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AFI-VWBK1 Module Datasheet

Last Updated on : 2021-12-15 03:36:18download

Product overview

VWBK1 is a single-chip online voice Wi-Fi module. It supports online voice interaction and AIoT. It can be used in Amazon Alexa scenarios and Bluetooth voice transmission scenarios, to help customers access the IoT/smart speaker/smart gateway by voice.

Features

  • Three kernels: BT MCU, Wi-Fi MCU, and CEVA DSP
  • BT MCU with the maximum clock rate of 120 MHz
  • Wi-Fi MCU with the maximum clock rate of 240 MHz
  • DSP with the maximum clock rate of 320 MHz, responsible for voice interruption
  • Operating voltage: 3.3 to 4.2V, 3.3V/1A recommended
  • 12 GPIOs (reuse), 2 UARTs, 2 ADCs,8 PWMs (reuse), and 1 I2C
  • Frequency of sample: 16K/16bit
  • Voice input: Embedded with 4 ADCs, which can be externally connected to 4 analog microphones
  • Voice output: Embedded with 2 stereo outputs, which can be connected to an external high-power speaker driven by a power amplifier
  • Recommended wakeup distance: <=5m
  • Recommended noise at the working background : <=60dBC
  • Wi-Fi connectivity
    • 802.11 b/g/n
    • Channels 1 to 14 at 2.4 GHz
    • Output power of up to +16 dBm in 802.11b mode
    • Onboard PCB antenna or IPEX antenna with a gain of 0.66 dBi
  • Bluetooth connectivity
    • Bluetooth 5.0: Traditional Bluetooth (including Basic Rate and Enhanced Data Rate) and Bluetooth Low Energy (Bluetooth LE)
    • Output power of up to +3 dBm
    • Bluetooth LE receiving sensitivity: -88 dBm

Applications

  • Smart speaker and voice assistant
  • Switch panel
  • Lighting
  • Major and small home appliances
  • Toy

Module interfaces

Module and footprint

VWBK1 is a module with an onboard antenna. Its front side is sheild case. The physical module is shown below:
AFI-VWBK1 Module Datasheet

Physical map of module (top)
AFI-VWBK1 Module Datasheet

Physical map of module (bottom)
There are pins on three sides of module VWBK1. The onboard antenna is on the fourth side. There are 39 pins in total, and the distance between two pins is 1.5mm. The dimensions of VWBK1 are 20mm (W) *28mm (L) *3.6mm (H). The following figure is a schematic diagram of the dimensions of VWBK1 (unit: mm)
AFI-VWBK1 Module Datasheet

Pin definition

The voice interaction of VWBK1 needs an external microphone, amplifier, and speaker. VWBK1 is the voice solution to Amazon Alexa. The logic of its keys and indicator light must meet specific requirements. Requirements on peripherals:

  • Microphone (required): Currently, two microphones are needed. The distance between them is recommended to be 40-80mm. For specific requirements on the microphone, please consult Tuya technicians, or you can also refer to the Guide to Selection of Microphone and Speaker of Voice Module.

  • Power amplifier (required): The power amplifier must be selected based on the speaker. For specific requirements on the power amplifier, please consult the Tuya technicians, or you can also refer to the Guide to Selection of Microphone and Speaker of Voice Module.
    -Speaker (required): The speaker must conform to its specifications. For specific specifications and structural design of the speaker, please consult Tuya technicians, or you can also refer to the Guide to Selection of Microphone and Speaker of Voice Module.

  • Indicator light (required): The Amazon voice system supports linear light, single light and ring light.

  • Key (required): The Amazon voice system supports the microphone disable/wake up/volume up/volume down keys.

  • The interfaces of the module are shown below:
    AFI-VWBK1 Module Datasheet

There are 39 pins in total. Their functions and definitions are shown below:

