Last Updated on : 2025-04-17 01:44:53download
TS24-2S is a Matter over Thread module that Tuya has developed. It consists of a highly integrated RF processing chip EFR32MG24, a few peripherals, a built-in 802.15.4 PHY/MAC Thread network protocol stack, and rich library functions.
TS24-2S is embedded with a low-power 32-bit ARM Cortex-M33 core, 1536 KB flash program memory, 192 KB RAM, and abundant peripheral resources. It integrates all function libraries of the Thread MAC and TCP/IP. You can develop embedded Thread products as required.
TS24-2S has two rows of pins with a spacing of 2 mm.
TS24-2S dimensions are 14.99±0.35 mm (W)×17.91±0.35 mm (L) ×2.80±0.15 mm (H). The PCB thickness is 0.8±0.1 mm.
The dimensions of TS24-2S are as follows:
Pin number | Symbol | Type | Function |
---|---|---|---|
1 | 3V3 | P | Power supply pin (typical power supply voltage: 3.3 V). |
2 | P8 | I/O | Hardware PWM pin, which is connected to PA08 on the internal IC. |
3 | GND | P | Power supply reference ground pin, which must be properly grounded. |
4 | P7 | I/O | Hardware PWM pin, which is connected to PA07 on the internal IC. |
5 | RX1 | I/O | Serial interface receiving pin (UART0_RXD ), which is connected to PD02 on the internal IC. |
6 | P6 | I/O | Hardware PWM pin, which is connected to PA06 on the internal IC. |
7 | TX1 | I/O | Serial interface transmission pin (UART0_TXD ), which is connected to PD03 on the internal IC. |
8 | P5 | AI | ADC, which is connected to PA05 on the internal IC. |
9 | P4 | I/O | Hardware PWM pin, which is connected to PA04 on the internal IC. |
10 | RST | I | Hardware reset pin. The chip is reset when the level is low. The level is high in. |
11 | P3 | I/O | Hardware PWM pin, which is connected to PA03 on the internal IC. |
Note:
- P indicates a power supply pin and I/O indicates an input/output pin.
- SWDIO and SWCLK are burning pins, which are not exposed by default. During routing, customers should bypass them.
Parameter | Description | Minimum value | Maximum value | Unit |
---|---|---|---|---|
Ts | Storage temperature | -50 | 150 | ℃ |
VBAT | Power supply voltage | 2.0 | 3.8 | V |
ESD voltage (human body model) | TAMB-25℃ | - | 2 | KV |
ESD voltage (machine model) | TAMB-25℃ | - | 0.5 | KV |
Parameter | Description | Minimum value | Typical value | Maximum value | Unit |
---|---|---|---|---|---|
Ta | Operating temperature | -40 | - | 85 | ℃ |
VCC | Operating voltage | 2.0 | 3.3 | 3.8 | V |
VIL | I/O low level input | - | - | VDD*0.3 | V |
VIH | I/O high level input | VDD*0.7 | - | - | V |
VOL | I/O low level output | - | - | VDD*0.2 | V |
VOH | I/O high level output | VDD*0.8 | - | - | V |
Working status | Mode | Rate | Transmit power/receive | Average value | Peak value (Typical value) | Unit |
---|---|---|---|---|---|---|
Transmit | - | 250Kbps | +19dBm | 175 | 180 | mA |
Transmit | - | 250 Kbps | +10 dBm | 55 | 60 | mA |
Transmit | - | 250 Kbps | +0 dBm | 22 | 24 | mA |
Receive | - | 250Kbps | Constantly receive | 7 | 9 | mA |
Working mode | Working status, Ta = 25°C | Average value | Maximum value (Typical value) | Unit | Remark |
---|---|---|---|---|---|
EZ mode | The module is in fast network connection state. | 450 | 500 | μA | Low Power Firmware |
Connected and busy | The module is connected to the network and in running state. | 150 | 200 | μA | Low Power Firmware |
Connected and idle | The module is connected to the network and in idle state. | 55 | 70 | μA | Low Power Firmware |
Deep sleep mode | Deep sleep mode, reserve 192-KB flash | 5 | - | μA |
Parameter | Description |
---|---|
Working frequency | 2.405 to 2.480 GHz |
Zigbee standard | IEEE 802.15.4 |
Data transmission rate | 250 Kbps |
Antenna type | PCB antenna with a gain of 1.74 dBi |
TX performance
Parameter | Minimum value | Typical value | Maximum value | Unit |
---|---|---|---|---|
Output power (250Kbps) | -30 | 15 | 19 | dBm |
Output power adjustment stepping | - | 0.5 | 1 | dBm |
Output spectrum adjacent channel suppression | - | -31 | - | dBc |
Frequency error | -15 | - | 15 | ppm |
RX sensitivity
Parameter | Minimum value | Typical value | Maximum value | Unit |
---|---|---|---|---|
PER<8%, RX sensitivity (250 Kbps) | -104 | -104 | -103 | dBm |
TS24-2S uses the PCB antenna.
