CBLC9 Module Datasheet

CBLC9 is a low-power embedded Wi-Fi module that Tuya has developed. It consists of a highly integrated RF chip BK7231N and a few peripherals, and not only supports the AP and STA dual-network-connection manner but supports the Bluetooth LE communication manner.

Overview

CBLC9 is built-in with a 32-bit MCU with a running speed of up to 120 MHz, 2-MB flash memory, and 256-KB RAM, so as to connect to the Tuya Cloud. The MCU’s specially extended instructions for processing signals can effectively implement audio encoding and decoding. Up to five ways of 32-bit PWM output make the chip very suitable for high-quality LED control.

Features

• Embedded low-power 32-bit CPU, which can also function as an application processor
• The clock rate: 120 MHz
• Operating voltage: 3 to 3.6V
• Peripheral: 5 PWMs
• Wi-Fi connectivity
  • 802.11 b/g/n
  • Channels 1 to 14@2.4 GHz
  • Support WEP, WPA/WPA2, WPA/WPA2 PSK (AES), WPA3 security modes
  • Up to + 16dBm output power in 802.11b mode
  • Support STA/AP/STA+AP working mode
  • Support SmartConfig and AP network configuration manners for Android and iOS devices
  • Operating temperature: -40℃ to 105℃
• Bluetooth LE connectivity
  • Support the Bluetooth LE V5.2
  • Up to 6 dBm transmit power in bluetooth mode
  • Bluetooth coexistence interface

Applications

• Intelligent building
• Smart household
• Smart home appliances
• Smart socket and light
• Industrial wireless control
• Baby monitor
• Network camera
• Intelligent bus

Module interfaces

Dimensions and package

CBLC9 has two rows of pins with a spacing of 2±0.1 mm.

The CBLC9 dimensions are 15±0.35 mm (W)×16.8±0.35 mm (L) ×1.9±0.15 mm (H).

Pin definition

Pin number	Symbol	I/O type	Function
1	P9	I/O	Support hardware PWM and correspond to P9 on the internal IC
2	P8	I/O	Common I/O pin and correspond to P8 on the internal IC
3	P6	I/O	Support hardware PWM and correspond to P6 on the internal IC
4	P7	I/O	Support hardware PWM and correspond to P7 on the internal IC
5	P24	I/O	Support hardware PWM and correspond to P24 on the internal IC
6	VCC	P	Power supply pin (3.3V)
7	P26	I/O	Support hardware PWM and correspond to P26 on the internal IC
8	GND	P	Power supply reference ground

Note: P indicates a power supply pin and I/O indicates an input/output pin.

Definitions of test points

Pin number	Symbol	I/O type	Function
TP1	RF	I/O	RF test point
TP2	GND	P	Connection point
TP3	CEN	I	Reset pin, 3.3V, pull-up resistor
TP4	U1_TXD	I/O	UART1_TX, user serial interface TX
TP5	U1_RXD	I/O	UART1_RX, user serial interface RX
TP6	U2_TXD	I/O	UART2_TX, LOG TX
TP8	CSN	I	Pull down externally before power on and RF calibration

Electrical parameters

Absolute electrical parameters

Parameter	Description	Minimum value	Maximum value	Unit
Ts	Storage temperature	-55	125	℃
VBAT	Power supply voltage	-0.3	3.9	V
ESD voltage (human body model)	TAMB-25℃	-4	4	KV
ESD voltage (machine model)	TAMB-25℃	-200	200	V

Normal working conditions

Parameter	Description	Minimum value	Typical value	Maximum value	Unit
Ta	Operating temperature	-40	-	105	℃
VBAT	Power supply voltage	3	3.3	3.6	V
VOL	I/O low level output	VSS	-	VSS+0.3	V
VOH	I/O high level output	VBAT-0. 3	-	VBAT	V
Imax	I/O drive current	-	6	20	mA
θ	Power supply slope	100	-	-	mV/ms

RF power consumption

Working status	Mode	Rate	Transmit power/receive	Average value	Peak value (Typical value)	Unit
Transmit	11b	11Mbps	+16dBm	279	315	mA
Transmit	11g	54Mbps	+14dBm	260	282	mA
Transmit	11n	MCS7	+13dBm	257	277	mA
Receive	11b	11 Mbps	Constantly receive	74	88	mA
Receive	11g	54 Mbps	Constantly receive	74	88	mA
Receive	11n	MCS 7	Constantly receive	74	88	mA