Pin number Function Type Description
2 TX1 IO TX1, used for communicating with MCU
3 RX1 IO RX1, used for communicating with MCU
4,5 VCC P Power supply
1,6,13,26,32 GND P Ground
7 DN/PWM3 IO DN of USB or PWM3 for the C light
8 DP/PWM4 IO DP of USB or PWM4 for W light
9 ADC13 AI/IO ADC13, reserve for peripherals. Also can be used as GPIO.
10 ADC12 AI/IO ADC12, reserve for keys, for example, volume +/-/phone.
11 PWM9 IO PWM9 dimming interface (by default, it is the indicator light of voice, red)
12 PWM8 IO PWM8 dimming interface (by default, it is the indicator light of voice, green)
14 PWM7 IO PWM7 dimming interface (by default, it is the indicator light of voice, blue)
15 PWM6 IO Used to drive the green light, reserved to be used for infrared transmission
16 PWM10 IO Used to drive the red light, reserved to be used for infrared receiving
17 ROUT-P AO Right channel, output, positive, connected to the external power amplifier to drive the speaker
18 ROUT-N AO Right channel, output, negative, connected to the external power amplifier to drive the speaker
19 LOUT-N AO Left channel, output, negative, connected to the external power amplifier to drive the speaker
20 LOUT-P AO Left channel, output, positive, connected to the external power amplifier to drive the speaker
21 MIC1P AI MIC1 positive, used as the input interface of AEC
22 MIC1N AI MIC1 negative, used as the input interface of AEC
23 GPIO24 IO Used to enable the power amplifier, SPK-EN
24 MIC2P AI MIC2 positive, used as the input interface of AEC
25 MIC2N AI MIC2 negative, used as the input interface of AEC
27 MIC3P AI MIC3 positive, connected to the external microphone
28 MIC3N AI MIC3 negative, connected to the external microphone
29 MIC4P AI MIC3 positive, connected to the external microphone
30 MIC4N AI MIC3 negative, connected to the external microphone
31 MICBIAS P Used to connect to the power supply of the microphone
33 GPIO2 IO Input signals, used to detect the on/off of the microphone
34 PWM0 IO PWM0, used to drive the blue light
35 SDA IO The data interface of the I2C (need to connect to the pull-up resistor). It can be used to drive the ring light and other I2C sensory components
36 SCL IO The clock interface of the I2C (need to connect to the pull-up resistor). It can be used to drive the ring light and other I2C sensory components
37 TX3 IO Transmitting interface of UART3, debugging interface
38 RX3 IO Receiving interface of UART3, debugging interface
39 RST I Reset pin

I/O is the common input/output pin, P is the power supply and ground pin, AI is the Analog input pin, and AO is the analog output pin.

Electrical parameters

Absolute electrical parameters

Parameter Description Minimum value Maximum value Unit
Ts Storage temperature -55 125
VCC Power supply voltage 3.3V 4.2 V
ESD voltage (human body model) TAMB-25℃ - ± 2000 KV
ESD voltage (machine model) TAMB-25℃ - - KV
Supply voltage 3.3 to 4.2V, 3.3V preferred

Working conditions

Parameter Description Minimum value Typical value Maximum value Unit
Ta Operating temperature -20 25 85
VCC Operating voltage 3.3 3.3 4.2 V
VIL Low voltage input -0.3 - 1.32 V
VIH High voltage input 2.06 - 3.6 V
VOL Low voltage output -0.3 - 0.4 V
VOH High voltage output 2.9 - 3.6 V
Imax Drive current -35 - 35 mA

Wi-Fi receiving and transmission power consumption

Operating status Mode Rate Transmit power/receive Average value Peak value (Typical value) Unit
Transmit 11b 11Mbps +16dBm 279 313 mA
Transmit 11g 54Mbps +14dBm 280 309 mA
Transmit 11n MCS7 +13dBm 274 304 mA
Receive 11b 11Mbps Constantly receive 184 187 mA
Receive 11g 54Mbps Constantly receive 184 187 mA
Receive 11n MCS7 Constantly receive 184 187 mA

Note: VBAT=3.3V

Power consumption in operating mode

Working mode Working status, Ta = 25℃, VCC=3.3V, not connected to PA power amplifier and loudspeaker Average value Maximum value Unit
Fast connected The module is fast connected to the network 187 568 mA
Idle and connected The module is connected to the network 165 341 mA
Voice control The module is connected to the network and waked up by voices 240 564 mA

RF features

Basic RF features

Parameter Description
Operating frequency 2.400 to 2.484 GHz
Wi-Fi standard 802.11 b/g/n (channels 1 to 14)
Data transmission rate 11b: 1, 2, 5.5, 11 (Mbps) 11g: 6, 9, 12, 18, 24, 36, 48, 54 (Mbps) 11n: HT20MCS (0~7) Bluetooth LE/BR/EDR 1M
Antenna type PCB antenna with a gain of 0.66 dBi

Transmission performance

TX performance

Parameter Minimum value Typical value Maximum value Unit
Average output power, 802.11b CCK Mode 11M - 16 - dBm
Average output power, 802.11g OFDM Mode 54M - 14 - dBm
Average output power, 802.11n OFDM Mode MCS7 - 13 - dBm
Average output power, Bluetooth LE/BR/EDR 1M - 3 - dBm
EVM@802.11b CCK 11 Mbps Mode 16 dBm - -23 - dB
EVM@802.11g OFDM 54 Mbps Mode 13.5 dBm - -27 - dB
EVM@802.11n OFDM MCS7 Mode 12 dBm - -28 - dB
Frequency error -10 - 10 ppm

