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NE1 Module Datasheet

Last Updated on : 2021-08-26 09:23:30download

Developed by Tuya, NE1 is a low-power embedded LPWA module in the NB-IoT series. It supports the NB-IoT radio communication protocol (3GPP Rel.14). NE1 contains a highly integrated Soc EC616 (which is internally embedded with an application processor, a low-power multi-band NB-IoT transceiver, and a PMU) and a few peripherals.

Overview

NE1 is embedded with a low-power 32-bit Cortex-M3 CPU and integrated with a 272-KB static random-access memory (SRAM), 4-MB NOR flash memory.

It supports MPU and interfaces such as UART, I2C, SPI, PWM, 4-channel 12-bit AUXADC, 32 kHz RTC timer, and USIM.

Features

  • Embedded low-power 32-bit Cortex-M3 processor
  • Power supply voltage
    • Working voltage: 2.2 to 4.5 V
    • Typical working voltage: 3.3 V
  • Peripherals: 17 GPIOs, 3 UARTs, 6 PWMs, 1 ADC, 1 SPI, and 1 I2C
  • SIM: 3 V/1.8 V SIM card
  • NB-IoT network
    • Cat NB 1/Cat NB 2

    • 3GPP R14 NB-IoT Standards

    • B3/B5/B8

    • Maximum transmit power: 23 dBm±2 dB

    • Receiving sensitivity < -127.3 dBm/15 kHz (not retransmission)

    • 50Ω characteristic impedance, an antenna provided by the third party

    • Data rate:

      • R13:
        • Single-tone: 25.5 kbps (downlink) and 16.7 kbps (uplink)
        • Multi-tone: 25.5 kbps (downlink) and 62.5 kbps (uplink)
      • R14: Multi-tone: 102 kbps (downlink) and 157 kbps (uplink)
    • Multi-tone: 25.5 kbps (downlink) and 62.5 kbps (uplink)

    • Network protocol feature: UDP/TCP/CoAP/LWM2M/ PPP*/SSL*/DTLS*/FTP*/ HTTP*/MQTT*/HTTPS*

    • Normal working temperature: -35°C to +75°C

    • Extended working temperature: -40°C to +85°C

    • Storage temperature: -40°C to +90°C

  • Upgrade through the main serial interface, FOTA

Applications

  • Public utilities: meter reading (water, gas, and electricity), intelligent water affairs (pipe network, leakage and quality inspection), smart fire extinguisher, fire hydrant, etc.
  • Smart health: drug traceability, remote medical monitoring, blood pressure meter, blood glucose meter, heart armour monitoring, baby monitor, etc.
  • Smart city: smart street lights, smart parking, urban trash can management, public safety alarms, urban environment monitoring (water pollution, noise, air quality PM2.5, etc.)
  • Consumers: wearable devices, bicycles, mopeds anti-theft, smart luggage, VIP tracking (children, elderly, pets, and vehicle rental), and payment/POS machines
  • Agricultural environment: precision planting (environment parameters: water, temperature, sunshine, biocide, and fertilizer), animal husbandry (health and tracking), aquaculture and food safety traceability
  • Logistics warehousing: asset, container tracking, warehouse management, fleet management tracking, and logistics status tracking
  • Smart building: access control, smart HVAC, smoke detection, fire detection, and elevator failure/repair
  • Manufacturing industry: production, equipment status monitoring, energy facilities, oil and gas monitoring, chemical park monitoring, large-scale rental equipment, and predictive maintenance (home appliances, machinery, etc.)

Change history

Date Updated content Version after update
08/05/2020 This is the first release. V1.0.0
12/03/2020 Updated current value and band information V1.0.1

Module interfaces

Pin distribution

NE1 has 66 pins in total. Among them, there are 52 LCC pins and 14 LGA pins. This part illustrates module interfaces and their definitions in details.

