SS23-U8 Module Datasheet

SS23-U8 is a low power embedded Sub-GHz communication module developed by Tuya Smart that operates at a frequency of 868 to 920 MHz. It consists of a highly integrated wireless RF chip EFR32FG23A020F512GM40-C and a few peripheral components, with a built-in network protocol stack and various library functions.

Overview

SS23-U8 embeds a low power 32-bit 78 MHz ARM Cortex-M33 CPU, 64 kB RAM, 512 kB flash, and various peripheral resources. All these resources can help develop your own embedded Sub-GHz products.

Features

• Built-in low-power 32-bit CPU that also acts as an application processor.
• Clock rate of 78 MHz.
• Operating voltage range: 1.8V–3.8V.
• Peripherals: 13 general-purpose input/output (GPIO) pins, 1 universal asynchronous receiver/transmitter (UART), and 1 analog-to-digital converter (ADC) pin.
• Sub-GHz connectivity
  • Operating frequency: 868 to 920 MHz
  • Transmission rate: 2.4 Kbit/s–2 Mbit/s
  • Output power: 20 dBm
  • External IPEX antenna or helical antenna
  • Operating temperature range: -40°C to +85°C

Scope of applications

• Smart building
• Smart home and electrical appliance
• Smart socket and light
• Industrial wireless control
• Baby monitor
• IP camera
• Smart bus

Module interfaces

Dimensions and footprint

SS23-U8 has three rows of pins. The pin spacing is 1.4±0.1 mm on both sides and 1.8±0.1 mm at the bottom.

The SS23-U8 dimensions are 20.3±0.35 mm (L) × 15.8±0.35 mm (W) × 2.6±0.15 mm (H).

Pin definition

Pin No.	Symbol	I/O type	Description
1	PA0	I/O	GPIO pin, corresponding to PA00 on the IC.
2	PA3	I/O	GPIO pin, corresponding to PA03 on the IC.
3	DIO	I/O	Used for firmware flashing, SWDIO, corresponding to PA02 on the IC.
4	CLK	I/O	Used for firmware flashing, SWCLK, corresponding to PA01 on the IC.
5	ADC	I	ADC pin, corresponding to PA04 on the IC.
6	PA5	I/O	GPIO pin, corresponding to PA05 on the IC.
7	PA6	I/O	GPIO pin, corresponding to PA06 on the IC.
8	PD2	I/O	Support hardware PWM, corresponding to PD02 on the IC.
9	PD1	I/O	Support hardware PWM, corresponding to PD01 on the IC.
10	PD0	I/O	Support hardware PWM, corresponding to PD00 on the IC.
11	PC0	I/O	Support hardware PWM, corresponding to PC00 on the IC.
12	PC1	I/O	Support hardware PWM, corresponding to PC01 on the IC.
13	GND	P	Ground pin.
14	VCC	P	Power supply pin (3.3V).
15	TX0	I/O	UART_TXD0, used to flash the firmware and authorize the module, corresponding to PC02 on the IC.
16	RX0	I/O	UART_RXD0, used to flash the firmware and authorize the module, corresponding to PC03 on the IC.
17	PA8	I/O	GPIO pin, corresponding to PA08 on the IC.
18	RST	I/O	Reset pin, corresponding to RESETn on the IC. It is effective when pulled down.
19	PA7	I/O	GPIO pin, corresponding to PA07 on the IC.
20	PB0	I/O	GPIO pin, corresponding to PB00 on the IC.
21	PB1	I/O	GPIO pin, corresponding to PB01 on the IC.

