ZT3L-Pro Module Datasheet

This topic describes Tuya’s proprietary ZT3L-Pro Zigbee module. It consists of a highly integrated wireless RF chip Z2 and a few peripheral components. The module is built around a 32-bit CPU core with 1 MB flash memory, 64 KB RAM, and various peripheral resources.

Overview

All these resources can help develop your own Zigbee products.

Features

• Built-in low-power 32-bit CPU processor

• Clock rate of 48 MHz

• Wide operating voltage range: 1.8V to 3.6V (2.8V or above recommended)

• Peripherals: 9 general-purpose input/output (GPIO) pins, 1 universal asynchronous receiver/transmitter (UART), and 1 analog-to-digital converter (ADC) pin

• Zigbee connectivity

  • Support IEEE 802.15.4 MAC/PHY
  • Operating channels 11 to 26 @ 2.400 to 2.483 GHz, air interface rate of 250 Kbit/s
  • Maximum output power of +20 dBm, and dynamic output power > 35 dB
  • Onboard PCB antenna
  • Onboard PCB antenna with a gain of 3.09 dBi
  • Operating temperature range: -40°C to 105°C
  • Support hardware Advanced Encryption Standard (AES) encryption

Applications

• Smart building
• Smart home and electrical appliance
• Smart socket and light
• Industrial wireless control
• Baby monitor
• Smart bus

Module interfaces

Dimensions and footprint

The ZT3L-Pro module has two rows of pins with a 2±0.1 mm pin spacing.

The ZT3L-Pro dimensions are 24±0.35 mm (L) × 16±0.35 mm (W) × 2.8±0.15 mm (H). The figure below shows the dimensions of the ZT3L-Pro module.

Pin definition

Pin No.	Symbol	I/O type	Description
1	CEN	I	Hardware reset pin. It outputs high by default, and is effective when pulled down.
2	C4	I/O	ADC pin, corresponding to C4 (Pin 24) on the IC.
3	CEN	I	This pin is internally connected to the RST pin and is pulled up inside the module.
4	D7	I/O	GPIO pin, corresponding to D7 (Pin 2) on the IC.
5	D2	I/O	Support hardware PWM, corresponding to D2 (Pin 31) on the IC.
6	C3	I/O	Support hardware PWM, corresponding to C3 (Pin 23) on the IC.
7	C2	I/O	Support hardware PWM, corresponding to C2 (Pin 22) on the IC.
8	PAVDD	P	Power supply pin (3.3V).
9	GND	P	Ground pin.
10	C0	I/O	GPIO pin, corresponding to C0 (Pin 20) on the IC.
11	D4	I/O	GPIO pin, corresponding to D4 (Pin 1) on the IC.
12	A0	I/O	GPIO pin, corresponding to A0 (Pin 3) on the IC.
13	B4	I/O	Support hardware PWM, corresponding to B4 (Pin 14) on the IC.
14	B5	I/O	Support hardware PWM, corresponding to B5 (Pin 15) on the IC.
15	B7	I/O	Uart_RXD, corresponding to B7 (Pin 17) on the IC.
16	B1	I/O	Uart_TXD, corresponding to B1 (Pin 6) on the IC.
17	SWS	I/O	Used for firmware flashing, corresponding to SWS (Pin 5) on the IC.

Electrical parameters

Absolute electrical parameters

Parameter	Description	Min value	Max value	Unit
Ta	Operating temperature	-40	105	°C
VBAT	Supply voltage	1.8V (2.8V or above recommended)	3.6	V
Electrostatic discharge voltage (human body model)	TAMB -25°C	-	2	kV
Electrostatic discharge voltage (machine model)	TAMB -25°C	-	0.5	kV

Normal operating conditions

Parameter	Description	Min value	Typical value	Max value	Unit
Ta	Operating temperature	-40	-	105	°C
VCC	Operating voltage	1.8V (2.8V or above recommended)	3.3	3.6	V
VIL	I/O low-level input	-	-	IOVDD × 0.3	V
VIH	I/O high-level input	IOVDD × 0.7	-	-	V
VOL	I/O low-level output	-	-	IOVDD × 0.2	V
VOH	I/O high-level output	IOVDD × 0.8	-	-	V

Power consumption during continuous transmission and reception

Operating status	Mode	Rate	Transmit/Receive power	Average value	Peak (Typical) value	Unit
Transmit	-	250 Kbit/s	+0 dBm	23.2	27	mA
Transmit	-	250 Kbit/s	+10 dBm	25	49.5	mA
Transmit	-	250 Kbit/s	+18.5 dBm	34	141	mA
Receive	-	250 Kbit/s	Continuous reception	13.7	16.1	mA

