WBLC9 Module Datasheet

WBLC9 is a low-power embedded Wi-Fi and Bluetooth module that Tuya has developed. It consists of a highly integrated RF chip (BK7231T) and several peripheral components, with an embedded Wi-Fi network protocol stack and robust library functions.

Overview

WBLC9 is embedded with a low-power 32-bit microcontroller unit (MCU), 2 MB flash memory, 256 KB static random-access memory (SRAM), and extensive peripherals.

WBLC9 is an RTOS platform that integrates all function libraries of the Wi-Fi MAC and TCP/IP protocols. You can develop embedded Wi-Fi products as required.

Features

• Embedded low-power 32-bit CPU, which can also function as an application processor
• Dominant frequency: 120 MHz
• Working voltage: 3.0 V to 3.6 V
• Peripherals: 6 GPIOs
• Wi-Fi connectivity
  • 802.11 b/g/n
  • Channels 1 to 14 at 2.4 GHz
  • Support WEP, WPA/WPA2, WPA/WPA2 PSK (AES),WPA3 security modes
  • Up to +17dBm output power in 802.11b mode
  • STA, AP, and STA+AP working modes
  • EZ and AP net pairing modes for Android and iOS devices
  • Onboard ceramics antenna with a gain of 0.5 dBi
  • Working temperature: -40°C to +105°C
• Bluetooth LE connectivity
  • Support for Bluetooth LE4.2
  • Maximum output power of +6 dBm
  • Onboard ceramics antenna

Applications

• Intelligent building
• Smart household and home appliances
• Smart socket and light
• Industrial wireless control
• Baby monitor
• Network camera
• Intelligent bus

Module interfaces

Dimensions and footprint

WBLC9 has two rows of pins with a 2±0.1 mm pin spacing.

The WBLC9 dimensions (W x L x H ) are 15±0.35mm (W)×16.8±0.35mm (L) ×3.0±0.15mm (H). The figure shows the WBLC9 front and rear views.

Interface pin definition

Pin No.	Symbol	I/O type	Function
1	P9	I/O	Hardware PWM pin, which is connected to the P9
2	P16	I/O	Common I/O pin, which is connected to the P16
3	P7	I/O	Hardware PWM pin, which is connected to the P7
4	P8	I/O	Hardware PWM pin, which is connected to the P8
5	P26	I/O	Hardware PWM pin, which is connected to the P26
6	VCC	P	Power supply pin (3.3 V)
7	P24	I/O	Hardware PWM pin, which is connected to the P24
8	GND	P	Ground pin

Test pin definition

Pin No.	Symbol	I/O type	Function
TP6	U2_TXD	I/O	UART2_TX, LOG TX
TP2	F_SCK	I/O	Clock pin when data is downloaded from the flash memory, which is connected to the P20 pin on the internal IC
TP3	F_CSN	I/O	Command enabling pin when data is downloaded from the flash memory, which is connected to the P21 pin on the internal IC
TP4	F_SI	I/O	Data input pin when data is downloaded from the flash memory, which is connected to the P22 pin on the internal IC
TP5	F_SO	I/O	Data output pin when data is downloaded from the flash memory, which is connected to the P23 pin on the internal IC
TP7	U2_RXD	I/O	UART2_RX, LOG RX
TP8	U1_TXD	I/O	UART1_TX, User serial port TX
TP9	U1_RXD	I/O	UART1_RX, User serial port RX
TP10	CEN	I	Reset pin, which is connected to 3.3 V for normal use

Electrical parameters

Absolute electrical parameters

Parameter	Description	Minimum value	Maximum value	Unit
Ts	Storage temperature	-40	105	℃
VBAT	Power supply voltage	3.0	3.6	V
Static electricity voltage (human body model)	TAMB-25℃	-	2	KV
Static electricity voltage (machine model)	TAMB-25℃	-	0.5	KV

