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Last Updated on : 2021-10-21 01:45:13download
SH4 is a low-power embedded Sub-G 433M that Tuya has developed. It consists of a highly integrated RF transceiver chip (CMTOV30-EQR) and a few peripherals. SH4 needs to control transmitting and receiving with the MCU. On the basis of this, you can develop the embedded Sub-G communication products as needed.
|Update date||Updated content||Version after update|
|10/15/2020||This is the first release.||V2.0.0|
SH4 has two lines of pins with a 2-mm pin spacing.
The SH4 dimensions are 15.5±0.35 mm (W)×13.8±0.35 mm (L)× 2.5±0.1 mm (H). The thickness of the PCB is 0.8 mm.
|Pin number||Symbol||I/O type||Function|
|2||GPIO3||I/O||It can be configured as INT1, INT2, DOUT/DIN, or DCLK (TX/RX) and corresponds to Pin 8 of the IC|
|3||GND||P||Power supply reference ground|
|4||SCLK||I||It’s the clock of the SPI and corresponds to Pin 9 of the IC|
|5||SDIO||I||It’s input and output of the SPI and corresponds to Pin 10 of the IC|
|6||CSB||I||It’s the chip select of accessing the register by the SPI and corresponds to Pin 13 of the IC|
|7||FCSB||I||It’s the chip select of accessing the FIFO by the SPI and corresponds to Pin 12 of the IC|
|8||VCC||P||Power supply pin (3.3V)|
|9||GND||P||Power supply reference ground|
|10||GPIO2||I/O||It can be configured as INT1, INT2, DOUT/DIN, or DCLK (TX/RX) and corresponds to Pin 15 of the IC|
|11||GPIO1||I/O||It can be configured as INT1, INT2, DOUT/DIN, or DCLK (TX/RX) and corresponds to Pin 16 of the IC|
|14||GND||P||Power supply reference ground|
|16||ANT||–||Rf_antenna, characteristic impedance of 50Ω|
Note: P indicates power supply pins, I/O indicates input or output pins, and INT1 and INT2 are disconnected. DOUT is demodulation output. DIN is demodulation input. DCLK is the modulation or demodulation data rate synchronization clock, which automatically switches when the TX/RX mode is switched.
|Parameter||Description||Minimum value||Maximum value||Unit|
|VBAT||Power supply voltage||-0.3||3.6||V|
|ESD voltage (human body model)||TAMB-25℃||-2||2||KV|
|Parameter||Description||Minimum value||Typical value||Maximum value||Unit|
|VBAT||Power supply voltage||1.8||3.3||3.6||V|
|Working status||Frequency||Rate||Transmit power/receive||Average value||Peak value (Typical value)||Unit|
|Working frequency||413 to 453 MHz|
|Standards of physical layer||IEEE 802.15.4g/c|
|Data transmission rate||0 to 300kbps|
|Antenna type||External IPEX antenna/external spring antenna/external PCB antenna|
|Parameter||Minimum value||Typical value||Maximum value||Unit|
|Average RF output power||-||8||-||dBm|
|Parameter||Data rate||Minimum value||Typical value||Maximum value||Unit|
The module does not have its own PCB antenna, and the third party needs to provide an antenna. The antenna can be an external spring antenna, an IPEX-FPC antenna, a PCB antenna, or the like. By default, the external IPEX antenna is preferred.
To ensure optimal Wi-Fi performance, it is recommended that the antenna be at least 15 mm away from other metal parts.
Parameters of the U.FL RF connector are as below:
The PCB dimensions are 15.5±0.35 mm (W)×13.8±0.35 mm (L) ×0.8±0.15 mm (H).
The stamp-hole module must be mounted by the SMT machine. After being unpacked, it must be soldered within 24 hours. Otherwise, it must be put into the drying cupboard where the RH is not greater than 10%, or it needs to be packaged under vacuum again and the exposure time needs to be recorded (the total exposure time cannot exceed 168 hours).
Storage conditions for a delivered module are as follows:
The module needs to be baked in the following cases:
Important: If this batch of modules is not baked within 168 hours, do not use the wave soldering to solder them. Because these modules are 3-level moisture-sensitive components, they are very likely to get damp when exposed outside. In this case, if they are soldered at high temperatures, it may result in component failure or poor soldering.
In the whole production process, take electrostatic discharge (ESD) protective measures.
To guarantee the passing rate, it is recommended that you use the SPI and AOI to monitor the quality of solder paste printing and mounting.
Perform mounting with the SMT based on the following reﬂow oven temperature curve. The highest temperature is 245°C. The reflow temperature curve is as below:
A: Temperature axis
B: Time axis
C: Liquidus temperature: 217 to 220°C
D: Ramp-up slope: 1 to 3°C/s
E: Duration of constant temperature: 60 to 120s; the range of constant temperature: 150 to 200°C
F: Duration above the liquidus: 50 to 70s
G: Peak temperature: 235 to 245°C
H: Ramp-down slope: 1 to 4°C/s
Note: The above curve is just an example of the solder paste SAC305. For more details about other solder pastes, please refer to Recommended oven temperature curve in the solder paste specifications.
|Product model||MOQ (pcs)||Shipping packaging method||Number of modules per reel (pcs)||Number of reels per carton (reel)|
FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this equipment.
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.
Note: This equipment has been tested and found to comply with the limits for a Class B digital device, according to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used following the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
Radiation Exposure Statement
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled rolled environment. This equipment should be installed and operated with a minimum distance of 20cm between the radiator and your body.
This radio module must not be installed to co-locate and operating simultaneously with other radios in the host system except following FCC multi-transmitter product procedures. Additional testing and equipment authorization may be required to operate simultaneously with other radios.
The availability of some specific channels and/or operational frequency bands are country dependent and are firmware programmed at the factory to match the intended destination. The firmware setting is not accessible by the end-user.
The host product manufacturer is responsible for compliance with any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.
The end-user manual shall include all required regulatory information/warnings as shown in this manual, including this product must be installed and operated with a minimum distance of 20 cm between the radiator and user body.
The RF module is considered as a limited modular transmitter according to FCC rules. Even though the RF module gets an FCC ID, the host product manufacturer can not use the FCC ID on the final product directly. In these circumstances, the host product manufacturer integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining the FCC authorization by a Class II permissive change application or a new application.
Declaration of Conformity European Notice
Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module product complies with essential requirements and other relevant provisions of Directive 2014/53/EU, 2011/65/EU. A copy of the Declaration of conformity can be found at https://www.tuya.com.
This product must not be disposed of as normal household waste, following the EU directive for waste electrical and electronic equipment (WEEE-2012/19/EU). Instead, it should be disposed of by returning it to the point of sale, or a municipal recycling collection point.
The device could be used with a separation distance of 20 cm to the human body.
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