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Tuya IoT Development Platform

TYZS4-IPEX Module Datasheet

Last Updated on : 2023-05-16 03:27:07download

TYZS4-IPEX is a low-power embedded Zigbee module that Tuya has developed. It consists of a highly integrated RF processing chip (EFR32MG1B232F256GM48-D), a few peripherals, a built-in 802.15.4 PHY/MAC Zigbee network protocol stack, and rich library functions.


TYZS4-IPEX is embedded with a low-power 32-bit ARM Cortex-M4 core, 256-KB flash memory, 32-KB RAM, and abundant peripheral resources.


  • Embedded with a low-power 32-bit ARM Cortex-M4 core with DSP instructions and floating-point units, which can also work as a processor
  • The clock rate: 40 MHz
  • Wide working voltage: 2.2 to 3.8 V
  • Peripherals: 4 GPIOs and 1 UART (flow control)
  • Zigbee working features:
    • Support 802.15.4 MAC/PHY
    • Working channels 11 to 26@2.400 to 2.483 GHz Air interface rate: 250 Kbps
    • Built-in DC-DC circuit, which improves the power efficiency to the greatest extent
    • Up to + 19dBm output power
    • 60 uA/MHz power consumption during running, 1.4uA sleep current
    • Ipex connector, which can be used together with multiple external antennas
    • Working temperature: -40℃ to 85℃
    • Support hardware encryption and AES 128/256
    • Support wireless packet capture


  • Intelligent building
  • Smart household and home appliances
  • Smart socket and light
  • Industrial wireless control
  • Health and measurement
  • Asset tracking

Module interfaces

Dimensions and package

TYZS4-IPEX has 2 rows of pins with a 2 mm pin spacing.

The dimensions of TYZS4-IPEX are 21±0.35 mm (W)×28±0.35 mm (L) ×3.5±0.15 mm (H).

The dimensions of TYZS4-IPEX are as follows:

TYZS4-IPEX Module Datasheet

Pin definition

The definitions of pins of TYZS4-IPEX are shown in the following table:

Pin number Symbol I/O type Function
1 nRST I Hardware reset pin, the chip is reset at the low level; the module has its own power-on reset, and users may not use this pin according to the actual situation.
2 FRC_DCLK I/O packet trace interface (PTI), which corresponds to PB11
3 SWDIO I/O Communication interface for JLINK burning, which can be configured as a GPIO in the application and corresponds to PF1
4 SWCLK I/O Clock signal of JLINK burning, which can be configured as GPIO in the application and corresponds to PF2
5 SWO I/O Work as an output pin in JLINK debugging communication state, and configured as a GPIO in the application and correspond to PF2
6 PWM3 I/O Configured as a GPIO and correspond to PF4
7 PWM1 I/O Configured as a GPIO and correspond to PF5
8 VCC P The power supply pin of the module (The typical power supply voltage: 3.3V)
9 GND P Power supply reference ground pin
10 UART_RTS I/O Reserved full-interface UART RTS signal, which can also be used as GPIO in the application and correspond to PA4
11 FRC_DFRAME I/O PTI debugging port, FRC_DFRAME. Target packet trace interface Frame signal. Correspond to PB13
12 FRC_DFRAME I/O PTI debugging port, FRC_DFRAME. Correspond to PB12
13 PWM2 I/O Reserved PWM output, can also be used as a GPIO. Correspond to PA2
14 UART_CTS I/O Reserved full-interface UART CTS signal, correspond to PA5
15 RXD I/O UART0_RXD, receiving interface, which is connected to UART_TX of the external host computer and corresponds to PA1
16 TXD O UART0_TXD, transmitting interface, which is connected to UART_RX of the external host computer and corresponds to PA0

Note: P indicates a power supply pin, I/O indicates an input/output pin and AI indicates an analog input pin.
nRST is only a resetting pin of the module and cannot be used for clearing network pairing information of Zigbee.

Definitions on test points

The definitions of pins of TYZS4-IPEX are shown in the following table:

Pin number Symbol I/O Type Function
- - I Used to production tests of modules

Note: Test pins are not recommended.

Electrical parameters

Absolute electrical parameters

Parameter Description Minimum value Maximum Value Unit
Ts Storage temperature -50 150
VCC Power supply voltage -0.3 3.8 V
ESD voltage (human body model) TAMB-25℃ - 2.5 KV
ESD voltage (machine model) TAMB-25℃ - 0.5 KV

Working conditions

Parameter Description Minimum value Typical value Maximum value Unit
Ta Working temperature -40 - 85
VCC Working voltage 1.8 3.3 3.8 V
VIL I/O low level input -0.3 - VCC*0.25 V
VIH I/O high level input VCC*0.75 - VCC V
VOL I/O low level output - - VDD*0.1 V
VOH I/O high level output VCC*0.8 - VCC V
Imax I/O drive current - - 12 mA

Zigbee TX power consumption

Symbol Rate Transmit power Typical value Unit
IRF 250Kbps +19dBm 120 mA
IRF 250Kbps +13dBm 50 mA
IRF 250Kbps +10dBm 32 mA
IRF 250Kbps +4dBm 17 mA
IRF 250Kbps +1dBm 11.8 mA

Note: When the above data are tested, the constant transmission is required, that is, duty cycle=100%.

Zigbee RX power consumption

Symbol Rate Typical value Unit
IRF 250Kbps 8 mA

Note: When the UART is in the active state, the received current is 14mA.

