WB1S Module Datasheet

WB1S is a low-power embedded Wi-Fi+Bluetooth LE dual-protocol module that Tuya has developed. It consists of a highly integrated RF chip (BK7231T) and several peripheral components, with an embedded Wi-Fi network protocol stack and robust library functions.

Overview

WB1S also contains a low-power 32-bit microcontroller unit (MCU), 1T1R WLAN module, 256 KB static random-access memory (SRAM), 2 MB flash memory, and extensive peripherals.

WB1S is an RTOS platform that integrates all function libraries of the Wi-Fi MAC and TCP/IP protocols. You can develop embedded Wi-Fi products as required.

Features

• Embedded low-power 32-bit CPU, which can also function as an application processor
• Clock rate: 120 MHz
• Working voltage: 3.0 V to 3.6 V
• Peripherals: nine GPIOs, one universal asynchronous receiver/transmitter (UART), and one analog-to-digital converter (ADC)
• Wi-Fi connectivity
  • 802.11b/g/n
  • Channels 1 to 14 at 2.4 GHz
  • Support WEP, WPA/WPA2, WPA/WPA2 PSK (AES),WPA3 security modes
  • Up to +16 dBm output power in 802.11b mode
  • EZ net pairing mode for Android and iOS devices
  • On-board PCB antenna
  • Working temperature: -40°C to +85°C
• Bluetooth LE:
  • Support Bluetooth LE (V4.2)
  • Maximum output power + 6dBm
  • Onboard PCB antenna and external antenna IPEX connector

Applications

• Intelligent building
• Smart household and home appliances
• Smart socket and light
• Industrial wireless control
• Baby monitor
• Network camera
• Intelligent bus

Module interfaces

Dimensions and footprint

WB1S has two rows of pins with a 2-mm pin spacing.

The WB1S dimensions (H x W x L) are 2.8 mm x 16 mm x 23.5 mm.

Note: The default dimensional tolerance is ±0.35 mm. If a customer has other requirements, clearly specify them in the datasheet after communication.

Interface pin definition

Pin No.	Symbol	I/O type	Function
1	VCC	P	UART1 power supply conversion (5V or 3.3V)
2	TXD1	I/O	UART1_TXD, which is used as a user-side serial interface pin and connected to the P11 pin on the internal IC
3	RXD1	I/O	UART1_RXD, which is used as a user-side serial interface pin and connected to the P10 pin on the internal IC
4	3V3	P	Power supply pin (3.3 V)
5	GND	P	Power supply reference ground pin
6	P26	I/O	Common I/O pin, which can be used as a hardware PWM pin and is connected to the P26 pin on the internal IC
7	P24	I/O	Common I/O pin, which can be used as a hardware PWM pin and is connected to the P24 pin on the internal IC
8	TXD2	I/O	UART2_TXD, which is used for displaying the module internal information and is connected to the P0 pin on the internal IC
9	P8	I/O	Common I/O pin, which can be used as a hardware PWM pin and is connected to the P8 pin on the internal IC
10	P7	I/O	Common I/O pin, which can be used as a hardware PWM pin and is connected to the P7 pin on the internal IC
11	RXD2	I/O	UART0_RXD, which is used for displaying the module internal information and is connected to the P1 pin on the internal IC
12	P9	I/O	Common I/O pin, which can be used as a hardware PWM pin and is connected to the P9 pin on the internal IC
13	P6	I/O	Common I/O pin, which can be used as a hardware PWM pin and is connected to the P6 pin on the internal IC
14	GND	P	Power supply reference ground pin
15	GND	P	Power supply reference ground pin
16	CEN	I	Low-level reset, high-level active (internally pulled high) Docking IC-CEN
17	ADC3	AI	ADC pin, which is connected to the P23 pin on the internal IC
18	GND	P	Power supply reference ground pin

Note:

• P indicates power supply pins, I/O indicates input/output pins, and AI indicates analog input pins.
• CEN is only a hardware reset pin and cannot clear the Wi-Fi network configuration.

Test pin definition

Pin No.	Symbol	I/O type	Function
1	SO	I/O	Data output pin when data is downloaded from the flash memory, which is used for module production and firmware burning and is connected to the P23 or ADC3 pin on the internal IC
2	SI	I/O	Data input pin when data is downloaded from the flash memory, which is used for module production and firmware burning and is connected to the P22 pin on the internal IC
3	CS	I/O	Chip selection pin when data is downloaded from the flash memory, which is used for module production and firmware burning and is connected to the P21 pin on the internal IC
4	SCK	I/O	Clock pin when data is downloaded from the flash memory, which is used for module production and firmware burning and is connected to the P20 pin on the internal IC

Note: Test pins are not recommended.

