TYZS4 Module Datasheet

Last Updated on : 2023-05-16 03:26:41download

TYZS4 is a low-power embedded Zigbee module developed by Tuya. The module consists of a highly integrated RF processor chip (EFR32MG1B232F256GM48-C0) and a small number of peripheral devices.


TYZS4 is built in with the 802.15.4 PHY/MAC Zigbee network protocol stack and rich library functions. TYZS4 has a low-power 32-bit ARM Cortex-M4 core, 256-KB flash memory, 32-KB RAM, and rich peripheral resources.
The schematic diagram of TYZS4 is shown below:
TYZS4 Module Datasheet


  • Built in with the low-power 32-bit ARM Cortex-M4 processor, have DSP instructions and a floating-point unit, and can also work as an application processor. Clock rate: 40MHz
  • Wide operating voltage: 2.2V-3.8V
  • Peripherals: 4×GPIOs, 1×UART (with flow control),
  • Zigbee operating characteristics
    • Supports 802.15.4 MAC/PHY
    • Operating channels 11 to 26 @2.400-2.483GHz, air-interface rate 250Kbps
    • Built-in DC-DC circuit for maximum power efficiency
    • +19dBm maximum output
    • 63μA/MHz operating power consumption; 1.4 μA sleep current
    • Built-in onboard PCB antenna/reserved Ipex connector for high gain external antenna
    • Operating temperature: -40℃ to 85℃
    • Supports hardware encryption and supports AES 128/256
    • Supports wireless packet captures


  • Smart buildings
  • Smart homes/appliances
  • Smart plugs, smart lighting
  • Industrial wireless control
  • Health and measurements
  • Asset tracking

Change history

Date Description Version after change
08/06/2019 Updated the format V2.0.0
06/04/2021 Updated information about dimensions V2.0.1
08/12/2021 Updated dimensions picture V2.0.2
07/29/2022 Updated Baking parameters V2.0.3

Module interfaces

Dimensions and footprint

​The TYZS4 has 2 rows of pins with a 2-mm gap.

​TYZS4 dimensions: 21±0.35mm (W) x 28±0.35mm (L) x 3.5±0.15mm (H).

TYZS4 Module Datasheet

TYZS4 Module Datasheet

Interface Pin definition

Pin number Symbol IO type Function
1 nRST I Hardware reset pin, the chip is reset when the pin is LOW; Power-on reset of the module, the user can use this pin as needed
2 FRC_DCLK I/O PTI debugging port, PTI full name: packet trace interface.
3 SWDIO I/O JLINK programming data communication port/can be used as a GPIO pin in applications.
4 SWCLK I/O JLINK programming clock signal/can be used as a GPIO pin in applications.
5 SWO I/O JLINK can be used as an output pin in the communication debugging state/can be used as a GPIO pin in applications.
6 PWM3 I/O GPIO pin usage.
7 PWM1 I/O GPIO pin usage.
8 VCC P Module power supply pin (common supply voltage: 3.3V)
9 GND P The reference ground of the module.
10 UART_RTS I/O The reserved full-serial UART RTS signal can also be used as a GPIO pin in applications.
11 FRC_DFRAME I/O PTI debugging port, FRC_DFRAME. Target packet trace interface frame signal.
12 FRC_DOUT I/O PTI debug port, FRC_DOUT, PTI data signal.
13 PWM2 I/O Reserved PWM output, can also be used as GPIO.
14 UART_CTS I/O The reserved full-serial UART CTS signal.
15 RXD I/O The UART0_RXD serial port receives and connects to the UART_TX of the external host.
16 TXD O The UART0_RXD serial port transmits and connects to the UART_RX of the external host.


  • P indicates the power pin
  • I/O indicates the input/output pin
  • AI indicates analog input pin
  • nRST is only the module hardware reset pin; it cannot clear Zigbee net-pairing information.

Test point definition

Pin number Symbol IO Type Function
- - I For module production testing

Note: The test pin is not recommended for use.

