TYZS8 Module Datasheet

Last Updated on : 2021-10-09 09:39:50download

The TYZS8 is a low-power embedded Zigbee module developed by Hangzhou Tuya Information Technology Co., Ltd. It consists of one EFR32MG13P732 highly integrated wireless RF processor chip and a small number of peripheral devices. It has a built-in 802.15.4 PHY/MAC Zigbee network protocol stack and rich library functions.


​The TYZS8 embeds a low-power 32-bit ARM Cortex-M4 core, 512KByte Flash program memory, 64KB RAM data memobr /ry, and a wealth of peripheral resources.

TYZS8 schematic diagram as shown in Figure 1:

TYZS8 Module Datasheet


A built-in low-power 32-bit ARM Cortex-M4 processor with a DSP instruction set and floating point unit that doubles as an application processor

  • Supports main frequency of 40MHz

  • Wide operating voltage: 1.8V-3.8V

  • Peripherals: 13×GPIOs, 1×UART, 1×ADC

  • Zigbee operating characteristics

    • Supports 802.15.4 MAC/PHY
    • Operating channels 11 to 26 @2.400-2.483GHz and an air-interface rate of 250Kbps
    • A built-in DC-DC circuit for maximum power efficiency and +19dBm maximum output.
    • 63uA/MHz operating power consumption; 1.4uA sleep current
    • Copper column antenna/reserved Ipex connector for high gain external antenna
    • Operating temperature: -40℃ to 85℃
    • Supports hardware encryption, supports AES 128/256


  • Smart buildings
  • Smart homes/appliances
  • Smart plugs, smart lighting
  • Industrial wireless control
  • Health and measurements
  • Asset tracking

Module interfaces

Package dimensions

TYZS8 has 3 rows of pins with a 1.27mm gap.

TYZS8 dimensions: 15mm (W) x 18mm (L) x 2mm (H). The TYZS8’s dimensions as shown in Figure 2:

TYZS8 Module Datasheet

Pin definition

Interface pins are defined as shown in the following table.

Pin number Symbol IO type Function
1 GND P The reference ground of the module.
2, 3, 4 NC - Unused pin.
5 GPIO0 I/O GPIO port usage.
6 GPIO2 I/O GPIO port usage.
7 GPIO3 I/O GPIO port usage.
8 PC11 I/O GPIO port usage.
9 PC10 I/O GPIO port usage.
10 PB12 I/O GPIO port usage.
11 PF6 I/O GPIO port usage.
12 ADC AI ADC port (1), 12-bit precision SAR analog-to-digital converter
13 NC - Unused pin.
14 PB13 I/O GPIO port usage.
15 nRST I Hardware reset pin, the chip is reset when the pin is LOW; The module comes with a power-on reset and the user can use this pin as needed
18 SWCLK I/O JLINK SWCLK programming pin. Can be used as a GPIO pin in normal applications.
19 SWDIO I/O JLINK SWDIO programming pin. Can be used as a GPIO pin in normal applications.
20 PF3 I/O GPIO pin usage.
21, 22, 23 NC - NC pin, external handling is not required
24 SWO I/O GPIO pin usage/can be used as an output pin under JLINK communication.
25 PWM3 I/O GPIO pin usage; light driver PWM port.
26 PWM2 I/O GPIO pin usage; light driver PWM port.
27 PWM1 I/O GPIO pin usage; light driver PWM port.
28 GND P The reference ground of the module.
29 3.3V P Module power supply pin (common supply voltage: 3.3V)
30 3.3V P Module power supply pin (common supply voltage: 3.3V)
  • P indicates the power pin, I/O indicates the input/output pin, and AI indicates the analog input pin.
  • The nRST is only the module hardware reset pin and it cannot clear Zigbee net-pairing information.
  • This pin can only be used as an ADC port. It cannot be used as a normal IO port. If it is not used, it needs to be left floating. As an ADC input, the input voltage range is limited to 0-AVDD and can be configured by software.

Test point definition

Pin Symbol IO type Function
- - I For module production testing

This test pin is not recommended for use.

Electrical parameters

Absolute electrical parameters

Parameters Description Minimum value Maximum value Unit
Ts Storage temperature -50 150
VDD Input voltage -0.3 3.8 V
Electrostatic discharge voltage (human-body model) TAMB-25℃ - 2.5 KV
Electrostatic discharge voltage (machine model) TAMB-25℃ - 0.5 KV

Operating conditions

Parameters Description Min Typ Max Unit
Ta Operating temperature -40 - 85
VCC Operating voltage 1.8 3.3 3.8 V
VIL IO low input -0.3 - VCC*0.25 V
VIH IO high input VCC*0.75 - VCC V
VOL IO low output - - VCC*0.1 V
VOH IO high output VCC*0.8 - VCC V
Imax IO drive current - - 12 mA

Zigbee TX power consumption

Symbol Rate Transmission power Typical value Unit
IRF 250Kbps +19dBm 120 mA
IRF 250Kbps +13dBm 50 mA
IRF 250Kbps +10dBm 32 mA
IRF 250Kbps +4dBm 17 mA
IRF 250Kbps +1dBm 11.8 mA

When testing the above data, continuous transmission duty cycle=100%.

Zigbee RX power consumption

Symbol Rate Typ Unit
IRF 250Kbps 8 mA

When UART is active, the RX mode current is 8mA.

Power consumption in operating

Operation Mode Operating condition, TA=25 Ave Max Unit
Quick configuration Module in quick configuration state 10 40 mA
Network connection idle Connected to a network - - mA
Deep sleep mode Deep sleep mode and retains 64KB Flash 1.4 3 uA

RF characteristics

Basic RF characteristics

Parameter Description
Operating frequency 2.400~2.484GHz
Physical layer standard IEEE 802.15.4
Data transfer rate 250Kbps
Antenna type Copper column antenna/Ipex connector external antenna
Line of sight >120m

Zigbee output performance

Parameter Min Typ Max Unit
Maximum output - +19 - dBm
Maximum output - -30 - dBm
Output adjacent channel suppression - 0.5 1 dB
Frequency error -15 - +15 ppm
Output adjacent channel suppression -31 dBc

The maximum output power is +19dBm. The power output can be adjusted under normal use. The high-power output can be used for overlay transmissions in extremely complex environments, such as modules embedded in the wall.

Zigbee RX sensitivity

Parameter Min Typ Max Unit
PER<10%, RX sensitivity, 250Kbps@OQPSK - -101 - dBm


Antenna type

Default copper column antenna connection.

At the same time, an external antenna can be connected via the Ipex connector for extended coverage in complex installation

Antenna interference reduction

To optimize the Zigbee performance of the wireless module in combination with the copper column antenna, it is recommended to keep the antenna at least 15mm from other metal parts. It is recommended that the corresponding antenna area of the adapter board be hollowed out for the best effect.

The user PCB board should not be routed around the antenna area and should not be covered with copper to avoid affecting the antenna radiation performance.

Packaging information and production guidance

Mechanical dimensions

TYZS8 Module Datasheet

TYZS8 Module Datasheet

PCB recommended packaging

TYZS8 Module Datasheet

Production guide

The storage conditions for the module after it has been shipped are as follows:

  1. The moisture-resistant bag must be stored at a temperature below 30℃, and under a relative humidity below 85%.
  2. The shelf life of dry-packed products is six months following the packaged date.
  • All line workers must wear anti-static wrist straps and anti-static clothing throughout the entire production process.
  • It is strictly prohibited to allow a module to come into contact with water or other contaminants during operations.

Recommended furnace temperature curve

TYZS8 Module Datasheet