TYBN1 Module Datasheet

TYBN1 is a low-power embedded Bluetooth module that Tuya has developed. It consists of a highly integrated Bluetooth chip (nRF52832), a few peripheral circuits, an embedded Bluetooth network communication protocol stack, and robust library functions.

Overview

TYBN1 contains a low-power 32-bit microcontroller unit (MCU) with Cortex-M4 as the core. It is integrated with a Bluetooth Low Energy (LE)/2.4G radio, a 512 Kbyte flash memory, a 64 Kbyte static random-access memory (SRAM), and 11 reusable I/O interfaces, and can support 4 analog-to-digital converters (ADC) at most.

Features

• Embedded low-power 32-bit MCU, which can also function as an application processor.
• The clock rate: 64 MHz
• Working voltage: 1.7V-3.6V
• Peripherals: 1 I2C (Inter-Integrated Circuit), 3 pulse width modulations (PWM), and 1 universal asynchronous receiver/transmitter (UART)
• Bluetooth LE RF features
  • Compatible with Bluetooth LE 5.0
  • The RF data rate can be up to 2 Mbps.
  • TX power:+10 dBm
  • RX sensitivity: -94.5 dBm@Bluetooth LE 1 Mbps
  • Embedded hardware AES encryption
  • Onboard PCB antenna
  • Working temperature: -20℃ to +85℃

Applications

• Smart LED
• Smart home
• Smart low-power sensor

Module interfaces

Dimensions and package

• TYBN1 has two rows of pins with a 1.5 mm pin spacing. Each row has 9 pins.

• The TYBN1 dimensions are 16±0.35 mm (W)×21±0.35 mm (L) x2.0±0.2 mm (H). The thickness of the PCB is 1.0±0.1 mm. The package is as follows:

  

  

Pin definition

The definition of interface pins is shown in the following table:

Pin No.	Symbol	I/O type	Function
1	GND	P	Power supply reference ground pin
2	IO19	I/O	Common GPIO interface, which corresponds to Pin 22 on the internal IC
3	IO12	I/O	Common GPIO interface, which corresponds to Pin 15 on the internal IC
4	IO4_A	I/O	GPIO interface, which can be configured as an ADC and corresponds to Pin 6 on the internal IC
5	IO5_A	I/O	GPIO interface, which can be configured as an ADC and corresponds to Pin 7 on the internal IC
6	IO3_A	I/O	GPIO interface, which can be configured as an ADC and corresponds to Pin 5 on the internal IC
7	IO2_A	I/O	GPIO interface, which can be configured as an ADC and corresponds to Pin 4 on the internal IC
8	GND	P	Power supply reference ground pin
9	3.3V	P	Power supply pin
10	IO11	I/O	Common GPIO interface, which corresponds to Pin 14 on the internal IC
11	IO14_D	I/O	Common GPIO interface, which corresponds to Pin 17 on the internal IC
12	IO15_D	I/O	Common GPIO interface, which corresponds to Pin 18 on the internal IC
13	IO16_D	I/O	Common GPIO interface, which corresponds to Pin 19 on the internal IC
14	IO18_D	I/O	Serial interface TXD pin, which corresponds to Pin 21 on the internal IC
15	IO20_D	I/O	Serial interface RXD pin, which corresponds to Pin 23 on the internal IC
16	IO21	I	Reset pin with a pull-up resistor inside, low-level activity, which corresponds to Pin 24 on the internal IC
17	SWC	I	JLINK communication clock pin, which corresponds to Pin 25 on the internal IC
18	SWDIO	I/O	JLINK communication data pin, which corresponds to Pin 26 on the internal IC

Note: P indicates a power supply pin, I/O indicates an input/output pin and AI indicates an analog input pin. If you have your requirements on the light color controlled by PWM output, please contact the business representative of Tuya.

