TS24-U Module Datasheet

TS24-U is a Matter over Thread module that Tuya has developed. It consists of a highly integrated RF processing chip EFR32MG24, a few peripherals, a built-in 802.15.4 PHY/MAC Thread network protocol stack, and rich library functions.

Product overview

TS24-U is embedded with a low-power 32-bit ARM Cortex-M33 core, 1536-KB flash program memory, 192-KB RAM, and abundant peripheral resources. It integrates all function libraries of the Thread MAC and TCP/IP. You can develop embedded Thread products as required.

Features

• Embedded ARM Cortex-M 33 processor having a low-power 32-bit CPU and DSP instructions and floating-point units, which can also function as an application processor.
• Clock rate: 78 MHz
• Wide operating voltage: 2.0 to 3.8 V
• Peripherals: 9 GPIOs, 1 UART, 2 ADCs, and 5 PWMs
• Thread connectivity
  • Support 802.15.4 MAC/PHY
  • Working channels 11 to 26 @2.400 to 2.483 GHz, air interface rate: 250 Kbps
  • Up to +10dBm output power
  • 35 μA/MHz power consumption during running; 5-μA sleep current
  • PCB antenna inside
  • Onboard antenna with a gain of -1 dBi
  • Operating temperature: -40°C to 105°C
  • Support hardware encryption and AES 128/256
• Bluetooth LE radio frequency (RF) features
  • Bluetooth LE
  • RF data rate of up to 2 Mbit/s
  • Transmitter power: +5 dBm
  • Receiver sensitivity: -96 dBm@Bluetooth LE 1 Mbit/s

Applications

• Smart building
• Smart household and home appliances
• Smart socket and light
• Industrial wireless control
• Baby monitor
• Network camera
• Smart bus

Module interfaces

Dimensions and footprint

TS24-U has 3 lines of pins. The spacing of pins at the two sides is 1.4±0.1 mm, and the spacing of pins at the bottom is 1.8±0.1 mm.

The dimensions of the TS24-U are 20.3±0.35 mm (L) × 15.8±0.35 mm (W) × 3.0±0.1 mm (H).

The dimensions of TS24-U are as follows:

Pin definition

Pin number	Symbol	Type	Function
1	PB4	I/O	Common I/O pin, which corresponds to PB04 on the internal IC
2	PB3	I/O	Common I/O pin, which corresponds to PB03 on the internal IC
3	PA2	I/O	Flashing pin, SWDIO, which corresponds to PA02 on the internal IC
4	PA1	I/O	Flashing pin, SWCLK, which corresponds to PA01 on the internal IC
5	PB2	I	ADC pin, which corresponds to PB02 on the internal IC
6	PA0	I/O	Common I/O pin, which corresponds to PA00 on the internal IC and sends user data in low power solutions
7	PB0	I/O	Common I/O pin, which corresponds to PB00 on the internal IC and receives user data in low power solutions
8	PC2	I/O	Support hardware PWM and correspond to PC02 on the internal IC
9	PC1	I/O	Support hardware PWM and correspond to PC01 on the internal IC
10	PA4	I/O	Support hardware PWM and correspond to PA04 on the internal IC
11	PA5	I/O	Support hardware PWM and correspond to PA05 on the internal IC
12	PA6	I/O	Support hardware PWM and correspond to PA06 on the internal IC
13	GND	P	Power supply reference ground
14	VCC	P	Power supply pin (3.3V)
15	TX0	I/O	UART_TXD0, used for transmitting user data and flashing authorization, which corresponds to PD03 on the internal IC
16	RX0	I/O	UART_RXD0, used for receiving user data and flashing authorization, which corresponds to PD02 on the internal IC
17	PA8	I	ADC pin, which corresponds to PA08 on the internal IC
18	RST	I/O	Reset pin, low active, which corresponds to RESETn on the internal IC
19	PA7	I/O	Common I/O pin, which corresponds to PA07 on the internal IC
20	PA3	I/O	Common I/O pin, which corresponds to PA03 on the internal IC
21	PB1	I/O	Common I/O pin, which corresponds to PB01 on the internal IC

