CR3L-IPEX Module Datasheet

CR3L-IPEX is a low-power embedded Wi-Fi+Bluetooth LE module that Tuya has developed. It consists of a highly integrated RF chip (RTL8720CM), with an embedded Wi-Fi network protocol stack and rich library functions.

Overview

With the maximum CPU clock rate of 100MHz, CR3L-IPEX contains a low-power KM4 MCU, a WLAN MAC, a 1T1R WLAN module, 4-MB SRAM, 4-MB flash memory, and extensive peripherals.

CR3L-IPEX is an RTOS platform that integrates all function libraries of the Wi-Fi MAC and TCP/IP protocols. You can develop embedded Wi-Fi products as required.

Features

• Embedded low-power KM4 MCU, which can also function as an application processor
• Clock rate: 100MHz
• Operating voltage: 3.0 to 3.6 V
• Peripherals: 9 GPIOs, 1 UART, and 1 Log_Tx
• Wi-Fi/BT connectivity
  • 802.11 B/G/N20
  • Channels 1 to 14 at 2.4 Ghz (channels 1 to 11 for US/CA and channels 1 to 13 for EU/CN)
  • Support WEP/WPA/WPA2/WPA2 PSK (AES) security modes
  • Support Bluetooth LE 4.2
  • +20 dBm output power in 802.11b mode
  • Support SmartConfig for Android and iOS devices
  • IPEX antenna
  • Passed CE and FCC certifications
  • Operating temperature: -40℃ to 105℃

Applications

• Intelligent building
• Smart household and home appliances
• Smart socket and light
• Industrial wireless control
• Baby monitor
• Network camera
• Intelligent bus

Change history

Date	Updated content	Version after update
3/8/2021	This is the first release.	V1.0.0

Module interfaces

Dimensions and footprint

CR3L-IPEX has two lines of pins with a pin spacing of 2 mm. Each line has 8 pins. The CR3L-IPEX dimensions are 16±0.35 mm (W)×24±0.35 mm (L) ×2.8±0.15 mm (H), which are shown as below:

Pin definition

Pin number	Symbol	I/O type	Function
1	RST	I/O	Reset pin, which is connected to the enabling pin inside the module.
2	NC	I/O	The pin is not connected to anything.
3	EN	I/O	Enabling pin, active at high level. The module has been pulled up, so users can control the pin externally.
4	A_20	I/O	GPIOA_20, GPIO, IC Pin1
5	A_2	I/O	GPIOA_2, hardware PWM, IC Pin 18
6	A_3	I/O	GPIOA_3, hardware PWM, IC Pin 19
7	A_4	I/O	GPIOA_4, hardware PWM, IC Pin 20
8	VD33	P	Power supply pin (3.3V)
9	GND	P	Power supply reference ground
10	A_15	I/O	GPIOA_15, common pin, IC Pin 36
11	A_16	I/O	GPIOA_16, UART_Log_TXD, which is used for displaying the module internal information and can be configured as a common GPIO
12	A_17	I/O	GPIOA_17, hardware PWM, IC Pin 38
13	A_18	I/O	GPIOA_18, hardware PWM, IC Pin 39
14	A_19	I/O	GPIOA_19, hardware PWM, IC Pin 40
15	RXD	I/O	GPIOA_13, UART0_RXD, which is used as a user-side serial port
16	TXD	I/O	GPIOA_14, UART0_TXD, which is used as a user-side serial port

Note: P indicates power supply pins and I/O indicates input/output pins. Test points A0 and A1 are prohibited.

Electrical parameters

Absolute electrical parameters

Parameter	Description	Minimum value	Maximum value	Unit
Ts	Storage temperature	-40	125	℃
VDD	Power supply voltage	-0.3	3.6	V
ESD voltage (human body model)	TAMB-25℃	-	2	KV
ESD voltage (machine model)	TAMB-25℃	-	0.5	KV

Operating conditions

Parameter	Description	Minimum value	Typical value	Maximum value	Unit
Ta	Operating temperature	-20	-	105	℃
VDD	Operating voltage	3.0	-	3.6	V
VIL	I/O low-level input	-	-	0.8	V
VIH	I/O high-level input	2.0	-	-	V
VOL	I/O low-level output	-	-	0.4	V
VOH	I/O high-level output	2.4	-	-	V
Imax	I/O drive current	-	-	16	mA
Cpad	Input pin capacitance	-	2	-	pF

RF power consumption

TX power consumption:

Symbol	Mode	power	Average value	Peak value (Typical value）	Unit
RF	11b 1Mbps	16dBm	301	323	mA
RF	11b 11Mbps	16dBm	246	258	mA
RF	11g 6Mbps	14.5dBm	218	240	mA
RF	11g 54Mbps	14.5dBm	194	224	mA
RF	11n BW20 MCS0	13.5dBm	202	225	mA
RF	11n BW20 MCS7	13.5dBm	195	227	mA

RX power consumption:

Symbol	Mode	Average value	Peak value (Typical value)	Unit
IRF	11B 11M	61	68	mA
IRF	11G 54M	61	68	mA
IRF	11N HT20 MCS7	61	68	mA

Power consumption during operating

Working mode	Working status (Ta = 25°C)	Average value	Peak value (Typical value)	Unit
Quick connection network state	The module is in the fast network connection state and the Wi-Fi indicator always flashes	75	324	mA
Connected and idle state	The module is connected to the network and the Wi-Fi indicator is always on	64	342	mA
Connected and operating state	The module is connected to the network and the Wi-Fi indicator is always on	63	330	mA
Disconnected state	The module is disconnected and the Wi-Fi indicator is dark	66	309	mA

RF parameters

Basic RF features

Parameter	Description
Frequency range	2.400 to 2.4835 GHz
Wi-Fi standard	IEEE 802.11b/g/n (channels 1 to 14)
Bluetooth LE standard	Bluetooth V4.2
Data transmission rate	11b:1, 2, 5.5, 11 (Mbps)
Data transmission rate	11g: 6, 9, 12, 18, 24, 36, 48, 54 (Mbps)
Data transmission rate	11n: HT20 MCS 0 to 7
Antenna Type	IPEX antenna with a gain of 3.3 dBi

TX performance

Parameter	Minimum value	Typical value	Maximum value	Unit
Average RF output power, 802.11b CCK Mode, 1 Mbit/s	-	16	-	dBm
Average RF output power, 802.11g OFDM mode, 54 Mbit/s	-	14.5	-	dBm
Average RF output power, 802.11n OFDM mode, MCS7	-	13.5	-	dBm
Average RF output power, Bluetooth LE V4.2, 1 Mbit/s	-	6.5	-	dBm
Frequency error	-20	-	20	ppm
EVM@802.11b CCK 11Mbps Mode 17.5 dBm	-	-	-10	dB
EVM@802.11g OFDM 54Mbps Mode 14.5dBm	-	-	-29	dB
EVM@802.11n OFDM MCS7 Mode 13.5dBm	-	-	-30	dB

RX performance

Parameter	Minimum value	Typical value	Maximum value	Unit
PER<8%, RX sensitivity, 802.11b CCK Mode 1M	-	-91	-	dBm
PER<10%, RX sensitivity, 802.11g OFDM Mode 54M	-	-75	-	dBm
PER<10%, RX sensitivity, 802.11n OFDM Mode MCS7	-	-72	-	dBm
PER<10%, RX sensitivity, Bluetooth LE 4.2 1M	-	-93	-	dBm

Antenna

Antenna type

CR3L-IPEX uses only the IPEX antenna with a gain of 3.3 dBi.

Antenna interference reduction

To ensure optimal Wi-Fi performance when the Wi-Fi module uses an onboard PCB antenna, it is recommended that the antenna be at least 15 mm away from other metal parts.

Packaging information and production instructions

Mechanical dimensions

The mechanical dimensions of the PCB of CR3L-IPEX are 16±0.35 mm (W)×24±0.35 mm (L) ×0.8±0.1 mm (H).

Note: The default dimensional tolerance is ±0.35 mm. If you have specific requirements on key dimensions, make them clear in the datasheet after communication.

Recommended PCB footprint

The schematic diagram of correspondence of pins of CR3L-IPEX

The PCB footprint of CR3L-IPEX is shown as below:

Production instructions

1. The Tuya SMT module should be mounted by the SMT device. After being unpacked, it should be soldered within 24 hours. Otherwise, it should be put into the drying cupboard where the RH is not greater than 10%; or it needs to be packaged under vacuum again and the exposure time needs to be recorded (the total exposure time cannot exceed 168 hours).
   • SMT devices:
     • Mounter
     • SPI
     • Reflow soldering machine
     • Thermal profiler
     • Automated optical inspection (AOI) equipment
   • Baking devices:
     • Cabinet oven
     • Anti-electrostatic and heat-resistant trays
     • Anti-electrostatic and heat-resistant gloves
2. Storage conditions for a delivered module:

   • The moisture-proof bag must be placed in an environment where the temperature is below 40°C and the relative humidity is lower than 90%.