NE1 Module Datasheet

Pin definition

Pin number Symbol I/O type Functions Description
1 GND GND
2 GPIO1 I GPIO1 (boot flag) 1.8 V, GPIO0 needs to be pulled down to the low level in download mode
3 SPI_MISO I Master input slave output/GPIO14 1.8 V, support only the slave mode
4 SPI_MOSI O Master output slave input/GPIO11 1.8 V, support only the slave mode
5 SPI_SCLK O Serial clock signal/GPIO15 1.8 V, support only the slave mode
6 SPI_CS O Chip select/GPIO16 1.8 V, support only the slave mode
7 NC - NC
8 GPIO10 I/O GPIO10 A universal GPIO interface
9 ADC0 I A universal analog-to-digital converter AIO 2 12-bit AUXADC
10 SIM_GND A SIM card dedicated place
11 SIM_DATA SIM card data signal
12 SIM_RST SIM card reset signal
13 SIM_CLK SIM card clock signal
14 SIM_VCC SIM card power supply 1.8/3.0 V
15 RESET I Reset module 3.3 V, active low
16 NETLIGHT I/O GPIO20 A universal GPIO interface If you need the network indication function, the pin is recommended
17 UART1_RXD I A main serial interface, which is used for receiving data and used as a programming calibration interface and AT receiving interface 1.8 V Please pay attention to level conversion
18 UART1_TXD O A main serial interface, which is used for transmitting data and used as a programming calibration interface, AT transmitting interface, and Tuya log output interface 1.8 V Please pay attention to reference level conversion
19 PSM_EINT I WAKEUP 3, an external interrupt pin, which can wake up the module in PSM mode 3.3 V, active on falling edge
20 RI GPIO7 A common GPIO interface
21 WAKEUP1 I WAKEUP 1, an external interrupt pin, which can wake up the module in PSM mode 3.3 V, active on falling edge
22 WAKEUP2 I WAKEUP 2, an external interrupt pin, which can wake up the module in PSM mode 3.3 V, active on falling edge
23 NC NC
24 VIO18_EXT O 1.8 V output power supply (no output in PSM mode) V-min=1.53 V, V-norm=1.8 V
25 WAKEUP5 I WAKEUP 5, an external interrupt pin, which can wake up the module in PSM mode 3.3 V, active on falling edge
26 WAKEUP4 I WAKEUP 4, an external interrupt pin, which can wake up the module in PSM mode 3.3 V, active on falling edge
27 GND GND
28 UART2_RXD I A default universal docking user serial interface, which is used for receiving data 1.8V Please pay attention to reference level conversion
29 UART2_TXD O A default universal docking user serial interface, which is used for transmitting data 1.8V Please pay attention to reference level conversion
30 NC NC
31 NC NC
32 I2C0_SDA I/O I2C0_data/GPIO9 A default I2C interface
33 I2C0_SCL O I2C0_clock/GPIO17 A default I2C interface
34 GND GND
35 RF_ANT RF_antenna 50Ω characteristic impedance
36, 37 GND GND
38 UART0_RXD I Receive data By default, it is a log serial interface for the original manufacturer of the chip. 1.8 V Please pay attention to the reference level conversion
39 UART0_TXD O Transmit data By default, it is a log serial interface for the original manufacturer of the chip. 1.8 V Please pay attention to the reference level conversion
40, 41 GND GND
42, 43 VBATT I Input power V=2.2 to 4.3 V, V-norm=3.3 V
44 NC NC
45 NC NC
46 NC NC
47 NC NC
48 NC NC
49 NC NC
50 NC NC
51 NC NC
52 NC NC
53 NC NC
54 NC NC
55 NC NC
56 NC NC
57 NC NC
58 NC NC
59 SWDIO Debugging interface
60 NC NC
61 NC NC
62 SWCLK Debugging interface
63 NC NC
64 FREF Reference frequency
65 GPIO6 GPIO6 A common GPIO interface
66 GND GND

Note: “*” indicates “still under development” or “currently not supported”.

Electrical parameters

Absolute electrical parameters

Parameter Description Minimum value Maximum value Unit
Ts Storage temperature -40 90
VBAT Power supply voltage 2.2 4.5 V
Contact discharge VBAT, GND -5 +5 KV
Contact discharge Antenna interface -5 +5 KV
Contact discharge Other interfaces -0.5 +0.5 KV
Air discharge VBAT, GND -10 +10 KV
Air discharge Antenna interface -10 +10 KV
Air discharge Other interfaces -1 +1 KV

Normal working conditions

Parameter Description Minimum value Typical value Maximum value Unit
Ta Working temperature -35 25 75
VBAT Power supply voltage 2.2 3.3 4.5 V
VIL I/O low-level input -0.3 - VCC*0.25 V
VIH I/O high-level input VCC*0.75 - VCC V
VOL I/O low-level output - - VCC*0.1 V
VOH I/O high-level output VCC*0.8 - VCC V
Imax I/O drive current - - 12 mA

