TS24-LC5 Module Datasheet

Last Updated on : 2024-06-14 03:01:44download

TS24-LC5 is a Matter over Thread module that Tuya has developed. It consists of a highly integrated RF processing chip EFR32MG24, a few peripherals, a built-in 802.15.4 PHY/MAC Thread network protocol stack, and rich library functions.

Product overview

TS24-LC5 is embedded with a low-power 32-bit ARM Cortex-M33 core, 1536 KB flash program memory, 192 KB RAM, and abundant peripheral resources. It integrates all function libraries of the Thread MAC and TCP/IP. You can develop embedded Thread products as required.


  • Embedded ARM Cortex-M 33 processor having a low-power 32-bit CPU and having DSP instructions and floating-point units, which can also function as an application processor
  • Clock rate: 78 MHz
  • Wide operating voltage: 2.0 to 3.8 V
  • Peripherals: 3 GPIOs
  • Thread connectivity
    • Support 802.15.4 MAC/PHY
    • Working channels 11 to 26 @2.400 to 2.483 GHz, air interface rate: 250 Kbps
    • Up to +19dBm output power
    • 35 uA/MHz power consumption during running; 5-μA sleep current
    • PCB antenna inside
    • Monopole antenna with a gain of 2.1 dBi
    • Operating temperature: -40℃ to 105℃
    • Support hardware encryption and AES 128/256


  • Intelligent building
  • Smart household and home appliances
  • Smart socket and light
  • Industrial wireless control
  • Baby monitor
  • Network camera
  • Intelligent bus

Module interfaces

Dimensions and footprint

TS24-LC5 has 6 pins at the front and back sides for plug-in assembly.
The TS24-LC5 dimensions are 8.50±0.35 mm (W)×12.7±0.35 mm (L) ×3.5±0.15 mm (H).

The dimensions of TS24-LC5 are as follows:

TS24-LC5 Module Datasheet

Pin definition

TS24-LC5 Module Datasheet

Pin number Symbol Type Function
1 ANT I/O Antenna pin, external monopole antenna
2 GND P Power supply reference ground
3 PA04 I/O Support hardware PWM and correspond to PA04 (Pin 25) on the internal IC
4 PA06 I/O Support hardware PWM and correspond to PA06 (Pin 27) on the internal IC
5 PA05 I/O Support hardware PWM and correspond to PA05 (Pin 26) on the internal IC
6 VCC P Power supply pin of the module (The typical power supply voltage: 3.3V

Test pin definition

Pin No. Symbol I/O type Function
TP1 SWDIO I/O JLINK SWDIO burning pin, which is connected to PA02 on the internal IC
TP2 SWCLK I/O JLINK SWCLK burning pin, which is connected to PA01 on the internal IC
TP3 RST I Hardware reset pin (The chip is reset when the level is low. The level is high in
TP4 TX I/O Serial interface transmission pin (TX), which is connected to PD03 on the internal IC
TP5 RX I/O Serial interface receiving pin (RX), which is connected to PD02 on the internal IC


  • P indicates a power supply pin and I/O indicates an input/output pin.

Electrical parameters

Absolute electrical parameters

Parameter Description Minimum value Maximum value Unit
Ts Storage temperature -50 150
VBAT Power supply voltage 2.0 3.8 V
ESD voltage (human body model) TAMB-25℃ - 2 KV
ESD voltage (machine model) TAMB-25℃ - 0.5 KV

Normal working conditions

Parameter Description Minimum value Typical value Maximum value Unit
Ta Operating temperature -40 - 105
VCC Operating voltage 2.0 3.3 3.8 V
VIL I/O low level input - - VDD*0.3 V
VIH I/O high level input VDD*0.7 - - V
VOL I/O low level output - - VDD*0.2 V
VOH I/O high level output VDD*0.8 - - V

