Last Updated on : 2023-01-10 07:12:11download
TYZS13 is a low power-consumption embedded Zigbee module developed by Tuya. It consists of a highly integrated wireless RF processor chip (EFR32MG13P732F512GM48) and several peripherals. TYZS13 is embedded with a low power-consumption 32-bit ARM Cortex-M4 core, 512-KB flash memory, 64-KB RAM, and rich peripheral resources.
TYZS13 is a silicon module that can develop Zigbee applications. In terms of hardware, it has PA and DC-DC. In terms of software, it can provide complete basic APIs for Zigbee. Based on this, users can develop embedded Zigbee products as required.
|Update time||Updated content||Version after update|
|December 2, 2018||First release||V1.0.0|
|July 23, 2019||Update the power consumption and added storage conditions||V2.0.0|
|August 16, 2019||Updated the range of supply voltage||V2.0.1|
|September 5, 2019||Update pictures about the module dimensions||V2.0.2|
|December 21, 2019||Updated the module dimensions||V2.0.3|
|May 11, 2020||Updated the MOQ and others||V2.0.4|
|March 4, 2021||Updated the production instructions||V2.1.0|
|Dec 8, 2022||Updated the antenna information||V2.1.1|
TYZS13 has three lines of pins with a spacing of 1.27 mm.
Dimensions of TYZS13 are as follows: 15±0.35 mm (W) x 18±0.35 mm (L) x 2±0.15 mm (H).
The following figure shows the dimensions of TYZS13.
The following table describes the interface pins.
|1||GND||P||Module reference ground pin|
|2||PD13||I/O||GPIO, corresponding to the PD13 pin (pin 22) of the IC|
|3||PD12||I/O||GPIO, corresponding to the PD12 pin (pin 21) of the IC|
|4||PD11||I/O||GPIO, corresponding to the PD11 pin (pin 20) of the IC|
|5||GPIO0||I/O||GPIO, corresponding to the PA3 pin (pin 28) of the IC|
|6||GPIO2||I/O||GPIO, corresponding to the PA5 pin (pin 30) of the IC|
|7||GPIO3||I/O||GPIO, corresponding to the PD15 pin (pin 2) of the IC|
|8||PC11||I/O||GPIO, corresponding to the PC11 pin (pin 48) of the IC|
|9||PC10||I/O||GPIO, corresponding to the PC10 pin (pin 47) of the IC|
|10||PB12||I/O||GPIO, corresponding to the PB12 pin (pin 32) of the IC|
|11||PF6||I/O||GPIO, corresponding to the PF6 pin (pin 7) of the IC|
|12||ADC||AI||Interface 1 of the ADC (a 12-bit precision SAR analog-to-digital converter), corresponding to the PB11 pin of the IC|
|13||PB15||I/O||GPIO, corresponding to the PB15 pin (pin 36) of the IC|
|14||PB13||I/O||GPIO, corresponding to the PB13 pin (pin 33) of the IC|
|15||nRST||I||Hardware reset pin, and the chip is reset when the level is low. TYZS13 has a power-on reset function, and this pin may be unnecessary in the actual situation.|
|18||SWCL K||I/O||JLINK SWCLK programming pin, which can also be used as a GPIO in common programs|
|19||SWDI O||I/O||JLINK SWDIO programming pin, which can also be used as a GPIO in common programs|
|20||PF3||I/O||GPIO, corresponding to the PF3 pin (pin 4) of the IC|
|21||PC7||I/O||GPIO, corresponding to the PC7 pin (pin 44) of the IC|
|22||PC8||I/O||GPIO, corresponding to the PC8 pin (pin 45) of the IC|
|23||PC9||I/O||GPIO, corresponding to the PC9 pin (pin 46) of the IC|
|24||SWO||I/O||Used as a GPIO or an output pin in the JLINK communication state; corresponding to the PF2 pin of the IC when being used as a GPIO|
|25||PWM3||I/O||GPIO, corresponding to the PF4 pin of the IC; light drive PWM interface|
|26||PWM2||I/O||GPIO, corresponding to the PA2 pin of the IC; light drive PWM interface|
|27||PWM1||I/O||GPIO, corresponding to the PA2 pin of the IC; light drive PWM interface|
|28||GND||P||Module reference ground pin|
|29||3.3 V||P||Power-supply pin of TYZS13 (typical power supply voltage: 3.3 V)|
|30||3.3 V||P||Power-supply pin of TYZS13 (typical power supply voltage: 3.3 V)|
- P indicates power-supply pins, I/O indicates input/output pins, and AI indicates analog input pins.
- The nRST is a module hardware reset pin, which cannot be used to clear the Zigbee network configuration.
- nRST can be used only as an ADC port and not a common I/O port. When not being used, nRST must be disconnected.
- When nRST is used as an ADC input port, the input voltage range is 0 V to the AVdd which is configurable using the software.
