TYZS13 Module Datasheet

TYZS13 is a low power-consumption embedded Zigbee module developed by Tuya. It consists of a highly integrated wireless RF processor chip (EFR32MG13P732F512GM48) and several peripherals. TYZS13 is embedded with a low power-consumption 32-bit ARM Cortex-M4 core, 512-KB flash memory, 64-KB RAM, and rich peripheral resources.

Overview

TYZS13 is a silicon module that can develop Zigbee applications. In terms of hardware, it has PA and DC-DC. In terms of software, it can provide complete basic APIs for Zigbee. Based on this, users can develop embedded Zigbee products as required.

Features

• Built-in low power-consuming 32-bit ARM Cortex-M4 core with DSP instructions and floating-point unit, which can function as an application processor
• Clock rate: 40 MHz
• Wide operating voltage range: 1.8 V to 3.8 V
• Peripherals: 22 GPIOs, 1 UART, 1 ADC, and 1 nRST
• Zigbee features
  • Working channel: channels 11 to 26 on 2.400 GHz to 2.483 GHz, with an air interface rate of 250 kbit/s
  • Built-in DC-DC circuit, maximizing the power supply efficiency
  • Maximum output power: +19 dBm
  • Power consumption during operating: 63 μA/MHz; current in sleep mode: 3.5 μA
  • Cooper antenna/External high-gain antenna used with the I-PEX connector
  • Operating temperature: –40℃ to +85℃
  • AES 128/256-based hardware encryption

Applications

• Smart building
• Smart home and household applications
• Smart socket
• Smart lighting
• Industrial wireless control
• Health care and measurement

Change history

Update time	Updated content	Version after update
December 2, 2018	First release	V1.0.0
July 23, 2019	Update the power consumption and added storage conditions	V2.0.0
August 16, 2019	Updated the range of supply voltage	V2.0.1
September 5, 2019	Update pictures about the module dimensions	V2.0.2
December 21, 2019	Updated the module dimensions	V2.0.3
May 11, 2020	Updated the MOQ and others	V2.0.4
March 4, 2021	Updated the production instructions	V2.1.0
Dec 8, 2022	Updated the antenna information	V2.1.1

Module interfaces

Dimensions and footprint

TYZS13 has three lines of pins with a spacing of 1.27 mm.

Dimensions of TYZS13 are as follows: 15±0.35 mm (W) x 18±0.35 mm (L) x 2±0.15 mm (H).

The following figure shows the dimensions of TYZS13.

Pin definition

The following table describes the interface pins.

Pin No.	Symbol	Type	Functions
1	GND	P	Module reference ground pin
2	PD13	I/O	GPIO, corresponding to the PD13 pin (pin 22) of the IC
3	PD12	I/O	GPIO, corresponding to the PD12 pin (pin 21) of the IC
4	PD11	I/O	GPIO, corresponding to the PD11 pin (pin 20) of the IC
5	GPIO0	I/O	GPIO, corresponding to the PA3 pin (pin 28) of the IC
6	GPIO2	I/O	GPIO, corresponding to the PA5 pin (pin 30) of the IC
7	GPIO3	I/O	GPIO, corresponding to the PD15 pin (pin 2) of the IC
8	PC11	I/O	GPIO, corresponding to the PC11 pin (pin 48) of the IC
9	PC10	I/O	GPIO, corresponding to the PC10 pin (pin 47) of the IC
10	PB12	I/O	GPIO, corresponding to the PB12 pin (pin 32) of the IC
11	PF6	I/O	GPIO, corresponding to the PF6 pin (pin 7) of the IC
12	ADC	AI	Interface 1 of the ADC (a 12-bit precision SAR analog-to-digital converter), corresponding to the PB11 pin of the IC
13	PB15	I/O	GPIO, corresponding to the PB15 pin (pin 36) of the IC
14	PB13	I/O	GPIO, corresponding to the PB13 pin (pin 33) of the IC
15	nRST	I	Hardware reset pin, and the chip is reset when the level is low. TYZS13 has a power-on reset function, and this pin may be unnecessary in the actual situation.
16	TXD	O	UART0_TXD
17	RXD	I	UART0_RXD
18	SWCL K	I/O	JLINK SWCLK programming pin, which can also be used as a GPIO in common programs
19	SWDI O	I/O	JLINK SWDIO programming pin, which can also be used as a GPIO in common programs
20	PF3	I/O	GPIO, corresponding to the PF3 pin (pin 4) of the IC
21	PC7	I/O	GPIO, corresponding to the PC7 pin (pin 44) of the IC
22	PC8	I/O	GPIO, corresponding to the PC8 pin (pin 45) of the IC
23	PC9	I/O	GPIO, corresponding to the PC9 pin (pin 46) of the IC
24	SWO	I/O	Used as a GPIO or an output pin in the JLINK communication state; corresponding to the PF2 pin of the IC when being used as a GPIO
25	PWM3	I/O	GPIO, corresponding to the PF4 pin of the IC; light drive PWM interface
26	PWM2	I/O	GPIO, corresponding to the PA2 pin of the IC; light drive PWM interface
27	PWM1	I/O	GPIO, corresponding to the PA2 pin of the IC; light drive PWM interface
28	GND	P	Module reference ground pin
29	3.3 V	P	Power-supply pin of TYZS13 (typical power supply voltage: 3.3 V)
30	3.3 V	P	Power-supply pin of TYZS13 (typical power supply voltage: 3.3 V)

