Last Updated on : 2023-02-08 08:10:20download
WXU-IPEX is a low-power embedded Wi-Fi and Bluetooth combo module that Tuya has developed. Embedded with the Wi-Fi network protocol stack and rich library functions, it consists of a highly integrated RF chip (T103C-HL).
With the maximum CPU clock rate of 160 MHz, WXU-IPEX also contains a low-power ARMv8 MCU, a WLAN MAC, a 1T1R WLAN, a 320-KB SRAM, a 2-MB ﬂash memory, and extensive peripherals.
WXU-IPEX is an RTOS platform that integrates all function libraries of the Wi-Fi MAC and TCP/IP protocol. You can develop embedded Wi-Fi products as required.
WXU-IPEX has 3 rows of pins. The spacing of pins at the two sides is 1.4 mm, and the spacing of pins at the bottom is 1.8 mm.
The dimensions of WXU-IPEX are 15.8±0.35 mm (W) × 20.3±0.35 mm (L) × 2.7±0.15 mm (H). The dimensions of WXU-IPEX are as follows:
|Pin number||Symbol||II/O type||Function|
|1||PB07||I/O||GPIOB_7, common GPIO, which can be reused as SPI_SCK and corresponds to Pin 23 of the IC|
|2||PB04||I/O||GPIOB_4, common GPIO, which can be reused as SPI_MOSI and corresponds to Pin 22 of the IC|
|3||RX1||I/O||GPIOB_15, common GPIO, UART1_RXD (user serial interface), which corresponds to Pin 26 of the IC|
|4||TX1||I/O||GPIOB_14, common GPIO, UART1_TXD (user serial interface), which corresponds to Pin 27 of the IC|
|5||ADC||I/O||GPIOA_11, common GPIO, which can be used as ADC. The range of input voltage is 0 to 2.5V. Correspond to Pin 4 of the IC.|
|6||RX2||I/O||GPIOA_21, UART2_Log_RXD (used to receive the external logs of the module), which can be configured as a common GPIO|
|7||TX2||I/O||GPIOA_22, UART2_Log_TXD (used to send the internal logs of the module), which can be configured as a common GPIO|
|8||PB03||I/O||GPIOB_03, hardware PWM, which corresponds to Pin 24 of the IC|
|9||PA20||I/O||GPIOA_20, hardware PWM, which corresponds to Pin 8 of the IC|
|10||PA19||I/O||GPIOA_19, hardware PWM, which corresponds to Pin 7 of the IC|
|11||PA13||I/O||GPIOA_13, hardware PWM, which corresponds to Pin 6 of the IC|
|12||PA23||I/O||GPIOA_23, common GPIO, which corresponds to Pin 11 of the IC. PA23 is not recommended to pull up. If a high level is detected during power on startup or reset, it will enter the test mode.|
|13||GND||P||Power supply reference ground|
|14||VCC||P||Power supply pin (Typical 3.3V)|
|15||TX0||I/O||GPIOB_00, UART0_TXD (user serial interface)|
|16||RX0||I/O||GPIOB_01, UART0_RXD (user serial interface)|
|17||PB02||I/O||GPIOB_02, common GPIO, which corresponds to Pin 25 of the IC. PB02 is not recommended to pull down. If a low level is detected during power on startup or reset, it will enter the firmware burning mode.|
|18||RSTN||I/O||Enabling pin, active at the low level. The module has been pulled to a high level and the user can control the pin externally|
|19||PA12||I/O||GPIOA_12, hardware PWM, which corresponds to Pin 5 of the IC|
|20||PB05||I/O||GPIOB_5, common GPIO, which can be reused as SPI_MISO and corresponds to Pin 21 of the IC|
|21||PB06||I/O||GPIOB_6, common GPIO, which can be reused as SPI_CS and corresponds to Pin 20 of the IC|
P indicates a power supply pin and I/O indicates an input/output pin.
