Last Updated on : 2025-04-17 01:45:27download
TS24-LC5 is a Matter over Thread module that Tuya has developed. It consists of a highly integrated RF processing chip EFR32MG24, a few peripherals, a built-in 802.15.4 PHY/MAC Thread network protocol stack, and rich library functions.
TS24-LC5 is embedded with a low-power 32-bit ARM Cortex-M33 core, 1536 KB flash program memory, 192 KB RAM, and abundant peripheral resources. It integrates all function libraries of the Thread MAC and TCP/IP. You can develop embedded Thread products as required.
TS24-LC5 has 6 pins at the front and back sides for plug-in assembly.
The TS24-LC5 dimensions are 8.50±0.35 mm (W)×12.7±0.35 mm (L) ×3.5±0.15 mm (H).
The dimensions of TS24-LC5 are as follows:
Pin number | Symbol | Type | Function |
---|---|---|---|
1 | ANT | I/O | Antenna pin, external monopole antenna |
2 | GND | P | Power supply reference ground |
3 | PA04 | I/O | Support hardware PWM and correspond to PA04 (Pin 25) on the internal IC |
4 | PA06 | I/O | Support hardware PWM and correspond to PA06 (Pin 27) on the internal IC |
5 | PA05 | I/O | Support hardware PWM and correspond to PA05 (Pin 26) on the internal IC |
6 | VCC | P | Power supply pin of the module (The typical power supply voltage: 3.3V |
Pin No. | Symbol | I/O type | Function |
---|---|---|---|
TP1 | SWDIO | I/O | JLINK SWDIO burning pin, which is connected to PA02 on the internal IC |
TP2 | SWCLK | I/O | JLINK SWCLK burning pin, which is connected to PA01 on the internal IC |
TP3 | RST | I | Hardware reset pin (The chip is reset when the level is low. The level is high in |
TP4 | TX | I/O | Serial interface transmission pin (TX), which is connected to PD03 on the internal IC |
TP5 | RX | I/O | Serial interface receiving pin (RX), which is connected to PD02 on the internal IC |
Note:
- P indicates a power supply pin and I/O indicates an input/output pin.
Parameter | Description | Minimum value | Maximum value | Unit |
---|---|---|---|---|
Ts | Storage temperature | -50 | 150 | ℃ |
VBAT | Power supply voltage | 2.0 | 3.8 | V |
ESD voltage (human body model) | TAMB-25℃ | - | 2 | KV |
ESD voltage (machine model) | TAMB-25℃ | - | 0.5 | KV |
Parameter | Description | Minimum value | Typical value | Maximum value | Unit |
---|---|---|---|---|---|
Ta | Operating temperature | -40 | - | 105 | ℃ |
VCC | Operating voltage | 2.0 | 3.3 | 3.8 | V |
VIL | I/O low level input | - | - | VDD*0.3 | V |
VIH | I/O high level input | VDD*0.7 | - | - | V |
VOL | I/O low level output | - | - | VDD*0.2 | V |
VOH | I/O high level output | VDD*0.8 | - | - | V |
Working status | Mode | Rate | Transmit power/receive | Average value | Peak value (Typical value) | Unit |
---|---|---|---|---|---|---|
Transmit | - | 250Kbps | +19dBm | 178 | 180 | mA |
Transmit | - | 250 Kbps | +10 dBm | 56 | 60 | mA |
Transmit | - | 250 Kbps | +0 dBm | 24 | 25 | mA |
Receive | - | 250Kbps | Constantly receive | 10.5 | 12.7 | mA |
Working mode | Working status (Ta = 25°C) | Average value | Maximum value (Typical value) | Unit |
---|---|---|---|---|
EZ | The module is in EZ mode. | 10.3 | 16.5 | mA |
Connected and idle | The module is connected to the network and in idle state. | 10.4 | 42 | mA |
Connected and busy | The module is connected to the network and in operating state. | 12.1 | 42 | mA |
Deep sleep mode | The module is in deep sleep mode, with 64-KB flash memory. | 5 | - | μA |
Parameter | Description |
---|---|
Working frequency | 2.405 to 2.480 GHz |
Zigbee standard | IEEE 802.15.4 |
Data transmission rate | 250 Kbps |
Monopole antenna with a gain of 2.1 dBi |
TX performance
Parameter | Minimum value | Typical value | Maximum value | Unit |
---|---|---|---|---|
Output power (250Kbps) | -30 | 15 | 19 | dBm |
Output power adjustment stepping | - | 0.5 | 1 | dBm |
Output spectrum adjacent channel suppression | - | -31 | - | dBc |
Frequency error | -15 | - | 15 | ppm |
RX sensitivity
Parameter | Minimum value | Typical value | Maximum value | Unit |
---|---|---|---|---|
PER<8%, RX sensitivity (250 Kbps) | -104 | -104 | -103 | dBm |
TS24-LC5 uses a monopole antenna.
To ensure optimal RF performance when the Thread module uses a PCB antenna, it is recommended that the antenna be at least 15 mm away from other metal parts.
To prevent adverse impact on the antenna radiation performance, avoid copper or traces within the antenna area on the PCB.
The TS24-LC5 dimensions are 8.50±0.35 mm (W)×12.7±0.35 mm (L) ×3.5±0.15 mm (H).
For the Tuya in-line module, wave soldering is most preferred and manual soldering is less preferred. After being unpacked, the module must be soldered within 24 hours. Otherwise, it must be put into the drying cupboard where the RH is not greater than 10%; or it needs to be packaged under vacuum again and record the exposure time (the total exposure time cannot exceed 168 hours).
Wave soldering devices and materials:
Baking devices:
The module needs to be baked in the following cases:
Baking settings:
In the whole production process, take electrostatic discharge (ESD) protective measures.
To guarantee the quality of products, you must pay attention to the following items: The amount of soldering flux, the height of the wave peak, whether the tin slag and copper content in the wave soldering tank exceed standards, whether the window and thickness of the wave soldering fixture are appropriate, and whether the wave soldering oven temperature curve is appropriate.
Set oven temperatures according to the following temperature curve of wave soldering. The peak temperature is 260°C±5°C.
Recommended soldering temperature:
Suggestions on oven temperature curve of wave soldering | Suggestions on manual soldering temperature | ||
---|---|---|---|
Preheat temperature | 80 to 130 °C | Soldering temperature | 360±20°C |
Preheat time | 75 to 100s | Soldering time | <3s/point |
Peak contact time | 3 to 5s | NA | NA |
Temperature of tin cylinder | 260±5°C | NA | NA |
Ramp-up slope | ≤2°C/s | NA | NA |
Ramp-down slope | ≤6°C/s | NA | NA |
Storage conditions for a delivered module:
The moisture-proof bag is placed in an environment where the temperature is below 40°C and the relative humidity is lower than 90%.
The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed.
There is a humidity indicator card (HIC) in the packaging bag.
Product model | MOQ (pcs) | Packing method | The number of modules per reel | The number of reels per carton |
---|---|---|---|---|
TS24-LC5 | 6000 | Tape reel | 1500 | 4 |
Is this page helpful?
YesFeedbackIs this page helpful?
YesFeedback