Electrical parameters

Absolute electrical parameters

Parameter	Description	Minimum value	Maximum value	Unit
Ts	Storage temperature	-40	150	°C
VCC	Power supply voltage	-0.3	3.6	V
Static electricity voltage (human body model)	Tamb = 25°C	N/A	2	kV
Static electricity voltage (machine model)	Tamb = 25°C	N/A	0.5	kV

Electrical conditions

Parameter	Description	Minimum value	Typical value	Maximum value	Unit
Ta	Working temperature	-40	N/A	85	°C
VCC	Power supply voltage	3.0	3.3	3.6	V
VIL	I/O low-level input	-0.3	N/A	VCC x 0.25	V
VIH	I/O high-level input	VCC x 0.75	N/A	3.6	V
VOL	I/O low-level output	N/A	N/A	VCC x 0.1	V
VoH	I/O high-level output	VCC x 0.8	N/A	VCC	V
Imax	I/O drive current	N/A	6	15	mA

RF current consumption

Working status	Mode	Rate	TX Power / Receiving	Typical value	Unit
TX	802.11b	11 Mbit/s	+16 dBm	222	mA
	802.11g	54 Mbit/s	+14 dBm	195	mA
	802.11n	MCS7	+12 dBm	185	mA
RX	802.11b	11 Mbit/s	Constant receiving	98	mA
	802.11g	54 Mbit/s	Constant receiving	98	mA
	802.11n	MCS7	Constant receiving	98	mA

Working current

Working mode	Working status (Ta = 25°C)	Average value	Peak value (Typical value)	Unit
Quick connection network status (Bluetooth network)	The module is in the fast network configuration state, and the Wi-Fi indicator light flashes quickly	100	260	mA
Fast connection network status (AP network configuration)	The module is in the fast connection network configuration state, the Wi-Fi indicator light flashes slowly	80	360	mA
Quick Connect Network Status (EZ Network)	The module is in the fast network configuration state, and the Wi-Fi indicator light flashes quickly	80	320	mA
Network connection idle state	The module is connected to the network and the Wi-Fi indicator light is always on	50	250	mA
Network operation status	The module is connected to the network and the Wi-Fi indicator light is always on	60	260	mA
Disconnected status	Module is offline	105	250	mA

RF features

Basic RF features

Parameter	Description
Frequency band	2.412 GHz to 2.484 GHz
Wi-Fi standard	IEEE 802.11b/g/n (channels 1 to 14)
Bluetooth LE standard	Bluetooth LE 4.2
Data transmission rate	802.11b: 1, 2, 5.5, or 11 (Mbit/s) 802.11g: 6, 9, 12, 18, 24, 36, 48, or 54 (Mbit/s) 802.11n: HT20 MCS0 to MCS7
Antenna type	Onboard PCB antenna with a gain of 0.5 dBi

TX performance

Parameter	Minimum value	Typical value	Maximum value	Unit
Average RF output power, 802.11b CCK mode 11 Mbit/s	N/A	16	N/A	dBm
Average RF output power, 802.11g OFDM mode 54 Mbit/s	N/A	14	N/A	dBm
Average RF output power, 802.11n OFDM mode MCS7	N/A	13	N/A	dBm
Frequency error	-2	N/A	+2	ppm
EVM under 802.11b CCK, 11 Mbit/s 16 dBm		-18		dB
EVM under 802.11g OFDM, 54 Mbit/s, 14 dBm	-30	-29	-25	dB
EVM under 802.11n OFDM, MCS7, 13 dBm	-31	-28	-27	dB

RX performance

Parameter	Minimum value	Typical value	Maximum value	Unit
PER < 8%, 802.11b CCK mode 1 Mbit/s	N/A	-92	N/A	dBm
PER < 10%, 802.11g OFDM mode 54 Mbit/s	N/A	-75	N/A	dBm
PER < 10%, 802.11n OFDM mode MCS7	N/A	-68	N/A	dBm
PER < 10%,Bluetooth LE 1M	NA	-95	NA	dBm

Antenna

Antenna type

The default method is a PCB onboard antenna

Antenna interference reduction

To ensure optimal Wi-Fi performance when the Wi-Fi module uses an onboard PCB antenna, it is recommended that the antenna be at least 15 mm away from other metal parts. To prevent an adverse impact on the antenna radiation performance, avoid copper or traces along the antenna area on the PCB. Deploy the antenna based on the antenna placement solutions, as shown in the following figure

Antenna connector specifications

Packaging information and production instructions

Mechanical dimensions

Note: The default dimensional tolerance is ±0.35 mm. If a customer has other requirements, clearly specify them in the datasheet after communication.

Recommended PCB layout

Production instructions

1. The Tuya SMT module should be mounted by the SMT device. After being unpacked, it should be soldered within 24 hours. Otherwise, it should be put into the drying cupboard where the RH is not greater than 10%; or it needs to be packaged under vacuum again and the exposure time needs to be recorded (the total exposure time cannot exceed 168 hours).