TX and RX power consumption

Working status Mode Rate Transmit power/receive Average value Peak value (Typical value) Unit
Transmit - 250Kbps +19dBm 178 180 mA
Transmit - 250 Kbps +10 dBm 56 60 mA
Transmit - 250 Kbps +0 dBm 24 25 mA
Receive - 250Kbps Constantly receive 10.5 12.7 mA

Working current

Working mode Working status (Ta = 25°C) Average value Maximum value (Typical value) Unit
EZ The module is in EZ mode. 10.3 16.5 mA
Connected and idle The module is connected to the network and in idle state. 10.4 42 mA
Connected and busy The module is connected to the network and in operating state. 12.1 42 mA
Deep sleep mode The module is in deep sleep mode, with 64-KB flash memory. 5 - μA

RF parameters

Basic RF features

Parameter Description
Working frequency 2.405 to 2.480 GHz
Zigbee standard IEEE 802.15.4
Data transmission rate 250 Kbps
Monopole antenna with a gain of 2.1 dBi

TX performance

TX performance

Parameter Minimum value Typical value Maximum value Unit
Output power (250Kbps) -30 15 19 dBm
Output power adjustment stepping - 0.5 1 dBm
Output spectrum adjacent channel suppression - -31 - dBc
Frequency error -15 - 15 ppm

RX performance

RX sensitivity

Parameter Minimum value Typical value Maximum value Unit
PER<8%, RX sensitivity (250 Kbps) -104 -104 -103 dBm

Antenna information

Antenna type

TS24-LC5 uses a monopole antenna.

Antenna interference reduction

To ensure optimal RF performance when the Thread module uses a PCB antenna, it is recommended that the antenna be at least 15 mm away from other metal parts.
To prevent adverse impact on the antenna radiation performance, avoid copper or traces within the antenna area on the PCB.

TS24-LC5 Module Datasheet

TS24-LC5 Module Datasheet

TS24-LC5 Module Datasheet

TS24-LC5 Module Datasheet

Packaging information and production instructions

Mechanical dimensions

The TS24-LC5 dimensions are 8.50±0.35 mm (W)×12.7±0.35 mm (L) ×3.5±0.15 mm (H).

TS24-LC5 Module Datasheet

Side view

TS24-LC5 Module Datasheet

Schematic diagram of footprint

TS24-LC5 Module Datasheet

Production instructions

  1. For the Tuya in-line module, wave soldering is most preferred and manual soldering is less preferred. After being unpacked, the module must be soldered within 24 hours. Otherwise, it must be put into the drying cupboard where the RH is not greater than 10%; or it needs to be packaged under vacuum again and record the exposure time (the total exposure time cannot exceed 168 hours).

  2. Wave soldering devices and materials:

    • Wave soldering equipment
    • Wave soldering fixture
    • Constant-temperature soldering iron
    • Tin bar, tin wire, and flux
    • Thermal profiler
  3. Baking devices:

    • Cabinet oven
    • Anti-electrostatic and heat-resistant trays
    • Anti-electrostatic and heat-resistant gloves
  4. The module needs to be baked in the following cases:

    • The packaging bag is damaged before unpacking.
    • There is no humidity indicator card (HIC) in the packaging bag.
    • After unpacking, circles of 10% and above on the HIC become pink.
    • The total exposure time has lasted for over 168 hours since unpacking.
    • More than 12 months have passed since the sealing of the bag.
  5. Baking settings:

    • Temperature: 40°C and ≤ 5% RH for reel package and 125°C and ≤5% RH for tray package (please use the heat-resistant tray rather than a plastic container)
    • Time: 168 hours for reel package and 12 hours for tray package
    • Alarm temperature: 50°C for reel package and 135°C for tray package
    • Production-ready temperature after natural cooling: < 36°C
    • Re-baking situation: If a module remains unused for over 168 hours after being baked, it needs to be baked again.
    • If a batch of modules is not baked within 168 hours, do not use the wave soldering to solder them. Because these modules are Level-3 moisture-sensitive devices, they are very likely to get damp when exposed beyond the allowable time. In this case, if they are soldered at high temperatures, it may result in device failure or poor soldering.
  6. In the whole production process, take electrostatic discharge (ESD) protective measures.

