Last Updated on : 2024-06-14 03:09:08download
Developed by Tuya, NE1 is a low-power embedded LPWA module in the NB-IoT series. It supports the NB-IoT radio communication protocol (3GPP Rel.14). NE1 contains a highly integrated Soc EC616 (which is internally embedded with an application processor, a low-power multi-band NB-IoT transceiver, a PMU, and a few peripherals.
NE1 is embedded with a low-power 32-bit Cortex-M3 CPU and integrated with a 272-KB static random-access memory (SRAM), 4-MB NOR flash memory.
It supports MPU and interfaces such as UART, I2C, SPI, PWM, 4-channel 12-bit AUXADC, 32 kHz RTC timer, and USIM.
Cat NB 1/Cat NB 2
3GPP R14 NB-IoT Standards
B3/B5/B8
Maximum transmit power: 23 dBm±2 dB
Receiving sensitivity < -127.3 dBm/15 kHz (not retransmission)
50Ω characteristic impedance, an antenna provided by the third party
Data rate:
Multi-tone: 25.5 kbps (downlink) and 62.5 kbps (uplink)
Network protocol feature: UDP/TCP/CoAP/LWM2M/ PPP*/SSL*/DTLS*/FTP*/ HTTP*/MQTT*/HTTPS*
Normal operating temperature: -35°C to +75°C
Extended operating temperature: -40°C to +85°C
Storage temperature: -40°C to +90°C
NE1 has 66 pins in total. Among them, there are 52 LCC pins and 14 LGA pins. This part illustrates module interfaces and their definitions in detail.
Pin number | Symbol | I/O type | Functions | Description |
---|---|---|---|---|
1 | GND | – | GND | – |
2 | GPIO1 | I | GPIO1 (boot flag) | 1.8 V, GPIO0 needs to be pulled down to the low level in download mode |
3 | SPI_MISO | I | Master input slave output/GPIO14 | 1.8 V, support only the slave mode |
4 | SPI_MOSI | O | Master output slave input/GPIO11 | 1.8 V, support only the slave mode |
5 | SPI_SCLK | O | Serial clock signal/GPIO15 | 1.8 V, support only the slave mode |
6 | SPI_CS | O | Chip select/GPIO16 | 1.8 V, support only the slave mode |
7 | NC | - | NC | |
8 | GPIO10 | I/O | GPIO10 | A universal GPIO interface |
9 | ADC0 | I | A universal analog-to-digital converter AIO 2 | 12-bit AUXADC |
10 | SIM_GND | – | A SIM card dedicated place | – |
11 | SIM_DATA | – | SIM card data signal | – |
12 | SIM_RST | – | SIM card reset signal | – |
13 | SIM_CLK | – | SIM card clock signal | – |
14 | SIM_VCC | – | SIM card power supply | 1.8/3.0 V |
15 | RESET | I | Reset module | 3.3 V, active low |
16 | NETLIGHT | I/O | GPIO20 | A universal GPIO interface. The pin cannot be used as the network indicator light for the general firmware V2.0.4 and above. If you need the network indicator light, you can use the MCU port. |
17 | UART1_RXD | I | A main serial interface, which is used for receiving data and used as a programming calibration interface and AT receiving interface | 1.8 V Please pay attention to level conversion |
18 | UART1_TXD | O | A main serial interface, which is used for transmitting data and used as a programming calibration interface, AT transmitting interface, and Tuya log output interface | 1.8 V Please pay attention to reference level conversion |
19 | PSM_EINT | I | WAKEUP 3, an external interrupt pin, which can wake up the module in PSM mode | 3.3 V, active on falling edge |
20 | RI | – | GPIO7 | A common GPIO interface |
21 | WAKEUP1 | I | WAKEUP 1, an external interrupt pin, which can wake up the module in PSM mode | 3.3 V, active on falling edge |
22 | WAKEUP2 | I | WAKEUP 2, an external interrupt pin, which can wake up the module in PSM mode | 3.3 V, active on falling edge |
23 | NC | – | NC | – |
24 | VIO18_EXT | O | 1.8 V output power supply (no output in PSM mode) | V-min=1.53 V, V-norm=1.8 V |
25 | WAKEUP5 | I | WAKEUP 5, an external interrupt pin, which can wake up the module in PSM mode | 3.3 V, active on falling edge |
