TYZS3 Module Datasheet

Last Updated on : 2022-07-29 08:50:33download

TYZS3 is a low power-consumption embedded Zigbee module developed by Tuya. It consists of a highly integrated wireless RF processor chip (EFR32MG13P732F512GM48) and several peripherals. TYZS3 is embedded with a low power-consumption 32-bit ARM Cortex-M4 core, 512-KB flash memory, 64-KB RAM, and rich peripheral resources.


TYZS3 is a silicon module that can be used to develop Zigbee applications. In terms of hardware, it has PA and DC-DC. In terms of software, it can provide complete basic APIs for Zigbee. Based on this, users can develop embedded Zigbee products as required.

The schematic diagram of TYZS3 is shown below:

TYZS3 Module Datasheet


  • A built-in low-power 32-bit ARM Cortex-M4 processor with the DSP instruction set and a floating-point unit, which can also work as an application processor
  • Clock rate: 40MHz
  • Wide operating voltage: 2.2V-3.8V
  • Peripherals: 9 GPIOs, 1 UART, and 1 ADC
  • Zigbee operating characteristics
    • Supports 802.15.4 MAC/PHY
    • Operating channels 11 to 26 @2.400-2.483GHz, air-interface rate 250Kbps
    • Built-in DC-DC circuit for optimizing the power supply efficiency
    • Maximum output power of +19 dBm, and normal output power of +10 dBm
    • 63μA/MHz operating power consumption; 1.4 μA sleep current
    • Built-in onboard PCB antenna/reserved Ipex connector for high gain external antenna
    • Operating temperature: -40℃ to 85℃
    • Supports hardware encryption and supports AES 128/256


  • Smart buildings
  • Smart homes/appliances
  • Smart plugs, smart lighting
  • Industrial wireless control
  • Health and measurements
  • Asset tracking

Change history

Change date changed content Version after change
10/16/2018 First release V1.0.0
06/02/2021 Updated information about the dimensional tolerance and MOQ V2.0.0
06/04/2021 Updated diagrams about dimensions V2.0.1
07/29/2022 Updated baking parameters V2.0.2

Module interfaces

Package dimensions

TYZS3 has 2 lines of pins with a 2-mm spacing.

TYZS3 dimensions: 16±0.35mm (W) x 24±0.35mm (L) x 2.6±0.15mm (H). TYZS3’s dimensions are shown in the following figures:
TYZS3 Module Datasheet

TYZS3 Module Datasheet

Pin definition

The pins are defined below:

Pin number Symbol Type Function
1 nRST I Hardware reset pin, the chip is reset when the pin is LOW; Power-on reset of the module, the user can use this pin as needed.
2 ADC AI ADC, 12-bit precision SAR analog to digital converter.
3 NC - NC pin, external handling is not required.
4 GPIO0 I/O GPIO pin usage.
5 SWO I/O GPIO pin usage/can be used as an output pin under JLINK communication.
6 PWM3 I/O GPIO pin usage.
7 PWM1 I/O GPIO pin usage.
8 VCC P Module power supply pin (common supply voltage: 3.3V)
9 GND P The reference ground of the module.
10 GPIO2 I/O GPIO pin usage.
11 SWDIO I/O JLINK SWDIO programming pin. Can be used as a GPIO pin in normal applications.
12 SWCLK I/O JLINK SWCLK programming pin. Can be used as a GPIO pin in normal applications.
13 PWM2 I/O GPIO pin usage.
14 GPIO3 I/O GPIO pin usage.


  • P indicates the power pin; I/O indicates the input/output pin; AI indicates the analog input pin.
  • nRST is only the module hardware reset pin; it cannot clear Zigbee net-pairing information.
  • (1): This pin can only be used as an ADC port. It cannot be used as a normal IO port. If it is not used, it needs to be left floating.
  • As an ADC input, the input voltage range is limited to 0-AVDD and can be configured by software.

When TYZS3 is used as a gateway module, the pins are connected as follows:
TYZS3 Module Datasheet

Pin name printed on the module Corresponding pin name when used as gateway module Pin of the internal IC Remarks
PWM3 UART_CTS PF4 The coordinator used for the gateway must be connected to hardware flow control by default. The baud rate is 115200. The pin is connected to UART_RTS of the MCU.
PWM2 UART_RTS PA2 The coordinator used for the gateway must be connected to hardware flow control by default. The baud rate is 115200. The pin is connected to UART_CTS of the MCU.
UART_RX UART_RX PA1 The pin is connected to UART_TX of the MCU.
UART_TX UART_TX PA0 The pin is connected to UART_RX of the MCU.
nRST nRST RST The pin is connected to the GPIO of the MCU, and the GPIO is at high level by default.
ADC REQUEST PB11 The pin is connected to STATE of the MCU, and the PTA pin needs to be connected to a 1.5K pull-down resistor.
GPIO0 GRANT PA3 The pin is connected to ACT of the MCU, and the PTA pin needs to be connected to a 1.5K pull-down resistor.
SWO PRIORITY PF2 The pin is connected to PRI of the MCU, and the PTA pin needs to be connected to a 1.5K pull-down resistor.

