Last Updated on : 2022-07-29 08:50:33download
TYZS3 is a low power-consumption embedded Zigbee module developed by Tuya. It consists of a highly integrated wireless RF processor chip (EFR32MG13P732F512GM48) and several peripherals. TYZS3 is embedded with a low power-consumption 32-bit ARM Cortex-M4 core, 512-KB flash memory, 64-KB RAM, and rich peripheral resources.
TYZS3 is a silicon module that can be used to develop Zigbee applications. In terms of hardware, it has PA and DC-DC. In terms of software, it can provide complete basic APIs for Zigbee. Based on this, users can develop embedded Zigbee products as required.
The schematic diagram of TYZS3 is shown below:
|Change date||changed content||Version after change|
|06/02/2021||Updated information about the dimensional tolerance and MOQ||V2.0.0|
|06/04/2021||Updated diagrams about dimensions||V2.0.1|
|07/29/2022||Updated baking parameters||V2.0.2|
TYZS3 has 2 lines of pins with a 2-mm spacing.
TYZS3 dimensions: 16±0.35mm (W) x 24±0.35mm (L) x 2.6±0.15mm (H). TYZS3’s dimensions are shown in the following figures:
The pins are defined below:
|1||nRST||I||Hardware reset pin, the chip is reset when the pin is LOW; Power-on reset of the module, the user can use this pin as needed.|
|2||ADC||AI||ADC, 12-bit precision SAR analog to digital converter.|
|3||NC||-||NC pin, external handling is not required.|
|4||GPIO0||I/O||GPIO pin usage.|
|5||SWO||I/O||GPIO pin usage/can be used as an output pin under JLINK communication.|
|6||PWM3||I/O||GPIO pin usage.|
|7||PWM1||I/O||GPIO pin usage.|
|8||VCC||P||Module power supply pin (common supply voltage: 3.3V)|
|9||GND||P||The reference ground of the module.|
|10||GPIO2||I/O||GPIO pin usage.|
|11||SWDIO||I/O||JLINK SWDIO programming pin. Can be used as a GPIO pin in normal applications.|
|12||SWCLK||I/O||JLINK SWCLK programming pin. Can be used as a GPIO pin in normal applications.|
|13||PWM2||I/O||GPIO pin usage.|
|14||GPIO3||I/O||GPIO pin usage.|
- P indicates the power pin; I/O indicates the input/output pin; AI indicates the analog input pin.
- nRST is only the module hardware reset pin; it cannot clear Zigbee net-pairing information.
- (1): This pin can only be used as an ADC port. It cannot be used as a normal IO port. If it is not used, it needs to be left floating.
- As an ADC input, the input voltage range is limited to 0-AVDD and can be configured by software.
When TYZS3 is used as a gateway module, the pins are connected as follows:
|Pin name printed on the module||Corresponding pin name when used as gateway module||Pin of the internal IC||Remarks|
|PWM3||UART_CTS||PF4||The coordinator used for the gateway must be connected to hardware flow control by default. The baud rate is 115200. The pin is connected to UART_RTS of the MCU.|
|PWM2||UART_RTS||PA2||The coordinator used for the gateway must be connected to hardware flow control by default. The baud rate is 115200. The pin is connected to UART_CTS of the MCU.|
|UART_RX||UART_RX||PA1||The pin is connected to UART_TX of the MCU.|
|UART_TX||UART_TX||PA0||The pin is connected to UART_RX of the MCU.|
|nRST||nRST||RST||The pin is connected to the GPIO of the MCU, and the GPIO is at high level by default.|
|ADC||REQUEST||PB11||The pin is connected to STATE of the MCU, and the PTA pin needs to be connected to a 1.5K pull-down resistor.|
|GPIO0||GRANT||PA3||The pin is connected to ACT of the MCU, and the PTA pin needs to be connected to a 1.5K pull-down resistor.|
|SWO||PRIORITY||PF2||The pin is connected to PRI of the MCU, and the PTA pin needs to be connected to a 1.5K pull-down resistor.|
The test pins are defined below:
|-||-||I||Used for production tests of the module.|
|Parameters||Description||Minimum value||Maximum value||Unit|
|ESD voltage (human body model)||TAMB-25℃||-||2.5||KV|
|ESD voltage (machine model)||TAMB-25℃||-||0.5||KV|
Normal operating conditions
|Parameters||Description||Minimum value||Typical value||Maximum value||Unit|
|VIL||Voltage input low||-0.3||-||VCC*0.25||V|
|VIH||Voltage input high||VCC*0.75||-||VCC||V|
|VOL||Voltage output low||-||-||VCC*0.1||V|
|VOH||Voltage output high||VCC*0.8||-||VCC||V|
Power consumption during continuous TX
|Symbol||Rate||Transmission power||Typical value||Unit|
Note: When testing the above data, the continuous transmission duty cycle=100%.
Power consumption during continuous RX
Note: When UART is active, the RX current is 14mA.
