Last Updated on : 2025-04-17 01:45:49download
TS24-U is a Matter over Thread module that Tuya has developed. It consists of a highly integrated RF processing chip EFR32MG24, a few peripherals, a built-in 802.15.4 PHY/MAC Thread network protocol stack, and rich library functions.
TS24-U is embedded with a low-power 32-bit ARM Cortex-M33 core, 1536-KB flash program memory, 192-KB RAM, and abundant peripheral resources. It integrates all function libraries of the Thread MAC and TCP/IP. You can develop embedded Thread products as required.
TS24-U has 3 lines of pins. The spacing of pins at the two sides is 1.4±0.1 mm, and the spacing of pins at the bottom is 1.8±0.1 mm.
The dimensions of the TS24-U are 20.3±0.35 mm (L) × 15.8±0.35 mm (W) × 3.0±0.1 mm (H).
The dimensions of TS24-U are as follows:
Pin number | Symbol | Type | Function |
---|---|---|---|
1 | PB4 | I/O | Common I/O pin, which corresponds to PB04 on the internal IC |
2 | PB3 | I/O | Common I/O pin, which corresponds to PB03 on the internal IC |
3 | PA2 | I/O | Flashing pin, SWDIO, which corresponds to PA02 on the internal IC |
4 | PA1 | I/O | Flashing pin, SWCLK, which corresponds to PA01 on the internal IC |
5 | PB2 | I | ADC pin, which corresponds to PB02 on the internal IC |
6 | PA0 | I/O | Common I/O pin, which corresponds to PA00 on the internal IC and sends user data in low power solutions |
7 | PB0 | I/O | Common I/O pin, which corresponds to PB00 on the internal IC and receives user data in low power solutions |
8 | PC2 | I/O | Support hardware PWM and correspond to PC02 on the internal IC |
9 | PC1 | I/O | Support hardware PWM and correspond to PC01 on the internal IC |
10 | PA4 | I/O | Support hardware PWM and correspond to PA04 on the internal IC |
11 | PA5 | I/O | Support hardware PWM and correspond to PA05 on the internal IC |
12 | PA6 | I/O | Support hardware PWM and correspond to PA06 on the internal IC |
13 | GND | P | Power supply reference ground |
14 | VCC | P | Power supply pin (3.3V) |
15 | TX0 | I/O | UART_TXD0 , used for transmitting user data and flashing authorization, which corresponds to PD03 on the internal IC |
16 | RX0 | I/O | UART_RXD0 , used for receiving user data and flashing authorization, which corresponds to PD02 on the internal IC |
17 | PA8 | I | ADC pin, which corresponds to PA08 on the internal IC |
18 | RST | I/O | Reset pin, low active, which corresponds to RESETn on the internal IC |
19 | PA7 | I/O | Common I/O pin, which corresponds to PA07 on the internal IC |
20 | PA3 | I/O | Common I/O pin, which corresponds to PA03 on the internal IC |
21 | PB1 | I/O | Common I/O pin, which corresponds to PB01 on the internal IC |
Parameter | Description | Minimum value | Maximum value | Unit |
---|---|---|---|---|
Ts | Storage temperature | -50 | 150 | °C |
VBAT | Power supply voltage | 2.0 | 3.8 | V |
ESD voltage (human body model) | TAMB-25℃ | - | 2 | KV |
ESD voltage (machine model) | TAMB-25℃ | - | 0.5 | KV |
Parameter | Description | Minimum value | Typical value | Maximum value | Unit |
---|---|---|---|---|---|
Ta | Operating temperature | -40 | - | 105 | °C |
VCC | Operating voltage | 2.0 | 3.3 | 3.8 | V |
VIL | I/O low level input | - | - | VDD*0.3 | V |
VIH | I/O high level input | VDD*0.7 | - | - | V |
VOL | I/O low level output | - | - | VDD*0.2 | V |
VOH | I/O high level output | VDD*0.8 | - | - | V |
Working status | Mode | Rate | Transmit power/receive | Average value | Peak value (Typical value) | Unit |
---|---|---|---|---|---|---|
Transmit | - | 250Kbps | +19dBm | 175 | 180 | mA |
Transmit | - | 250 Kbps | +10 dBm | 55 | 60 | mA |
Transmit | - | 250 Kbps | +0 dBm | 22 | 24 | mA |
Receive | - | 250Kbps | Constantly receive | 7 | 9 | mA |
Working mode | Working status, Ta = 25°C | Average value | Maximum value (Typical value) | Unit | Remark |
---|---|---|---|---|---|
EZ mode | The module is in fast network connection state. | 450 | 500 | μA | Low Power Firmware |
Connected and busy | The module is connected to the network and in running state. | 150 | 200 | μA | Low Power Firmware |
Connected and idle | The module is connected to the network and in idle state. | 55 | 70 | μA | Low Power Firmware |
Deep sleep mode | Deep sleep mode, reserve 192-KB flash | 5 | - | μA |
Zigbee parameter | Description |
---|---|
Working frequency | 2.405 to 2.480 GHz |
Zigbee standard | IEEE 802.15.4 |
Data transmission rate | 250 Kbps |
Antenna type | PCB antenna with a gain of -1 dBi |
Bluetooth LE Parameter | Description |
---|---|
Operating frequency | 2.4 GHz ISM band |
Wireless standard | Bluetooth LE 5.3 |
