GB600 Module Datasheet

GB600 is a Global Navigation Satellite System (GNSS) module developed by Tuya. It applies to in-vehicle navigation, outdoor positioning, surveying, and mapping products.

Overview

As a single-chip L1 band GNSS module, GB600 consists of a highly integrated, multi-system, low-power, high-performance SoC chip Beken-BK1661, and its peripheral circuits. This module features built-in components such as a surface acoustic wave (SAW) filter, low noise amplifier (LNA), and 26 MHz temperature compensated crystal oscillator (TCXO). It supports multi-mode joint positioning (GPS L1, Beidou B1, Galileo E1, QZSS L1, and GLONASS G1) or single-system independent positioning, thus ensuring fast and accurate positioning results, and providing users with an efficient and convenient positioning experience.

The GB600 module is compact, uses SMT pads, and supports standard pick-and-place and reflow soldering with full automatic integration. It is especially suitable for low-cost, low-power applications.

Features

• Positioning engine:
  • 120 simultaneous tracking channels
  • Hot start time: < 1.0 second
  • Cold start sensitivity: -148 dBm
  • Hot start sensitivity: -159 dBm
  • Re-capture sensitivity: -159 dBm
  • Tracking sensitivity: -165 dBm
  • Data update rate: up to 20 Hz
• Support GPS, BDS, Galileo, QZSS, and GLONASS
  • RF subsystem adopts a broadband design, and the input signal is centered at about 1575 MHz
  • Receive and track GPS’s 1575.42 MHz L1 C/A signal
  • Receive and track the BDS satellite navigation system’s 1561.098 MHz B1C/B1I signal
  • Receive and track Galileo’s 1575.42 MHz E1 signal
  • Receive and track GLONASS’s 1575.42 MHz G1 signal
  • Receive and track QZSS’s 1575.42 MHz L1 signal
  • GB600 is configured to receive joint positioning signals from five systems by default and can be customized as GPS+BDS, GPS+GLONASS, or a single GNSS system. You can file a service ticket to request the required GNSS firmware.
• Operating voltage range: 2.4V to 3.6V, with the typical voltage of 3.3V
• Internal 26 MHz TCXO
• Protocol and port: Comply with the National Marine Electronics Association (NEMA) protocol. Communicate with the host through the UART.
• Operating temperature range: -40°C to +85°C.

Module interfaces

Pin definition

GB600 is a surface-mounted module with 2 rows of 18 LCC pads and a pin spacing of 1.10 mm.

• GB600 dimensions:
  • Width: 9.70 ± 0.35 mm
  • Length: 10.10 ± 0.35 mm
  • Height: 2.20 ± 0.15 mm
• PCB thickness: 0.8 ± 0.1 mm

Pin definition

Pin No.	Symbol	I/O type	Description
1	GND	–	The ground pin.
2	TX0	O	Main UART, data transmission (TX) of the module’s serial port 0, used for NMEA sentence output, corresponding to GPIO 6 on the chip.
3	RX0	I	Main UART, data reception (RX) of the module’s serial port 0, used for PMTK/PQ command input and firmware update, corresponding to GPIO 7 on the chip.
4	1PPS	O	Pulse per second.
5	TX1	O	Data TX of the module’s serial port 1, corresponding to GPIO 2 on the chip.
6	VB	PI	The backup power input for the module, ranging from 2.4V to 3.6V, with a typical value of 3.3V.
7	RX1	I	Data RX of the module’s serial port 1, corresponding to GPIO 3 on the chip.
8	VCC	PI	The main power input for the module, ranging from 2.4V to 3.6V, with a typical value of 3.3V. The main power ripple should be less than 50 mVpp, and there should be at least one decoupling capacitor of 2.2 μF or more close to the pin.
9	RST	I	Reset pin. Active low.
10	GND	–	The ground pin.
11	RF	I	GNSS signal input pin (BDS B1, GPS L1, Galileo E1, QZSS L1, and GLONASS G1)
12	GND	–	The ground pin.
13	NC	–	Not connected.
14	VRF	PO	Active antenna feeding output, ranging from 1.7V to 3.1V. The default value is 2.8V.
15	NC	–	Not connected.
16	SDA	I/O	I2C_SDA, corresponding to GPIO 9 on the chip. When I2C is used, a pull-up resistor of about 5 KΩ is required to pull up the SDA.
17	SCL	I/O	I2C_SCL, corresponding to GPIO 8 on the chip. When I2C is used, a pull-up resistor of about 5 KΩ is required to pull up the SCL.
18	NC	–	Not connected.