  7. To guarantee the quality of products, you must pay attention to the following items: The amount of soldering flux, the height of the wave peak, whether the tin slag and copper content in the wave soldering tank exceed standards, whether the window and thickness of the wave soldering fixture are appropriate, and whether the wave soldering oven temperature curve is appropriate.

Recommended oven temperature curve and temperature

Set oven temperatures according to the following temperature curve of wave soldering. The peak temperature is 260°C±5°C.

TS24-LC5 Module Datasheet

Recommended soldering temperature:

Suggestions on oven temperature curve of wave soldering Suggestions on manual soldering temperature
Preheat temperature 80 to 130 °C Soldering temperature 360±20°C
Preheat time 75 to 100s Soldering time <3s/point
Peak contact time 3 to 5s NA NA
Temperature of tin cylinder 260±5°C NA NA
Ramp-up slope ≤2°C/s NA NA
Ramp-down slope ≤6°C/s NA NA

Storage conditions

Storage conditions for a delivered module:

  • The moisture-proof bag is placed in an environment where the temperature is below 40°C and the relative humidity is lower than 90%.

  • The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed.

  • There is a humidity indicator card (HIC) in the packaging bag.

    TS24-LC5 Module Datasheet

    TS24-LC5 Module Datasheet

MOQ and packaging information

Product model MOQ (pcs) Packing method The number of modules per reel The number of reels per carton
TS24-LC5 6000 Tape reel 1500 4

Appendix: Statement

FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this device.

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

Note: This device has been tested and found to comply with the limits for a Class B digital device, according to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This device generates, uses, and can radiate radio frequency energy and, if not installed and used following the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation.

If this device does cause harmful interference to radio or television reception, which can be determined by turning the device off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

  • Reorient or relocate the receiving antenna.
  • Increase the separation between the device and receiver.
  • Connect the device into an outlet on a circuit different from that to which the receiver is connected.
  • Consult the dealer or an experienced radio/TV technician for help.

Radiation Exposure Statement

This device complies with FCC radiation exposure limits set forth for an uncontrolled rolled environment. This device should be installed and operated with a minimum distance of 20cm between the radiator and your body.

Important Note

This radio module must not be installed to co-locate and operate simultaneously with other radios in the host system except by following FCC multi-transmitter product procedures. Additional testing and device authorization may be required to operate simultaneously with other radios.

The availability of some specific channels and/or operational frequency bands are country dependent and are firmware programmed at the factory to match the intended destination. The firmware setting is not accessible to the end-user.

The host product manufacturer is responsible for compliance with any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.

The end-user manual shall include all required regulatory information/warnings as shown in this manual, including “This product must be installed and operated with a minimum distance of 20 cm between the radiator and user body”.

This device has got an FCC ID: 2ANDL-TS24-LC5. The end product must be labeled in a visible area with the following: “Contains Transmitter Module FCC ID: 2ANDL-TS24-LC5”.

This device is intended only for OEM integrators under the following conditions:

The antenna must be installed such that 20cm is maintained between the antenna and users, and the transmitter module may not be co-located with any other transmitter or antenna.

As long as the 2 conditions above are met, further transmitter tests will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed.

Declaration of Conformity European Notice

TS24-LC5 Module Datasheet

Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module product is in compliance with essential requirements and other relevant provisions of Directive 2014/53/EU,2011/65/EU. A copy of the Declaration of Conformity can be found at https://www.tuya.com.

TS24-LC5 Module Datasheet

This product must not be disposed of as normal household waste, in accordance with the EU directive for waste electrical and electronic equipment (WEEE-2012/19/EU). Instead, it should be disposed of by returning it to the point of sale, or to a municipal recycling collection point.

The device could be used with a separation distance of 20cm from the human body.