Working conditions

Parameter	Description	Minimum value	Typical value	Maximum value	Unit
Ta	Working temperature	-40	-	105	℃
VBAT	Power supply voltage	3.0	3.3	3.6	V
VIL	I/O low-level input	-0.3	-	VCC*0.25	V
VIH	I/O high-level input	VCC*0.75	-	VCC	V
VOL	I/O low-level output	-	-	VCC*0.1	V
VoH	I/O high-level output	VCC*0.8	-	VCC	V
Imax	I/O drive current	-	-	12	mA

Current consumption during constant transmission and receiving

Working status	Mode	Rate	TX Power/ Receiving	Typical value	Maximum value	Unit
TX	11b	11Mbps	+17.5dBm	295	354	mA
TX	11g	54Mbps	+13.5dBm	266	300	mA
TX	11n	MCS7	+13dBm	260	290	mA
RX	11b	11Mbps	Constant receiving	98	100	mA
RX	11g	54Mbps	Constant receiving	98	100	mA
RX	11n	MCS7	Constant receiving	98	100	mA

Working current

Working mode	Working status (Ta = 25°C)	Average value	Maximum value	Unit
BT	The module is in BT mode, and the Wi-Fi indicator blinks quickly.	96	13	mA
EZ	The module is in EZ mode, and the Wi-Fi indicator blinks quickly.	134	357	mA
AP	The module is in AP mode, and the Wi-Fi indicator blinks slowly.	178	264	mA
Connected	The module is connected to the network and work, and the Wi-Fi indicator is steady on.	134	357	mA
Connected	The module is connected to the network and idle, and the Wi-Fi indicator is steady on.	153	273	mA

RF features

Basic RF features

Parameter	Description
Frequency band	2.412~2.484GHz
Wi-Fi standard	IEEE 802.11b/g/n(channels1-14)
Data transmission rate	11b:1,2,5.5, 11 (Mbps); 11g:6,9,12,18,24,36,48,54(Mbps); 11n: HT20 MCS0~7
Antenna type	Onboard ceramics antenna with a gain of 0.5 dBi

TX performance

Performance during constant transmission

Parameter	Minimum value	Typical value	Maximum value	Unit
Average RF output power,802.11b CCK Mode 11M	-	17	-	dBm
Average RF output power,802.11g OFDM Mode 54M	-	14	-	dBm
Average RF output power,802.11n OFDM Mode MCS7	-	13	-	dBm
Frequency error	-10	-	10	ppm

RX performance

RX sensitivity

Parameter	Minimum value	Typical value	Maximum value	Unit
PER<8%, RX sensitivity, 802.11b DSSS Mode 11M	-	-85	-	dBm
PER<10%, RX sensitivity, 802.11g OFDM Mode 54M	-	-72	-	dBm
PER<10%, RX sensitivity, 802.11n OFDM Mode MCS7	-	-68	-	dBm
PER<10%, RX sensitivity, Bluetooth LE 1M MCS7	-	-95	-	dBm

Antenna

Antenna type

WBLC9 uses an Onboard ceramics antenna.

Antenna interference reduction

To ensure optimal Wi-Fi performance when the Wi-Fi module uses an onboard ceramics antenna.

Packaging information and production instructions

Mechanical dimensions

The PCB dimensions (W x L x H) are 15±0.35mm (W)×16.8±0.35mm (L) ×1.0±0.1mm (H).

Recommended schematic encapsulation

Recommended PCB Encapsulation-SMT

WBLC9 module is inserted and welded.