Electrical parameters

Absolute electrical parameters

Parameter	Description	Min value	Max value	Unit
Ts	Storage temperature	-40	150	°C
VCC	Supply voltage	-0.3	3.6	V
Electrostatic discharge voltage (human body model)	TAMB -25°C	–	TBD	kV
Electrostatic discharge voltage (machine model)	TAMB -25°C	–	TBD	kV

Normal operating conditions

Parameter	Description	Min value	Typical value	Max value	Unit
Ta	Operating temperature	-40	25	85	°C
VCC	Supply voltage	2.4	3.3	3.6	V
V_BCKP	Backup voltage	2.4	3.3	3.6	V

Power consumption in working mode

Working mode	Parameter	Average value	Peak (Typical) value	Unit
Capture	VCC_IN current	20.5	24.5	mA
Tracking	VCC_IN current	21.5	26.3	mA

Key specifications

Parameter	Conditions	Metrics	Unit
CN0 calibration	Signal strength of the simulator: -130 dBm (AVG)	40 ± 2	dBc
Time to first fix (TTFF) in static mode and under open sky conditions	Cold start, hot start, and recapture	28/1.0/2	Second
Sensitivity	Capture and tracking	-159/-165	dBm
Positioning accuracy	CEP50 in static mode and under open sky conditions	1.5	Meter
Antenna	Antenna provided by the third party with the characteristic impedance of 50Ω	–	–

Antenna information

The GB600 module receives signals from the GPS L1 band (1575.42 MHz) and BDS B1 band (1561 MHZ) by default. The RF signal is input through the RF pin, and the characteristic impedance of the RF port must be controlled at 50Ω, with the trace kept as short as possible.

Antenna parameters recommendation

The GB600 module can receive satellite signals by connecting a dedicated active or passive antenna. The antenna performance has a crucial impact on the receiving sensitivity of the entire GNSS system. The following table shows the recommended antenna specifications.

Passive antenna parameter	Specification	Remarks
Dimensions	25 mm × 25 mm × 4 mm	–
RX frequency range	1561 to 1575 MHz	Center frequency: 1561 ± 3 MHz, 1575 ± 3MHz
Characteristic impedance	50Ω	–
Bandwidth	15 MHz minimum	Return loss ≤ -10 dB
Frequency temperature coefficient	0 ± 10 ppm/°C	-40°C to 85°C
Polarization	RHCP	Right-handed circular polarization (RHCP)
Gain	1.5 dBi typical	–
Axial ratio	5 dB maximum	–
VSWR	1.5 maximum	–

Active antenna parameter	Specification	Remarks
RX frequency range	GPS L1 band: 1575.42 ± 1.023 MHz BDS B1 band: 1561 ± 2.046 MHz	–
Bandwidth	20 MHz minimum	Return loss ≤ -10 dB
VSWR	2.0 maximum	–
Polarization	RHCP	–
Characteristic impedance	50Ω	–
Noise figure	1.5 maximum	–
Gain (ceramic antenna)	5 dBic	On a 70 mm × 70 mm motherboard
Gain (internal LNA)	28 ± 3 dB	–
Current consumption	9 ± 3 mA	The power supply is 3.3V

Passive antenna reference design

The preceding figure shows the circuit for connecting a standard passive antenna to the module. R1, C1, and C2 are reserved for impedance matching of the antenna. C1 and C2 are not connected by default, and the default resistance value of R1 is 0R. The impedance of the RF signal cable must be within 50Ω, and the trace needs to be as short as possible.