Electrical parameters

Absolute electrical parameters

Parameters Description Minimum value Maximum value Unit
Ts Storage temperature -50 150
VCC Input voltage -0.3 3.8 V
ESD voltage (human body model) TAMB-25℃ - 2.5 KV
ESD voltage (machine model) TAMB-25℃ - 0.5 KV

Electrical conditions

Parameters Description Minimum value Typical value Maximum value Unit
Ta Operating temperature -40 - 85
VCC Operating voltage 1.8 3.3 3.8 V
VIL IO low input -0.3 - VCC*0.25 V
VIH IO high input VCC*0.75 - VCC V
VOL IO low output - - VCC*0.1 V
VOH IO high output VCC*0.8 - VCC V
Imax IO drive current - - 12 mA

Zigbee TX power consumption

Symbol Rate Transmission power Typical value Unit
IRF 250Kbps +19dBm 120 mA
IRF 250Kbps +13dBm 50 mA
IRF 250Kbps +10dBm 32 mA
IRF 250Kbps +4dBm 17 mA
IRF 250Kbps +1dBm 11.8 mA

Note: When testing the above data, the continuous transmission duty cycle=100%.

Zigbee RX power consumption

Symbol Rate Typical value Unit
IRF 250Kbps 8 mA

Note: When UART is active, the RX current is 14mA.

Power consumption in operating mode

Operation mode Operating condition, Ta=25℃ Average value Maximum value Unit
Quick configuration Module in quick configuration state 10 40 mA
Network connection state Connected to a network 3 5 mA
Deep sleep mode Deep-sleep mode and retains 64KB RAM 3 6 μA

RF characteristics

Basic RF characteristics

Parameter Description
Operating frequency 2.400 to 2.484GHz
Physical layer standard IEEE 802.15.4
Data transfer rate 250Kbps
Antenna type PCB antenna/Ipex connector external antenna
Line of sight >300m

Zigbee output performance

Parameter Minimum value Typical value Maximum value Unit
Maximum output - +19 - dBm
Minimum output - -30 - dBm
Output power adjustment step - 0.5 1 dB
Frequency error -15 - +15 ppm
Output adjacent channel suppression -31 dBc

Note: The maximum output power is +19dBm. The power output can be adjusted under normal use. The high-power output can be used for overlay transmissions in extremely complex environments, such as gateway-level indoor/outdoor coverage.

Zigbee RX sensitivity

Parameter Minimum value Typical value Maximum value Unit
Receiving sensitivity, PER<10% - -101 - dBm

Antenna information

Antenna type

By ​default, TYZS4 uses the PCB onboard antenna. ​

Antenna interference reduction

​To optimize the Zigbee performance of the wireless module in combination with the PCB onboard antenna, it is recommended to keep the antenna at least 15mm from other metal parts. It is recommended that the corresponding antenna area of the adapter board be hollowed out for the best effect.

​The user PCB board should not be routed around the antenna area and should not be covered with copper to avoid affecting the antenna radiation performance.

Packaging information and production guidance

Mechanical dimensions

TYZS4 Module Datasheet

TYZS4 Module Datasheet

PCB recommended packaging

TYZS4 Module Datasheet

When packaging, customers can directly reference the above plug-in content and the packaging file in Altium Designer format.

Production instructions

  1. The Tuya SMT module should be mounted by the SMT device. After being unpacked, it should be soldered within 24 hours. Otherwise, it should be put into the drying cupboard where the RH is not greater than 10%; or it needs to be packaged under vacuum again and the exposure time needs to be recorded (the total exposure time cannot exceed 168 hours).
    • SMT devices:
      • Mounter
      • SPI
      • Reflow soldering machine
      • Thermal profiler
      • Automated optical inspection (AOI) equipment
    • Baking devices:
      • Cabinet oven
      • Anti-electrostatic and heat-resistant trays
      • Anti-electrostatic and heat-resistant gloves
  2. Storage conditions for a delivered module:
    • The moisture-proof bag must be placed in an environment where the temperature is below 40°C and the relative humidity is lower than 90%.

    • The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed.

    • There is a humidity indicator card (HIC) in the packaging bag.

