AFI-VWBK1 Module Datasheet

Product overview

VWBK1 is a single-chip online voice Wi-Fi module. It supports online voice interaction and AIoT. It can be used in Amazon Alexa scenarios and Bluetooth voice transmission scenarios, to help customers access the IoT/smart speaker/smart gateway by voice.

Features

• Three kernels: BT MCU, Wi-Fi MCU, and CEVA DSP
• BT MCU with the maximum clock rate of 120 MHz
• Wi-Fi MCU with the maximum clock rate of 240 MHz
• DSP with the maximum clock rate of 320 MHz, responsible for voice interruption
• Operating voltage: 3.3 to 4.2V, 3.3V/1A recommended
• 12 GPIOs (reuse), 2 UARTs, 2 ADCs，8 PWMs (reuse), and 1 I2C
• Frequency of sample: 16K/16bit
• Voice input: Embedded with 4 ADCs, which can be externally connected to 4 analog microphones
• Voice output: Embedded with 2 stereo outputs, which can be connected to an external high-power speaker driven by a power amplifier
• Recommended wakeup distance: <=5m
• Recommended noise at the working background : <=60dBC
• Wi-Fi connectivity
  • 802.11 b/g/n
  • Channels 1 to 14 at 2.4 GHz
  • Output power of up to +16 dBm in 802.11b mode
  • Onboard PCB antenna or IPEX antenna with a gain of 0.66 dBi
• Bluetooth connectivity
  • Bluetooth 5.0: Traditional Bluetooth (including Basic Rate and Enhanced Data Rate) and Bluetooth Low Energy (Bluetooth LE)
  • Output power of up to +3 dBm
  • Bluetooth LE receiving sensitivity: -88 dBm

Applications

• Smart speaker and voice assistant
• Switch panel
• Lighting
• Major and small home appliances
• Toy

Module interfaces

Module and footprint

VWBK1 is a module with an onboard antenna. Its front side is sheild case. The physical module is shown below:

Physical map of module (top)

Physical map of module (bottom)
There are pins on three sides of module VWBK1. The onboard antenna is on the fourth side. There are 39 pins in total, and the distance between two pins is 1.5mm. The dimensions of VWBK1 are 20mm (W) *28mm (L) *3.6mm (H). The following figure is a schematic diagram of the dimensions of VWBK1 (unit: mm)

Pin definition

The voice interaction of VWBK1 needs an external microphone, amplifier, and speaker. VWBK1 is the voice solution to Amazon Alexa. The logic of its keys and indicator light must meet specific requirements. Requirements on peripherals:

• Microphone (required): Currently, two microphones are needed. The distance between them is recommended to be 40-80mm. For specific requirements on the microphone, please consult Tuya technicians, or you can also refer to the Guide to Selection of Microphone and Speaker of Voice Module.

• Power amplifier (required): The power amplifier must be selected based on the speaker. For specific requirements on the power amplifier, please consult the Tuya technicians, or you can also refer to the Guide to Selection of Microphone and Speaker of Voice Module.
  -Speaker (required): The speaker must conform to its specifications. For specific specifications and structural design of the speaker, please consult Tuya technicians, or you can also refer to the Guide to Selection of Microphone and Speaker of Voice Module.

• Indicator light (required): The Amazon voice system supports linear light, single light and ring light.

• Key (required): The Amazon voice system supports the microphone disable/wake up/volume up/volume down keys.

• The interfaces of the module are shown below:
  

There are 39 pins in total. Their functions and definitions are shown below:

I/O is the common input/output pin, P is the power supply and ground pin, AI is the Analog input pin, and AO is the analog output pin.

Electrical parameters

Absolute electrical parameters

Working conditions

Wi-Fi receiving and transmission power consumption

Note: V_BAT=3.3V

Power consumption in operating mode

RF features

Basic RF features

Transmission performance

TX performance

RX performance

RX sensitivity

Antenna information

Antenna type

By default, VWBK1 uses an onboard MIFA PCB antenna whose frequency band is 2.4G.

Antenna interference reduction

To ensure the optimal performance of Wi-Fi, it is recommended that the antenna should be 15mm away from other metal parts.

You should not wire or lay copper in the antenna area to avoid effects on the antenna performance.

Production instructions

1. The Tuya SMT module should be mounted by the SMT device. After being unpacked, it should be soldered within 24 hours. Otherwise, it should be put into the drying cupboard where the RH is not greater than 10%; or it needs to be packaged under vacuum again and the exposure time needs to be recorded (the total exposure time cannot exceed 168 hours).
   • SMT devices:
     • Mounter
     • SPI
     • Reflow soldering machine
     • Thermal profiler
     • Automated optical inspection (AOI) equipment
   • Baking devices:
     • Cabinet oven
     • Anti-electrostatic and heat-resistant trays
     • Anti-electrostatic and heat-resistant gloves
2. Storage conditions for a delivered module:

   • The moisture-proof bag must be placed in an environment where the temperature is below 40°C and the relative humidity is lower than 90%.

   • The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed.

   • There is a humidity indicator card (HIC) in the packaging bag.

     

3. The module needs to be baked in the following cases:
   • The packaging bag is damaged before unpacking.
   • There is no HIC in the packaging bag.
   • After unpacking, circles of 10% and above on the HIC become pink.
   • The total exposure time has lasted for over 168 hours since unpacking.
   • More than 12 months has passed since the sealing of the bag.
4. Baking settings:
   • Temperature: 60°C and ≤ 5% RH for reel package and 125°C and ≤5% RH for tray package (please use the heat-resistant tray rather than plastic container)
   • Time: 48 hours for reel package and 12 hours for tray package
   • Alarm temperature: 65°C for reel package and 135°C for tray package
   • Production-ready temperature after natural cooling: < 36°C
   • Re-baking situation: If a module remains unused for over 168 hours after being baked, it needs to be baked again.
   • If a batch of modules is not baked within 168 hours, do not use the reflow soldering to solder them. Because these modules are Level-3 moisture-sensitive devices, they are very likely to get damp when exposed beyond the allowable time. In this case, if they are soldered at high temperatures, it may result in device failure or poor soldering.
5. In the whole production process, take electrostatic discharge (ESD) protective measures.
6. To guarantee the passing rate, it is recommended that you use the SPI and AOI to monitor the quality of solder paste printing and mounting.

Recommended oven temperature curve

Set oven temperatures according to the following temperature curve of reflow soldering. The peak temperature is 245°C.

• A: Temperature axis

• B: Time axis

• C: Liquidus temperature: 217 to 220°C

• D: Ramp-up slope: 1 to 3°C/s

• E: Duration of constant temperature: 60 to 120s; the range of constant temperature: 150 to 200°C

• F: Duration above the liquidus: 50 to 70s

• G: Peak temperature: 235 to 245°C

• H: Ramp-down slope: 1 to 4°C/s

  Note: The above curve is just an example of the solder paste SAC305. For more details about other solder pastes, please refer to Recommended oven temperature curve in the solder paste specifications.

Storage conditions

Note: The unit is mm.