SS3L Module Datasheet

SS3L is a low-power embedded sub-GHz 434 MHz communications module that Tuya has developed. It consists of a highly integrated RF chip (EFR32FG14P231F256IM32-B) and several peripheral components, with an embedded network protocol stack and rich library functions.

Overview

SS3L is embedded with a low-power 32-bit CPU, 32 KB random-access memory (RAM), 256 KB flash memory, and extensive peripherals. You can develop embedded sub-GHz communications products as required.

Features

• Embedded low-power 32-bit CPU, which can also function as an application processor
• Clock rate: 40 MHz
• Working voltage: 3.0 V to 3.6 V
• Peripherals: 13 GPIOs, 1 universal asynchronous receiver/transmitter (UART), and 1 analog to digital converter (ADC)
• Sub-GHz connectivity
  • 434 MHz working frequency
  • 50 kbit/s transmission rate, and frequency-shift keying (FSK) modulation
  • +14 dBm or +20 dBm output power
  • External antenna connected through an I-PEX connector
  • Working temperature: –40°C to +105°C

Application scenarios

• Intelligent building
• Smart household and home appliances
• Smart socket and light
• Industrial wireless control
• Baby monitor
• Network camera
• Intelligent bus

Module interfaces

Dimensions and footprint

SS3L has three lines of pins with a spacing of 2 mm.
The SS3L dimensions (H x L x W) are 3.3±0.15 mm x 24±0.35 mm x 16±0.35 mm.

Interface pin definition

Pin No.	Symbol	I/O type	Function
1	RST	I/O	Hardware reset pin, which is active at a low level and has been connected to a pull-up resistor
2	ADC	AI	ADC pin
3	EN	I/O	NC pin
4	PB11	I/O	Interrupt pin, which is connected to PB11 (pin 19) on the internal IC
5	PB12	I/O	Hardware PWM pin, which is connected to PB12 (pin 20) on the internal IC
6	PB13	I/O	Hardware PWM pin, which is connected to PB13 (pin 21) on the internal IC
7	PB14	I/O	Hardware PWM pin, which is connected to PB14 (pin 23) on the internal IC
8	3V3	P	Power supply pin (3.3 V)
9	PD14	I/O	Common GPIO pin, which is connected to PD14 (pin 15) on the internal IC
10	NC	I/O	NC pin
11	GND	P	Power supply reference ground pin
12	SWO	I/O	SWO pin, which is used for SWD debugging
13	IO	I/O	SWDIO pin, which is used for SWD debugging
14	CLK	I/O	SWCLK pin, which is used for SWD debugging
15	GND	P	Power supply reference ground pin
16	PD13	I/O	Common GPIO pin, which is connected to PD13 (pin 14) on the internal IC
17	PF3	I/O	Common GPIO pin, which is connected to PF3 (pin 4) on the internal IC
18	PC10	I/O	Common GPIO pin, which is connected to PC10 (pin 31) on the internal IC
19	PC11	I/O	Hardware PWM pin, which is connected to PC11 (pin 32) on the internal IC
20	PB15	I/O	Hardware PWM pin, which is connected to PB15 (pin 24) on the internal IC
21	RX	I/O	UART0_RXD pin
22	TX	I/O	UART0_TXD pin

Note: P indicates a power supply pin, I/O indicates an input/output pin, and AI indicates an analog input pin.

Test pin definition

Pin No.	Symbol	I/O type	Function
N/A	TEST	I/O	Used for the module product test.

Note: Test pins are not recommended.

Electrical parameters

Absolute electrical parameters

Parameter	Description	Minimum value	Maximum value	Unit
Ts	Storage temperature	–40	125	°C
VBAT	Power supply voltage	1.8	3.8	V
ESD voltage (human body model)	Tamb = 25°C	N/A	2	kV
ESD voltage (machine model)	Tamb = 25°C	N/A	0.5	kV

Working conditions

Parameter	Description	Minimum value	Typical value	Maximum value	Unit
Ta	Working temperature	–20	N/A	105	°C
VBAT	Power supply voltage	2.1	3.3	3.6	V
VIL	I/O low-level input	–0.3	N/A	VCC x 0.3	V
VIH	I/O high-level input	VCC x 0.75	N/A	VCC	V
VOL	I/O low-level output	N/A	N/A	VCC x 0.1	V
VOH	I/O high-level output	VCC x 0.8	N/A	VCC	V
Imax	I/O drive current	N/A	N/A	12	mA

Current consumption

Working status	Mode	Rate	TX Power/RX	Average Value	Maximum value (Typical value)	Unit
TX	FSK	50 kbit/s	+14 dBm	100	111	mA
RX	FSK	50 kbit/s	–107 dBm	7	17	mA
Low power monitoring	1s period 1ms jump	/	/	<12	/	μA
Low power node	Interrupt the wake - up process (3s)	/	/	1.92	/	mA

Working current

Working Mode	Working Status (Ta = 25°C)	Average Value	Maximum Value (Typical Value)	Unit
EZ	The module is in EZ mode.	4.7	13	mA
Connected	The module is connected to the network.	7	17	mA
Disconnected	The module is disconnected from the network.	4	13	mA

RF features

Basic RF features

Parameter	Description
Working frequency	433.05 MHz to 434.79 MHz
Physical layer standard	IEEE 802.15.4g/c
Data transmission rate	150 kbit/s
Antenna type	IPEX

TX performance

Continuous TX performance

Parameter	Minimum value	Typical value	Maximum value	Unit
Average RF output power	N/A	14	N/A	dBm
Frequency error	–10	N/A	+10	ppm

RX performance

RX sensitivity

Parameter	Minimum value	Typical value	Maximum value	Unit
RX sensitivity	N/A	–107	N/A	dBm

Antenna

Antenna type

SS3L uses a spring antenna or an external antenna. By default, SS3L uses an external antenna with an I-PEX connector.