Operating current

Working mode	Working status, Ta = 25°C	Average value	Maximum value (Typical value)	Unit
Quick network connection state (Bluetooth)	The module is in the fast network connection state and the Wi-Fi indicator flashes fast	79	263	mA
Quick network connection state (AP)	The module is in the hotspot network connection state and the Wi-Fi indicator flashes slowly	80	310	mA
Quick network connection state (EZ)	The module is in the fast network connection state and the Wi-Fi indicator flashes fast	97	316	mA
Connected state	The module is connected to the network and the Wi-Fi indicator is always on	47	308	mA
Weakly connected state	The module and hotspot are in the state of weak connection and the Wi-Fi indicator light is always on	205	350	mA
Disconnected state	The module is disconnected and the Wi-Fi indicator is always off	79	263	mA

RF parameters

Basic RF features

Parameter	Description
Working frequency	2.412 to 2.480 GHz
Wi-Fi standard	IEEE 802.11 b/g/n (channels 1 to 14)
Data transmission rate	11b: 1, 2, 5.5, 11 (Mbps) 11g: 6, 9, 12, 18, 24, 36, 48, 54 (Mbps) 11n: HT20 MCS 0 to 7
Antenna type	Ceramic patch antenna, gain 1.2dbi

Wi-Fi transmission performance

Parameter	Minimum value	Typical value	Maximum value	Unit
Average RF output power, 802.11b CCK Mode 11M	-	16	-	dBm
Average RF output power, 802.11g OFDM Mode 54M	-	15	-	dBm
Average RF output power, 802.11n OFDM Mode MCS7	-	14	-	dBm
Frequency error	-10	-	10	ppm

Wi-Fi receiving performance

Parameter	Minimum value	Typical value	Maximum value	Unit
PER<8%, RX sensitivity, 802.11b DSSS Mode 11M	-	-85	-	dBm
PER<10%, RX sensitivity, 802.11g OFDM Mode 54M	-	-72	-	dBm
PER<10%, RX sensitivity, 802.11n OFDM Mode MCS7	-	-68	-	dBm
PER<10%, RX sensitivity, Bluetooth LE 1M	-	-94	-	dBm

Bluetooth LE transmission performance

Parameter	Minimum value	Typical value	Maximum value	Unit
Working frequency	2402	-	2480	MHz
Air rate	-	1	-	Mbps
Transmit power	-20	6	20	dBm
Frequency error	-150	-	150	kHz

Bluetooth Low Energy (LE) receiving performance

Parameter	Minimum value	Typical value	Maximum value	Unit
RX sensitivity	-	-93	-	dBm
Maximum RF signal input	-10	-	-	dBm
Inter-modulation	-	-	-23	dBm
Co-channel suppression ratio	-	10	-	dB

Antenna

Antenna type

CBLC9 uses the 3216 ceramic patch antenna.

Antenna interference reduction

When the Wi-Fi module uses the ceramic patch antenna, to ensure optimal Wi-Fi performance it is recommended that the antenna be at least 15 mm away from other metal parts.

To prevent an adverse impact on the antenna radiation performance, avoid copper or traces along the antenna area on the PCB.

Footprint information and production instructions

Mechanical dimensions

The CBLC9 PCB dimensions are 15±0.35 mm (W)×16.8±0.35 mm (L) ×1±0.1 mm (H).

Note: The default outline dimension tolerance is ±0.35 mm, and the critical dimension tolerance is ±0.15 mm. If you have specific requirements on dimensions, specify them clearly in the datasheet after communication.