|Parameter||Description||Minimum value||Maximum value||Unit|
|VBAT||Power supply voltage||-0.3||5.5||V|
|ESD voltage (human body model)||TAMB-25°C||-||2||KV|
|ESD voltage (machine model)||TAMB-25°C||-||0.5||KV|
|Parameter||Description||Minimum value||Typical value||Maximum value||Unit|
|VIL||I/O low level input||-0.3||-||1.32||V|
|VIH||I/O high level input||2.06||-||3.6||V|
|VOL||I/O low level output||-0.3||-||0.4||V|
|VOH||I/O high level output||2.9||-||3.6||V|
|Imax||I/O drive current||-||-||30||mA|
|Cpad||Input pin capacitance||-||2||-||pF|
TX power consumption:
|Symbol||Mode||Power||Average value||Peak value (Typical value)||Unit|
|IRF||11b 1Mbps||17 dBm||141||280||mA|
|IRF||11b 11Mbps||17 dBm||135||284||mA|
|IRF||11g 6Mbps||16 dBm||137||276||mA|
|IRF||11g 54Mbps||16 dBm||174||284||mA|
|IRF||11n BW20 MCS0||16 dBm||140||276||mA|
|IRF||11n BW20 MCS7||15 dBm||126||268||mA|
RX power consumption:
|Symbol||Mode||Average value||Peak value (Typical value)||Unit|
|IRF||11N HT20 MCS0||40||56||mA|
|IRF||11N HT20 MCS7||40||56||mA|
|Working mode||Working status, Ta = 25°C||Average value||Maximum value (Typical value)||Unit|
|Quick network connection state (Bluetooth)||The module is in the fast network connection state and the Wi-Fi indicator flashes fast||46||400||mA|
|Quick network connection state (AP)||The module is in the hotspot network connection state and the Wi-Fi indicator flashes slowly||55||412||mA|
|Quick network connection state (EZ)||The module is in the fast network connection state and the Wi-Fi indicator flashes fast||47||408||mA|
|No operation during network connection||The module is connected to the network and the Wi-Fi indicator is always on||12||310||mA|
|Operations are being performed during network connection||The module is connected to the network and the Wi-Fi indicator is always on||34||372||mA|
|Weakly connected||The module and the hotspot are weakly connected and the Wi-Fi indicator light is always on||39||378||mA|
|Disconnected||The module is in a disconnected state and the Wi-Fi indicator light is always off||57||420||mA|
|Module disabled||The EN pin of the module is connected to the ground.||23||20||mA|
|DTIM10||The module is in low power consumption mode and wakes up once every 1000 ms||230||/||μA|
|Low power consumption mode RX||The module MCU is in the Sleep state, Wi-Fi is in the Active state, and the RX listening beacon is turned on, once every 1000 ms||25||/||mA|
When the module is powered on, started/reset, and works normally, there is a high instantaneous peak current. It is recommended that the customer’s backplane add two 22 μF/withstand voltage 25V/0805 packaged large capacitors at the power input of the module. The above test data is based on adding two 22 μF capacitors. The recommended current is greater than 500 mA during normal operation.
|Frequency range||2.400 to 2.4835 GHz|
|Wi-Fi standard||IEEE 802.11b/g/n (channels 1 to 14)|
|Bluetooth standard||Bluetooth 5.0: 1/2Mbps|
|Data transmission rate||11b: 1, 2, 5.5, 11 (Mbps)|
|Data transmission rate||11g: 6, 9, 12, 18, 24, 36, 48, 54 (Mbps)|
|Data transmission rate||11n: HT20 MCS0 to 7|
|Antenna type||FPC IPEX antenna|
|Parameter||Minimum value||Typical value||Maximum value||Unit|
|Average RF output power, 802.11b CCK Mode 1M||-||17||-||dBm|
|Average RF output power, 802.11b CCK Mode 11M||-||17||-||dBm|
|Average RF output power, 802.11g OFDM Mode 6M||-||16||-||dBm|
|Average RF output power, 802.11g OFDM Mode 54M||-||16||-||dBm|
|Average RF output power, 802.11n OFDM Mode MCS0||-||16||-||dBm|
|EAverage RF output power, 802.11n OFDM Mode MCS7||-||15||-||dBm|
|Average RF output power, Bluetooth 5.0 1M||-||7||-||dBm|
|EVM@802.11b CCK 11 Mbps Mode 17 dBm||-||-||-17||dB|
|EVM@802.11g OFDM 54 Mbps Mode 16 dBm||-||-||-29||dB|
|EVM@802.11n OFDM MCS7 Mode 15 dBm||-||-||-30||dB|
|Parameter||Minimum Value||Typical Value||Maximum Value||Unit|
|PER<8%, RX sensitivity, 802.11b CCK Mode 1M||-||-96||-||dBm|
|PER<8%, RX sensitivity, 802.11b CCK Mode 11M||-||-90||-||dBm|
|PER<10%, RX sensitivity, 802.11g OFDM Mode 6M||-||-91||-||dBm|
|PER<10%, RX sensitivity, 802.11g OFDM Mode 54M||-||-75||-||dBm|
|PER<10%, RX sensitivity, 802.11n OFDM Mode MCS0||-||-91||-||dBm|
|PER<10%, RX sensitivity, 802.11n OFDM Mode MCS7||-||-72||-||dBm|
|PER<30.8%, RX sensitivity, Bluetooth 5.0 1M||-||-95||-||dBm|
|PER<30.8%, RX sensitivity, Bluetooth 5.0 2M||-||-93||-||dBm|
WXU-IPEX adopts the external IPEX antenna.
To ensure optimal Wi-Fi performance when the Wi-Fi module uses an onboard PCB antenna, it is recommended that the antenna be at least 15 mm away from other metal parts.
The mechanical dimensions of the PCB of WXU-IPEX are 15.8±0.35 mm (W) × 20.3±0.35 mm (L) × 1.0±0.1 mm (H). The following figure shows the mechanical dimensions of WXU-IPEX:
The default dimensional tolerance is ±0.35 mm. If customers have specific requirements on dimensions, they should make them clear in the module datasheet after communication.
