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T34 Module Datasheet

Last Updated on : 2021-09-25 09:24:14download

T34 is a low-power embedded Wi-Fi module that Tuya has developed. It consists of a highly integrated RF chip (T34), with an embedded Wi-Fi network protocol stack and rich library functions.

Overview

T34 is integrated with the BK7231N chip, a crystal, an RF matching circuit, and most of peripheral devices. T34 not only supports the AP and STA dual-network-connection manner but supports the Bluetooth LE network connection manner. A 32-bit MCU with a maximum running speed of 120 MHz, a built-in 2-MB flash memory, a 256-KB RAM, and up to six 32-bit PWM outputs make the chip very suitable for high-quality LED control.

Features

  • Embedded low-power 32-bit CPU, which can also function as an application processor
  • Clock rate: 120 MHz
  • Operating voltage: 3.3 ± 0.3V
  • Peripherals: 6 PWMs, 2 I2Cs, 2 UARTs, and 1 SPI
  • Wi-Fi connectivity
    • 802.11 b/g/n
    • Channels 1 to 14@2.4 GHz
    • Support WEP, WPA/WPA2, and WPA/WPA2 PSK (AES) security modes
    • Up to +16 dBm output power in 802.11b mode
    • Support STA/AP/STA+AP working mode
    • Support SmartConfig and AP network configuration manners for Android and iOS devices
    • Operating temperature: -40℃ to 105℃
  • Bluetooth LE connectivity
    • Up to 6 dBm transmit power in Bluetooth mode
    • Complete Bluetooth coexistence interface

Applications

  • Intelligent building
  • Smart household and home appliances
  • Smart socket and light
  • Industrial wireless control
  • Baby monitor
  • Network camera
  • Intelligent bus

Change history

Update date Updated content Version after update
10/20/2020 This is the first release. V1.0.0

Module interfaces

Dimensions and package

T34 is packaged in the form of LGA 6x6 36-pin.

The T34 dimensions are 6±0.1 mm (W)×6±0.1 mm (L) ×0.85±0.1 mm (H).

The dimensions of T34 are as follows:

T34 Module Datasheet

Pin definition

Pin number Symbol Type Function
1, 3, 32, 33, 34, 35, and 36 GND P Ground 33, 34, 35, and 36 are ground pads at the back of the chip.
2 ANT I/O External antenna with 2.4 GHz RF output/input
4 and 5 VCCPA P RF PA power input, voltage is 3.0 to 3.6V, 3.3V recommended
6 VDDDIG O Digital power output, the voltage is about 1.2V
7 VDDAON O Always open power output, the voltage is 1.2V
8 VBAT I Chip main-power input, voltage is 3.0 to 3.6V, 3.3 V recommended
9 CEN I Enable end of a chip, high effective
10 P28/ADC4/RXEN I/O A universal I/O port, ADC4 or set high during receiving of RF
11 P14/SD_CLK/SCK/ANT0 I/O A universal I/O port, CLK of SD, SCK of SPI, or ANT0 controlled by the Bluetooth LE antenna
12 P16/SD_CMD/MOSI/ANT2 I/O A universal I/O port, CMD of SD, MOSI of SPI, or ANT2 controlled by the Bluetooth LE antenna
13 P15/CSN/ANT1 I/O A universal I/O port, CSN of SPI, or ANT1 controlled by the Bluetooth LE antenna
14 P17/SD_D0/MISO/ANT3 I/O A universal I/O port, D 0 of SD, MISO of SPI, or ANT 3 controlled by the Bluetooth LE antenna
15 P26/ADC1/IRDA/PWM5 I/O A universal I/O port, ADC 1, infrared receiving or PWM5
16 P24/ADC2/LPO_CLK/PWM4 I/O A universal I/O port, ADC2, low-power clock 32.768KB output, or PWM 4
17 P23/ADC3/TDO/F_SO I/O A universal I/O port, ADC3, TDO of JTAG or data output during the download of flash with SPI
18 P22/ADC5/CLK_26M/TDI/TXEN/F_SI I/O A universal I/O port, ADC 5, crystal frequency output, TDI of JTAG, set high during RF transmission, or data input during the download of flash
19 P21/ADC6/I2C1_SDA/TMS/F_CSN I/O P21 is the mode selection pin. When it is set to low level, it means entering the RF test mode.
20 P20/I2C1_SCL/TCK/F_SCK I/O A universal I/O port, SCL of I2C1, TCK of JTAG, or clock during the download of flash during SPI
21 P6/ CLK13M/PWM0 I/O A universal I/O port, 1, 2, 4, and 8 frequency division output of crystal clock, or PWM0
22 P7/WIFI_ACT/PWM1 I/O A universal I/O port or WIFI_ACTIVE coexisting with Wi-Fi and BT, or PWM1
23 P8/BT_ACT/PWM2 I/O A universal I/O port, BT_ACTIVE coexisting with Wi-Fi and BT, or PWM 2
24 P9/BT_PRIORITY/PWM3 I/O A universal I/O port, BT_PRIORITY coexisting with Wi-Fi and BT, or PWM 3
25 P10/DL_RX/UART1_RXD I/O A universal I/O port, RXD of UART for downloading flash, RXD of the serial UART1
26 P11/DL_TX/UART1_TXD I/O A universal I/O port, TXD of UART for downloading flash, TXD of the serial UART1
27 P1/UART2_RXD/I2C2_SDA I/O A universal I/O port, RXD of a serial port UART 2, or SDA of I2C2 P1 is used for self-calibration.
28 P0/UART2_TXD/I2C2_SCL I/O A universal I/O port, TXD of a serial port UART 2, or SCL of I2C2
29 XI I T34 has the built-in crystal, no need to be connected externally
30 XO O T34 has the built-in crystal, no need to be connected externally
31 VSYS O System power output The voltage is about 2.7 to 3.0V.