   • SMT devices:
     • Mounter
     • SPI
     • Reflow soldering machine
     • Thermal profiler
     • Automated optical inspection (AOI) equipment
   • Baking devices:
     • Cabinet oven
     • Anti-electrostatic and heat-resistant trays
     • Anti-electrostatic and heat-resistant gloves

2. Storage conditions for a delivered module:

   • The moisture-proof bag must be placed in an environment where the temperature is below 40°C and the relative humidity is lower than 90%.

   • The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed.

   • There is a humidity indicator card (HIC) in the packaging bag.

     

3. The module needs to be baked in the following cases:

   • The packaging bag is damaged before unpacking.
   • There is no HIC in the packaging bag.
   • After unpacking, circles of 10% and above on the HIC become pink.
   • The total exposure time has lasted for over 168 hours since unpacking.
   • More than 12 months has passed since the sealing of the bag.

4. Baking settings:

   • Temperature: 40°C and ≤ 5% RH for reel package and 125°C and ≤5% RH for tray package (please use the heat-resistant tray rather than plastic container).
   • Time: 168 hours for reel package and 12 hours for tray package.
   • Alarm temperature: 50°C for reel package and 135°C for tray package.
   • Production-ready temperature after natural cooling: < 36°C.
   • Re-baking situation: If a module remains unused for over 168 hours after being baked, it needs to be baked again.
   • If a batch of modules is not baked within 168 hours, do not use the reflow soldering to solder them. Because these modules are Level-3 moisture-sensitive devices, they are very likely to get damp when exposed beyond the allowable time. In this case, if they are soldered at high temperatures, it may result in device failure or poor soldering.

5. In the whole production process, take electrostatic discharge (ESD) protective measures.

6. To guarantee the passing rate, it is recommended that you use the SPI and AOI to monitor the quality of solder paste printing and mounting.

Recommended oven temperature curve

Set oven temperatures according to the following temperature curve of reflow soldering. The peak temperature is 245°C.

• A: Temperature axis

• B: Time axis

• C: Liquidus temperature: 217 to 220°C

• D: Ramp-up slope: 1 to 3°C/s

• E: Duration of constant temperature: 60 to 120s; the range of constant temperature: 150 to 200°C

• F: Duration above the liquidus: 50 to 70s

• G: Peak temperature: 235 to 245°C

• H: Ramp-down slope: 1 to 4°C/s

  Note: The above curve is just an example of the solder paste SAC305. For more details about other solder pastes, please refer to Recommended oven temperature curve in the solder paste specifications.

Storage conditions

MOQ and packaging information

Product number	MOQ (pcs)	Packing method	Modules per reel	Reels per carton
WB1S	3600	Tape reel	900	4

Appendix: Statement

FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this device.

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

Note: This device has been tested and found to comply with the limits for a Class B digital device, according to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This device generates, uses, and can radiate radio frequency energy and, if not installed and used following the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation.

If this device does cause harmful interference to radio or television reception, which can be determined by turning the device off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

• Reorient or relocate the receiving antenna.
• Increase the separation between the device and receiver.
• Connect the device into an outlet on a circuit different from that to which the receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help.

Radiation Exposure Statement

This device complies with FCC radiation exposure limits set forth for an uncontrolled rolled environment. This device should be installed and operated with a minimum distance of 20cm between the radiator and your body.

Important Note

This radio module must not be installed to co-locate and operating simultaneously with other radios in the host system except following FCC multi-transmitter product procedures. Additional testing and device authorization may be required to operate simultaneously with other radios.

The availability of some specific channels and/or operational frequency bands are country dependent and are firmware programmed at the factory to match the intended destination. The firmware setting is not accessible by the end-user.

The host product manufacturer is responsible for compliance with any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.

The end-user manual shall include all required regulatory information/warnings as shown in this manual, including “This product must be installed and operated with a minimum distance of 20 cm between the radiator and user body”.

This device has got an FCC ID: 2ANDL-WB1S. The end product must be labeled in a visible area with the following: “Contains Transmitter Module FCC ID: 2ANDL-WB1S”.

This device is intended only for OEM integrators under the following conditions:

The antenna must be installed such that 20cm is maintained between the antenna and users, and the transmitter module may not be co-located with any other transmitter or antenna.

As long as the 2 conditions above are met, further transmitter tests will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed.

Declaration of Conformity European Notice

Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module product is in compliance with essential requirements and other relevant provisions of Directive 2014/53/EU,2011/65/EU. A copy of the Declaration of conformity can be found at https://www.tuya.com.

This product must not be disposed of as normal household waste, in accordance with the EU directive for waste electrical and electronic equipment (WEEE-2012/19/EU). Instead, it should be disposed of by returning it to the point of sale, or to a municipal recycling collection point.

The device could be used with a separation distance of 20cm to the human body.