When TYZS13 is used as a gateway module, the pins are connected as follows:
|Pin name printed on the module||Corresponding gateway pin||Pin of the internal IC||Remarks|
|PWM3||UART_CTS||PF4||The coordinator used for the gateway must be connected to hardware flow control by default. The baud rate is 115200. The pin is connected to UART_RTS of the MCU.|
|PWM2||UART_RTS||PA2||The coordinator used for the gateway must be connected to hardware flow control by default. The baud rate is 115200. The pin is connected to UART_CTS of the MCU.|
|UART_RX||UART_RX||PA1||The pin is connected to UART_TX of the MCU.|
|UART_TX||UART_TX||PA0||The pin is connected to UART_RX of the MCU.|
|nRST||nRST||RST||The pin is connected to the GPIO of the MCU, and the GPIO is at high level by default.|
|ADC||REQUEST||PB11||The pin is connected to STATE of the MCU, and the PTA pin needs to be connected to a 1.5-K pull-down resistor.|
|GPIO0||GRANT||PA3||The pin is connected to ACT of the MCU, and the PTA pin needs to be connected to a 1.5-K pull-down resistor.|
|SWO||PRIORITY||PF2||The pin is connected to PRI of the MCU, and the PTA pin needs to be connected to a 1.5-K pull-down resistor.|
TYZS13 has no special test points exposed outside.
The following table describes the absolute electrical characteristics.
|Parameter||Description||Minimum value||Maximum value||Unit|
|ESD voltage (human body model)||Tamb –25°C||N/A||2.5||kV|
|ESD voltage (machine model)||Tamb –25°C||N/A||0.5||kV|
The following table describes the normal electrical conditions.
|Parameter||Description||Minimum value||Typical value||Maximum value||Unit|
|VIL||Voltage input low||–0.3||N/A||VCC x 0.25||V|
|VIH||Voltage input highl input||VCC x 0.75||N/A||VCC||V|
|VOL||Voltage output low||N/A||N/A||VCC x 0.1||V|
|VOH||Voltage output high||VCC x 0.8||N/A||VCC||V|
The following table describes the TX power consumption during constant emission.
|Symbol||Rate||TX power||Typical value||Unit|
|IRF||250 kbit/s||+19 dBm||120||mA|
|IRF||250 kbit/s||+13 dBm||50||mA|
|IRF||250 kbit/s||+10 dBm||32||mA|
|IRF||250 kbit/s||+4 dBm||17||mA|
|IRF||250 kbit/s||+1 dBm||11.8||mA|
Note: When the preceding data is being tested, the duty cycle is set to 100%.
The following table describes the RX power consumption during constant receiving.
|Note: When the UART is in the active state, the received current is 14 mA.|
The following table describes the TYZS13 operating current.
|Working mode||Working status (Ta = 25°C)||Average value||Maximum value||Unit|
|EZ mode||The module is in the EZ state.||10||40||mA|
|Operation mode||The module is connected to the network.||1||23||mA|
|Deep sleep mode||The module is in deep sleep mode, with 64 KB RAM.||3.5||5||μA|
The following table describes the basic RF features.
|Frequency band||2.400 GHz to 2.484 GHz|
|Physical-layer standard||IEEE 802.15.4|
|Data transmitting rate||250 kbit/s|
|Antenna type||Cooper antenna/External antenna used with the I-PEX connector|
|Line-of-sight transmission distance||> 120 m|
The following table describes the TX continuous transmission performance.
|Parameter||Minimum value||Typical value||Maximum value||Unit|
|Maximum output power||N/A||+19||N/A||dBm|
|Minimum output power||N/A||–30||N/A||dBm|
|Output power adjustment step||N/A||0.5||1||dB|
|Output spectrum adjacent-channel rejection ratio||–31||dBc|
Note: The maximum output power can reach +19 dBm. The power output can be adjusted under normal use. The high-power output can be used for overlay transmission in extremely complex conditions, such as modules embedded in a wall.
The following table describes the RX sensitivity.
|Parameter||Minimum value||Typical value||Maximum value||Unit|
|PER < 10%, RX sensitivity, 250 kbit/s (OQPSK)||-||–101||-||dBm|
By default, the copper column antenna is used. In addition, external antennas can be connected through I-PEX connectors, which are applied to extend the coverage in complex installation environments.
Customers can choose the FPC antenna in the existing library: 1.17.01.00219.
The dimension of IPEX:
When you use a copper column antenna on a Zigbee module, ensure that the antenna on the module is at least 15 mm away from other metal parts for optimal wireless performance. It is recommended that the antenna location on the PCB be hollowed out.
To prevent a negative impact on antenna radiation performance, do not route copper or cable wires along the antenna area of the user PCB board.
The moisture-proof bag must be placed in an environment where the temperature is below 40°C and the relative humidity is lower than 90%.
The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed.
There is a humidity indicator card (HIC) in the packaging bag.
Set oven temperatures according to the following temperature curve of reflow soldering. The peak temperature is 245°C.
A: Temperature axis
B: Time axis
C: Liquidus temperature: 217 to 220°C
D: Ramp-up slope: 1 to 3°C/s
E: Duration of constant temperature: 60 to 120s; the range of constant temperature: 150 to 200°C
F: Duration above the liquidus: 50 to 70s
G: Peak temperature: 235 to 245°C
H: Ramp-down slope: 1 to 4°C/s
Note: The above curve is just an example of the solder paste SAC305. For more details about other solder pastes, please refer to Recommended oven temperature curve in the solder paste specifications.
|Product module||MOQ (pcs)||Packing method||Modules per reel||Reels per carton|
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