   • The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed.

   • There is a humidity indicator card (HIC) in the packaging bag.

     

3. The module needs to be baked in the following cases:
   • The packaging bag is damaged before unpacking.
   • There is no HIC in the packaging bag.
   • After unpacking, circles of 10% and above on the HIC become pink.
   • The total exposure time has lasted for over 168 hours since unpacking.
   • More than 12 months has passed since the sealing of the bag.
4. Baking settings:
   • Temperature: 60°C and ≤ 5% RH for reel package and 125°C and ≤5% RH for tray package (please use the heat-resistant tray rather than plastic container)
   • Time: 48 hours for reel package and 12 hours for tray package
   • Alarm temperature: 65°C for reel package and 135°C for tray package
   • Production-ready temperature after natural cooling: < 36°C
   • Re-baking situation: If a module remains unused for over 168 hours after being baked, it needs to be baked again.
   • If a batch of modules is not baked within 168 hours, do not use the reflow soldering to solder them. Because these modules are Level-3 moisture-sensitive devices, they are very likely to get damp when exposed beyond the allowable time. In this case, if they are soldered at high temperatures, it may result in device failure or poor soldering.
5. In the whole production process, take electrostatic discharge (ESD) protective measures.
6. To guarantee the passing rate, it is recommended that you use the SPI and AOI to monitor the quality of solder paste printing and mounting.

Recommended oven temperature curve

Set oven temperatures according to the following temperature curve of reflow soldering. The peak temperature is 245°C.

• A: Temperature axis

• B: Time axis

• C: Liquidus temperature: 217 to 220°C

• D: Ramp-up slope: 1 to 3°C/s

• E: Duration of constant temperature: 60 to 120s; the range of constant temperature: 150 to 200°C

• F: Duration above the liquidus: 50 to 70s

• G: Peak temperature: 235 to 245°C

• H: Ramp-down slope: 1 to 4°C/s

  Note: The above curve is just an example of the solder paste SAC305. For more details about other solder pastes, please refer to Recommended oven temperature curve in the solder paste specifications.

Storage conditions

MOQ and packaging information

Product model	MOQ (pcs)	Packaging method	Number of modules per reel	Number of reels per carton
CR3L-IPEX	3600	Tape reel	900	4

Appendix: Statement

FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this device.

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

Note: This device has been tested and found to comply with the limits for a Class B digital device, according to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This device generates, uses, and can radiate radio frequency energy and, if not installed and used following the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation.

If this device does cause harmful interference to radio or television reception, which can be determined by turning the device off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

• Reorient or relocate the receiving antenna.
• Increase the separation between the device and receiver.
• Connect the device into an outlet on a circuit different from that to which the receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help.

Radiation Exposure Statement

This device complies with FCC radiation exposure limits set forth for an uncontrolled rolled environment. This device should be installed and operated with a minimum distance of 20cm between the radiator and your body.

Important Note

This radio module must not be installed to co-locate and operating simultaneously with other radios in the host system except following FCC multi-transmitter product procedures. Additional testing and device authorization may be required to operate simultaneously with other radios.

The availability of some specific channels and/or operational frequency bands are country dependent and are firmware programmed at the factory to match the intended destination. The firmware setting is not accessible by the end-user.

The host product manufacturer is responsible for compliance with any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.

The end-user manual shall include all required regulatory information/warnings as shown in this manual, including “This product must be installed and operated with a minimum distance of 20 cm between the radiator and user body”.

This device has got an FCC ID: 2ANDL-CR3L-IPEX. The end product must be labeled in a visible area with the following: “Contains Transmitter Module FCC ID: 2ANDL-CR3L-IPEX”.

This device is intended only for OEM integrators under the following conditions:

The antenna must be installed such that 20cm is maintained between the antenna and users, and the transmitter module may not be co-located with any other transmitter or antenna.

As long as the 2 conditions above are met, further transmitter tests will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed.

Declaration of Conformity European Notice

Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module product is in compliance with essential requirements and other relevant provisions of Directive 2014/53/EU,2011/65/EU. A copy of the Declaration of conformity can be found at https://www.tuya.com.

This product must not be disposed of as normal household waste, in accordance with the EU directive for waste electrical and electronic equipment (WEEE-2012/19/EU). Instead, it should be disposed of by returning it to the point of sale, or to a municipal recycling collection point.

The device could be used with a separation distance of 20cm to the human body.