Note:

• P indicates power-supply pins, I/O indicates input/output pins, and AI indicates analog input pins.
• The nRST is a module hardware reset pin, which cannot be used to clear the Zigbee network configuration.
• nRST can be used only as an ADC port and not a common I/O port. When not being used, nRST must be disconnected.
• When nRST is used as an ADC input port, the input voltage range is 0 V to the AVdd which is configurable using the software.

When TYZS13 is used as a gateway module, the pins are connected as follows:

Pin name printed on the module	Corresponding gateway pin	Pin of the internal IC	Remarks
PWM3	UART_CTS	PF4	The coordinator used for the gateway must be connected to hardware flow control by default. The baud rate is 115200. The pin is connected to UART_RTS of the MCU.
PWM2	UART_RTS	PA2	The coordinator used for the gateway must be connected to hardware flow control by default. The baud rate is 115200. The pin is connected to UART_CTS of the MCU.
UART_RX	UART_RX	PA1	The pin is connected to UART_TX of the MCU.
UART_TX	UART_TX	PA0	The pin is connected to UART_RX of the MCU.
nRST	nRST	RST	The pin is connected to the GPIO of the MCU, and the GPIO is at high level by default.
ADC	REQUEST	PB11	The pin is connected to STATE of the MCU, and the PTA pin needs to be connected to a 1.5-K pull-down resistor.
GPIO0	GRANT	PA3	The pin is connected to ACT of the MCU, and the PTA pin needs to be connected to a 1.5-K pull-down resistor.
SWO	PRIORITY	PF2	The pin is connected to PRI of the MCU, and the PTA pin needs to be connected to a 1.5-K pull-down resistor.

Definitions of test pins

TYZS13 has no special test points exposed outside.

Electrical characteristics

Absolute electrical characteristics

The following table describes the absolute electrical characteristics.

Parameter	Description	Minimum value	Maximum value	Unit
Ts	Storage temperature	–50	+150	°C
VCC	Supply voltage	–0.3	3.8	V
ESD voltage (human body model)	Tamb –25°C	N/A	2.5	kV
ESD voltage (machine model)	Tamb –25°C	N/A	0.5	kV

Electrical conditions

The following table describes the normal electrical conditions.

Parameter	Description	Minimum value	Typical value	Maximum value	Unit
Ta	Operating temperature	–40	N/A	+85	°C
VCC	Operating voltage	1.8	3.3	3.8	V
VIL	Voltage input low	–0.3	N/A	VCC x 0.25	V
VIH	Voltage input highl input	VCC x 0.75	N/A	VCC	V
VOL	Voltage output low	N/A	N/A	VCC x 0.1	V
VOH	Voltage output high	VCC x 0.8	N/A	VCC	V
Imax	Drive current	N/A	N/A	12	mA

Zigbee TX power consumption

The following table describes the TX power consumption during constant emission.

Symbol	Rate	TX power	Typical value	Unit
IRF	250 kbit/s	+19 dBm	120	mA
IRF	250 kbit/s	+13 dBm	50	mA
IRF	250 kbit/s	+10 dBm	32	mA
IRF	250 kbit/s	+4 dBm	17	mA
IRF	250 kbit/s	+1 dBm	11.8	mA

Note: When the preceding data is being tested, the duty cycle is set to 100%.

Zigbee RX power consumption

The following table describes the RX power consumption during constant receiving.

Symbol	Rate	Typical value	Unit
IRF	250 kbit/s	8	mA
Note: When the UART is in the active state, the received current is 14 mA.

Power consumption in operating mode

The following table describes the TYZS13 operating current.

Working mode	Working status (Ta = 25°C)	Average value	Maximum value	Unit
EZ mode	The module is in the EZ state.	10	40	mA
Operation mode	The module is connected to the network.	1	23	mA
Deep sleep mode	The module is in deep sleep mode, with 64 KB RAM.	3.5	5	μA

RF features

Basic RF features

The following table describes the basic RF features.