Data transmission rate | 1 Mbit/s and 2 Mbit/s |
Antenna type | PCB antenna with a gain of -1 dBi |
TX performance
Zigbee parameter | Minimum value | Typical value | Maximum value | Unit |
---|---|---|---|---|
Output power (250Kbps) | -30 | 15 | 19 | dBm |
Output power adjustment stepping | - | 0.5 | 1 | dBm |
Output spectrum adjacent channel suppression | - | -31 | - | dBc |
Frequency error | -15 | - | 15 | ppm |
Bluetooth LE parameter | Minimum value | Typical value | Maximum value | Unit |
---|---|---|---|---|
RF average output power | - | 4.5 | 5 | dBm |
Bandwidth of 20 dB modulation signal (1 Mbit/s) | - | 2500 | - | KHz |
RX sensitivity
Zigbee parameter | Minimum value | Typical value | Maximum value | Unit |
---|---|---|---|---|
PER<8%, RX sensitivity (250 Kbps) | -104 | -104 | -103 | dBm |
Bluetooth LE parameter | Minimum value | Typical value | Maximum value | Unit |
---|---|---|---|---|
RX sensitivity 1 Mbit/s | - | -96 | - | dBm |
RX sensitivity 2 Mbit/s | - | -93.5 | - | dBm |
Frequency offset error 1 Mbit/s | -250 | - | +300 | KHz |
Co-channel interference suppression | - | - | -10 | dB |
TS24-U uses the PCB antenna.
To ensure optimal RF performance when the Thread module uses a PCB antenna, it is recommended that the antenna be at least 15 mm away from other metal parts.
To prevent adverse impact on the antenna radiation performance, avoid copper or traces within the antenna area on the PCB.
The PCB dimensions are 20.3±0.35 mm (W)×15.8±0.35 mm (L) ×1.0±0.1 mm (H).
For the modules that can be packaged with the SMT or in an in-line way, you can select either of them according to the PCB design solutions of customers. If a PCB is designed to be SMT-packaged, package the module with the SMT. If a PCB is designed to be in-line-packaged, package the module in an in-line way. After being unpacked, the module must be soldered within 24 hours. Otherwise, it needs to be put into the drying cupboard where the relative humidity is not greater than 10%; or it needs to be packaged again under vacuum and the exposure time needs to be recorded (the total exposure time cannot exceed 168 hours).
Storage conditions for a delivered module:
The moisture-proof bag must be placed in an environment in which the temperature is below 40°C and the relative humidity is lower than 90%.
The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed.
There is a humidity indicator card (HIC) in the packaging bag.
The module needs to be baked in the following cases:
Baking settings:
In the whole production process, take electrostatic discharge (ESD) protective measures.
To guarantee the passing rate, it is recommended that you use the SPI and AOI to monitor the quality of solder paste printing and mounting.
Select a proper soldering manner according to the process. For the SMT process, please refer to the recommended oven temperature curve of reflow soldering. For the wave soldering process, please refer to the recommended oven temperature curve of wave soldering. There are some differences between the set temperatures and the actual temperatures. All the temperatures shown in this module datasheet are obtained through actual measurements.
Manner 1: SMT process (Recommended oven temperature curve of reflow soldering)
Set oven temperatures according to the following curve.
A: Temperature axis
B: Time axis
C: Liquidus temperature: 217 to 220°C
D: Ramp-up slope: 1 to 3°C/s
E: Duration of constant temperature: 60 to 120s; the range of constant temperature: 150 to 200°C
F: Duration above the liquidus: 50 to 70s
G: Peak temperature: 235 to 245°C
H: Ramp-down slope: 1 to 4°C/s
The above curve is just an example of the solder paste SAC305. For more details about other solder pastes, please refer to Recommended oven temperature curve in the solder paste specifications.
Manner 2: Wave soldering process (Oven temperature curve of wave soldering)
Set oven temperatures according to the following temperature curve of wave soldering. The peak temperature is 260°C±5°C.
Suggestions on oven temperature curve of wave soldering | Suggestions on manual soldering temperature | ||
---|---|---|---|
Preheat temperature | 80 to 130 °C | Soldering temperature | 360±20°C |
Preheat time | 75 to 100s | Soldering time | <3s/point |
Peak contact time | 3 to 5s | NA | NA |
Temperature of tin cylinder | 260±5°C | NA | NA |
Ramp-up slope | ≤2°C/s | NA | NA |
Ramp-down slope | ≤6°C/s | NA | NA |
Product model | MOQ (pcs) | Packing method | Modules per reel | Reels per carton |
---|---|---|---|---|
TS24-U | 4400 | Tape reel | 1100 | 4 |
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