Operating current

Working mode	Status (Ta = 25°C)	Average value	Max (Typical) value	Unit
Pairing in EZ mode	The module is being paired in EZ mode.	13.6	13.9	mA
Connected	The module is connected to the internet.	13.5	14.8	mA
Deep sleep mode	Deep sleep mode (32 KB SRAM reserved)	2.8	-	μA

RF parameters

Basic RF features

Parameter	Description
Operating frequency	2.405 to 2.480 GHz
Zigbee standard	IEEE 802.15.4
Data transmission rate	250 Kbit/s
Antenna type	PCB antenna with a gain of 3.09 dBi

Transmitter (TX) performance

Continuous transmission performance

Parameter	Min value	Typical value	Max value	Unit
Maximum output power (250 Kbit/s)	-	20	-	dBm
Minimum output power (250 Kbit/s)	-	-25	-	dBm
Output power adjustment step	-	0.5	1	dBm
Adjacent channel interference suppression of output spectrum	-	-31	-	dBc
Frequency error	-10	-	10	ppm

Receiver (RX) performance

RX sensitivity

Parameter	Min value	Typical value	Max value	Unit
PER < 8%, RX sensitivity (250 Kbit/s)	-101	-100	-99	dBm

Power-up sequence of the module

The Z2 chip has requirements for power-up sequence. During the power-up process, the system begins to start after the RST pin reaches 1.62V. At this time, the VCC pin needs to reach above 1.8V within 10 ms. The RST pin has an RC link. When the RST pin reaches 1.62V, the VCC pin of the bare module has far exceeded 1.8V.

If the power driver connected to a module with a Z2 chip is charged and discharged by a large capacitor, and the module voltage is not fully discharged below 0.6V, the module might crash when restarted. The VCC_3.3V power supply pin of the module needs to be connected to a 1K dummy load to speed up discharge. The figure below shows part of the power drive link for your reference.

Antenna information

Antenna type

Only PCB antenna applies.

Antenna interference reduction

When a PCB antenna is used on a Zigbee module, we recommend that the module antenna is at least 15 mm away from other metal components. This can optimize the Zigbee performance.

Make sure that the enclosure surrounding the antenna is not traced or filled with copper. Otherwise, the RF performance might be degraded.

Packing and production instructions

Mechanical dimensions

The PCB dimensions are 24±0.35 mm (L) × 16±0.35 mm (W) × 0.8±0.1 mm (H).

Side view

Pin out

Dual-inline package (DIP)

ZT3L-Pro can use an SMT package or DIP. The figure below shows the dimensions and packaging design of the DIP.

Surface-mount technology (SMT) package

Production instructions

1. For the modules that can be packaged with the surface-mount technology (SMT) or in in-line form, you can select either of them according to your PCB design solutions. If a PCB is designed to be SMT-packaged, package the module with the SMT. If a PCB is designed to use an in-line package, use wave soldering. Complete soldering within 24 hours after the module is unpacked. Otherwise, we recommend that you place the module in a drying cupboard with a relative humidity level below 10%, or pack the module in vacuum again. Then, record the packing time and duration of exposure. The total exposure time cannot exceed 168 hours.

   • Instruments or devices required for the SMT process:
     • Surface mount system
     • SPI
     • Reflow soldering machine
     • Thermal profiler
     • Automated optical inspection (AOI) equipment
   • Instruments or devices required for the wave soldering process:
     • Wave soldering equipment
     • Wave soldering fixture
     • Constant-temperature soldering iron
     • Tin bar, tin wire, and flux
     • Thermal profiler
   • Instruments or devices required for the baking process:
     • Cabinet oven
     • Electrostatic discharge (ESD) protection and heat-resistant trays
     • ESD protection and heat-resistant gloves

2. A delivered module must meet the following storage requirements:

   • The moisture-proof bag must be placed in an environment where the temperature is below 40°C and the relative humidity is lower than 90%.

   • The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed.

   • A humidity indication card (HIC) is put in the sealed package.

     

3. The module needs to be baked in the following cases:

   • The vacuum packaging bag is damaged before unpacking.
   • After unpacking, no HIC is found in the packaging bag.
   • After unpacking, the HIC indicates a humidity level of 10% or higher. In this case, the circle turns pink on the HIC.
   • The total exposure time has lasted for over 168 hours since unpacking.
   • More than 12 months have passed since the first sealing of the bag.