RX performance

RX sensitivity

Parameter Minimum value Typical value Maximum value Unit
PER<8%, RX sensitivity, 802.11b DSSS Mode 11M - -87 - dBm
PER<10%, RX sensitivity, 802.11g OFDM Mode 54M - -71 - dBm
PER<10%, RX sensitivity, 802.11n OFDM Mode MCS7 - -68 - dBm
PER<30%,RX sensitivity, Bluetooth LE 1M - -88 - dBm

Antenna information

Antenna type

By default, VWBK1 uses an onboard MIFA PCB antenna whose frequency band is 2.4G.

Antenna interference reduction

To ensure the optimal performance of Wi-Fi, it is recommended that the antenna should be 15mm away from other metal parts.

You should not wire or lay copper in the antenna area to avoid effects on the antenna performance.

AFI-VWBK1 Module Datasheet

AFI-VWBK1 Module Datasheet

AFI-VWBK1 Module Datasheet

AFI-VWBK1 Module Datasheet

Production instructions

  1. The Tuya SMT module should be mounted by the SMT device. After being unpacked, it should be soldered within 24 hours. Otherwise, it should be put into the drying cupboard where the RH is not greater than 10%; or it needs to be packaged under vacuum again and the exposure time needs to be recorded (the total exposure time cannot exceed 168 hours).
    • SMT devices:
      • Mounter
      • SPI
      • Reflow soldering machine
      • Thermal profiler
      • Automated optical inspection (AOI) equipment
    • Baking devices:
      • Cabinet oven
      • Anti-electrostatic and heat-resistant trays
      • Anti-electrostatic and heat-resistant gloves
  2. Storage conditions for a delivered module:
    • The moisture-proof bag must be placed in an environment where the temperature is below 40°C and the relative humidity is lower than 90%.

    • The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed.

    • There is a humidity indicator card (HIC) in the packaging bag.

      AFI-VWBK1 Module Datasheet

  3. The module needs to be baked in the following cases:
    • The packaging bag is damaged before unpacking.
    • There is no HIC in the packaging bag.
    • After unpacking, circles of 10% and above on the HIC become pink.
    • The total exposure time has lasted for over 168 hours since unpacking.
    • More than 12 months has passed since the sealing of the bag.
  4. Baking settings:
    • Temperature: 60°C and ≤ 5% RH for reel package and 125°C and ≤5% RH for tray package (please use the heat-resistant tray rather than plastic container)
    • Time: 48 hours for reel package and 12 hours for tray package
    • Alarm temperature: 65°C for reel package and 135°C for tray package
    • Production-ready temperature after natural cooling: < 36°C
    • Re-baking situation: If a module remains unused for over 168 hours after being baked, it needs to be baked again.
    • If a batch of modules is not baked within 168 hours, do not use the reflow soldering to solder them. Because these modules are Level-3 moisture-sensitive devices, they are very likely to get damp when exposed beyond the allowable time. In this case, if they are soldered at high temperatures, it may result in device failure or poor soldering.
  5. In the whole production process, take electrostatic discharge (ESD) protective measures.
  6. To guarantee the passing rate, it is recommended that you use the SPI and AOI to monitor the quality of solder paste printing and mounting.

Recommended oven temperature curve

Set oven temperatures according to the following temperature curve of reflow soldering. The peak temperature is 245°C.

AFI-VWBK1 Module Datasheet

  • A: Temperature axis

  • B: Time axis

  • C: Liquidus temperature: 217 to 220°C

  • D: Ramp-up slope: 1 to 3°C/s

  • E: Duration of constant temperature: 60 to 120s; the range of constant temperature: 150 to 200°C

  • F: Duration above the liquidus: 50 to 70s

  • G: Peak temperature: 235 to 245°C

  • H: Ramp-down slope: 1 to 4°C/s

    Note: The above curve is just an example of the solder paste SAC305. For more details about other solder pastes, please refer to Recommended oven temperature curve in the solder paste specifications.

Storage conditions

AFI-VWBK1 Module Datasheet

Note: The unit is mm.

Revision Update Reviser Time
V1.0.0 First release *** June 21, 2021
V1.0.1 1. Updated some definitions on IO. 2. Added some descriptions. 3. Added the production instructions *** Oct 13th, 2021