Active antenna reference design

The following figure shows the circuit for connecting a standard active antenna to the module. C1 is a DC-blocking capacitor. R1, C1, and C2 are reserved for impedance matching of the antenna. C1 and C2 are not connected by default, and the default resistance value of R1 is 0R. During PCB layout, L1, C4, and C5 must be placed close to the antenna interface, and the near end of the L1 pad should be connected to the RF trace.

Packing and production instructions

Mechanical dimensions

The following figure shows the mechanical dimensions of the GB600 module (unit: mm):

Bottom view and recommended footprint

The following figure shows the mechanical dimensions of the GB600 module in a bottom view (unit: mm):

The following figure shows the recommended footprint (unit: mm):

Production instructions

• Package the module with the SMT if Tuya’s module is designed to be SMT-packaged. After being unpacked, the module must be soldered within 24 hours. Otherwise, it needs to be put into a drying cupboard with a relative humidity level no greater than 10%, or packaged in vacuum again. Then, record the packing time and duration of exposure. The total exposure time cannot exceed 168 hours.

  • Instruments or devices required for the SMT process:
    • Surface mount system
    • SPI
    • Reflow soldering machine
    • Thermal profiler
    • Automated optical inspection (AOI) device
  • Instruments or devices required for the baking process:
    • Cabinet oven
    • Electrostatic discharge (ESD) protection and heat-resistant trays
    • ESD protection and heat-resistant gloves

• A delivered module must meet the following storage requirements:

  • The moisture-proof bag must be placed in an environment where the temperature is below 40°C and the relative humidity is lower than 90%.

  • The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed.

  • A humidity indicator card (HIC) is put in the sealed package.

    

• The module needs to be baked in the following cases:

  • The vacuum packaging bag is damaged before unpacking.
  • After unpacking, no HIC is found in the packaging bag.
  • After unpacking, the HIC indicates a humidity level of 10% or higher. In this case, the circle turns pink on the HIC.
  • The total exposure time has lasted for over 168 hours since unpacking.
  • More than 12 months have passed since the first sealing of the bag.

• The baking parameter settings are described below:

  • Baking temperature: 40°C for reel packaging with relative humidity ≤ 5%. And 125°C for tray packaging with relative humidity ≤ 5% (use a heat-resistant tray, rather than a plastic container).
  • Baking time: 168 hours for reel packaging and 12 hours for tray packaging.
  • Temperature for triggering an alert: 50°C for reel packaging and 135°C for tray packaging.
  • Production can begin after a module has cooled down to below 36°C under natural conditions.
  • If a module remains unused for over 168 hours after being baked, it needs to be baked again.
  • If a batch of modules is not baked after exposure for more than 168 hours, do not use wave soldering to solder them. Because these modules are level-3 moisture-sensitive devices, they are very likely to get damp when exposed beyond the allowable time. In this case, if they are soldered at high temperatures, device failure or poor soldering performance might occur.

• In the whole production process, take electrostatic discharge (ESD) protective measures.

• To guarantee the pass rate, we recommend that you use the SPI and AOI to monitor the quality of solder paste printing and mounting.

Recommended oven temperature curve

Set the temperature according to the following temperature curve of reflow soldering. The peak temperature is 245°C.

• A: temperature axis
• B: time axis
• C: alloy liquidus temperature from 217°C to 220°C
• D: ramp-up slope from 1°C/s to 3°C/s
• E: keep a constant temperature from 150°C to 200°C for a time period from 60s to 120s
• F: keep a temperature above liquidus temperature for 50s to 70s
• G: peak temperature from 235°C to 245°C
• H: ramp-down slope from 1°C/s to 4°C/s

Storage conditions

MOQ and packaging information

Product model	MOQ (pcs)	Shipping packaging	Modules per reel	Reels per carton
GB600	4,800	Tape and reel	1,200	4