HPWSMS1 Module Datasheet

HPWSMS1 is a low-power embedded Wi-Fi+Bluetooth module that Tuya has developed. It consists of a highly integrated RF chip RS9116 and a few peripherals. The single bands QMS and WMS SoCs support the full multi-protocol wireless connection. Redpine offers the Linux and Android systems the drive programs.

Features

• Wi-Fi standards
  • Support the IEEE802.11 b/g/n mode
  • Support the band width of 20 MHz
  • Maximum transmit power: 16 dB
  • Receive power: -95 dB@1M
  • Frequency range: 2412 MHz to 2484 MHz
• Bluetooth standards
  • Bluetooth 4.2 and Bluetooth 5.0
  • Maximum transmit power: -1.5 dB (the bluetooth is only used for searching for the SSID of a device)

Working conditions

• Working voltage: 1.76 to 3.65V
• Working temperature: -40℃ to -85℃

Security features

• Hardware device identification and secret key are stored at the PUF
• Accelerators: AES 128/256, SHA 256/384/512, HMAC, RSA, ECC, ECDH, RNG, and CRC
• WPA/WPA2-Personal, WPA/WPA2 Enterprise for Client, EAP-TLS, EAP-FAST, EAP-TTLS, EAP-LEAP, and PEAP-MSCHAP-v2
• Real random
• Secure boot
• Secure and backup firmware upgrade
• FIPS140-2 compatible

Applications

• Multimedia
• Consumer electronics
• Home appliances
• Industrial and home automation
• Intelligent gateway and metering

Module interfaces

Dimensions and package

HPWSMS1 has 100 pins with a 0.7±0.1 mm pin spacing.

The HPWSMS1 dimensions are 20±0.35 mm (W) ×14±0.35 mm (L) ×3±0.15 mm (H).

HPWSMS1 is shown below:

Pin definition

Pin No.	IC	I/O
1	GND	GND
2	NC	/
3	NC	/
4	NC	/
5	NC	/
6	NC	/
7	A35	GPIO
8	NC	/
9	GND	GND
10	GND	GND
11	A37	USB_ID
12	A40	USB_DM
13	B36	USB_DP
14	A39	USB_AVDD_3P3, USB 3V3 power supply pin
15	B35	USB_AVDD_1P1, USB 1V1 power supply pin
16	A38	USB_VBUS, USB 5V power supply pin
17	VOUTLDOSOC Output of SoC LDO	Electric power conversion pin of chip
18	NC	/
19	NC	/
20	GND	GND
21	NC	/
22	A42	SDIO_DATA3, SDIO data pin
23	A43	SDIO_DATA2, SDIO data pin
24	B40	SDIO_CLK
25	A1	SDIO_CMD
26	NC	/
27	NC	/
28	NC	/
29	PA_AVDD	3.3V power supply pin
30	GND	GND
31	GND	GND
32	RF OUT	RF output pin, connected to the antenna link at the baseboard
33	GND	GND
34	GND	GND
35	GND	GND
36	GND	GND
37	NC	/
38	GND	GND
39	B10	HOST_BB_EN, sleep control pin, which is used for sending instructions to the host processor. When the chip enters the ULP sleep mode and gives an instruction, it is in the low logic, and when the chip exits from the ULP sleep mode and gives an instruction, it is in the high logic.
40	NC	/
41	NC	/
42	GND	GND
43	GND	GND
44	GND	GND
45	GND	GND
46	NC	/
47	GND	GND
48	GND	GND
49	VIN_MOD	3.3V power supply pin
50	A16	TMS, JTAG software debugging pin
51	B15	TD0, JTAG software debugging pin
52	A17	TCK, JTAG software debugging pin
53	B16	TDI, JTAG software debugging pin
54	A19	GPIO
55	NC	/
56	NC	/
57	GND	GND
58	A20	UART1_RX
59	A21	UART1_TX
60	B18	GPIO
61	A22	GPIO
62	B21	GPIO
63	A24	GPIO
64	B22	GPIO
65	A27	POC_IN, Power On Control Input
66	B24	ULP low-power sleep control pin
67	GND	GND
68	GND	GND
69	A29	32.768-K crystal input pin, NC by default
70	GND	GND
71	NC	/
72	A31	RESET_N, resetting pin Pull the voltage to 3.3V through the master MCU or pull the voltage to 3.3V by connecting to the external.
73	NC	/
74	NC	/
75	A41	GPIO
76	B39	SDIO_DATA0, SDIO data pin
77	A44	SDIO_DATA1, SDIO data pin
78	SDIO_IO_VDD	3.3V power supply pin
79	NC	/
80	NC	/
81	A4	GPIO
82	PA_AVDD	3.3V power supply pin
83	GND	GND
84	GND	GND
85	GND	GND
86	GND	GND
87	GND	GND
88	GND	GND
89	NC	/
90	GND	GND
91	A25	GPIO
92	B25	POC_OUT, Power On Control Output.
93	GND	GND
94	UULP_VBAT	3.3V power supply pin
95	GND	GND
96	B26	32.768-K crystal input pin, NC by default
97	GND	GND
98	VINBCKDC	3.3V power supply pin
99	NC	/
100	NC	/