Electrical parameters

Absolute electrical parameters

Parameter	Description	Minimum value	Maximum value	Unit
Ts	Storage temperature	–40	125	℃
VCC	Power supply voltage	–0.3	3.9	V
Static electricity discharge voltage (human body model)	TAMB-25℃	-	2	KV
Static electricity discharge voltage (machine model)	TAMB-25℃	-	1	KV

Working conditions

Parameter	Description	Minimum value	Typical value	Maximum value	Unit
Ta	Working temperature	–20	-	85	℃
VCC	Working voltage	1.7	3.3	3.6	V
VIL	I/O low level input	–0.3	-	VCC*0.3	V
VIH	I/O high level input	VCC*0.7	-	VCC	V
VOL	I/O low level output	VSS	-	0.3	V
VOH	I/O high level output	VCC–0.3	-	VCC	V

Power consumption in working mode

Symbol	Conditions	Typical value	Unit
Itx	Constantly transmit, the output power of 0 dBm	7.5	mA
Irx	Constantly receive	6	mA
IDC	Mesh network connection state	13	mA
Ideepsleep	Sleep mode	1	μA

RF features

Basic RF features

Parameter	Description
Working frequency	2.4 GHz ISM band
Wireless standard	Bluetooth LE 5.0
Data transmission rate	1 Mbps, 2 Mbps
Antenna type	Onboard PCB antenna

RF output power

Parameter	Minimum value	Typical value	Maximum value	Unit
Average RF output power	–40	4	4	dBm
20dB bandwidth (1M)	-	1300	-	KHz
20dB bandwidth (2M)	-	2600	-	KHz

RF receiving sensitivity

| Parameter| Minimum value | Typical value| Maximum value | Unit |
| ----- | ----- | ---- | ---- | ---- | ----- |
| RX sensitivity | 1 Mbps | –93 | –93 |–90 | dBm |
| RX sensitivity | 2 Mbps | –92 | –96 | –89 | dBm |
| Frequency offset error | 1 Mbps |–250 | - | +250 | KHz |
| Frequency offset error | 2 Mbps | –320 | - | +320 | KHz |
| Co-channel interference suppression | - | - | –7 | - | dB |

Antenna

Antenna type

TYBN1 uses an onboard PCB antenna whose frequency band is 2.400 to 2.483 GHz.

Antenna interference reduction

To ensure optimal RF performance, it is recommended that the antenna be at least 15 mm away from other metal parts.

Because TYBN1 is mounted to the main control panel through SMT, the placement location and manner of the PCB directly affect the RF performance. The following are placement positions recommended and not recommended.

Among them, placement positions in Solution 1 and 2 are recommended, that is, the antenna is placed outside the frame of the panel, or the antenna is placed along the frame edge of the panel with a carved area below. In the above two solutions, the RF performance is not different from that of an independent module.

If the PCB antenna must be placed on the panel due to the design limit, you can refer to the placement manner in Solution 3. That is, the antenna is placed along with the frame of the panel without copper or traces below. However, the RF performance is still reduced by 1 to 2 dBm.

The placement position in Solution 4 is not recommended. In this solution, the antenna is placed on the PCB without a clearance area below, which greatly affects the strength of the RF signal.

Packaging information and production instructions

Mechanical dimensions and dimensions of the back of the pad

Note: The default outline dimension tolerance is ±0.35 mm, and the critical dimension tolerance is ±0.1 mm. If you have specific requirements on dimensions, specify them clearly in the datasheet after communication.

Production instructions

• The stamp-hole module must be mounted by the SMT machine. After being unpacked, it must be soldered within 24 hours. Otherwise, it must be put into the drying cupboard where the RH is not greater than 10%, or it needs to be packaged under vacuum again and the exposure time needs to be recorded (the total exposure time cannot exceed 168 hours).

  • SMT equipment:
    • Mounter
    • SPI
    • Reflow soldering machine
    • Oven temperature tester
    • Automated optical inspection (AOI) equipment
  • Baking equipment:
    • Cabinet oven
    • Anti-static heat-resistant pallets
    • Anti-static heat-resistant gloves

• Storage conditions for a delivered module are as follows:

  • The moisture-proof bag must be placed in an environment where the temperature is below 40°C and the relative humidity is lower than 90%.
  • The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed.
  • The package contains a humidity indicator card (HIC).
    