Definitions of test pins

The test pins are defined below:

Pin number Symbol Type Function
- - I Used for production tests of the module.

Electrical parameters

Absolute electrical parameters

Absolute parameters

Parameters Description Minimum value Maximum value Unit
Ts Storage temperature -50 150
VCC Input voltage -0.3 3.8 V
ESD voltage (human body model) TAMB-25℃ - 2.5 KV
ESD voltage (machine model) TAMB-25℃ - 0.5 KV

Operating conditions

Normal operating conditions

Parameters Description Minimum value Typical value Maximum value Unit
Ta Operating temperature -40 - 85
VCC Operating voltage 1.8 3.3 3.8 V
VIL Voltage input low -0.3 - VCC*0.25 V
VIH Voltage input high VCC*0.75 - VCC V
VOL Voltage output low - - VCC*0.1 V
VOH Voltage output high VCC*0.8 - VCC V
Imax Drive current - - 12 mA

Zigbee TX power consumption

Power consumption during continuous TX

Symbol Rate Transmission power Typical value Unit
IRF 250Kbps +19dBm 120 mA
IRF 250Kbps +13dBm 50 mA
IRF 250Kbps +10dBm 32 mA
IRF 250Kbps +4dBm 17 mA
IRF 250Kbps +1dBm 11.8 mA

Note: When testing the above data, the continuous transmission duty cycle=100%.

Zigbee RX power consumption

Power consumption during continuous RX

Symbol Rate Typical value Unit
IRF 250Kbps 8 mA

Note: When UART is active, the RX current is 14mA.

Power consumption in operating mode

TYZS3 operating current

Operation mode Operating condition, Ta=25℃ Average value Maximum value(Typical) Unit
Quick configuration Module in quick configuration state 10 40 mA
Network connection state Connected to a network 1 23 mA
Deep sleep mode Deep-sleep mode and retains 64KB RAM 3.5 5 μA

RF Characteristics

Basic RF characteristics

Basic RF characteristics

Parameter Description
Operating frequency 2.400 to 2.484GHz
Physical layer standard IEEE 802.15.4
Data transfer rate 250Kbps
Antenna type PCB antenna/Ipex connector external antenna
Line of sight >150m

Zigbee output performance

Continuous TX performance

Parameter Minimum value Typical value Maximum value Unit
Maximum output - +19 - dBm
Minimum output - -30 - dBm
Output power adjustment step - 0.5 1 dB
Frequency error -15 - +15 ppm
Output adjacent channel suppression -31 dBc

Note: The maximum output power is +19dBm. The power output can be adjusted under normal use. The high-power output can be used for overlay transmissions in extremely complex environments, such as modules embedded in the wall.

Zigbee RX sensitivity

RX sensitivity

Parameter Minimum value Typical value Maximum value Unit
PER<10%, RX sensitivity, 250Kbps@OQPSK - -101 - dBm

Antenna signal

Antenna type

Default PCB onboard antenna connection. At the same time, an external antenna can be connected via the Ipex connector for extended coverage in complex installation environments.

Antenna interference reduction

To optimize the Zigbee performance of the wireless module in combination with the PCB onboard antenna, it is recommended to keep the antenna at least 15mm from other metal parts. It is recommended that the corresponding antenna area of the adapter board be hollowed out for the best effect.

The user PCB board should not be routed around the antenna area and should not be covered with copper to avoid affecting the antenna radiation performance.

For the module PCB onboard antenna area, refer to the following figure of TYZS3 mechanical dimensional.

Packaging information and production guidance

Mechanical dimensions

TYZS3 Module Datasheet

PCB recommended packaging

TYZS3 Module Datasheet

TYZS3 Module Datasheet

Production instructions

  1. The Tuya SMT module should be mounted by the SMT device. After being unpacked, it should be soldered within 24 hours. Otherwise, it should be put into the drying cupboard where the RH is not greater than 10%; or it needs to be packaged under vacuum again and the exposure time needs to be recorded (the total exposure time cannot exceed 168 hours).