TX and RX power consumption

Working mode Description Average value Peak value (Typical value) Unit
PSM Deep Sleep 800 1000 nA
Idle @DRX=2.56S 115 / μA
Single-tone carrier frequency of 15 kHz B3@23 dBm 148 316 mA
Single-tone carrier frequency of 15 kHz B5@23 dBm 156 327 mA
Single-tone carrier frequency of 15 kHz B8@23 dBm 146 301 mA
Single-tone carrier frequency of 3.75 kHz B3@23 dBm 190 310 mA
Single-tone carrier frequency of 3.75 kHz B5@23 dBm 198 325 mA
Single-tone carrier frequency of 3.75 kHz B8@23 dBm 185 300 mA

RF parameters

Basic RF features

Parameter Description
Working frequency Band 3: 1710-1785 Mhz; 1805-1880 Mhz Band 5: 824-849 Mhz; 869-894 Mhz Band 8: 880-915 Mhz; 925-960 Mhz
NB-IoT standards 3GPP 36.521
6.2.2F UE maximum output power for category NB1
6.2.3F maximum power reduction (MPR) for category NB1
6.2.5F configured UE transmitted output power for UE category NB1
6.3.2F minimum output power for category NB1
6.3.3F transmit off power for category NB1
6.3.4 F1 on/off time mask for category NB1
6.3.4.F2 NPRACH time mask for category NB1
6.3.5F.2 power control relative power tolerance for category NB1
6.3.5F.1 power control absolute power tolerance for category NB1
6.5.1F frequency error for category NB1
6.5.2.1F.1 error vector magnitude (EVM) for category NB1
6.5.2.2F carrier leakage for category NB1
6.5.2.3F in-band emissions for non-allocated RB for category NB1
6.6.1F occupied bandwidth for category NB1
6.6.2.1F spectrum emission Mask for category NB1
6.6.2.3F adjacent channel leakage power ratio for category NB1
7.3F.1 reference sensitivity level without repetitions for category NB1
7.4F maximum input level for category NB1
Data transmission rate Single-tone: 25.5 kbps (downlink), 16.7 kbps (uplink) Multi-tone: 25.5 kbps (downlink), 62.5kbps (uplink)
Antenna type Antenna provided by the third party (external antenna, FPC antenna, etc.)

TX performance

TX performance

Frequency band Minimum value Maximum value Unit
B3 <-39 23dBm±2dB dBm
B5 <-39 23dBm±2dB dBm
B8 <-39 23dBm±2dB dBm

RX performance

RX sensitivity

Frequency band Typical value Unit
Band3 -127.3 dBm/15kHz dBm
Band5 -127.3 dBm/15kHz dBm
Band8 -127.3 dBm/15kHz dBm

Antenna

Antenna type

The module does not have its own PCB board antenna, and the third party needs to provide an antenna. The antenna can be an external rod antenna, a spring antenna, an IPEX-FPC antenna, a PCB board antenna, etc. The antenna forms include monopole antenna, PIFA antenna, IFA antenna, loop antenna, etc.

NE1 Module Datasheet

NE1 Module Datasheet

NE1 Module Datasheet

Antenna interference reduction

To ensure optimal NB-IoT performance, it is recommended that the antenna be at least 10 mm away from other metal parts.

Packaging information and production instructions

Mechanical dimensions

NE1 has 66 pins in total. Among them, 52 pins are LCC package, and 14 pins are LGA package.
The NE1 dimensions are 17.7±0.35mm (L)×15.8±0.35mm (W) ×2.4±0.15mm (H), which are shown as belows:

NE1 Module Datasheet
NE1 Module Datasheet

Side view

NE1 Module Datasheet

The schematic diagram of footprint

NE1 Module Datasheet

The diagram of PCB footprint-SMT

NE1 Module Datasheet

Top/bottom view

NE1 Module Datasheet

Note: The length and width tolerance is ±0.35 mm, the height tolerance is ±0.15mm, and the PCB thickness tolerance is ±0.1 mm. If you have any special requirements on dimensions, make them clear in the datasheet after communication.

Production instructions

  1. The Tuya SMT module should be mounted by the SMT device. After being unpacked, it should be soldered within 24 hours. Otherwise, it should be put into the drying cupboard where the RH is not greater than 10%; or it needs to be packaged under vacuum again and the exposure time needs to be recorded (the total exposure time cannot exceed 168 hours).
    • SMT devices:
      • Mounter
      • SPI
      • Reflow soldering machine
      • Thermal profiler
      • Automated optical inspection (AOI) equipment
    • Baking devices:
      • Cabinet oven
      • Anti-electrostatic and heat-resistant trays
      • Anti-electrostatic and heat-resistant gloves
  2. Storage conditions for a delivered module:
    • The moisture-proof bag must be placed in an environment where the temperature is below 40°C and the relative humidity is lower than 90%.

    • The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed.

