TS24-LC5 Module Datasheet

TS24-LC5 is a Matter over Thread module that Tuya has developed. It consists of a highly integrated RF processing chip EFR32MG24, a few peripherals, a built-in 802.15.4 PHY/MAC Thread network protocol stack, and rich library functions.

Product overview

TS24-LC5 is embedded with a low-power 32-bit ARM Cortex-M33 core, 1536 KB flash program memory, 192 KB RAM, and abundant peripheral resources. It integrates all function libraries of the Thread MAC and TCP/IP. You can develop embedded Thread products as required.

Features

• Embedded ARM Cortex-M 33 processor having a low-power 32-bit CPU and having DSP instructions and floating-point units, which can also function as an application processor
• Clock rate: 78 MHz
• Wide operating voltage: 2.0 to 3.8 V
• Peripherals: 3 GPIOs
• Thread connectivity
  • Support 802.15.4 MAC/PHY
  • Working channels 11 to 26 @2.400 to 2.483 GHz, air interface rate: 250 Kbps
  • Up to +19dBm output power
  • 35 uA/MHz power consumption during running; 5-μA sleep current
  • PCB antenna inside
  • Monopole antenna with a gain of 2.1 dBi
  • Operating temperature: -40℃ to 105℃
  • Support hardware encryption and AES 128/256

Applications

• Intelligent building
• Smart household and home appliances
• Smart socket and light
• Industrial wireless control
• Baby monitor
• Network camera
• Intelligent bus

Module interfaces

Dimensions and footprint

TS24-LC5 has 6 pins at the front and back sides for plug-in assembly.
The TS24-LC5 dimensions are 8.50±0.35 mm (W)×12.7±0.35 mm (L) ×3.5±0.15 mm (H).

The dimensions of TS24-LC5 are as follows:

Pin definition

Pin number	Symbol	Type	Function
1	ANT	I/O	Antenna pin, external monopole antenna
2	GND	P	Power supply reference ground
3	PA04	I/O	Support hardware PWM and correspond to PA04 (Pin 25) on the internal IC
4	PA06	I/O	Support hardware PWM and correspond to PA06 (Pin 27) on the internal IC
5	PA05	I/O	Support hardware PWM and correspond to PA05 (Pin 26) on the internal IC
6	VCC	P	Power supply pin of the module (The typical power supply voltage: 3.3V

Test pin definition

Pin No.	Symbol	I/O type	Function
TP1	SWDIO	I/O	JLINK SWDIO burning pin, which is connected to PA02 on the internal IC
TP2	SWCLK	I/O	JLINK SWCLK burning pin, which is connected to PA01 on the internal IC
TP3	RST	I	Hardware reset pin (The chip is reset when the level is low. The level is high in
TP4	TX	I/O	Serial interface transmission pin (TX), which is connected to PD03 on the internal IC
TP5	RX	I/O	Serial interface receiving pin (RX), which is connected to PD02 on the internal IC

Note:

• P indicates a power supply pin and I/O indicates an input/output pin.

Electrical parameters

Absolute electrical parameters

Parameter	Description	Minimum value	Maximum value	Unit
Ts	Storage temperature	-50	150	℃
VBAT	Power supply voltage	2.0	3.8	V
ESD voltage (human body model)	TAMB-25℃	-	2	KV
ESD voltage (machine model)	TAMB-25℃	-	0.5	KV

Normal working conditions

Parameter	Description	Minimum value	Typical value	Maximum value	Unit
Ta	Operating temperature	-40	-	105	℃
VCC	Operating voltage	2.0	3.3	3.8	V
VIL	I/O low level input	-	-	VDD*0.3	V
VIH	I/O high level input	VDD*0.7	-	-	V
VOL	I/O low level output	-	-	VDD*0.2	V
VOH	I/O high level output	VDD*0.8	-	-	V

TX and RX power consumption

Working status	Mode	Rate	Transmit power/receive	Average value	Peak value (Typical value)	Unit
Transmit	-	250Kbps	+19dBm	178	180	mA
Transmit	-	250 Kbps	+10 dBm	56	60	mA
Transmit	-	250 Kbps	+0 dBm	24	25	mA
Receive	-	250Kbps	Constantly receive	10.5	12.7	mA

Working current

Working mode	Working status (Ta = 25°C)	Average value	Maximum value (Typical value)	Unit
EZ	The module is in EZ mode.	10.3	16.5	mA
Connected and idle	The module is connected to the network and in idle state.	10.4	42	mA
Connected and busy	The module is connected to the network and in operating state.	12.1	42	mA
Deep sleep mode	The module is in deep sleep mode, with 64-KB flash memory.	5	-	μA