The following figure is the schematic diagram of WXU-IPEX:
The following figure is the diagram of PCB packaging:
For the modules that can be packaged with the SMT or in an in-line way, you can select either of them according to the PCB design solutions of customers. If a PCB is designed to be SMT-packaged, package the module with the SMT. If a PCB is designed to be in-line-packaged, package the module in an in-line way. After being unpacked, the module must be soldered within 24 hours. Otherwise, it needs to be put into the drying cupboard where the relative humidity is not greater than 10%; or it needs to be packaged again under vacuum and the exposure time needs to be recorded (the total exposure time cannot exceed 168 hours).
Storage conditions for a delivered module:
The moisture-proof bag must be placed in an environment where the temperature is below 40°C and the relative humidity is lower than 90%.
The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed.
There is a humidity indicator card (HIC) in the packaging bag.
The module needs to be baked in the following cases:
In the whole production process, take electrostatic discharge (ESD) protective measures.
To guarantee the passing rate, it is recommended that you use the SPI and AOI to monitor the quality of solder paste printing and mounting.
Select a proper soldering manner according to the process. For the SMT process, please refer to the recommended oven temperature curve of reflow soldering. For the wave soldering process, please refer to the recommended oven temperature curve of wave soldering. There are some differences between the set temperatures and the actual temperatures. All the temperatures shown in this module datasheet are obtained through actual measurements.
Manner 1: SMT process (Recommended oven temperature curve of reflow soldering)
Set oven temperatures according to the following curve.
A: Temperature axis
B: Time axis
C: Liquidus temperature: 217 to 220°C
D: Ramp-up slope: 1 to 3°C/s
E: Duration of constant temperature: 60 to 120s; the range of constant temperature: 150 to 200°C
F: Duration above the liquidus: 50 to 70s
G: Peak temperature: 235 to 245°C
H: Ramp-down slope: 1 to 4°C/s
The above curve is just an example of the solder paste SAC305. For more details about other solder pastes, please refer to Recommended oven temperature curve in the solder paste specifications.
Manner 2: Wave soldering process (Oven temperature curve of wave soldering)
Set oven temperatures according to the following temperature curve of wave soldering. The peak temperature is 260°C±5°C.
|Suggestions on oven temperature curve of wave soldering||Suggestions on manual soldering temperature|
|Preheat temperature||80 to 130 °C||Soldering temperature||360±20°C|
|Preheat time||75 to 100s||Soldering time||＜3s/point|
|Peak contact time||3 to 5s||NA||NA|
|Temperature of tin cylinder||260±5°C||NA||NA|
|Product number||MOQ (pcs)||Packing method||The number of modules per reel||The number of reels per carton|
FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this device. The module is limited to installation in mobile or fixed applications.
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.
Note: This device has been tested and found to comply with the limits for a Class B digital device, according to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This device generates, uses, and can radiate radio frequency energy and, if not installed and used following the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation.
If this device does cause harmful interference to radio or television reception, which can be determined by turning the device off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
Radiation Exposure Statement
This device complies with FCC radiation exposure limits set forth for an uncontrolled rolled environment. This device should be installed and operated with a minimum distance of 20cm between the radiator and your body.
This radio module must not be installed to co-locate and operate simultaneously with other radios in the host system except following FCC multi-transmitter product procedures. Additional testing and device authorization may be required to operate simultaneously with other radios.
The availability of some specific channels and/or operational frequency bands are country dependent and are firmware programmed at the factory to match the intended destination. The firmware setting is not accessible to the end-user.
The host product manufacturer is responsible for compliance with any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed. A separate approval is required for all other operating configurations including portable configurations with respect to Part 2.1093 and different antenna configurations.
The end-user manual shall include all required regulatory information/warnings as shown in this manual, including “This product must be installed and operated with a minimum distance of 20 cm between the radiator and user body”. The OEM integrator is responsible for ensuring that the end-user has no manual instructions to remove or install the module.
This device has got an FCC ID: 2ANDL-WXU-IPEX. The end product must be labeled in a visible area with the following: “Contains Transmitter Module FCC ID: 2ANDL-WXU-IPEX”.
This device is intended only for OEM integrators under the following conditions:
The antenna must be installed such that 20cm is maintained between the antenna and users, and the transmitter module may not be co-located with any other transmitter or antenna.
As long as the 2 conditions above are met, further transmitter tests will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed.
Declaration of Conformity European Notice
Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module product is in compliance with essential requirements and other relevant provisions of Directive 2014/53/EU, 2011/65/EU. A copy of the Declaration of conformity can be found at https://www.tuya.com.
This product must not be disposed of as normal household waste, in accordance with the EU directive for waste electrical and electronic equipment (WEEE-2012/19/EU). Instead, it should be disposed of by returning it to the point of sale, or to a municipal recycling collection point.
The device could be used with a separation distance of 20cm from the human body.
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