Electrical parameters

Absolute electrical parameters

Parameter	Description	Min value	Max value	Unit
Ts	Storage temperature	-40	125	°C
VBAT	Supply voltage	1.8	3.8	V
Electrostatic discharge voltage (human body model)	TAMB -25°C	-	2	kV
Electrostatic discharge voltage (machine model)	TAMB -25°C	-	0.5	kV

Normal operating conditions

Parameter	Description	Min value	Typical value	Max value	Unit
Ta	Operating temperature	-40	-	85	°C
VBAT	Supply voltage	2.1	3.3	3.6	V
VIL	I/O low-level input	-0.3	-	VCC × 0.3	V
VIH	I/O high-level input	VCC × 0.75	-	VCC	V
VOL	I/O low-level output	-	-	VCC × 0.1	V
VoH	I/O high-level output	VCC × 0.8	-	VCC	V
Imax	I/O drive current	-	-	12	mA

Power consumption during continuous transmission and reception

Working status	Mode	Rate	Transmit/Receive power	Average value	Peak (Typical) value	Unit
Transmit	FSK	50 Kbit/s	+20 dBm	100	111	mA
Receive	FSK	50 Kbit/s	-107 dBm	7	17	mA
Low power listening	Jumps every 1 ms within a 1s period	/	/	<12	/	μA
Low power node	Network joining after interrupt wakeup (3s)	/	/	1.92	/	mA

Operating current

Work mode	Status (Ta = 25°C)	Average value	Peak (Typical) value	Unit
Pairing in EZ mode	The module is being paired in EZ mode	4.7	13	mA
Connected	The module is connected to the internet	7	17	mA
Disconnected	The module is disconnected from the internet	4	13	mA

RF parameters

Basic RF features

Parameter	Description
Operating frequency	868–920 MHz
Data transmission rate	2.4 Kbit/s–2 Mbit/s
Antenna type	IPEX antenna or helical antenna

Transmission performance

TX continuous transmission performance

Parameter	Min value	Typical value	Max value	Unit
RF average output power	-	20	-	dBm
Frequency error	-10	-	10	ppm

Receiving performance

RX sensitivity

Parameter	Min value	Typical value	Max value	Unit
RX sensitivity	-	-107	-	dBm

Antenna information

Antenna type

There are two types of antennas: helical antenna and external antenna. The IPEX external antenna is used by default.

Antenna interference reduction

When a helical antenna is used on the module, we recommend that the module antenna is at least 15 mm away from other metal components. This can optimize the antenna performance. Make sure that the enclosure surrounding the antenna is not traced or filled with copper. Otherwise, the RF performance might be degraded.

Specifications of antenna connector

Packing and production instructions

Mechanical dimensions

The PCB dimensions are 20.3±0.35 mm (W) × 15.8±0.35 mm (L) × 1.0±0.1 mm (H).

Side view

Schematic diagram

Recommended PCB footprint

Production instructions

1. Package the module with the SMT if Tuya’s module is designed to be SMT-packaged. After being unpacked, the module must be soldered within 24 hours. Otherwise, it needs to be put into a drying cupboard with a relative humidity level no greater than 10%, or pack the module in vacuum again. Then, record the packing time and duration of exposure. The total exposure time cannot exceed 168 hours.

   • Instruments or devices required for the SMT process:
     • Surface mount system
     • SPI
     • Reflow soldering machine
     • Thermal profiler
     • AOI
   • Instruments or devices required for the baking process:
     • Cabinet oven
     • Anti-electrostatic and heat-resistant trays
     • Anti-electrostatic and heat-resistant gloves

2. A delivered module must meet the following storage requirements:

   • The moisture-proof bag must be placed in an environment where the temperature is below 40°C and the relative humidity is lower than 90%.

   • The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed.

   • A humidity indicator card (HIC) is put in the sealed package.

     

3. The module needs to be baked in the following cases:

   • The vacuum packaging bag is damaged before unpacking.
   • After unpacking, no HIC is found in the packaging bag.
   • After unpacking, the HIC indicates a humidity level of 10% or higher. In this case, the circle turns pink on the HIC.
   • The total exposure time has lasted for over 168 hours since unpacking.
   • More than 12 months have passed since the first sealing of the bag.