RF parameters

Basic RF features

Parameter	Description
Working frequency	2.405 to 2.480 GHz
Zigbee standard	IEEE 802.15.4
Data transmission rate	250 Kbps
Monopole antenna with a gain of 2.1 dBi

TX performance

TX performance

Parameter	Minimum value	Typical value	Maximum value	Unit
Output power (250Kbps)	-30	15	19	dBm
Output power adjustment stepping	-	0.5	1	dBm
Output spectrum adjacent channel suppression	-	-31	-	dBc
Frequency error	-15	-	15	ppm

RX performance

RX sensitivity

Parameter	Minimum value	Typical value	Maximum value	Unit
PER<8%, RX sensitivity (250 Kbps)	-104	-104	-103	dBm

Antenna information

Antenna type

TS24-LC5 uses a monopole antenna.

Antenna interference reduction

To ensure optimal RF performance when the Thread module uses a PCB antenna, it is recommended that the antenna be at least 15 mm away from other metal parts.
To prevent adverse impact on the antenna radiation performance, avoid copper or traces within the antenna area on the PCB.

Packaging information and production instructions

Mechanical dimensions

The TS24-LC5 dimensions are 8.50±0.35 mm (W)×12.7±0.35 mm (L) ×3.5±0.15 mm (H).

Side view

Schematic diagram of footprint

Production instructions

1. For the Tuya in-line module, wave soldering is most preferred and manual soldering is less preferred. After being unpacked, the module must be soldered within 24 hours. Otherwise, it must be put into the drying cupboard where the RH is not greater than 10%; or it needs to be packaged under vacuum again and record the exposure time (the total exposure time cannot exceed 168 hours).

2. Wave soldering devices and materials:

   • Wave soldering equipment
   • Wave soldering fixture
   • Constant-temperature soldering iron
   • Tin bar, tin wire, and flux
   • Thermal profiler

3. Baking devices:

   • Cabinet oven
   • Anti-electrostatic and heat-resistant trays
   • Anti-electrostatic and heat-resistant gloves

4. The module needs to be baked in the following cases:

   • The packaging bag is damaged before unpacking.
   • There is no humidity indicator card (HIC) in the packaging bag.
   • After unpacking, circles of 10% and above on the HIC become pink.
   • The total exposure time has lasted for over 168 hours since unpacking.
   • More than 12 months have passed since the sealing of the bag.

5. Baking settings:

   • Temperature: 40°C and ≤ 5% RH for reel package and 125°C and ≤5% RH for tray package (please use the heat-resistant tray rather than a plastic container)
   • Time: 168 hours for reel package and 12 hours for tray package
   • Alarm temperature: 50°C for reel package and 135°C for tray package
   • Production-ready temperature after natural cooling: < 36°C
   • Re-baking situation: If a module remains unused for over 168 hours after being baked, it needs to be baked again.
   • If a batch of modules is not baked within 168 hours, do not use the wave soldering to solder them. Because these modules are Level-3 moisture-sensitive devices, they are very likely to get damp when exposed beyond the allowable time. In this case, if they are soldered at high temperatures, it may result in device failure or poor soldering.

6. In the whole production process, take electrostatic discharge (ESD) protective measures.

7. To guarantee the quality of products, you must pay attention to the following items: The amount of soldering flux, the height of the wave peak, whether the tin slag and copper content in the wave soldering tank exceed standards, whether the window and thickness of the wave soldering fixture are appropriate, and whether the wave soldering oven temperature curve is appropriate.

Recommended oven temperature curve and temperature

Set oven temperatures according to the following temperature curve of wave soldering. The peak temperature is 260°C±5°C.

Recommended soldering temperature:

Suggestions on oven temperature curve of wave soldering		Suggestions on manual soldering temperature
Preheat temperature	80 to 130 °C	Soldering temperature	360±20°C
Preheat time	75 to 100s	Soldering time	＜3s/point
Peak contact time	3 to 5s	NA	NA
Temperature of tin cylinder	260±5°C	NA	NA
Ramp-up slope	≤2°C/s	NA	NA
Ramp-down slope	≤6°C/s	NA	NA

Storage conditions

Storage conditions for a delivered module:

• The moisture-proof bag is placed in an environment where the temperature is below 40°C and the relative humidity is lower than 90%.

• The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed.

• There is a humidity indicator card (HIC) in the packaging bag.

  

  

MOQ and packaging information

Product model	MOQ (pcs)	Packing method	The number of modules per reel	The number of reels per carton
TS24-LC5	6000	Tape reel	1500	4