Note: P indicates a power supply pin and I/O indicates an input/output pin.

Electrical parameters

Absolute electrical parameters

Parameter Description Minimum value Maximum value Unit
Ts Storage temperature -55 125
VBAT Supply voltage -0.3 3.9 V
ESD voltage (human body model) TAMB-25℃ -4 4 KV
ESD voltage (machine model) TAMB-25℃ -200 200 V

Normal working conditions

Parameter Description Minimum value Typical value Maximum value Unit
Ta Operating temperature -40 - 105
VBAT Supply voltage 3.0 3.3 3.6 V
VIL I/O low-level input -0.3 - VCC*0.25 V
VIH I/O high-level input VCC*0.75 - VCC V
VOL I/O low level output VSS - VSS+0.3 V
VOH I/O high level output VCC-0. 3 - VCC V
Imax I/O drive current - 6 20 mA

RF power consumption

Working status Mode Rate Transmit power/receive Average value Peak value (Typical value) Unit
Transmit 11b 11Mbps +16dBm 280 304 mA
Transmit 11g 54Mbps +15dBm 257 306 mA
Transmit 11n MCS7 +14dBm 260 281 mA
Receive 11b 11Mbps Constantly receive 75 85 mA
Receive 11g 54Mbps Constantly receive 75 85 mA
Receive 11n MCS 7 Constantly receive 77 85 mA

Operating current

Working mode Working status, Ta = 25°C Average value Maximum value (Typical value) Unit
Quick network pairing state (Bluetooth) The module is in the fast network pairing state and the Wi-Fi indicator flashes fast 88 283 mA
Quick network pairing state (AP) The module is in the hotspot network pairing state and the Wi-Fi indicator flashes slowly 85 300 mA
Quick network pairing state (EZ) The module is in the fast network pairing state and the Wi-Fi indicator flashes fast 90 378 mA
Connected The module is connected to the network and the Wi-Fi indicator is always on 35 350 mA
Disconnected The module is disconnected and the Wi-Fi indicator is dark 70 280 mA

RF parameters

Basic RF features

Parameter Description
Working frequency 2.412 to 2.484 GHz
Wi-Fi standard IEEE 802.11 b/g/n (channels 1 to 14)
Data transmission rate 11b: 1, 2, 5.5, 11 (Mbps);
11g: 6, 9, 12, 18, 24, 36, 48, 54 (Mbps);
11n: HT20 MCS 0 to 7;
11n: HT40 MCS 0 to 7
Antenna type PCB, FPC or ceramic antenna