Parameter	Description
Frequency band	2.400 GHz to 2.484 GHz
Physical-layer standard	IEEE 802.15.4
Data transmitting rate	250 kbit/s
Antenna type	Cooper antenna/External antenna used with the I-PEX connector
Line-of-sight transmission distance	> 120 m

Zigbee output performance

The following table describes the TX continuous transmission performance.

Parameter	Minimum value	Typical value	Maximum value	Unit
Maximum output power	N/A	+19	N/A	dBm
Minimum output power	N/A	–30	N/A	dBm
Output power adjustment step	N/A	0.5	1	dB
Frequency error	–15	N/A	+15	ppm
Output spectrum adjacent-channel rejection ratio		–31		dBc

Note: The maximum output power can reach +19 dBm. The power output can be adjusted under normal use. The high-power output can be used for overlay transmission in extremely complex conditions, such as modules embedded in a wall.

Zigbee RX sensitivity

The following table describes the RX sensitivity.

Parameter	Minimum value	Typical value	Maximum value	Unit
PER < 10%, RX sensitivity, 250 kbit/s (OQPSK)	-	–101	-	dBm

Antenna

Antenna types

By default, the copper column antenna is used. In addition, external antennas can be connected through I-PEX connectors, which are applied to extend the coverage in complex installation environments.
Customers can choose the FPC antenna in the existing library: 1.17.01.00219.

The dimension of IPEX:

Antenna interference reduction

When you use a copper column antenna on a Zigbee module, ensure that the antenna on the module is at least 15 mm away from other metal parts for optimal wireless performance. It is recommended that the antenna location on the PCB be hollowed out.
To prevent a negative impact on antenna radiation performance, do not route copper or cable wires along the antenna area of the user PCB board.

Packaging information and production instructions

Mechanical dimensions

Production instructions

1. The Tuya SMT module should be mounted by the SMT device. After being unpacked, it should be soldered within 24 hours. Otherwise, it should be put into the drying cupboard where the RH is not greater than 10%; or it needs to be packaged under vacuum again and the exposure time needs to be recorded (the total exposure time cannot exceed 168 hours).
   • SMT devices:
     • Mounter
     • SPI
     • Reflow soldering machine
     • Thermal profiler
     • Automated optical inspection (AOI) equipment
   • Baking devices:
     • Cabinet oven
     • Anti-electrostatic and heat-resistant trays
     • Anti-electrostatic and heat-resistant gloves
2. Storage conditions for a delivered module:

   • The moisture-proof bag must be placed in an environment where the temperature is below 40°C and the relative humidity is lower than 90%.

   • The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed.

   • There is a humidity indicator card (HIC) in the packaging bag.

     

3. The module needs to be baked in the following cases:
   • The packaging bag is damaged before unpacking.
   • There is no HIC in the packaging bag.
   • After unpacking, circles of 10% and above on the HIC become pink.
   • The total exposure time has lasted for over 168 hours since unpacking.
   • More than 12 months has passed since the sealing of the bag.
4. Baking settings:
   • Temperature: 60°C and ≤ 5% RH for reel package and 125°C and ≤5% RH for tray package (please use the heat-resistant tray rather than plastic container)
   • Time: 48 hours for reel package and 12 hours for tray package
   • Alarm temperature: 65°C for reel package and 135°C for tray package
   • Production-ready temperature after natural cooling: < 36°C
   • Re-baking situation: If a module remains unused for over 168 hours after being baked, it needs to be baked again.
   • If a batch of modules is not baked within 168 hours, do not use the reflow soldering to solder them. Because these modules are Level-3 moisture-sensitive devices, they are very likely to get damp when exposed beyond the allowable time. In this case, if they are soldered at high temperatures, it may result in device failure or poor soldering.
5. In the whole production process, take electrostatic discharge (ESD) protective measures.
6. To guarantee the passing rate, it is recommended that you use the SPI and AOI to monitor the quality of solder paste printing and mounting.

Recommended oven temperature curve

Set oven temperatures according to the following temperature curve of reflow soldering. The peak temperature is 245°C.

• A: Temperature axis

• B: Time axis

• C: Liquidus temperature: 217 to 220°C

• D: Ramp-up slope: 1 to 3°C/s

• E: Duration of constant temperature: 60 to 120s; the range of constant temperature: 150 to 200°C

• F: Duration above the liquidus: 50 to 70s

• G: Peak temperature: 235 to 245°C

• H: Ramp-down slope: 1 to 4°C/s

  Note: The above curve is just an example of the solder paste SAC305. For more details about other solder pastes, please refer to Recommended oven temperature curve in the solder paste specifications.

Storage conditions

MOQ and packaging information

Product module	MOQ (pcs)	Packing method	Modules per reel	Reels per carton
TYZS13	6400	Tape reel	1600	4