• The module needs to be baked in the following cases:

  • Vacuum packing bag was found to be damaged before being unpacked.
  • There is no humidity indicator card (HIC) in the vacuum packing bag.
  • After being unpacked, 10% and above circles on the HIC become pink.
  • The total exposure time has been more than 168 hours since unpacking.
  • More than 12 months have passed since the sealing date of the bag.

• Baking settings:

  • Temperature: 40°C and ≤ 5% RH for reel package and 125°C and ≤5% RH for tray package (please use the heat-resistant tray rather than a plastic container).
  • Time: 168 hours for reel package and 12 hours for tray package.
  • Alarm temperature: 50°C for reel package and 135°C for tray package.
  • Production-ready temperature after natural cooling: < 36°C.
  • Re-baking situation: If a module remains unused for over 168 hours after being baked, it needs to be baked again.
  • If a batch of modules is not baked within 168 hours, do not use the wave soldering to solder them. Because these modules are Level-3 moisture-sensitive devices, they are very likely to get damp when exposed beyond the allowable time. In this case, if they are soldered at high temperatures, it may result in device failure or poor soldering.

• In the whole production process, take electrostatic discharge (ESD) protective measures.

• To guarantee the passing rate, it is recommended that you use the SPI and AOI to monitor the quality of solder paste printing and mounting.

Recommended oven temperature curve

Perform mounting with the SMT based on the following reflow oven temperature curve. The highest temperature is 245°C. The reflow temperature curve is as below:

• A: Temperature axis

• B: Time axis

• C: Liquidus temperature: 217 to 220°C

• D: Ramp-up slope: 1 to 3°C/s

• E: Duration of constant temperature: 60 to 120s; the range of constant temperature: 150 to 200°C

• F: Duration above the liquidus: 50 to 70s

• G: Peak temperature: 235 to 245°C

• H: Ramp-down slope: 1 to 4°C/s

  Note: The above curve is just an example of the solder paste SAC305. For more details about other solder pastes, please refer to Recommended oven temperature curve in the solder paste specifications.

Storage conditions

MOQ and packaging information

Product No.	MOQ (pcs)	Shipping packaging method	Number of modules per reel (pcs)	Number of reels per carton (reel)
TYBN1	3600	Tape reel	900	4

Appendix: Statement

FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this equipment.

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

Note: This equipment has been tested and found to comply with the limits for a Class B digital device, according to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used following the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and receiver.
• Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help.

Radiation Exposure Statement

This equipment complies with FCC radiation exposure limits set forth for an uncontrolled rolled environment. This equipment should be installed and operated with a minimum distance of 20cm between the radiator and your body.

Important Note

This radio module must not be installed to co-locate and operating simultaneously with other radios in the host system except following FCC multi-transmitter product procedures. Additional testing and equipment authorization may be required to operate simultaneously with other radios.

The availability of some specific channels and/or operational frequency bands are country dependent and are firmware programmed at the factory to match the intended destination. The firmware setting is not accessible by the end-user.

The host product manufacturer is responsible for compliance with any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.

The end-user manual shall include all required regulatory information/warnings as shown in this manual, including this product must be installed and operated with a minimum distance of 20 cm between the radiator and user body.

The RF module is considered as a limited modular transmitter according to FCC rules. Even though the RF module gets an FCC ID, the host product manufacturer can not use the FCC ID on the final product directly. In these circumstances, the host product manufacturer integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining the FCC authorization by a Class II permissive change application or a new application.

Declaration of Conformity European Notice

Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module product complies with essential requirements and other relevant provisions of Directive 2014/53/EU, 2011/65/EU. A copy of the Declaration of conformity can be found at https://www.tuya.com.

This product must not be disposed of as normal household waste, following the EU directive for waste electrical and electronic equipment (WEEE-2012/19/EU). Instead, it should be disposed of by returning it to the point of sale, or a municipal recycling collection point.

The device could be used with a separation distance of 20 cm to the human body.