SH4 Module Datasheet

Overview

SH4 is a low-power embedded Sub-G 433M that Tuya has developed. It consists of a highly integrated RF transceiver chip (CMTOV30-EQR) and a few peripherals. SH4 needs to control transmitting and receiving with the MCU. On the basis of this, you can develop the embedded Sub-G communication products as needed.

Features

• Operating voltage: 1.8 to 3.6V
• Typical operating voltage: 3.3 V
• Peripherals: 3 GPIOs, 1×SPI
• Sub-G connectivity
  • Working frequency: 433 MHz
  • Transmission rate: 0.5 to 300 kbps
  • Modulation method: FSK, GFSK and OOK
  • Output power: + 10dBm
  • External IPEX antenna/external spring antenna/external PCB antenna
  • Operating temperature: -40℃ to 85℃

Applications

• Smart building
• Smart household
• Industrial wireless control
• Smart home appliances

Change history

Update date	Updated content	Version after update
10/15/2020	This is the first release.	V2.0.0

Module interfaces

Dimensions and package

SH4 has two lines of pins with a 2-mm pin spacing.

The SH4 dimensions are 15.5±0.35 mm (W)×13.8±0.35 mm (L)× 2.5±0.1 mm (H). The thickness of the PCB is 0.8 mm.

Side view:

Bottom view:
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Pin definition

Pin number	Symbol	I/O type	Function
1	NC	–	NC
2	GPIO3	I/O	It can be configured as INT1, INT2, DOUT/DIN, or DCLK (TX/RX) and corresponds to Pin 8 of the IC
3	GND	P	Power supply reference ground
4	SCLK	I	It’s the clock of the SPI and corresponds to Pin 9 of the IC
5	SDIO	I	It’s input and output of the SPI and corresponds to Pin 10 of the IC
6	CSB	I	It’s the chip select of accessing the register by the SPI and corresponds to Pin 13 of the IC
7	FCSB	I	It’s the chip select of accessing the FIFO by the SPI and corresponds to Pin 12 of the IC
8	VCC	P	Power supply pin (3.3V)
9	GND	P	Power supply reference ground
10	GPIO2	I/O	It can be configured as INT1, INT2, DOUT/DIN, or DCLK (TX/RX) and corresponds to Pin 15 of the IC
11	GPIO1	I/O	It can be configured as INT1, INT2, DOUT/DIN, or DCLK (TX/RX) and corresponds to Pin 16 of the IC
12	NC	–	NC
13	NC	–	NC
14	GND	P	Power supply reference ground
15	NC	–	NC
16	ANT	–	Rf_antenna, characteristic impedance of 50Ω

Note: P indicates power supply pins, I/O indicates input or output pins, and INT1 and INT2 are disconnected. DOUT is demodulation output. DIN is demodulation input. DCLK is the modulation or demodulation data rate synchronization clock, which automatically switches when the TX/RX mode is switched.

Electrical parameters

Absolute electrical parameters

Parameter	Description	Minimum value	Maximum value	Unit
Ts	Storage temperature	-50	150	℃
Tj	Junction temperature	-40	125	℃
VBAT	Power supply voltage	-0.3	3.6	V
ESD voltage (human body model)	TAMB-25℃	-2	2	KV

Normal working conditions

Parameter	Description	Minimum value	Typical value	Maximum value	Unit
Ta	Operating temperature	-40	-	85	℃
VBAT	Power supply voltage	1.8	3.3	3.6	V

TX and RX power consumption

Working status	Frequency	Rate	Transmit power/receive	Average value	Peak value (Typical value)	Unit
Transmit	433 band	50kbps	+10dBm	30	50	mA
Receive	433 band	50kbps	-107dBm	7	10	mA

RF parameters

Basic RF features

Parameter	Description
Working frequency	413 to 453 MHz
Standards of physical layer	IEEE 802.15.4g/c
Data transmission rate	0 to 300kbps
Antenna type	External IPEX antenna/external spring antenna/external PCB antenna

TX performance

TX performance

Parameter	Minimum value	Typical value	Maximum value	Unit
Average RF output power	-	8	-	dBm
Frequency error	-10	-	10	ppm

RX performance

RX sensitivity

Parameter	Data rate	Minimum value	Typical value	Maximum value	Unit
RX sensitivity	2.4Kbps	-	-114	-	dBm

Antenna information

Antenna type

The module does not have its own PCB antenna, and the third party needs to provide an antenna. The antenna can be an external spring antenna, an IPEX-FPC antenna, a PCB antenna, or the like. By default, the external IPEX antenna is preferred.

Antenna interference reduction

To ensure optimal Wi-Fi performance, it is recommended that the antenna be at least 15 mm away from other metal parts.

U.FL RF connector

Parameters of the U.FL RF connector are as below:

Packaging information and production instructions

Mechanical dimensions

The PCB dimensions are 15.5±0.35 mm (W)×13.8±0.35 mm (L) ×0.8±0.15 mm (H).

