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CBLC9 Module Datasheet

Last Updated on : 2022-08-19 01:45:26download

CBLC9 is a low-power embedded Wi-Fi module that Tuya has developed. It consists of a highly integrated RF chip BK7231N and a few peripherals, and not only supports the AP and STA dual-network-connection manner but supports the Bluetooth LE communication manner.

Overview

CBLC9 is built-in with a 32-bit MCU with a running speed of up to 120 MHz, 2-MB flash memory, and 256-KB RAM, so as to connect to the Tuya Cloud. The MCU’s specially extended instructions for processing signals can effectively implement audio encoding and decoding. Up to five ways of 32-bit PWM output make the chip very suitable for high-quality LED control.

Features

  • Embedded low-power 32-bit CPU, which can also function as an application processor
  • The clock rate: 120 MHz
  • Operating voltage: 3 to 3.6V
  • Peripheral: 5 PWMs
  • Wi-Fi connectivity
    • 802.11 b/g/n
    • Channels 1 to 14@2.4 GHz
    • Support WEP, WPA/WPA2, WPA/WPA2 PSK (AES), WPA3 security modes
    • Up to + 16dBm output power in 802.11b mode
    • Support STA/AP/STA+AP working mode
    • Support SmartConfig and AP network configuration manners for Android and iOS devices
    • Operating temperature: -40℃ to 105℃
  • Bluetooth LE connectivity
    • Support the Bluetooth LE V5.2
    • Up to 6 dBm transmit power in bluetooth mode
    • Bluetooth coexistence interface

Applications

  • Intelligent building
  • Smart household
  • Smart home appliances
  • Smart socket and light
  • Industrial wireless control
  • Baby monitor
  • Network camera
  • Intelligent bus

Module interfaces

Dimensions and package

CBLC9 has two rows of pins with a spacing of 2±0.1 mm.

The CBLC9 dimensions are 15±0.35 mm (W)×16.8±0.35 mm (L) ×1.9±0.15 mm (H).

CBLC9 Module Datasheet

Pin definition

Pin number Symbol I/O type Function
1 P9 I/O Support hardware PWM and correspond to P9 on the internal IC
2 P8 I/O Common I/O pin and correspond to P8 on the internal IC
3 P6 I/O Support hardware PWM and correspond to P6 on the internal IC
4 P7 I/O Support hardware PWM and correspond to P7 on the internal IC
5 P24 I/O Support hardware PWM and correspond to P24 on the internal IC
6 VCC P Power supply pin (3.3V)
7 P26 I/O Support hardware PWM and correspond to P26 on the internal IC
8 GND P Power supply reference ground

Note: P indicates a power supply pin and I/O indicates an input/output pin.

Definitions of test points

Pin number Symbol I/O type Function
TP1 RF I/O RF test point
TP2 GND P Connection point
TP3 CEN I Reset pin, 3.3V, pull-up resistor
TP4 U1_TXD I/O UART1_TX, user serial interface TX
TP5 U1_RXD I/O UART1_RX, user serial interface RX
TP6 U2_TXD I/O UART2_TX, LOG TX
TP8 CSN I Pull down externally before power on and RF calibration

Electrical parameters

Absolute electrical parameters

Parameter Description Minimum value Maximum value Unit
Ts Storage temperature -55 125
VBAT Power supply voltage -0.3 3.9 V
ESD voltage (human body model) TAMB-25℃ -4 4 KV
ESD voltage (machine model) TAMB-25℃ -200 200 V

Normal working conditions

Parameter Description Minimum value Typical value Maximum value Unit
Ta Operating temperature -40 - 105
VBAT Power supply voltage 3 3.3 3.6 V
VOL I/O low level output VSS - VSS+0.3 V
VOH I/O high level output VBAT-0. 3 - VBAT V
Imax I/O drive current - 6 20 mA

RF power consumption

Working status Mode Rate Transmit power/receive Average value Peak value (Typical value) Unit
Transmit 11b 11Mbps +16dBm 279 315 mA
Transmit 11g 54Mbps +14dBm 260 282 mA
Transmit 11n MCS7 +13dBm 257 277 mA
Receive 11b 11 Mbps Constantly receive 74 88 mA
Receive 11g 54 Mbps Constantly receive 74 88 mA
Receive 11n MCS 7 Constantly receive 74 88 mA

Operating current

Working mode Working status, Ta = 25°C Average value Maximum value (Typical value) Unit
Quick network connection state (Bluetooth) The module is in the fast network connection state and the Wi-Fi indicator flashes fast 79 263 mA
Quick network connection state (AP) The module is in the hotspot network connection state and the Wi-Fi indicator flashes slowly 80 310 mA
Quick network connection state (EZ) The module is in the fast network connection state and the Wi-Fi indicator flashes fast 97 316 mA
Connected state The module is connected to the network and the Wi-Fi indicator is always on 47 308 mA
Weakly connected state The module and hotspot are in the state of weak connection and the Wi-Fi indicator light is always on 205 350 mA
Disconnected state The module is disconnected and the Wi-Fi indicator is always off 79 263 mA

RF parameters

Basic RF features

Parameter Description
Working frequency 2.412 to 2.480 GHz
Wi-Fi standard IEEE 802.11 b/g/n (channels 1 to 14)
Data transmission rate 11b: 1, 2, 5.5, 11 (Mbps)
11g: 6, 9, 12, 18, 24, 36, 48, 54 (Mbps)
11n: HT20 MCS 0 to 7
Antenna type Ceramic patch antenna, gain 1.2dbi

Wi-Fi transmission performance

Parameter Minimum value Typical value Maximum value Unit
Average RF output power, 802.11b CCK Mode 11M - 16 - dBm
Average RF output power, 802.11g OFDM Mode 54M - 14 - dBm
Average RF output power, 802.11n OFDM Mode MCS7 - 13 - dBm
Frequency error -10 - 10 ppm

Wi-Fi receiving performance

Parameter Minimum value Typical value Maximum value Unit
PER<8%, RX sensitivity, 802.11b DSSS Mode 11M - -85 - dBm
PER<10%, RX sensitivity, 802.11g OFDM Mode 54M - -72 - dBm
PER<10%, RX sensitivity, 802.11n OFDM Mode MCS7 - -68 - dBm
PER<10%, RX sensitivity, Bluetooth LE 1M - -94 - dBm

Bluetooth LE transmission performance

Parameter Minimum value Typical value Maximum value Unit
Working frequency 2402 - 2480 MHz
Air rate - 1 - Mbps
Transmit power -20 6 20 dBm
Frequency error -150 - 150 kHz

Bluetooth Low Energy (LE) receiving performance

Parameter Minimum value Typical value Maximum value Unit
RX sensitivity - -93 - dBm
Maximum RF signal input -10 - - dBm
Inter-modulation - - -23 dBm
Co-channel suppression ratio - 10 - dB

Antenna

Antenna type

CBLC9 uses the 3216 ceramic patch antenna.

Antenna interference reduction

When the Wi-Fi module uses the ceramic patch antenna, to ensure optimal Wi-Fi performance it is recommended that the antenna be at least 15 mm away from other metal parts.

To prevent an adverse impact on the antenna radiation performance, avoid copper or traces along the antenna area on the PCB.

Footprint information and production instructions

Mechanical dimensions

The CBLC9 PCB dimensions are 15±0.35 mm (W)×16.8±0.35 mm (L) ×1±0.1 mm (H).
CBLC9 Module Datasheet
CBLC9 Module Datasheet
CBLC9 Module Datasheet

Note: The default outline dimension tolerance is ±0.35 mm, and the critical dimension tolerance is ±0.15 mm. If you have specific requirements on dimensions, specify them clearly in the datasheet after communication.

Recommended footprint

CBLC9 Module Datasheet

Production instructions

  1. For the Tuya in-line module, wave soldering is most preferred and manual soldering is less preferred. After being unpacked, the module must be soldered within 24 hours. Otherwise, it must be put into the drying cupboard where the RH is not greater than 10%; or it needs to be packaged under vacuum again and record the exposure time (the total exposure time cannot exceed 168 hours).
  2. Wave soldering devices and materials:
    • Wave soldering equipment
    • Wave soldering fixture
    • Constant-temperature soldering iron
    • Tin bar, tin wire, and flux
    • Thermal profiler
  3. Baking devices:
    • Cabinet oven
    • Anti-electrostatic and heat-resistant trays
    • Anti-electrostatic and heat-resistant gloves
  4. The module needs to be baked in the following cases:
    • The packaging bag is damaged before unpacking.
    • There is no humidity indicator card (HIC) in the packaging bag.
    • After unpacking, circles of 10% and above on the HIC become pink.
    • The total exposure time has lasted for over 168 hours since unpacking.
    • More than 12 months have passed since the sealing of the bag.
  5. Baking settings:
    • Temperature: 40°C and ≤ 5% RH for reel package and 125°C and ≤5% RH for tray package (please use the heat-resistant tray rather than a plastic container)
    • Time: 168 hours for reel package and 12 hours for tray package
    • Alarm temperature: 50°C for reel package and 135°C for tray package
    • Production-ready temperature after natural cooling: < 36°C
    • Re-baking situation: If a module remains unused for over 168 hours after being baked, it needs to be baked again.
    • If a batch of modules is not baked within 168 hours, do not use the wave soldering to solder them. Because these modules are Level-3 moisture-sensitive devices, they are very likely to get damp when exposed beyond the allowable time. In this case, if they are soldered at high temperatures, it may result in device failure or poor soldering.
  6. In the whole production process, take electrostatic discharge (ESD) protective measures.
  7. To guarantee the quality of products, you must pay attention to the following items: The amount of soldering flux, the height of the wave peak, whether the tin slag and copper content in the wave soldering tank exceed standards, whether the window and thickness of the wave soldering fixture are appropriate, and whether the wave soldering oven temperature curve is appropriate.

Recommended oven temperature curve and temperature

Set oven temperatures according to the following temperature curve of wave soldering. The peak temperature is 260°C±5°C.

CBLC9 Module Datasheet

Recommended soldering temperature:

Suggestions on oven temperature curve of wave soldering Suggestions on manual soldering temperature
Preheat temperature 80 to 130 °C Soldering temperature 360±20°C
Preheat time 75 to 100s Soldering time <3s/point
Peak contact time 3 to 5s NA NA
Temperature of tin cylinder 260±5°C NA NA
Ramp-up slope ≤2°C/s NA NA
Ramp-down slope ≤6°C/s NA NA

Storage conditions

Storage conditions for a delivered module:

  • The moisture-proof bag is placed in an environment where the temperature is below 40°C and the relative humidity is lower than 90%.

  • The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed.

  • There is a humidity indicator card (HIC) in the packaging bag.

    CBLC9 Module Datasheet

    CBLC9 Module Datasheet

MOQ and packaging information

Product model MOQ (pcs) Shipping packaging method The number of modules per reel The number of reels per carton
CBLC9 4400 Tape reel 1100 4

Appendix: Statement

FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this device.

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

Note: This device has been tested and found to comply with the limits for a Class B digital device, according to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This device generates, uses, and can radiate radio frequency energy and, if not installed and used following the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation.

If this device does cause harmful interference to radio or television reception, which can be determined by turning the device off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

  • Reorient or relocate the receiving antenna.
  • Increase the separation between the device and receiver.
  • Connect the device into an outlet on a circuit different from that to which the receiver is connected.
  • Consult the dealer or an experienced radio/TV technician for help.

Radiation Exposure Statement

This device complies with FCC radiation exposure limits set forth for an uncontrolled rolled environment. This device should be installed and operated with a minimum distance of 20cm between the radiator and your body.

Important Note

This radio module must not be installed to co-locate and operating simultaneously with other radios in the host system except following FCC multi-transmitter product procedures. Additional testing and device authorization may be required to operate simultaneously with other radios.

The availability of some specific channels and/or operational frequency bands are country dependent and are firmware programmed at the factory to match the intended destination. The firmware setting is not accessible by the end-user.

The host product manufacturer is responsible for compliance with any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.

The end-user manual shall include all required regulatory information/warnings as shown in this manual, including “This product must be installed and operated with a minimum distance of 20 cm between the radiator and user body”.

The RF module is considered as a limited modular transmitter according to FCC rules. Even though the RF module gets an FCC ID, the host product manufacturer can not use the FCC ID on the final product directly. In these circumstances, the host product manufacturer integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining the FCC authorization by a Class II permissive change application or a new application.

Declaration of Conformity European Notice

CBLC9 Module Datasheet

Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module product is in compliance with essential requirements and other relevant provisions of Directive 2014/53/EU,2011/65/EU. A copy of the Declaration of conformity can be found at https://www.tuya.com.

CBLC9 Module Datasheet

This product must not be disposed of as normal household waste, in accordance with the EU directive for waste electrical and electronic equipment (WEEE-2012/19/EU). Instead, it should be disposed of by returning it to the point of sale, or to a municipal recycling collection point.

The device could be used with a separation distance of 20cm to the human body.