Electrical parameters

Absolute electrical parameters

Parameter	Description	Minimum value	Maximum value	Unit
Ta	Working temperature	-40	85	℃
VBAT	Power supply voltage	-0.3	3.9	V
Static electricity discharge voltage (human body model)	TAMB-25℃	-	2	KV
Static electricity discharge voltage (machine model)	TAMB-25℃	-	0.5	KV

Normal working conditions

Parameter	Description	Minimum value	Typical value	Maximum value	Unit
Ta	Working temperature	-40	-	85	℃
VCC	Working voltage	1.76	3.3	3.65	V

Power consumption during constant transmission, receiving, and sleep

Working status	Mode	Rate	Transmit power/Receive	Average value	Peak value (Typical value)	Unit
Transmit	11b	11Mbps	+17.5dBm	288	455	mA
Transmit	11g	54Mbps	+15dBm	156	228	mA
Transmit	11n-HT20	MCS7	+15dBm	130	227	mA
Receive	11b	11Mbps	Constantly receive	125	129.7	mA
Receive	11g	54Mbps	Constantly receive	125	129.7	mA
Receive	11n-HT20	MCS7	Constantly receive	125	129.7	mA
Sleep mode	/	/	the average of current within the 6 min’s test time	120	/	uA

RF parameters

Basic RF features

Parameter	Description
Working frequency	Wi-Fi: 2.412 to 2.484 Ghz (Channels 1 to 11 for US/CA); Bluetooth: 2402 to 2480 MHz
Wi-Fi standard	IEEE 802.11b/g/n
Data transmission rate	Wi-Fi: 11b: 1, 2, 5.5, 11 (Mbps); 11g: 6, 9, 12, 18, 24, 36, 48, 54 (Mbps); 11n: HT20 MCS 0 to 7; Bluetooth 1M/2M
Antenna type	There is a reserved antenna interface pin on the module. Actually, the antenna should be on the baseboard

TX performance

2.4G TX performance

Parameter	Minimum value	Typical value	Maximum value	Unit
Average RF output power, 802.11b CCK Mode 11M	-	16	-	dBm
Average RF output power, 802.11g OFDM Mode 54M	-	13	-	dBm
Average RF output power, 802.11n HT20 Mode MCS7	-	13	-	dBm
Frequency error	-10	-	10	ppm
Bluetooth 1M/2M output power	-	-1.5	-	dBm

Note: To meet the requirements of FCC, the power of channels 1 and 11 (left and right bands) needs to be lowered.

RX performance

RX sensitivity

Parameter	Minimum value	Typical value	Maximum value	Unit
PER<8%, RX sensitivity, 802.11b DSSS Mode 11M	-	-86	-	dBm
PER<10%, RX sensitivity, 802.11g 54 M	-	-74	-	dBm
PER<10%, RX sensitivity, 802.11n HT20-MCS7	-	-68	-	dBm

Antenna information

Antenna type

There is a reserved antenna interface pin on the module. Actually, the antenna should be on the baseboard.

Antenna interference reduction

To ensure the optimal Wi-Fi performance, it is recommended that the antenna be at least 15 mm away from other metal parts.
To prevent adverse impact on the antenna radiation performance, avoid copper or traces within the antenna area on the PCB.

Packaging information and production instructions

Mechanical dimensions

The PCB dimensions are 20±0.35 mm (L)×14±0.35 mm (W) ×3±0.15 mm (H).

Production instructions

• The stamp-hole module must be mounted by the SMT machine. After being unpacked, it must be soldered within 24 hours. Otherwise, it must be put into the drying cupboard where the RH is not greater than 10%, or it needs to be packaged under vacuum again and the exposure time needs to be recorded (the total exposure time cannot exceed 168 hours).