Electrical parameters

Absolute electrical parameters

Parameter	Description	Minimum value	Maximum value	Unit
Ts	Storage temperature	-50	150	°C
VBAT	Power supply voltage	2.0	3.8	V
ESD voltage (human body model)	TAMB-25℃	-	2	KV
ESD voltage (machine model)	TAMB-25℃	-	0.5	KV

Normal working conditions

Parameter	Description	Minimum value	Typical value	Maximum value	Unit
Ta	Operating temperature	-40	-	105	°C
VCC	Operating voltage	2.0	3.3	3.8	V
VIL	I/O low level input	-	-	VDD*0.3	V
VIH	I/O high level input	VDD*0.7	-	-	V
VOL	I/O low level output	-	-	VDD*0.2	V
VOH	I/O high level output	VDD*0.8	-	-	V

TX and RX power consumption

Working status	Mode	Rate	Transmit power/receive	Average value	Peak value (Typical value)	Unit
Transmit	-	250Kbps	+19dBm	175	180	mA
Transmit	-	250 Kbps	+10 dBm	55	60	mA
Transmit	-	250 Kbps	+0 dBm	22	24	mA
Receive	-	250Kbps	Constantly receive	7	9	mA

Working current

Working mode	Working status, Ta = 25°C	Average value	Maximum value (Typical value)	Unit	Remark
EZ mode	The module is in fast network connection state.	450	500	μA	Low Power Firmware
Connected and busy	The module is connected to the network and in running state.	150	200	μA	Low Power Firmware
Connected and idle	The module is connected to the network and in idle state.	55	70	μA	Low Power Firmware
Deep sleep mode	Deep sleep mode, reserve 192-KB flash	5	-	μA

RF parameters

Basic RF features

Zigbee parameter	Description
Working frequency	2.405 to 2.480 GHz
Zigbee standard	IEEE 802.15.4
Data transmission rate	250 Kbps
Antenna type	PCB antenna with a gain of -1 dBi

Bluetooth LE Parameter	Description
Operating frequency	2.4 GHz ISM band
Wireless standard	Bluetooth LE 5.3
Data transmission rate	1 Mbit/s and 2 Mbit/s
Antenna type	PCB antenna with a gain of -1 dBi

TX performance

TX performance

Zigbee parameter	Minimum value	Typical value	Maximum value	Unit
Output power (250Kbps)	-30	15	19	dBm
Output power adjustment stepping	-	0.5	1	dBm
Output spectrum adjacent channel suppression	-	-31	-	dBc
Frequency error	-15	-	15	ppm

Bluetooth LE parameter	Minimum value	Typical value	Maximum value	Unit
RF average output power	-	4.5	5	dBm
Bandwidth of 20 dB modulation signal (1 Mbit/s)	-	2500	-	KHz

RX performance

RX sensitivity

Zigbee parameter	Minimum value	Typical value	Maximum value	Unit
PER<8%, RX sensitivity (250 Kbps)	-104	-104	-103	dBm

Bluetooth LE parameter	Minimum value	Typical value	Maximum value	Unit
RX sensitivity 1 Mbit/s	-	-96	-	dBm
RX sensitivity 2 Mbit/s	-	-93.5	-	dBm
Frequency offset error 1 Mbit/s	-250	-	+300	KHz
Co-channel interference suppression	-	-	-10	dB

Antenna information

Antenna type

TS24-U uses the PCB antenna.

Antenna interference reduction

To ensure optimal RF performance when the Thread module uses a PCB antenna, it is recommended that the antenna be at least 15 mm away from other metal parts.
To prevent adverse impact on the antenna radiation performance, avoid copper or traces within the antenna area on the PCB.

Packaging information and production instructions

Mechanical dimensions

The PCB dimensions are 20.3±0.35 mm (W)×15.8±0.35 mm (L) ×1.0±0.1 mm (H).

Side view

Schematic diagram of footprint

Recommended packaging

Production instructions

1. For the modules that can be packaged with the SMT or in an in-line way, you can select either of them according to the PCB design solutions of customers. If a PCB is designed to be SMT-packaged, package the module with the SMT. If a PCB is designed to be in-line-packaged, package the module in an in-line way. After being unpacked, the module must be soldered within 24 hours. Otherwise, it needs to be put into the drying cupboard where the relative humidity is not greater than 10%; or it needs to be packaged again under vacuum and the exposure time needs to be recorded (the total exposure time cannot exceed 168 hours).