Wi-Fi transmission performance

Parameter Minimum value Typical value Maximum value Unit
Average RF output power, 802.11b CCK Mode 11M - 16 - dBm
Average RF output power, 802.11g OFDM Mode 54M - 15 - dBm
Average RF output power, 802.11n OFDM Mode MCS7 - 14 - dBm
Frequency error -20 - 20 ppm

Wi-Fi receiving performance

Parameter Minimum value Typical value Maximum value Unit
PER<8%, RX sensitivity, 802.11b DSSS Mode 11M - -88 - dBm
PER<10%, RX sensitivity, 802.11g OFDM Mode 54M - -74 - dBm
PER<10%, RX sensitivity, 802.11n OFDM Mode MCS7 - -72 - dBm
PER<10%, RX sensitivity, Bluetooth LE 1M - -93 - dBm

Bluetooth LE transmission performance

Parameter Minimum value Typical value Maximum value Unit
Working frequency 2402 - 2480 MHz
Air rate - 1 - Mbps
Transmit power -20 6 20 dBm
Frequency error -150 - 150 kHz

Bluetooth LE receiving performance

Parameter Minimum value Typical value Maximum value Unit
RX sensitivity - -93 - dBm
Maximum RF signal input -10 - - dBm
Inter-modulation - - -23 dBm
Co-channel suppression ratio - 10 - dB

Antenna

Antenna type

T34 can choose an antenna according to the actual space and environment.

Antenna interference reduction

To ensure optimal Wi-Fi performance when the Wi-Fi module uses an onboard PCB antenna, it is recommended that the antenna be at least 15 mm away from other metal parts.

To prevent adverse impact on the antenna radiation performance, avoid copper or traces within the antenna area on the PCB.

Packaging information and production instructions

Mechanical dimensions

T34 Module Datasheet

Symbol Size (unit: mm) Size (unit: mm)
Min Nom Max Min Nom Max
A 0.650 0.750 0.850 0.026 0.030 0.033
c 0.140 0.170 0.200 0.006 0.007 0.008
D 5.900 6.000 6.100 0.232 0.236 0.240
E 5.900 6.000 6.100 0.232 0.236 0.240
D1 3.800 3.900 4.000 0.150 0.154 0.157
D2 1.325 1.400 1.475 0.052 0.055 0.058
E1 3.800 3.900 4.000 0.150 0.154 0.157
E2 1.325 1.400 1.475 0.052 0.055 0.058
H --- 0.279 --- --- 0.011 ---
H1 --- 0.279 --- --- 0.011 ---
L 0.325 0.400 0.475 0.013 0.016 0.019
L1 0.025 0.100 0.175 0.001 0.004 0.007
e --- 0.600 --- --- 0.024 ---
e1 --- 2.500 --- --- 0.098 ---
b 0.250 0.300 0.350 0.010 0.012 0.014
aaa 0.100 0.004
bbb 0.150 0.006
ccc 0.100 0.004
ddd 0.080 0.003
eee 0.150 0.006

The schematic diagram for reference

T34 Module Datasheet

Production instructions

  1. The Tuya SMT module should be mounted by the SMT device. After being unpacked, it should be soldered within 24 hours. Otherwise, it should be put into the drying cupboard where the RH is not greater than 10%; or it needs to be packaged under vacuum again and the exposure time needs to be recorded (the total exposure time cannot exceed 168 hours).
    • SMT devices:
      • Mounter
      • SPI
      • Reflow soldering machine
      • Thermal profiler
      • Automated optical inspection (AOI) equipment
    • Baking devices:
      • Cabinet oven
      • Anti-electrostatic and heat-resistant trays
      • Anti-electrostatic and heat-resistant gloves
  2. Storage conditions for a delivered module:
    • The moisture-proof bag must be placed in an environment where the temperature is below 40°C and the relative humidity is lower than 90%.

    • The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed.

    • There is a humidity indicator card (HIC) in the packaging bag.