Antenna interference reduction

To ensure optimal performance when the module uses a spring antenna, it is recommended that the antenna be at least 15 mm away from other metal parts.
To prevent adverse impact on the antenna radiation performance, avoid copper or traces along the antenna area on the PCB.

Antenna connector specifications

Packaging information and production instructions

Mechanical dimensions

The PCB dimensions (H x L x W) are 1.0±0.1 mm x 24±0.35 mm x 16±0.35 mm.

Side view

Pin connections

Production instructions

• The stamp-hole module must be mounted by the SMT machine. After being unpacked, it must be soldered within 24 hours. Otherwise, it must be put into the drying cupboard where the RH is not greater than 10%, or it needs to be packaged under vacuum again and the exposure time needs to be recorded (the total exposure time cannot exceed 168 hours).

  • SMT equipment:
    • Mounter
    • SPI
    • Reflow soldering machine
    • Oven temperature tester
    • Automated optical inspection (AOI) equipment
  • Baking equipment:
    • Cabinet oven
    • Anti-static heat-resistant pallets
    • Anti-static heat-resistant gloves

• Storage conditions for a delivered module are as follows:

  • The moisture-proof bag must be placed in an environment where the temperature is below 40°C and the relative humidity is lower than 90%.
  • The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed.
  • The package contains a humidity indicator card (HIC).
    

• The module needs to be baked in the following cases:

  • Vacuum packing bag was found to be damaged before being unpacked.
  • There is no humidity indicator card (HIC) in the vacuum packing bag.
  • After being unpacked, 10% and above circles on the HIC become pink.
  • The total exposure time has been more than 168 hours since unpacking.
  • More than 12 months have passed since the sealing date of the bag.

• Baking settings:

  • Temperature: 40°C and ≤ 5% RH for reel package and 125°C and ≤5% RH for tray package (please use the heat-resistant tray rather than a plastic container)
  • Time: 168 hours for reel package and 12 hours for tray package
  • Alarm temperature: 50°C for reel package and 135°C for tray package
  • Production-ready temperature after natural cooling: < 36°C
  • Re-baking situation: If a module remains unused for over 168 hours after being baked, it needs to be baked again.
  • If a batch of modules is not baked within 168 hours, do not use the wave soldering to solder them. Because these modules are Level-3 moisture-sensitive devices, they are very likely to get damp when exposed beyond the allowable time. In this case, if they are soldered at high temperatures, it may result in device failure or poor soldering.

• In the whole production process, take electrostatic discharge (ESD) protective measures.

• To guarantee the passing rate, it is recommended that you use the SPI and AOI to monitor the quality of solder paste printing and mounting.

Recommended oven temperature curve

Perform mounting with the SMT based on the following reflow oven temperature curve. The highest temperature is 245°C. The reflow temperature curve is as below:

• A: Temperature axis

• B: Time axis

• C: Liquidus temperature: 217 to 220°C

• D: Ramp-up slope: 1 to 3°C/s

• E: Duration of constant temperature: 60 to 120s; the range of constant temperature: 150 to 200°C

• F: Duration above the liquidus: 50 to 70s

• G: Peak temperature: 235 to 245°C

• H: Ramp-down slope: 1 to 4°C/s

  Note: The above curve is just an example of the solder paste SAC305. For more details about other solder pastes, please refer to Recommended oven temperature curve in the solder paste specifications.

Storage conditions

MOQ and packing information

Product model	MOQ	Packing method	Number of modules in per reel	Number of reels in per carton
SS3L	4000	Tape reel	1000	4

Appendix: Statement

FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this device.

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

Note: This device has been tested and found to comply with the limits for a Class B digital device, according to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This device generates, uses, and can radiate radio frequency energy and, if not installed and used following the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation.

If this device does cause harmful interference to radio or television reception, which can be determined by turning the device off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

• Reorient or relocate the receiving antenna.
• Increase the separation between the device and receiver.
• Connect the device into an outlet on a circuit different from that to which the receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help.

Radiation Exposure Statement

This device complies with FCC radiation exposure limits set forth for an uncontrolled rolled environment. This device should be installed and operated with a minimum distance of 20cm between the radiator and your body.

Important Note

This radio module must not be installed to co-locate and operating simultaneously with other radios in the host system except following FCC multi-transmitter product procedures. Additional testing and device authorization may be required to operate simultaneously with other radios.

The availability of some specific channels and/or operational frequency bands are country dependent and are firmware programmed at the factory to match the intended destination. The firmware setting is not accessible by the end-user.

The host product manufacturer is responsible for compliance with any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.

The end-user manual shall include all required regulatory information/warnings as shown in this manual, including “This product must be installed and operated with a minimum distance of 20 cm between the radiator and user body”.

This device has got an FCC ID: 2ANDL-SS3L. The end product must be labeled in a visible area with the following: “Contains Transmitter Module FCC ID: 2ANDL-SS3L”.

This device is intended only for OEM integrators under the following conditions:

The antenna must be installed such that 20cm is maintained between the antenna and users, and the transmitter module may not be co-located with any other transmitter or antenna.

As long as the 2 conditions above are met, further transmitter tests will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed.

Declaration of Conformity European Notice

Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module product is in compliance with essential requirements and other relevant provisions of Directive 2014/53/EU,2011/65/EU. A copy of the Declaration of conformity can be found at https://www.tuya.com.

This product must not be disposed of as normal household waste, in accordance with the EU directive for waste electrical and electronic equipment (WEEE-2012/19/EU). Instead, it should be disposed of by returning it to the point of sale, or to a municipal recycling collection point.

The device could be used with a separation distance of 20cm to the human body.