Production instructions

1. For the Tuya in-line module, wave soldering is most preferred and manual soldering is less preferred. After being unpacked, the module must be soldered within 24 hours. Otherwise, it must be put into the drying cupboard where the RH is not greater than 10%; or it needs to be packaged under vacuum again and record the exposure time (the total exposure time cannot exceed 168 hours).
2. Wave soldering devices and materials:
   • Wave soldering equipment
   • Wave soldering fixture
   • Constant-temperature soldering iron
   • Tin bar, tin wire, and flux
   • Thermal profiler
3. Baking devices:
   • Cabinet oven
   • Anti-electrostatic and heat-resistant trays
   • Anti-electrostatic and heat-resistant gloves
4. The module needs to be baked in the following cases:
   • The packaging bag is damaged before unpacking.
   • There is no humidity indicator card (HIC) in the packaging bag.
   • After unpacking, circles of 10% and above on the HIC become pink.
   • The total exposure time has lasted for over 168 hours since unpacking.
   • More than 12 months have passed since the sealing of the bag.
5. Baking settings:
   • Temperature: 40°C and ≤ 5% RH for reel package and 125°C and ≤5% RH for tray package (please use the heat-resistant tray rather than a plastic container)
   • Time: 168 hours for reel package and 12 hours for tray package
   • Alarm temperature: 50°C for reel package and 135°C for tray package
   • Production-ready temperature after natural cooling: < 36°C
   • Re-baking situation: If a module remains unused for over 168 hours after being baked, it needs to be baked again.
   • If a batch of modules is not baked within 168 hours, do not use the wave soldering to solder them. Because these modules are Level-3 moisture-sensitive devices, they are very likely to get damp when exposed beyond the allowable time. In this case, if they are soldered at high temperatures, it may result in device failure or poor soldering.
6. In the whole production process, take electrostatic discharge (ESD) protective measures.
7. To guarantee the quality of products, you must pay attention to the following items: The amount of soldering flux, the height of the wave peak, whether the tin slag and copper content in the wave soldering tank exceed standards, whether the window and thickness of the wave soldering fixture are appropriate, and whether the wave soldering oven temperature curve is appropriate.

Recommended oven temperature curve and temperature

Set oven temperatures according to the following temperature curve of wave soldering. The peak temperature is 260°C±5°C.

Recommended soldering temperature:

Suggestions on oven temperature curve of wave soldering		Suggestions on manual soldering temperature
Preheat temperature	80 to 130 °C	Soldering temperature	360±20°C
Preheat time	75 to 100s	Soldering time	＜3s/point
Peak contact time	3 to 5s	NA	NA
Temperature of tin cylinder	260±5°C	NA	NA
Ramp-up slope	≤2°C/s	NA	NA
Ramp-down slope	≤6°C/s	NA	NA

Storage conditions

Storage conditions for a delivered module:

• The moisture-proof bag is placed in an environment where the temperature is below 40°C and the relative humidity is lower than 90%.

• The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed.

• There is a humidity indicator card (HIC) in the packaging bag.

  

  

MOQ and packing information

Product model	MOQ (pcs)	Packing method	Number of modules in each reel Pack	Number of reel packs in each box
WBLC9	4400	Carrier tape and reel packing	1100	4

Appendix: Statement

FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this equipment.

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:

(1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and receiver.
• Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help.

Radiation Exposure Statement

This equipment complies with FCC radiation exposure limits set forth for an uncontrolled rolled environment. This equipment should be installed and operated with a minimum distance of 20cm between the radiator and your body.

Important Note

This radio module must not be installed to co-locate and operating simultaneously with other radios in the host system except in accordance with FCC multi-transmitter product procedures. Additional testing and equipment authorization may be required to operate simultaneously with other radios.

The availability of some specific channels and/or operational frequency bands are country dependent and are firmware programmed at the factory to match the intended destination. The firmware setting is not accessible by the end-user.

The host product manufacturer is responsible for compliance with any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.

The end-user manual shall include all required regulatory information/warning as shown in this manual, including: This product must be installed and operated with a minimum distance of 20 cm between the radiator and user body.

The RF module is considered as a limited modular transmitter according to FCC rules. Even though the RF module gets an FCC ID, the host product manufacturer can not use the FCC ID on the final product directly. In these circumstances, the host product manufacturer integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining the FCC authorization by a Class II permissive change application or a new application.

Declaration of Conformity European Notice

Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module product is in compliance with essential requirements and other relevant provisions of Directive 2014/53/EU,2011/65/EU. A copy of the Declaration of conformity can be found at https://www.tuya.com

This product must not be disposed of as normal household waste, in accordance with the EU directive for waste electrical and electronic equipment (WEEE- 2012/19/EU). Instead, it should be disposed of by returning it to the point of sale, or to a municipal recycling collection point.

The device could be used with a separation distance of 20cm to the human body.