      T34 Module Datasheet

  3. The module needs to be baked in the following cases:
    • The packaging bag is damaged before unpacking.
    • There is no HIC in the packaging bag.
    • After unpacking, circles of 10% and above on the HIC become pink.
    • The total exposure time has lasted for over 168 hours since unpacking.
    • More than 12 months have passed since the sealing of the bag.
  4. Baking settings:
    • Temperature: 60°C and ≤ 5% RH for reel package and 125°C and ≤5% RH for tray package (please use the heat-resistant tray rather than plastic container)
    • Time: 48 hours for reel package and 12 hours for tray package
    • Alarm temperature: 65°C for reel package and 135°C for tray package
    • Production-ready temperature after natural cooling: < 36°C
    • Re-baking situation: If a module remains unused for over 168 hours after being baked, it needs to be baked again.
    • If a batch of modules is not baked within 168 hours, do not use the reflow soldering to solder them. Because these modules are Level-3 moisture-sensitive devices, they are very likely to get damp when exposed beyond the allowable time. In this case, if they are soldered at high temperatures, it may result in device failure or poor soldering.
  5. In the whole production process, take electrostatic discharge (ESD) protective measures.
  6. To guarantee the passing rate, it is recommended that you use the SPI and AOI to monitor the quality of solder paste printing and mounting.

Recommended oven temperature curve

Set oven temperatures according to the following temperature curve of reflow soldering. The peak temperature is 245°C.

T34 Module Datasheet

  • A: Temperature axis

  • B: Time axis

  • C: Liquidus temperature: 217 to 220°C

  • D: Ramp-up slope: 1 to 3°C/s

  • E: Duration of constant temperature: 60 to 120s; the range of constant temperature: 150 to 200°C

  • F: Duration above the liquidus: 50 to 70s

  • G: Peak temperature: 235 to 245°C

  • H: Ramp-down slope: 1 to 4°C/s

    Note: The above curve is just an example of the solder paste SAC305. For more details about other solder pastes, please refer to Recommended oven temperature curve in the solder paste specifications.

Storage conditions

T34 Module Datasheet

Product model Package Packing method MOQ
T34 LGA36_6X6 Tape reel 3000

Appendix: Statement

FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this device.

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

Note: This device has been tested and found to comply with the limits for a Class B digital device, according to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This device generates, uses, and can radiate radio frequency energy and, if not installed and used following the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation.

If this device does cause harmful interference to radio or television reception, which can be determined by turning the device off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

  • Reorient or relocate the receiving antenna.
  • Increase the separation between the device and receiver.
  • Connect the device into an outlet on a circuit different from that to which the receiver is connected.
  • Consult the dealer or an experienced radio/TV technician for help.

Radiation Exposure Statement

This device complies with FCC radiation exposure limits set forth for an uncontrolled rolled environment. This device should be installed and operated with a minimum distance of 20cm between the radiator and your body.

Important Note

This radio module must not be installed to co-locate and operating simultaneously with other radios in the host system except following FCC multi-transmitter product procedures. Additional testing and device authorization may be required to operate simultaneously with other radios.

The availability of some specific channels and/or operational frequency bands are country dependent and are firmware programmed at the factory to match the intended destination. The firmware setting is not accessible by the end-user.

The host product manufacturer is responsible for compliance with any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.

The end-user manual shall include all required regulatory information/warnings as shown in this manual, including “This product must be installed and operated with a minimum distance of 20 cm between the radiator and user body”.

This device has got an FCC ID: 2ANDL-T34. The end product must be labelled in a visible area with the following: “Contains Transmitter Module FCC ID: 2ANDL-T34”.

This device is intended only for OEM integrators under the following conditions:

The antenna must be installed such that 20cm is maintained between the antenna and users, and the transmitter module may not be co-located with any other transmitter or antenna.

As long as the 2 conditions above are met, further transmitter tests will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed.

Declaration of Conformity European Notice

T34 Module Datasheet

Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module product is in compliance with essential requirements and other relevant provisions of Directive 2014/53/EU,2011/65/EU. A copy of the Declaration of conformity can be found at https://www.tuya.com.

T34 Module Datasheet

This product must not be disposed of as normal household waste, in accordance with the EU directive for waste electrical and electronic equipment (WEEE-2012/19/EU). Instead, it should be disposed of by returning it to the point of sale, or to a municipal recycling collection point.

The device could be used with a separation distance of 20cm to the human body.