TYZS3 operating current
|Operation mode||Operating condition, Ta=25℃||Average value||Maximum value（Typical）||Unit|
|Quick configuration||Module in quick configuration state||10||40||mA|
|Network connection state||Connected to a network||1||23||mA|
|Deep sleep mode||Deep-sleep mode and retains 64KB RAM||3.5||5||μA|
Basic RF characteristics
|Operating frequency||2.400 to 2.484GHz|
|Physical layer standard||IEEE 802.15.4|
|Data transfer rate||250Kbps|
|Antenna type||PCB antenna/Ipex connector external antenna|
|Line of sight||>150m|
Continuous TX performance
|Parameter||Minimum value||Typical value||Maximum value||Unit|
|Output power adjustment step||-||0.5||1||dB|
|Output adjacent channel suppression||-31||dBc|
Note: The maximum output power is +19dBm. The power output can be adjusted under normal use. The high-power output can be used for overlay transmissions in extremely complex environments, such as modules embedded in the wall.
|Parameter||Minimum value||Typical value||Maximum value||Unit|
|PER<10%, RX sensitivity, 250Kbps@OQPSK||-||-101||-||dBm|
Default PCB onboard antenna connection. At the same time, an external antenna can be connected via the Ipex connector for extended coverage in complex installation environments.
To optimize the Zigbee performance of the wireless module in combination with the PCB onboard antenna, it is recommended to keep the antenna at least 15mm from other metal parts. It is recommended that the corresponding antenna area of the adapter board be hollowed out for the best effect.
The user PCB board should not be routed around the antenna area and should not be covered with copper to avoid affecting the antenna radiation performance.
For the module PCB onboard antenna area, refer to the following figure of TYZS3 mechanical dimensional.
The Tuya SMT module should be mounted by the SMT device. After being unpacked, it should be soldered within 24 hours. Otherwise, it should be put into the drying cupboard where the RH is not greater than 10%; or it needs to be packaged under vacuum again and the exposure time needs to be recorded (the total exposure time cannot exceed 168 hours).
Storage conditions for a delivered module:
The module needs to be baked in the following cases:
In the whole production process, take electrostatic discharge (ESD) protective measures.
To guarantee the passing rate, it is recommended that you use the SPI and AOI to monitor the quality of solder paste printing and mounting.
Set oven temperatures according to the following temperature curve of reflow soldering. The peak temperature is 245°C.
A: Temperature axis
B: Time axis
C: Liquidus temperature: 217 to 220°C
D: Ramp-up slope: 1 to 3°C/s
E: Duration of constant temperature: 60 to 120s; the range of constant temperature: 150 to 200°C
F: Duration above the liquidus: 50 to 70s
G: Peak temperature: 235 to 245°C
H: Ramp-down slope: 1 to 4°C/s
Note: The above curve is just an example of the solder paste SAC305. For more details about other solder pastes, please refer to Recommended oven temperature curve in the solder paste specifications.
|Product model||MOQ (pcs)||Packing method||The number of modules per reel||The number of reels per carton|
FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this device.
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.
Note: This device has been tested and found to comply with the limits for a Class B digital device, according to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This device generates, uses, and can radiate radio frequency energy and, if not installed and used following the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation.
If this device does cause harmful interference to radio or television reception, which can be determined by turning the device off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
Radiation Exposure Statement
This device complies with FCC radiation exposure limits set forth for an uncontrolled rolled environment. This device should be installed and operated with a minimum distance of 20cm between the radiator and your body.
This radio module must not be installed to co-locate and operating simultaneously with other radios in the host system except following FCC multi-transmitter product procedures. Additional testing and device authorization may be required to operate simultaneously with other radios.
The availability of some specific channels and/or operational frequency bands are country dependent and are firmware programmed at the factory to match the intended destination. The firmware setting is not accessible by the end-user.
The host product manufacturer is responsible for compliance with any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.
The end-user manual shall include all required regulatory information/warnings as shown in this manual, including “This product must be installed and operated with a minimum distance of 20 cm between the radiator and user body”.
This device has got an FCC ID：2ANDL-TYZS3. The final end product must be labeled in a visible area with the following: “Contains Transmitter Module FCC ID: 2ANDL-TYZS3”
This device is intended only for OEM integrators under the following conditions:
The antenna must be installed such that 20cm is maintained between the antenna and users, and 2) The transmitter module may not be co-located with any other transmitter or antenna.
As long as the 2 conditions above are met, further transmitter tests will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed.
Declaration of Conformity European Notice
Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module product is in compliance with essential requirements and other relevant provisions of Directive 2014/53/EU,2011/65/EU. A copy of the Declaration of conformity can be found at https://www.tuya.com.
This product must not be disposed of as normal household waste, in accordance with the EU directive for waste electrical and electronic equipment (WEEE-2012/19/EU). Instead, it should be disposed of by returning it to the point of sale, or to a municipal recycling collection point.
The device could be used with a separation distance of 20cm to the human body.
Is this page helpful?YesFeedback
Is this page helpful?YesFeedback