Recommended footprint

Production instructions

1. For the Tuya in-line module, wave soldering is most preferred and manual soldering is less preferred. After being unpacked, the module must be soldered within 24 hours. Otherwise, it must be put into the drying cupboard where the RH is not greater than 10%; or it needs to be packaged under vacuum again and record the exposure time (the total exposure time cannot exceed 168 hours).
2. Wave soldering devices and materials:
   • Wave soldering equipment
   • Wave soldering fixture
   • Constant-temperature soldering iron
   • Tin bar, tin wire, and flux
   • Thermal profiler
3. Baking devices:
   • Cabinet oven
   • Anti-electrostatic and heat-resistant trays
   • Anti-electrostatic and heat-resistant gloves
4. The module needs to be baked in the following cases:
   • The packaging bag is damaged before unpacking.
   • There is no humidity indicator card (HIC) in the packaging bag.
   • After unpacking, circles of 10% and above on the HIC become pink.
   • The total exposure time has lasted for over 168 hours since unpacking.
   • More than 12 months have passed since the sealing of the bag.
5. Baking settings:
   • Temperature: 40°C and ≤ 5% RH for reel package and 125°C and ≤5% RH for tray package (please use the heat-resistant tray rather than a plastic container)
   • Time: 168 hours for reel package and 12 hours for tray package
   • Alarm temperature: 50°C for reel package and 135°C for tray package
   • Production-ready temperature after natural cooling: < 36°C
   • Re-baking situation: If a module remains unused for over 168 hours after being baked, it needs to be baked again.
   • If a batch of modules is not baked within 168 hours, do not use the wave soldering to solder them. Because these modules are Level-3 moisture-sensitive devices, they are very likely to get damp when exposed beyond the allowable time. In this case, if they are soldered at high temperatures, it may result in device failure or poor soldering.
6. In the whole production process, take electrostatic discharge (ESD) protective measures.
7. To guarantee the quality of products, you must pay attention to the following items: The amount of soldering flux, the height of the wave peak, whether the tin slag and copper content in the wave soldering tank exceed standards, whether the window and thickness of the wave soldering fixture are appropriate, and whether the wave soldering oven temperature curve is appropriate.

Recommended oven temperature curve and temperature

Set oven temperatures according to the following temperature curve of wave soldering. The peak temperature is 260°C±5°C.

Recommended soldering temperature:

Suggestions on oven temperature curve of wave soldering		Suggestions on manual soldering temperature
Preheat temperature	80 to 130 °C	Soldering temperature	360±20°C
Preheat time	75 to 100s	Soldering time	＜3s/point
Peak contact time	3 to 5s	NA	NA
Temperature of tin cylinder	260±5°C	NA	NA
Ramp-up slope	≤2°C/s	NA	NA
Ramp-down slope	≤6°C/s	NA	NA

Storage conditions

Storage conditions for a delivered module:

• The moisture-proof bag is placed in an environment where the temperature is below 40°C and the relative humidity is lower than 90%.

• The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed.

• There is a humidity indicator card (HIC) in the packaging bag.

  

  

MOQ and packaging information

Product model	MOQ (pcs)	Shipping packaging method	The number of modules per reel	The number of reels per carton
CBLC9	4400	Tape reel	1100	4

Appendix: Statement

FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this device.

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

Note: This device has been tested and found to comply with the limits for a Class B digital device, according to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This device generates, uses, and can radiate radio frequency energy and, if not installed and used following the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation.

If this device does cause harmful interference to radio or television reception, which can be determined by turning the device off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

• Reorient or relocate the receiving antenna.
• Increase the separation between the device and receiver.
• Connect the device into an outlet on a circuit different from that to which the receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help.

Radiation Exposure Statement

This device complies with FCC radiation exposure limits set forth for an uncontrolled rolled environment. This device should be installed and operated with a minimum distance of 20cm between the radiator and your body.

Important Note

This radio module must not be installed to co-locate and operating simultaneously with other radios in the host system except following FCC multi-transmitter product procedures. Additional testing and device authorization may be required to operate simultaneously with other radios.

The availability of some specific channels and/or operational frequency bands are country dependent and are firmware programmed at the factory to match the intended destination. The firmware setting is not accessible by the end-user.

The host product manufacturer is responsible for compliance with any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.

The end-user manual shall include all required regulatory information/warnings as shown in this manual, including “This product must be installed and operated with a minimum distance of 20 cm between the radiator and user body”.

The RF module is considered as a limited modular transmitter according to FCC rules. Even though the RF module gets an FCC ID, the host product manufacturer can not use the FCC ID on the final product directly. In these circumstances, the host product manufacturer integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining the FCC authorization by a Class II permissive change application or a new application.

Declaration of Conformity European Notice

Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module product is in compliance with essential requirements and other relevant provisions of Directive 2014/53/EU,2011/65/EU. A copy of the Declaration of conformity can be found at https://www.tuya.com.

This product must not be disposed of as normal household waste, in accordance with the EU directive for waste electrical and electronic equipment (WEEE-2012/19/EU). Instead, it should be disposed of by returning it to the point of sale, or to a municipal recycling collection point.

The device could be used with a separation distance of 20cm to the human body.