Schematic diagram of footprint

Guidance on a typical application

Production instructions

• The stamp-hole module must be mounted by the SMT machine. After being unpacked, it must be soldered within 24 hours. Otherwise, it must be put into the drying cupboard where the RH is not greater than 10%, or it needs to be packaged under vacuum again and the exposure time needs to be recorded (the total exposure time cannot exceed 168 hours).

  • SMT equipment:
    • Mounter
    • SPI
    • Reflow soldering machine
    • Oven temperature tester
    • Automated optical inspection (AOI) equipment
  • Baking equipment:
    • Cabinet oven
    • Anti-static heat-resistant pallets
    • Anti-static heat-resistant gloves

• Storage conditions for a delivered module are as follows:

  • The moisture-proof bag must be placed in an environment where the temperature is below 40°C and the relative humidity is lower than 90%.
  • The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed.
  • The package contains a humidity indicator card (HIC).
    

• The module needs to be baked in the following cases:

  • Vacuum packing bag was found to be damaged before being unpacked.
  • There is no humidity indicator card (HIC) in the vacuum packing bag.
  • After being unpacked, 10% and above circles on the HIC become pink.
  • The total exposure time has been more than 168 hours since unpacking.
  • More than 12 months have passed since the sealing date of the bag.

• Baking settings:

  • Temperature: 60°C and ≤ 5%RH for reelizing and 125°C and ≤5%RH for palletizing (please use heat-resistant pallet rather than plastic pallet)
  • Time: 48 hours for reelizing and 12 hours for palletizing
  • Alarm temperature: 65°C for reelizing and 135°C for palletizing
  • Production ready temperature after natural cooling: < 36°C
  • The number of drying times: 1
  • Re-baking condition: If a module remains unused for 168 hours after being unpacked, it must be baked again.

    Important: If this batch of modules is not baked within 168 hours, do not use the wave soldering to solder them. Because these modules are 3-level moisture-sensitive components, they are very likely to get damp when exposed outside. In this case, if they are soldered at high temperatures, it may result in component failure or poor soldering.

• In the whole production process, take electrostatic discharge (ESD) protective measures.

• To guarantee the passing rate, it is recommended that you use the SPI and AOI to monitor the quality of solder paste printing and mounting.

Recommended oven temperature curve

Perform mounting with the SMT based on the following reflow oven temperature curve. The highest temperature is 245°C. The reflow temperature curve is as below:

• A: Temperature axis

• B: Time axis

• C: Liquidus temperature: 217 to 220°C

• D: Ramp-up slope: 1 to 3°C/s

• E: Duration of constant temperature: 60 to 120s; the range of constant temperature: 150 to 200°C

• F: Duration above the liquidus: 50 to 70s

• G: Peak temperature: 235 to 245°C

• H: Ramp-down slope: 1 to 4°C/s

  Note: The above curve is just an example of the solder paste SAC305. For more details about other solder pastes, please refer to Recommended oven temperature curve in the solder paste specifications.

Storage conditions

MOQ and packaging information

Product model	MOQ (pcs)	Shipping packaging method	Number of modules per reel (pcs)	Number of reels per carton (reel)
SH4	3600	Tape reel	900	4

Appendix: Statement

FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this equipment.

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

Note: This equipment has been tested and found to comply with the limits for a Class B digital device, according to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used following the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and receiver.
• Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help.

Radiation Exposure Statement

This equipment complies with FCC radiation exposure limits set forth for an uncontrolled rolled environment. This equipment should be installed and operated with a minimum distance of 20cm between the radiator and your body.

Important Note

This radio module must not be installed to co-locate and operating simultaneously with other radios in the host system except following FCC multi-transmitter product procedures. Additional testing and equipment authorization may be required to operate simultaneously with other radios.

The availability of some specific channels and/or operational frequency bands are country dependent and are firmware programmed at the factory to match the intended destination. The firmware setting is not accessible by the end-user.

The host product manufacturer is responsible for compliance with any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.

The end-user manual shall include all required regulatory information/warnings as shown in this manual, including this product must be installed and operated with a minimum distance of 20 cm between the radiator and user body.

The RF module is considered as a limited modular transmitter according to FCC rules. Even though the RF module gets an FCC ID, the host product manufacturer can not use the FCC ID on the final product directly. In these circumstances, the host product manufacturer integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining the FCC authorization by a Class II permissive change application or a new application.

Declaration of Conformity European Notice

Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module product complies with essential requirements and other relevant provisions of Directive 2014/53/EU, 2011/65/EU. A copy of the Declaration of conformity can be found at https://www.tuya.com.

This product must not be disposed of as normal household waste, following the EU directive for waste electrical and electronic equipment (WEEE-2012/19/EU). Instead, it should be disposed of by returning it to the point of sale, or a municipal recycling collection point.

The device could be used with a separation distance of 20 cm to the human body.