3°C/s
E: Duration of constant temperature: 60 to 120s; the range of constant temperature: 150 to 200°C
F: Duration above the liquidus: 50 to 70s
G: Peak temperature: 235 to 245°C
H: Ramp-down slope: 1 to 4°C/s
Note: The above curve is just an example of the solder paste SAC305. For more details about other solder pastes, please refer to Recommended oven temperature curve in the solder paste specifications.
Manner 2: Wave soldering process (Oven temperature curve of wave soldering)
Set oven temperatures according to the following temperature curve of wave soldering. The peak temperature is 260°C±5°C.
|Suggestions on oven temperature curve of wave soldering||Suggestions on manual soldering temperature|
|Preheat temperature||80 to 130 °C||Soldering temperature||360±20°C|
|Preheat time||75 to 100s||Soldering time||＜3s/point|
|Peak contact time||3 to 5s||NA||NA|
|Temperature of tin cylinder||260±5°C||NA||NA|
|Product model||MOQ (pcs)||Packing method||Modules per reel||Reels per carton|
FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this device.
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.
Note: This device has been tested and found to comply with the limits for a Class B digital device, according to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This device generates, uses, and can radiate radio frequency energy and, if not installed and used following the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation.
If this device does cause harmful interference to radio or television reception, which can be determined by turning the device off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
Radiation Exposure Statement
This device complies with FCC radiation exposure limits set forth for an uncontrolled rolled environment. This device should be installed and operated with a minimum distance of 20cm between the radiator and your body.
This radio module must not be installed to co-locate and operate simultaneously with other radios in the host system except following FCC multi-transmitter product procedures. Additional testing and device authorization may be required to operate simultaneously with other radios.
The availability of some specific channels and/or operational frequency bands are country dependent and are firmware programmed at the factory to match the intended destination. The firmware setting is not accessible by the end-user.
The host product manufacturer is responsible for compliance with any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.
The end-user manual shall include all required regulatory information/warnings as shown in this manual, including “This product must be installed and operated with a minimum distance of 20 cm between the radiator and user body”.
This device has got an FCC ID: 2ANDL-BPU. The end product must be labeled in a visible area with the following: “Contains Transmitter Module FCC ID: 2ANDL-BPU”.
This device is intended only for OEM integrators under the following conditions:
The antenna must be installed such that 20cm is maintained between the antenna and users, and the transmitter module may not be co-located with any other transmitter or antenna.
As long as the 2 conditions above are met, further transmitter tests will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed.
Declaration of Conformity European Notice
Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module product complies with essential requirements and other relevant provisions of Directive 2014/53/EU, 2011/65/EU. A copy of the Declaration of conformity can be found at https://www.tuya.com.
This product must not be disposed of as normal household waste, under the EU directive for waste electrical and electronic equipment (WEEE-2012/19/EU). Instead, it should be disposed of by returning it to the point of sale, or a municipal recycling collection point.
The device could be used with a separation distance of 20cm to the human body.
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