To ensure optimal RF performance when the Thread module uses a PCB antenna, it is recommended that the antenna be at least 15 mm away from other metal parts.
To prevent adverse impact on the antenna radiation performance, avoid copper or traces within the antenna area on the PCB.
The PCB dimensions are 17.91±0.35 mm (W)×14.99±0.35 mm (L) ×0.8±0.1 mm (H).
For the modules that can be packaged with the SMT or in an in-line way, you can select either of them according to the PCB design solutions of customers. If a PCB is designed to be SMT-packaged, package the module with the SMT. If a PCB is designed to be in-line-packaged, package the module in an in-line way. After being unpacked, the module must be soldered within 24 hours. Otherwise, it needs to be put into the drying cupboard where the relative humidity is not greater than 10%; or it needs to be packaged again under vacuum and the exposure time needs to be recorded (the total exposure time cannot exceed 168 hours).
Storage conditions for a delivered module:
The moisture-proof bag must be placed in an environment in which the temperature is below 40°C and the relative humidity is lower than 90%.
The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed.
There is a humidity indicator card (HIC) in the packaging bag.
The module needs to be baked in the following cases:
Baking settings:
In the whole production process, take electrostatic discharge (ESD) protective measures.
To guarantee the passing rate, it is recommended that you use the SPI and AOI to monitor the quality of solder paste printing and mounting.
Select a proper soldering manner according to the process. For the SMT process, please refer to the recommended oven temperature curve of reflow soldering. For the wave soldering process, please refer to the recommended oven temperature curve of wave soldering. There are some differences between the set temperatures and the actual temperatures. All the temperatures shown in this module datasheet are obtained through actual measurements.
Manner 1: SMT process (Recommended oven temperature curve of reflow soldering)
Set oven temperatures according to the following curve.
A: Temperature axis
B: Time axis
C: Liquidus temperature: 217 to 220°C
D: Ramp-up slope: 1 to 3°C/s
E: Duration of constant temperature: 60 to 120s; the range of constant temperature: 150 to 200°C
F: Duration above the liquidus: 50 to 70s
G: Peak temperature: 235 to 245°C
H: Ramp-down slope: 1 to 4°C/s
Note: The above curve is just an example of the solder paste SAC305. For more details about other solder pastes, please refer to the recommended oven temperature curve in the solder paste specifications.
Manner 2: Wave soldering process (Oven temperature curve of wave soldering)
Set oven temperatures according to the following temperature curve of wave soldering. The peak temperature is 260°C±5°C.
Suggestions on oven temperature curve of wave soldering | Suggestions on manual soldering temperature | ||
---|---|---|---|
Preheat temperature | 80 to 130 °C | Soldering temperature | 360±20°C |
Preheat time | 75 to 100s | Soldering time | < 3s/point |
Peak contact time | 3 to 5s | NA | NA |
Temperature of tin cylinder | 260±5°C | NA | NA |
Ramp-up slope | ≤2°C/s | NA | NA |
Ramp-down slope | ≤6°C/s | NA | NA |
Product model | MOQ (pcs) | Packing method | Modules per reel | Reels per carton |
---|---|---|---|---|
TS24-2S | 4400 | Tape reel | 1100 | 4 |
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