  • SMT equipment:
    • Mounter
    • SPI
    • Reflow soldering machine
    • Oven temperature tester
    • Automated optical inspection (AOI) equipment
  • Baking equipment:
    • Cabinet oven
    • Anti-static heat-resistant pallets
    • Anti-static heat-resistant gloves

• Storage conditions for a delivered module are as follows:

  • The moisture-proof bag must be placed in an environment where the temperature is below 40°C and the relative humidity is lower than 90%.
  • The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed.
  • The package contains a humidity indicator card (HIC).
    

• The module needs to be baked in the following cases:

  • Vacuum packing bag was found to be damaged before being unpacked.
  • There is no humidity indicator card (HIC) in the vacuum packing bag.
  • After being unpacked, 10% and above circles on the HIC become pink.
  • The total exposure time has been more than 168 hours since unpacking.
  • More than 12 months have passed since the sealing date of the bag.

• Baking settings:

  • Temperature: 60°C and ≤ 5%RH for reelizing and 125°C and ≤5%RH for palletizing (please use heat-resistant pallet rather than plastic pallet)
  • Time: 48 hours for reelizing and 12 hours for palletizing
  • Alarm temperature: 65°C for reelizing and 135°C for palletizing
  • Production ready temperature after natural cooling: < 36°C
  • The number of drying times: 1
  • Re-baking condition: If a module remains unused for 168 hours after being unpacked, it must be baked again.

    Important: If this batch of modules is not baked within 168 hours, do not use the wave soldering to solder them. Because these modules are 3-level moisture-sensitive components, they are very likely to get damp when exposed outside. In this case, if they are soldered at high temperatures, it may result in component failure or poor soldering.

• In the whole production process, take electrostatic discharge (ESD) protective measures.

• To guarantee the passing rate, it is recommended that you use the SPI and AOI to monitor the quality of solder paste printing and mounting.

Recommended oven temperature curve

Perform mounting with the SMT based on the following reflow oven temperature curve. The highest temperature is 245°C. The reflow temperature curve is as below:

• A: Temperature axis

• B: Time axis

• C: Liquidus temperature: 217 to 220°C

• D: Ramp-up slope: 1 to 3°C/s

• E: Duration of constant temperature: 60 to 120s; the range of constant temperature: 150 to 200°C

• F: Duration above the liquidus: 50 to 70s

• G: Peak temperature: 235 to 245°C

• H: Ramp-down slope: 1 to 4°C/s

  Note: The above curve is just an example of the solder paste SAC305. For more details about other solder pastes, please refer to Recommended oven temperature curve in the solder paste specifications.

Storage conditions

MOQ and packaging information

Product number	MOQ (pcs)	Shipping packaging method	The number of modules per reel	The number of reels per carton
HPWSMS1		Tape reel		4

Appendix: Statement

FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this device.

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

Note: This device has been tested and found to comply with the limits for a Class B digital device, according to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This device generates, uses, and can radiate radio frequency energy and, if not installed and used following the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation.

If this device does cause harmful interference to radio or television reception, which can be determined by turning the device off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

• Reorient or relocate the receiving antenna.
• Increase the separation between the device and receiver.
• Connect the device into an outlet on a circuit different from that to which the receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help.

Radiation Exposure Statement

This device complies with FCC radiation exposure limits set forth for an uncontrolled rolled environment. This device should be installed and operated with a minimum distance of 20cm between the radiator and your body.

Important Note

This radio module must not be installed to co-locate and operating simultaneously with other radios in the host system except following FCC multi-transmitter product procedures. Additional testing and device authorization may be required to operate simultaneously with other radios.

The availability of some specific channels and/or operational frequency bands are country-dependent and are firmware programmed at the factory to match the intended destination. The firmware setting is not accessible by the end-user.

The host product manufacturer is responsible for compliance with any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.

The end-user manual shall include all required regulatory information/warnings as shown in this manual, including “This product must be installed and operated with a minimum distance of 20 cm between the radiator and user body”.

This device has got an FCC ID: 2ANDL-HPWSMS1. The end product must be labeled in a visible area with the following: “Contains Transmitter Module FCC ID: 2ANDL-HPWSMS1”.

This device is intended only for OEM integrators under the following conditions:

The antenna must be installed such that 20cm is maintained between the antenna and users, and the transmitter module may not be co-located with any other transmitter or antenna.

As long as the 2 conditions above are met, further transmitter tests will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed.