JWBR2S-5V Module Datasheet

Product overview

Developed by Tuya, JWBR2S-5V is a Wi-Fi module suitable for serial communication of the 5V TTL. It consists of a WBR1 module, which supports both the Wi-Fi and Bluetooth communication protocols and a level conversion circuit. It is further embedded with the Wi-Fi/Bluetooth network protocol stack and Tuya serial communication protocol.
JWBR2S-5V is an RTOS platform. On the basis of the serial communication manner, you can develop embedded products as required.

Features

• Embedded low-power KM4-MCU, which can also function as an application processor
  • The maximum clock rate: 100 MHz
• Operating voltage: 5V
• Peripheral: 1 UART
• Wi-Fi connectivity
  • 802.11 b/g/n20/
  • Channels 1 to 14@2.4 GHz
  • Support Bluetooth Low Energy 4.2
  • Support WPA/WPA2 security mode
  • Up to +18dBm output power in 802.11b mode
  • Support SmartConfig for Android and iOS devices
  • Onboard PCB antenna
  • Operating temperature: -20℃ to 85℃

Applications

• Intelligent building
• Smart household and home appliances
• Smart socket and light
• Industrial wireless control
• Baby monitor
• Network camera
• Intelligent bus

Module interfaces

Dimensions and footprint

The electrical interface of JWBR2S-5V is the PH-4AW connector with a spacing of 2.0 mm.
As shown in the following figure, the dimensions of JWBR2S-5V are 42.6±0.35 mm (W) × 31±0.35 mm (L) × 9.1±0.15 mm (H). The thickness of the PCB is 1.2±0.1 mm.

Pin definition

Pin number	Symbol	Type	Function
1	RX	I/O	UART0_RXD, receiving interface the module, input the level of 5V TTL
2	TX	I/O	UART0_TXD, transmitting interface of the module, output the level of 5V TTL
3	GND	P	Power supply reference ground
4	VCC	P	Power supply pin (5V)

Note: P indicates power supply pins and I/O indicates input/output pins.

Definitions on test pins

Pin number	Symbol	Type	Function
1	3.3V	P	Power supply pin inside the module (3.3V)
2	GND	P	Power supply reference ground
3	Log_Tx	I/O	UART_Log_TXD (used to display the internal information of the module)
4	Log_Rx	I/O	UART_Log_RXD (used to display the internal information of the module)
5	RXD	I/O	Interface for programming firmware of the module
6	TXD	I/O	Interface for programming firmware of the module
7	A_0	I/O	GPIOA_0, interface for programming firmware of the module When powered on, the pin needs to be pulled to 3.3V.
8	RST	I/O	Hardware reset pin

Note: P indicates power supply pins, I/O indicates input/output pins and test points are prohibited.

Electrical parameters

Absolute electrical parameters

Parameter	Description	Minimum value	Maximum value	Unit
Ts	Storage temperature	-40	105	℃
VBAT	Supply voltage	-0.3	5.5	V
ESD voltage (human body model)	TAMB-25℃	-	2	KV
ESD voltage (machine model)	TAMB-25℃	-	0.5	KV

Normal working conditions

Parameter	Description	Minimum value	Typical value	Maximum value	Unit
Ta	Working temperature	-20	-	85	℃
VBAT	Supply voltage	4.5	5	5.5	V
VIL	Voltage Input Low	-0.3	-	0.825	V
VIH	Voltage Input High	2.475	-	3.3	V
VOL	Voltage Output Low	-	-	0.33	V
VOH	Voltage Output High	2.64	-	3.3	V
Imax	Drive current	-	-	16	mA
Cpad	Input pin capacitance	-	2	-	pF

TX power consumption

Working status	Mode	Rate	Transmit power	Average value	Peak value (typical value)	Unit
Transmit	11b	11Mbps	+17.5dBm	269.1	299.9	mA
Transmit	11g	54Mbps	+14.5dBm	166.8	233.1	mA
Transmit	11n BW20	MCS7	+13.5dBm	164.2	226.5	mA

RX power consumption

Working status	Mode	Receive	Average value	Peak value (typical value)	Unit
Receive	CPU Active	11Mbps	65.7	73.7	mA
Receive	CPU Active	54Mbps	65.2	73	mA
Receive	CPU Active	MCS7	66.2	73.8	mA

Power consumption in working mode

Working mode	Working status, Ta = 25°C	Average value	Peak value (typical value)	Unit
EZ	The module is in fast connection state	60	291.5	mA
Idle state of network connection	The module is in idle state of network connection	60.3	239.5	mA
Operation state of network connection	The module is connecting to the network	60.2	287.5	mA
Disconnected state	The module is disconnected	61	288	mA

Note: The peak lasts about 5μs. The above parameters may vary with different firmware functions.

RF parameters

Basic RF features

Parameter	Description
Working frequency	2.400 to 2.484 GHz
Wi-Fi standard	IEEE 802.11 b/g/n (channels 1 to 14)
Data transmission rate	11b: 1, 2, 5.5, and 11 (Mbps); 11g: 6, 9, 12, 18, 24, 36, 48, and 54 (Mbps); 11n: HT20 MCS 0 to 7
Antenna type	PCB antenna

TX performance

TX performance

Parameter	Minimum value	Typical value	Maximum value	Unit
Average output power, 802.11b CCK Mode 11M	-	17.5	-	dBm
Average output power, 802.11g OFDM Mode 54M	-	14.5	-	dBm
Average output power, 802.11n OFDM Mode MCS7	-	13.5	-	dBm
Frequency error	-20	-	20	ppm

RX performance

RX sensitivity

Parameter	Minimum value	Typical value	Maximum value	Unit
PER<8%, RX sensitivity, 802.11b DSSS Mode 1M	-	-91	-	dBm
PER<10%, RX sensitivity, 802.11g OFDM Mode 54M	-	-75	-	dBm
PER<10%, RX sensitivity, 802.11n OFDM Mode MCS7	-	-72	-	dBm

Antenna information

Antenna type

JWBR2S-5V supports two types of antennas: Onboard PCB antenna and external antenna. By default, the onboard PCB antenna is preferred.

Antenna interference reduction

To ensure optimal Wi-Fi performance when the Wi-Fi module uses an onboard PCB antenna, it is recommended that the antenna be at least 15 mm away from other metal parts.
To prevent adverse impact on the antenna radiation performance, avoid copper or traces within the antenna area of the PCB.

Specifications of antenna connector

There is no antenna connector for this module currently.

Power-on sequence

The chip has requirements on the power-on sequence. It is recommended that the voltage should rise from 0 to 3.3V within 40mS.

Symbol	Parameter	Minimum value	Typical value	Maximum value	Unit
TPRDY	3.3V ready time	0.6		40	mS
CHIP_EN	CHIP_EN ready time	0.6		40	mS

The high-level establishment time t2 for the TX and RX pins of the adapter board should be less than the high-level establishment time t1 for the power supply. Before the power supply pin of the adapter board is powered on, the MCU should not pull the level of the TX/RX pin to be high.

Packaging information and production instructions

Mechanical dimensions

As shown in the following figure, the dimensions of JWBR2S-5V are 42.6±0.35 mm (W) × 31±0.35 mm (L) × 9.1±0.15 mm (H). The thickness of the PCB is 1.2±0.1 mm.

Specifications of terminal

The terminal has 4 pins with a spacing of 2.0 mm between each other. Detailed parameters are as follows:

Production instructions

1. For the Tuya in-line module, wave soldering is most preferred and manual soldering is less preferred. After being unpacked, the module must be soldered within 24 hours. Otherwise, it must be put into the drying cupboard where the RH is not greater than 10%; or it needs to be packaged under vacuum again and record the exposure time (the total exposure time cannot exceed 168 hours).
2. Wave soldering devices and materials:
   • Wave soldering equipment
   • Wave soldering fixture
   • Constant-temperature soldering iron
   • Tin bar, tin wire, and flux
   • Thermal profiler
3. Baking devices:
   • Cabinet oven
   • Anti-electrostatic and heat-resistant trays
   • Anti-electrostatic and heat-resistant gloves
4. The module needs to be baked in the following cases:
   • The packaging bag is damaged before unpacking.
   • There is no humidity indicator card (HIC) in the packaging bag.
   • After unpacking, circles of 10% and above on the HIC become pink.
   • The total exposure time has lasted for over 168 hours since unpacking.
   • More than 12 months have passed since the sealing of the bag.
5. Baking settings:
   • Temperature: 40°C and ≤ 5% RH for reel package and 125°C and ≤5% RH for tray package (please use the heat-resistant tray rather than plastic container)
   • Time: 168 hours for reel package and 12 hours for tray package
   • Alarm temperature: 50°C for reel package and 135°C for tray package
   • Production-ready temperature after natural cooling: < 36°C
   • Re-baking situation: If a module remains unused for over 168 hours after being baked, it needs to be baked again.
   • If a batch of modules is not baked within 168 hours, do not use the wave soldering to solder them. Because these modules are Level-3 moisture-sensitive devices, they are very likely to get damp when exposed beyond the allowable time. In this case, if they are soldered at high temperatures, it may result in device failure or poor soldering.
6. In the whole production process, take electrostatic discharge (ESD) protective measures.
7. To guarantee the quality of products, you must pay attention to the following items: The amount of soldering flux, the height of the wave peak, whether the tin slag and copper content in the wave soldering tank exceed standards, whether the window and thickness of the wave soldering fixture are appropriate, and whether the wave soldering oven temperature curve is appropriate.rom getting wet or dirty.

Recommended oven temperature curve

We mount the PCB with the SMT according to the following temperature curve. The peak temperature is 245°C.

Storage conditions