    • There is a humidity indicator card (HIC) in the packaging bag.

      NE1 Module Datasheet

  3. The module needs to be baked in the following cases:
    • The packaging bag is damaged before unpacking.
    • There is no HIC in the packaging bag.
    • After unpacking, circles of 10% and above on the HIC become pink.
    • The total exposure time has lasted for over 168 hours since unpacking.
    • More than 12 months have passed since the sealing of the bag.
  4. Baking settings:
    • Temperature: 60°C and ≤ 5% RH for reel package and 125°C and ≤5% RH for tray package (please use the heat-resistant tray rather than plastic container)
    • Time: 48 hours for reel package and 12 hours for tray package
    • Alarm temperature: 65°C for reel package and 135°C for tray package
    • Production-ready temperature after natural cooling: < 36°C
    • Re-baking situation: If a module remains unused for over 168 hours after being baked, it needs to be baked again.
    • If a batch of modules is not baked within 168 hours, do not use the reflow soldering to solder them. Because these modules are Level-3 moisture-sensitive devices, they are very likely to get damp when exposed beyond the allowable time. In this case, if they are soldered at high temperatures, it may result in device failure or poor soldering.
  5. In the whole production process, take electrostatic discharge (ESD) protective measures.
  6. To guarantee the passing rate, it is recommended that you use the SPI and AOI to monitor the quality of solder paste printing and mounting.

Recommended oven temperature curve

Set oven temperatures according to the following temperature curve of reflow soldering. The peak temperature is 245°C.

NE1 Module Datasheet

  • A: Temperature axis

  • B: Time axis

  • C: Liquidus temperature: 217 to 220°C

  • D: Ramp-up slope: 1 to 3°C/s

  • E: Duration of constant temperature: 60 to 120s; the range of constant temperature: 150 to 200°C

  • F: Duration above the liquidus: 50 to 70s

  • G: Peak temperature: 235 to 245°C

  • H: Ramp-down slope: 1 to 4°C/s

    Note: The above curve is just an example of the solder paste SAC305. For more details about other solder pastes, please refer to Recommended oven temperature curve in the solder paste specifications.

Storage conditions

NE1 Module Datasheet

Product number MOQ (pcs) Shipping packaging method The number of modules per reel The number of reels per carton
NE1 5600 Tape reel 1400 4

Appendix: Statement

FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this device.

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

Note: This device has been tested and found to comply with the limits for a Class B digital device, according to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This device generates, uses, and can radiate radio frequency energy and, if not installed and used following the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation.

If this device does cause harmful interference to radio or television reception, which can be determined by turning the device off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

  • Reorient or relocate the receiving antenna.
  • Increase the separation between the device and receiver.
  • Connect the device into an outlet on a circuit different from that to which the receiver is connected.
  • Consult the dealer or an experienced radio/TV technician for help.

Radiation Exposure Statement

This device complies with FCC radiation exposure limits set forth for an uncontrolled rolled environment. This device should be installed and operated with a minimum distance of 20cm between the radiator and your body.

Important Note

This radio module must not be installed to co-locate and operating simultaneously with other radios in the host system except following FCC multi-transmitter product procedures. Additional testing and device authorization may be required to operate simultaneously with other radios.

The availability of some specific channels and/or operational frequency bands are country dependent and are firmware programmed at the factory to match the intended destination. The firmware setting is not accessible by the end-user.

The host product manufacturer is responsible for compliance with any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.

The end-user manual shall include all required regulatory information/warnings as shown in this manual, including “This product must be installed and operated with a minimum distance of 20 cm between the radiator and user body”.

This device has got an FCC ID: 2ANDL-NE1. The end product must be labeled in a visible area with the following: “Contains Transmitter Module FCC ID: 2ANDL-NE1”.

This device is intended only for OEM integrators under the following conditions:

The antenna must be installed such that 20cm is maintained between the antenna and users, and the transmitter module may not be co-located with any other transmitter or antenna.

As long as the 2 conditions above are met, further transmitter tests will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed.

Declaration of Conformity European Notice

NE1 Module Datasheet

Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module product is in compliance with essential requirements and other relevant provisions of Directive 2014/53/EU,2011/65/EU. A copy of the Declaration of conformity can be found at https://www.tuya.com.

NE1 Module Datasheet

This product must not be disposed of as normal household waste, in accordance with the EU directive for waste electrical and electronic equipment (WEEE-2012/19/EU). Instead, it should be disposed of by returning it to the point of sale, or to a municipal recycling collection point.

The device could be used with a separation distance of 20cm to the human body.