26 | WAKEUP4 | I | WAKEUP 4, an external interrupt pin, which can wake up the module in PSM mode | 3.3 V, active on falling edge |
27 | GND | – | GND | – |
28 | UART2_RXD | I | A default universal docking user serial interface, which is used for receiving data | 1.8V Please pay attention to reference level conversion |
29 | UART2_TXD | O | A default universal docking user serial interface, which is used for transmitting data | 1.8V Please pay attention to reference level conversion |
30 | NC | – | NC | – |
31 | NC | – | NC | – |
32 | I2C0_SDA | I/O | I2C0_data/GPIO9 | A default I2C interface |
33 | I2C0_SCL | O | I2C0_clock/GPIO17 | A default I2C interface |
34 | GND | – | GND | – |
35 | RF_ANT | – | RF_antenna | 50Ω characteristic impedance |
36, 37 | GND | – | GND | – |
38 | UART0_RXD | I | Receive data | By default, it is a log serial interface for the original manufacturer of the chip. 1.8 V Please pay attention to the reference level conversion |
39 | UART0_TXD | O | Transmit data | By default, it is a log serial interface for the original manufacturer of the chip. 1.8 V Please pay attention to the reference level conversion |
40, 41 | GND | – | GND | – |
42, 43 | VBATT | I | Input power | V=2.2 to 4.3 V, V-norm=3.3 V |
44 | NC | – | NC | – |
45 | NC | – | NC | – |
46 | NC | – | NC | – |
47 | NC | – | NC | – |
48 | NC | – | NC | – |
49 | NC | – | NC | – |
50 | NC | – | NC | – |
51 | NC | – | NC | – |
52 | NC | – | NC | – |
53 | NC | – | NC | – |
54 | NC | – | NC | – |
55 | NC | – | NC | – |
56 | NC | – | NC | – |
57 | NC | – | NC | – |
58 | NC | – | NC | – |
59 | SWDIO | – | Debugging interface | – |
60 | NC | – | NC | – |
61 | NC | – | NC | – |
62 | SWCLK | – | Debugging interface | – |
63 | NC | – | NC | – |
64 | FREF | – | Reference frequency | – |
65 | GPIO6 | – | GPIO6 | A common GPIO interface |
66 | GND | – | GND | – |
Note: “*” indicates “still under development” or “currently not supported”.
Parameter | Description | Minimum value | Maximum value | Unit |
---|---|---|---|---|
Ts | Storage temperature | -40 | 90 | ℃ |
VBAT | Power supply voltage | 2.2 | 4.5 | V |
Contact discharge | VBAT, GND | -5 | +5 | KV |
Contact discharge | Antenna interface | -5 | +5 | KV |
Contact discharge | Other interfaces | -0.5 | +0.5 | KV |
Air discharge | VBAT, GND | -10 | +10 | KV |
Air discharge | Antenna interface | -10 | +10 | KV |
Air discharge | Other interfaces | -1 | +1 | KV |
Parameter | Description | Minimum value | Typical value | Maximum value | Unit |
---|---|---|---|---|---|
Ta | Operating temperature | -35 | 25 | 75 | ℃ |
VBAT | Power supply voltage | 2.2 | 3.3 | 4.5 | V |
VIL | I/O low-level input | -0.3 | - | VCC*0.25 | V |
VIH | I/O high-level input | VCC*0.75 | - | VCC | V |
VOL | I/O low-level output | - | - | VCC*0.1 | V |
VOH | I/O high-level output | VCC*0.8 | - | VCC | V |
Imax | I/O drive current | - | - | 12 | mA |
Working mode | Description | Average value | Peak value (Typical value) | Unit |
---|---|---|---|---|
PSM | Deep Sleep | 800 | 1000 | nA |
Idle | @DRX=2.56S | 115 | / | μA |
Single-tone carrier frequency of 15 kHz | B3@23 dBm | 148 | 316 | mA |
Single-tone carrier frequency of 15 kHz | B5@23 dBm | 156 | 327 | mA |
Single-tone carrier frequency of 15 kHz | B8@23 dBm | 146 | 301 | mA |
Single-tone carrier frequency of 3.75 kHz | B3@23 dBm | 190 | 310 | mA |
Single-tone carrier frequency of 3.75 kHz | B5@23 dBm | 198 | 325 | mA |
Single-tone carrier frequency of 3.75 kHz | B8@23 dBm | 185 | 300 | mA |
Parameter | Description |
---|---|
Working frequency | Band 3: 1710-1785 Mhz; 1805-1880 Mhz Band 5: 824-849 Mhz; 869-894 Mhz Band 8: 880-915 Mhz; 925-960 Mhz |