4. The baking parameter settings are described below:

   • Baking temperature: 40°C for reel packaging with relative humidity ≤ 5%. And 125°C for tray packaging with relative humidity ≤ 5% (use the heat-resistant tray, rather than plastic containers).
   • Baking time: 168 hours for reel packaging and 12 hours for tray packaging.
   • Temperature for triggering an alert: 50°C for reel packaging and 135°C for tray packaging.
   • Production can begin after a module has cooled down to below 36°C under natural conditions.
   • If a module remains unused for over 168 hours after being baked, it needs to be baked again.
   • If a batch of modules is not baked after exposure for more than 168 hours, do not use wave soldering to solder them. Because these modules are level-3 moisture-sensitive devices, they are very likely to get damp when exposed beyond the allowable time. In this case, if they are soldered at high temperatures, device failure or poor soldering performance might occur.

5. In the whole production process, take electrostatic discharge (ESD) protective measures.

6. To guarantee the pass rate, we recommend that you use the SPI and AOI to monitor the quality of solder paste printing and mounting.

Recommended oven temperature curve

Perform the SMT process according to the following temperature curve of reflow soldering. The peak temperature is 245°C.

• A: temperature axis

• B: time axis

• C: alloy liquidus temperature from 217°C to 220°C

• D: ramp-up slope from 1°C/s to 3°C/s

• E: keep a constant temperature from 150°C to 200°C for a time period from 60s to 120s

• F: temperature above liquidus temperature for 50s to 70s

• G: peak temperature from 235°C to 245°C

• H: ramp-down slope from 1°C/s to 4°C/s

  The curve above is based on solder paste SAC305. For more information about other solder pastes, see the recommended oven temperature curve in the specified solder paste specifications.

Storage conditions

MOQ and packaging information

Product model	MOQ (pcs)	Shipping packaging	Modules per reel (pcs)	Reels per carton
SS23-U8	4,000	Tape and reel	1,000	4

Appendix: Statement

FCC Caution : Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this device.

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

Note : This device has been tested and found to comply with the limits for a Class B digital device, according to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This device generates, uses, and can radiate radio frequency energy and, if not installed and used following the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation.

If this device does cause harmful interference to radio or television reception, which can be determined by turning the device off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

• Reorient or relocate the receiving antenna.
• Increase the separation between the device and receiver.
• Connect the device into an outlet on a circuit different from that to which the receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help.

Radiation Exposure Statement

This device complies with FCC radiation exposure limits set forth for an uncontrolled rolled environment. This device should be installed and operated with a minimum distance of 20cm between the radiator and your body.

Important Note

This radio module must not be installed to co-locate and operate simultaneously with other radios in the host system except by following FCC multi-transmitter product procedures. Additional testing and device authorization may be required to operate simultaneously with other radios.

The availability of some specific channels and/or operational frequency bands are country dependent and are firmware programmed at the factory to match the intended destination. The firmware setting is not accessible to the end-user.

The host product manufacturer is responsible for compliance with any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.

The end-user manual shall include all required regulatory information/warnings as shown in this manual, including “This product must be installed and operated with a minimum distance of 20 cm between the radiator and user body”.

This device has got an FCC ID: 2ANDL-SS23-U8. The end product must be labeled in a visible area with the following: “Contains Transmitter Module FCC ID: 2ANDL-SS23-U8”.

This device is intended only for OEM integrators under the following conditions:

The antenna must be installed such that 20cm is maintained between the antenna and users, and the transmitter module may not be co-located with any other transmitter or antenna.

As long as the 2 conditions above are met, further transmitter tests will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed.

Declaration of Conformity European Notice

Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module product is in compliance with essential requirements and other relevant provisions of Directive 2014/53/EU,2011/65/EU. A copy of the Declaration of Conformity can be found at https://www.tuya.com.

This product must not be disposed of as normal household waste, in accordance with the EU directive for waste electrical and electronic equipment (WEEE-2012/19/EU). Instead, it should be disposed of by returning it to the point of sale, or to a municipal recycling collection point.

The device could be used with a separation distance of 20cm from the human body.