4. The baking parameter settings are described below:

   • Baking temperature: 40°C for reel packaging with relative humidity ≤ 5%. And 125°C for tray packaging with relative humidity ≤ 5% (use a heat-resistant tray, rather than plastic containers).
   • Baking time: 168 hours for reel packaging and 12 hours for tray packaging.
   • Temperature for triggering an alert: 50°C for reel packaging and 135°C for tray packaging.
   • Production can begin after a module has cooled down to below 36°C under natural conditions.
   • If a module remains unused for over 168 hours after being baked, it needs to be baked again.
   • If a batch of modules is not baked after exposure for more than 168 hours, do not use wave soldering to solder them. Because these modules are level-3 moisture-sensitive devices, they are very likely to get damp when exposed beyond the allowable time. In this case, if they are soldered at high temperatures, device failure or poor soldering performance might occur.

5. In the whole production process, take electrostatic discharge (ESD) protective measures.

6. To guarantee the pass rate, we recommend that you use the SPI and AOI to monitor the quality of solder paste printing and mounting.

Recommended oven temperature curve

Select a proper soldering technique according to the process. For more information, refer to the recommended oven temperature curve of either reflow soldering or wave soldering. The set temperatures might deviate from the actual temperature measurements. All temperatures shown in this module datasheet are obtained through actual measurements.

Technique 1: SMT process (recommended oven temperature curve of reflow soldering)

Set the oven temperatures according to the following curve.

• A: temperature axis
• B: time axis
• C: alloy liquidus temperature from 217°C to 220°C
• D: ramp-up slope from 1°C/s to 3°C/s
• E: keep a constant temperature from 150°C to 200°C for a time period of 60s to 120s
• F: temperature above liquidus temperature for 50s to 70s
• G: peak temperature from 235°C to 245°C
• H: ramp-down slope from 1°C/s to 4°C/s

Technique 2: Wave soldering process (oven temperature curve of wave soldering)

Set the oven temperatures according to the following temperature curve of wave soldering. The peak temperature is 260°C±5°C.

Suggestions on wave soldering	-	Suggestions on manual repair soldering	-
Preheat temperature	80°C to 130°C	Soldering temperature	360°C ± 20°C
Preheat duration	75s to 100s	Soldering duration	Less than 3s/point
Contact duration at the peak	3s to 5s	N/A	N/A
Solder tank temperature	260°C ± 5°C	N/A	N/A
Ramp-up slope	≤ 2°C/s	N/A	N/A
Ramp-down slope	≤ 6°C/s	N/A	N/A

Storage conditions

MOQ and packaging information

Product model	MOQ (pcs)	Shipping packaging	Modules per reel	Reels per carton
ZT3L-Pro	3,600	Tape and reel	900	4

Appendix: Statement

FCC Caution : Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this device.

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

Note: This device has been tested and found to comply with the limits for a Class B digital device, according to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This device generates, uses, and can radiate radio frequency energy and, if not installed and used following the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation.

If this device does cause harmful interference to radio or television reception, which can be determined by turning the device off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

• Reorient or relocate the receiving antenna.
• Increase the separation between the device and receiver.
• Connect the device to an outlet on a circuit different from that to which the receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help.

Radiation Exposure Statement

This device complies with FCC radiation exposure limits set forth for an uncontrolled rolled environment. This device should be installed and operated with a minimum distance of 20cm between the radiator and your body.

Important Note

This radio module must not be installed to co-locate and operate simultaneously with other radios in the host system except by following FCC multi-transmitter product procedures. Additional testing and device authorization may be required to operate simultaneously with other radios.

The availability of some specific channels and/or operational frequency bands are country dependent and are firmware programmed at the factory to match the intended destination. The firmware setting is not accessible to the end-user.

The host product manufacturer is responsible for compliance with any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.

The end-user manual shall include all required regulatory information/warnings as shown in this manual, including “This product must be installed and operated with a minimum distance of 20 cm between the radiator and user body”.

This device has got an FCC ID: 2ANDL-ZT3L-Pro. The end product must be labeled in a visible area with the following: “Contains Transmitter Module FCC ID: 2ANDL-ZT3L-Pro”.

This device is intended only for OEM integrators under the following conditions:
The antenna must be installed such that 20cm is maintained between the antenna and users, and The transmitter module may not be co-located with any other transmitter or antenna.

As long as the 2 conditions above are met, further transmitter tests will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed.

Declaration of Conformity European Notice

Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module product is in compliance with essential requirements and other relevant provisions of Directive 2014/53/EU,2011/65/EU. A copy of the Declaration of Conformity can be found at https://www.tuya.com.

This product must not be disposed of as normal household waste, in accordance with the EU directive for waste electrical and electronic equipment (WEEE-2012/19/EU). Instead, it should be disposed of by returning it to the point of sale, or to a municipal recycling collection point.

The device could be used with a separation distance of 20cm from the human body.