      TYZS4 Module Datasheet

  3. The module needs to be baked in the following cases:
    • The packaging bag is damaged before unpacking.
    • There is no HIC in the packaging bag.
    • After unpacking, circles of 10% and above on the HIC become pink.
    • The total exposure time has lasted for over 168 hours since unpacking.
    • More than 12 months have passed since the sealing of the bag.
  4. Baking settings:
    • Temperature: 40°C and ≤ 5% RH for reel package and 125°C and ≤5% RH for tray package (please use the heat-resistant tray rather than plastic container)
    • Time: 168 hours for reel package and 12 hours for tray package
    • Alarm temperature: 50°C for reel package and 135°C for tray package
    • Production-ready temperature after natural cooling: < 36°C
    • Re-baking situation: If a module remains unused for over 168 hours after being baked, it needs to be baked again.
    • If a batch of modules is not baked within 168 hours, do not use the wave soldering to solder them. Because these modules are Level-3 moisture-sensitive devices, they are very likely to get damp when exposed beyond the allowable time. In this case, if they are soldered at high temperatures, it may result in device failure or poor soldering.
  5. In the whole production process, take electrostatic discharge (ESD) protective measures.
  6. To guarantee the passing rate, it is recommended that you use the SPI and AOI to monitor the quality of solder paste printing and mounting.

Recommended oven temperature curve

Perform mounting with the SMT based on the following reflow oven temperature curve. The highest temperature is 245°C. The reflow temperature curve is as below:

TYZS4 Module Datasheet

  • A: Temperature axis

  • B: Time axis

  • C: Liquidus temperature: 217 to 220°C

  • D: Ramp-up slope: 1 to 3°C/s

  • E: Duration of constant temperature: 60 to 120s; the range of constant temperature: 150 to 200°C

  • F: Duration above the liquidus: 50 to 70s

  • G: Peak temperature: 235 to 245°C

  • H: Ramp-down slope: 1 to 4°C/s

    Note: The above curve is just an example of the solder paste SAC305. For more details about other solder pastes, please refer to Recommended oven temperature curve in the solder paste specifications.

Storage conditions

TYZS4 Module Datasheet

MOQ and packaging information

Product number MOQ (pcs) Packaging method Modules per reel Reels per carton
TYZS4 2800 Tape reel 700 4

Appendix: Statement

FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this device.

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

Note: This device has been tested and found to comply with the limits for a Class B digital device, according to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This device generates, uses, and can radiate radio frequency energy and, if not installed and used following the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation.

If this device does cause harmful interference to radio or television reception, which can be determined by turning the device off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

  • Reorient or relocate the receiving antenna.
  • Increase the separation between the device and receiver.
  • Connect the device into an outlet on a circuit different from that to which the receiver is connected.
  • Consult the dealer or an experienced radio/TV technician for help.

Radiation Exposure Statement

This device complies with FCC radiation exposure limits set forth for an uncontrolled rolled environment. This device should be installed and operated with a minimum distance of 20cm between the radiator and your body.

Important Note

This radio module must not be installed to co-locate and operating simultaneously with other radios in the host system except following FCC multi-transmitter product procedures. Additional testing and device authorization may be required to operate simultaneously with other radios.

The availability of some specific channels and/or operational frequency bands are country-dependent and are firmware programmed at the factory to match the intended destination. The firmware setting is not accessible by the end-user.

The host product manufacturer is responsible for compliance with any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.

The end-user manual shall include all required regulatory information/warnings as shown in this manual, including “This product must be installed and operated with a minimum distance of 20 cm between the radiator and user body”.

This device has got an FCC ID: 2ANDL-TYZS4. The end product must be labeled in a visible area with the following: “Contains Transmitter Module FCC ID: 2ANDL-TYZS4”.

This device is intended only for OEM integrators under the following conditions:

The antenna must be installed such that 20cm is maintained between the antenna and users, and the transmitter module may not be co-located with any other transmitter or antenna.

As long as the 2 conditions above are met, further transmitter tests will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed.

Declaration of Conformity European Notice

TYZS4 Module Datasheet

Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module product is in compliance with essential requirements and other relevant provisions of Directive 2014/53/EU,2011/65/EU. A copy of the Declaration of conformity can be found at https://www.tuya.com.

TYZS4 Module Datasheet

This product must not be disposed of as normal household waste, in accordance with the EU directive for waste electrical and electronic equipment (WEEE-2012/19/EU). Instead, it should be disposed of by returning it to the point of sale, or to a municipal recycling collection point.

The device could be used with a separation distance of 20cm to the human body.