   • (SMT process) SMT devices:
     • Mounter
     • SPI
     • Reflow soldering machine
     • Thermal profiler
     • Automated optical inspection (AOI) equipment
   • (Wave soldering process) Wave soldering devices
     • Wave soldering equipment
     • Wave soldering fixture
     • Constant-temperature soldering iron
     • Tin bar, tin wire, and flux
     • Thermal profiler
   • Baking devices:
     • Cabinet oven
     • Anti-electrostatic and heat-resistant trays
     • Anti-electrostatic and heat-resistant gloves

2. Storage conditions for a delivered module:

   • The moisture-proof bag must be placed in an environment in which the temperature is below 40°C and the relative humidity is lower than 90%.

   • The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed.

   • There is a humidity indicator card (HIC) in the packaging bag.

     

3. The module needs to be baked in the following cases:

   • The packaging bag is damaged before unpacking.
   • There is no humidity indicator card (HIC) in the packaging bag.
   • After unpacking, circles of 10% and above on the HIC become pink.
   • The total exposure time has lasted for over 168 hours since unpacking.
   • More than 12 months have passed since the sealing of the bag.

4. Baking settings:

   • Temperature: 40°C and ≤ 5% RH for reel package and 125°C and ≤5% RH for tray package (please use the heat-resistant tray rather than plastic container)
   • Time: 168 hours for reel package and 12 hours for tray package
   • Alarm temperature: 50°C for reel package and 135°C for tray package
   • Production-ready temperature after natural cooling: < 36°C
   • Re-baking situation: If a module remains unused for over 168 hours after being baked, it needs to be baked again.
   • If a batch of modules is not baked within 168 hours, do not use reflow soldering or wave soldering to solder them. Because these modules are Level-3 moisture-sensitive devices, they are very likely to get damp when exposed beyond the allowable time. In this case, if they are soldered at high temperatures, it may result in device failure or poor soldering.

5. In the whole production process, take electrostatic discharge (ESD) protective measures.

6. To guarantee the passing rate, it is recommended that you use the SPI and AOI to monitor the quality of solder paste printing and mounting.

Recommended oven temperature curve

Select a proper soldering manner according to the process. For the SMT process, please refer to the recommended oven temperature curve of reflow soldering. For the wave soldering process, please refer to the recommended oven temperature curve of wave soldering. There are some differences between the set temperatures and the actual temperatures. All the temperatures shown in this module datasheet are obtained through actual measurements.

Manner 1: SMT process (Recommended oven temperature curve of reflow soldering)

Set oven temperatures according to the following curve.

• A: Temperature axis

• B: Time axis

• C: Liquidus temperature: 217 to 220°C

• D: Ramp-up slope: 1 to 3°C/s

• E: Duration of constant temperature: 60 to 120s; the range of constant temperature: 150 to 200°C

• F: Duration above the liquidus: 50 to 70s

• G: Peak temperature: 235 to 245°C

• H: Ramp-down slope: 1 to 4°C/s

  The above curve is just an example of the solder paste SAC305. For more details about other solder pastes, please refer to Recommended oven temperature curve in the solder paste specifications.

Manner 2: Wave soldering process (Oven temperature curve of wave soldering)

Set oven temperatures according to the following temperature curve of wave soldering. The peak temperature is 260°C±5°C.

Suggestions on oven temperature curve of wave soldering		Suggestions on manual soldering temperature
Preheat temperature	80 to 130 °C	Soldering temperature	360±20°C
Preheat time	75 to 100s	Soldering time	＜3s/point
Peak contact time	3 to 5s	NA	NA
Temperature of tin cylinder	260±5°C	NA	NA
Ramp-up slope	≤2°C/s	NA	NA
Ramp-down slope	≤6°C/s	NA	NA

Storage conditions

MOQ and packaging information

Product model	MOQ (pcs)	Packing method	Modules per reel	Reels per carton
TS24-U	4400	Tape reel	1100	4