NB-IoT standards | 3GPP 36.521 |
6.2.2F UE maximum output power for category NB1 | |
6.2.3F maximum power reduction (MPR) for category NB1 | |
6.2.5F configured UE transmitted output power for UE category NB1 | |
6.3.2F minimum output power for category NB1 | |
6.3.3F transmit off power for category NB1 | |
6.3.4 F1 on/off time mask for category NB1 | |
6.3.4.F2 NPRACH time mask for category NB1 | |
6.3.5F.2 power control relative power tolerance for category NB1 | |
6.3.5F.1 power control absolute power tolerance for category NB1 | |
6.5.1F frequency error for category NB1 | |
6.5.2.1F.1 error vector magnitude (EVM) for category NB1 | |
6.5.2.2F carrier leakage for category NB1 | |
6.5.2.3F in-band emissions for non-allocated RB for category NB1 | |
6.6.1F occupied bandwidth for category NB1 | |
6.6.2.1F spectrum emission Mask for category NB1 | |
6.6.2.3F adjacent channel leakage power ratio for category NB1 | |
7.3F.1 reference sensitivity level without repetitions for category NB1 | |
7.4F maximum input level for category NB1 | |
Data transmission rate | Single-tone: 25.5 kbps (downlink), 16.7 kbps (uplink) Multi-tone: 25.5 kbps (downlink), 62.5kbps (uplink) |
Antenna type | Antenna provided by the third party (external antenna, FPC antenna, etc.) |
TX performance
Frequency band | Minimum value | Maximum value | Unit |
---|---|---|---|
B3 | <-39 | 23dBm±2dB | dBm |
B5 | <-39 | 23dBm±2dB | dBm |
B8 | <-39 | 23dBm±2dB | dBm |
RX sensitivity
Frequency band | Typical value | Unit |
---|---|---|
Band3 | -127.3 dBm/15kHz | dBm |
Band5 | -127.3 dBm/15kHz | dBm |
Band8 | -127.3 dBm/15kHz | dBm |
The module does not have its own PCB board antenna, and the third party needs to provide an antenna. The antenna can be an external rod antenna, a spring antenna, an IPEX-FPC antenna, a PCB board antenna, etc. The antenna forms include monopole antenna, PIFA antenna, IFA antenna, loop antenna, etc.
To ensure optimal NB-IoT performance, it is recommended that the antenna be at least 10 mm away from other metal parts.
NE1 has 66 pins in total. Among them, 52 pins are LCC package, and 14 pins are LGA package.
The NE1 dimensions are 17.7±0.35mm (L)×15.8±0.35mm (W) ×2.4±0.15mm (H), which are shown as belows:
Note: The length and width tolerance is ±0.35 mm, the height tolerance is ±0.15mm, and the PCB thickness tolerance is ±0.1 mm. If you have any special requirements on dimensions, make them clear in the datasheet after communication.
The moisture-proof bag must be placed in an environment where the temperature is below 40°C and the relative humidity is lower than 90%.
The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed.
There is a humidity indicator card (HIC) in the packaging bag.
Set oven temperatures according to the following temperature curve of reflow soldering. The peak temperature is 245°C.
A: Temperature axis
B: Time axis
C: Liquidus temperature: 217 to 220°C
D: Ramp-up slope: 1 to 3°C/s
E: Duration of constant temperature: 60 to 120s; the range of constant temperature: 150 to 200°C
F: Duration above the liquidus: 50 to 70s
G: Peak temperature: 235 to 245°C
H: Ramp-down slope: 1 to 4°C/s
Note: The above curve is just an example of the solder paste SAC305. For more details about other solder pastes, please refer to Recommended oven temperature curve in the solder paste specifications.
Product model | MOQ (pcs) | Shipping packaging method | The number of modules per reel | The number of reels per carton |
---|---|---|---|---|
NE1 | 5600 | Tape reel | 1400 | 4 |
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