    • SMT devices:
      • Mounter
      • SPI
      • Reflow soldering machine
      • Thermal profiler
      • Automated optical inspection (AOI) equipment
    • Baking devices:
      • Cabinet oven
      • Anti-electrostatic and heat-resistant trays
      • Anti-electrostatic and heat-resistant gloves
  2. Storage conditions for a delivered module:

    • The moisture-proof bag must be placed in an environment where the temperature is below 40°C and the relative humidity is lower than 90%.
    • The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed.
    • There is a humidity indicator card (HIC) in the packaging bag.
      TYZS3 Module Datasheet
  3. The module needs to be baked in the following cases:

    • The packaging bag is damaged before unpacking.
    • There is no HIC in the packaging bag.
    • After unpacking, circles of 10% and above on the HIC become pink.
    • The total exposure time has lasted for over 168 hours since unpacking.
    • More than 12 months have passed since the sealing of the bag.
  4. Baking settings:

    • Temperature: 40°C and ≤ 5% RH for reel package and 125°C and ≤5% RH for tray package (please use the heat-resistant tray rather than plastic container)
    • Time: 168 hours for reel package and 12 hours for tray package
    • Alarm temperature: 50°C for reel package and 135°C for tray package
    • Production-ready temperature after natural cooling: < 36°C
    • Re-baking situation: If a module remains unused for over 168 hours after being baked, it needs to be baked again.
    • If a batch of modules is not baked within 168 hours, do not use the wave soldering to solder them. Because these modules are Level-3 moisture-sensitive devices, they are very likely to get damp when exposed beyond the allowable time. In this case, if they are soldered at high temperatures, it may result in device failure or poor soldering.
  5. In the whole production process, take electrostatic discharge (ESD) protective measures.

  6. To guarantee the passing rate, it is recommended that you use the SPI and AOI to monitor the quality of solder paste printing and mounting.

Recommended oven temperature curve

Set oven temperatures according to the following temperature curve of reflow soldering. The peak temperature is 245°C.

TYZS3 Module Datasheet

  • A: Temperature axis

  • B: Time axis

  • C: Liquidus temperature: 217 to 220°C

  • D: Ramp-up slope: 1 to 3°C/s

  • E: Duration of constant temperature: 60 to 120s; the range of constant temperature: 150 to 200°C

  • F: Duration above the liquidus: 50 to 70s

  • G: Peak temperature: 235 to 245°C

  • H: Ramp-down slope: 1 to 4°C/s

    Note: The above curve is just an example of the solder paste SAC305. For more details about other solder pastes, please refer to Recommended oven temperature curve in the solder paste specifications.

Storage conditions

TYZS3 Module Datasheet

MOQ and packaging information

Product model MOQ (pcs) Packing method The number of modules per reel The number of reels per carton
TYZS3 3600 Tape reel 900 4

Appendix: Statement

FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this device.

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

Note: This device has been tested and found to comply with the limits for a Class B digital device, according to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This device generates, uses, and can radiate radio frequency energy and, if not installed and used following the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation.

If this device does cause harmful interference to radio or television reception, which can be determined by turning the device off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

  • Reorient or relocate the receiving antenna.
  • Increase the separation between the device and receiver.
  • Connect the device into an outlet on a circuit different from that to which the receiver is connected.
  • Consult the dealer or an experienced radio/TV technician for help.

Radiation Exposure Statement

This device complies with FCC radiation exposure limits set forth for an uncontrolled rolled environment. This device should be installed and operated with a minimum distance of 20cm between the radiator and your body.

Important Note

This radio module must not be installed to co-locate and operating simultaneously with other radios in the host system except following FCC multi-transmitter product procedures. Additional testing and device authorization may be required to operate simultaneously with other radios.

The availability of some specific channels and/or operational frequency bands are country dependent and are firmware programmed at the factory to match the intended destination. The firmware setting is not accessible by the end-user.

The host product manufacturer is responsible for compliance with any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.

The end-user manual shall include all required regulatory information/warnings as shown in this manual, including “This product must be installed and operated with a minimum distance of 20 cm between the radiator and user body”.

This device has got an FCC ID:2ANDL-TYZS3. The final end product must be labeled in a visible area with the following: “Contains Transmitter Module FCC ID: 2ANDL-TYZS3”

This device is intended only for OEM integrators under the following conditions:
The antenna must be installed such that 20cm is maintained between the antenna and users, and 2) The transmitter module may not be co-located with any other transmitter or antenna.

As long as the 2 conditions above are met, further transmitter tests will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed.

Declaration of Conformity European Notice

TYZS3 Module Datasheet

Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module product is in compliance with essential requirements and other relevant provisions of Directive 2014/53/EU,2011/65/EU. A copy of the Declaration of conformity can be found at https://www.tuya.com.

TYZS3 Module Datasheet

This product must not be disposed of as normal household waste, in accordance with the EU directive for waste electrical and electronic equipment (WEEE-2012/19/EU). Instead, it should be disposed of by returning it to the point of sale, or to a municipal recycling collection point.

The device could be used with a separation distance of 20cm to the human body.