Last Updated on : 2022-08-03 09:26:59download
GUC300 is a GNSS positioning module that Tuya has developed. It is applicable to car navigation, outdoor positioning, and survey and mapping products.
GUC300 is constituted of a highly integrated GNSS chip UFirebird-UC6226NIS and peripheral circuits. It is built-in with a SAW filter, an LNA, 26 MHz TCXO, and other components, so as to ensure fast and precise location.
Besides, it supports GPS and BeiDou dual-system navigation, thereby offering customers an efficient and convenient positioning experience.
GUC300 has 2 rows of pins with a 0.3 mm pin spacing. A row has 12 pins.
The dimensions of GUC300:
The thickness of PCB: 0.8±0.1 mm
|Pin number||Symbol||Signal type||Description|
|1||NC||–||Pulled up and not connected|
|2||NC||–||Pulled up and not connected|
|3||1PPS||O||PPS stands for Pulse Per Second|
|4||NC||–||Pulled up and not connected|
|5||NC||–||Pulled up and not connected|
|6||NC||–||Pulled up and not connected|
|7||NC||–||Pulled up and not connected|
|8||RESET_N||I||Reset pin, active low|
|9||VCC_RF||PO||RF power output, which can supply power for the external active antenna. If not used, it shall be pulled up.|
|11||RF||I||RF signal input pin, which is connected to an external antenna|
|14||NC||–||Pulled up and not connected|
|15||NC||–||Pulled up and not connected|
|16||TXD1||O||Standby serial interface, which is used for transmitting data|
|17||RXD1||I||Standby serial interface, which is used for receiving data|
|18||NC||–||Pulled up and not connected|
|19||NC||–||Pulled up and not connected|
|20||T0||O||Serial interface for data transmission, which is used to output NMEA sentences|
|21||R0||I||Serial interface for data reception, which is used to input PMTK/PQ commands and upgrade the firmware|
|22||VB||PI||Input of stand-by electric source|
|23||V||PI||Main power input|
Note: P indicates a power supply pin and I/O indicates an input/output pin. “*” indicates that the function is not supported currently.
|Parameter||Description||Minimum value||Maximum value||Unit|
|V||Power supply voltage||-0.2||3.6||V|
|Static electricity discharge voltage (human body model)||TAMB-25℃||–||TBD||KV|
|Static electricity discharge voltage (machine model)||TAMB-25℃||–||TBD||KV|
|Parameter||Description||Minimum value||Typical value||Maximum value||Unit|
|V||Power supply voltage||2.8||3.3||3.6||V|
|Working mode||Project type||Average value||Peak value (typical value)||Unit|
Note: When a power consumption test is conducted, the test voltage
VDCDC_INis 3.3V and the latest firmware version R18.104.22.168 Build 7099 is adopted.
|CN0 test value||The signal strength of the stimulator: -130 dBm (AVG)||40±2||dBc|
|TTFF (the module is static in the open environment)||Cold boot/hot start/recapture||30/1.2/2||s|
|Sensitivity test||Capture sensitivity/tracking sensitivity||-145/-158||dBm|
|Positioning precision||Remain static in the open environment CEP50||2.5||m|
|Antenna type||Antenna provided by the third party with the characteristic impedance of 50Ω||–||–|
The module does not have its own onboard PCB antenna, which needs to be provided by a third party.
The antenna can be an external rod antenna, a passive ceramic antenna, an active antenna, a spiral antenna, etc. The antenna forms include monopole antenna, dielectric antenna, IFA antenna, and the like.
Top and side view of GUC300 (unit: mm)
Note: The default outline dimension tolerance is ±0.35 mm, and the critical dimension tolerance is ±0.1 mm. If you have specific requirements on dimensions, make them clear in the module datasheet after communication.
Bottom view of GUC300 (unit: mm)
Recommended package (unit: mm)
The Tuya SMT module should be mounted by the SMT device. After being unpacked, it should be soldered within 24 hours. Otherwise, it should be put into the drying cupboard where the RH is not greater than 10%; or it needs to be packaged under vacuum again and the exposure time needs to be recorded (the total exposure time cannot exceed 168 hours).
Storage conditions for a delivered module:
The moisture-proof bag must be placed in an environment where the temperature is below 40°C and the relative humidity is lower than 90%.
The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed.
There is a humidity indicator card (HIC) in the packaging bag.
The module needs to be baked in the following cases:
In the whole production process, take electrostatic discharge (ESD) protective measures.
To guarantee the passing rate, it is recommended that you use the SPI and AOI to monitor the quality of solder paste printing and mounting.
Set oven temperatures according to the following temperature curve of reflow soldering. The peak temperature is 245°C.
A: Temperature axis
B: Time axis
C: Liquidus temperature: 217 to 220°C
D: Ramp-up slope: 1 to 3°C/s
E: Duration of constant temperature: 60 to 120s; the range of constant temperature: 150 to 200°C
F: Duration above the liquidus: 50 to 70s
G: Peak temperature: 235 to 245°C
H: Ramp-down slope: 1 to 4°C/s
Note: The above curve is just an example of the solder paste SAC305. For more details about other solder pastes, please refer to Recommended oven temperature curve in the solder paste specifications.
|Product number||MOQ (pcs)||Shipping packaging method||The number of modules per reel||The number of reels per carton|
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