Power consumption in working mode

Working mode Working status, Ta = 25°C Average value Maximum value Unit
Quick connection network state The module is in the fast network connection state 10 40 mA
Network connection state The module is connected to the network 3 6 mA
Deep sleep mode Deep sleep mode, reserve 64KB RAM 3 5 uA

RF features

Basic RF features

Parameter Description
Working frequency 2.400 to 2.484 GHz
Standards of physical layer IEEE 802.15.4
Data transmission rate 250 Kbps
Antenna type External antenna with an Ipex connector
LOS propagation distance > 120m

Zigbee output performance

Parameter Minimum value Typical value Maximum value Unit
Maximum output power - +10 +19 dBm
Minimum output power - -30 - dBm
Output power adjustment stepping - 0.5 1 dB
Frequency error -15 - +15 ppm
Output spectrum adjacent channel suppression - -31 - dBc

Note: The maximum output power can be +19dBm. Generally, the power output may be adjusted and the large power output can be used for coverage transmission in an extremely complicated environment, for example, gateway-level indoor/outdoor space coverage.

Zigbee receiving sensitivity

Parameter Minimum value Typical value Maximum value Unit
Receiving sensitivity, PER<10% - -101 - dBm


Antenna type

TYZS4-IPEX uses the external antenna with an Ipex connector, for example, the FPC antenna. The antenna can be used in a complex environment.

The dimensions of the IPEX base are as follows:

TYZS4-IPEX Module Datasheet

Antenna interference reduction

To ensure the optimal WiFi performance when the module uses the external antenna, you should ensure that its surrounding areas are cleared. It is recommended that the antenna be at least 15 mm away from other metal parts. Besides, it is recommended that the antenna area corresponding to the adapter plate be hollowed out.

To prevent an adverse impact on the antenna radiation performance, avoid copper or traces along the antenna area on the PCB.

For the antenna area of the PCB of the module, see the diagram of the mechanical dimensions of TYZS4-IPEX.

Packaging information and production instructions

Mechanical dimensions

TYZS4-IPEX Module Datasheet

Recommended PCB packaging

TYZS4-IPEX Module Datasheet

Production instructions

When TYZS4-IPEX is used as a gateway module, refer to the following wire connection:

TYZS4-IPEX Module Datasheet

Module-end signal MCU-end signal Description
UART_CTS UART_RTS For an interface (baud: 115200) with flow control, connect to the pin. Support the default ZS4-IPEX version. For an interface (baud: 57600) with flow control, you may not connect to the pin. You need to confirm the version with the provider.
UART_RTS UART_CTS For an interface (baud: 115200) with flow control, connect to the pin. Support the default ZS4-IPEX version. For an interface (baud: 57600) with flow control, you may not connect to the pin. You need to confirm the version with the provider.
VCC VCC Power supply pin
GND GND Ground reference pin
nRST GPIO GPIO, high level by default
FRC_DCLK GPIO GPIO, a low level by default
PW1 (REQUEST) STATE PTA (not support the default version, need to confirm the version with the provider)
PW2 (GRANT) ACT PTA (not support the default version, need to confirm the version with the provider)
PW3 (PRIORITY) PRI PTA (not support the default version, need to confirm the version with the provider)

Production instructions

  1. The Tuya SMT module should be mounted by the SMT device. After being unpacked, it should be soldered within 24 hours. Otherwise, it should be put into the drying cupboard where the RH is not greater than 10%; or it needs to be packaged under vacuum again and the exposure time needs to be recorded (the total exposure time cannot exceed 168 hours).
    • SMT devices:
      • Mounter
      • SPI
      • Reflow soldering machine
      • Thermal profiler
      • Automated optical inspection (AOI) equipment
    • Baking devices:
      • Cabinet oven
      • Anti-electrostatic and heat-resistant trays
      • Anti-electrostatic and heat-resistant gloves
  2. Storage conditions for a delivered module:
    • The moisture-proof bag must be placed in an environment where the temperature is below 40°C and the relative humidity is lower than 90%.

    • The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed.

    • There is a humidity indicator card (HIC) in the packaging bag.

      TYZS4-IPEX Module Datasheet

  3. The module needs to be baked in the following cases:
    • The packaging bag is damaged before unpacking.
    • There is no HIC in the packaging bag.
    • After unpacking, circles of 10% and above on the HIC become pink.
    • The total exposure time has lasted for over 168 hours since unpacking.
    • More than 12 months have passed since the sealing of the bag.
  4. Baking settings:
    • Temperature: 60°C and ≤ 5% RH for reel package and 125°C and ≤5% RH for tray package (please use the heat-resistant tray rather than plastic container)
    • Time: 48 hours for reel package and 12 hours for tray package
    • Alarm temperature: 65°C for reel package and 135°C for tray package
    • Production-ready temperature after natural cooling: < 36°C
    • Re-baking situation: If a module remains unused for over 168 hours after being baked, it needs to be baked again.
    • If a batch of modules is not baked within 168 hours, do not use the reflow soldering to solder them. Because these modules are Level-3 moisture-sensitive devices, they are very likely to get damp when exposed beyond the allowable time. In this case, if they are soldered at high temperatures, it may result in device failure or poor soldering.
  5. In the whole production process, take electrostatic discharge (ESD) protective measures.
  6. To guarantee the passing rate, it is recommended that you use the SPI and AOI to monitor the quality of solder paste printing and mounting.

Recommended oven temperature curve

Perform mounting with the SMT based on the following reflow oven temperature curve. The highest temperature is 245°C. The reflow temperature curve is as below:

TYZS4-IPEX Module Datasheet

  • A: Temperature axis

  • B: Time axis

  • C: Liquidus temperature: 217 to 220°C

  • D: Ramp-up slope: 1 to 3°C/s

  • E: Duration of constant temperature: 60 to 120s; the range of constant temperature: 150 to 200°C

  • F: Duration above the liquidus: 50 to 70s

  • G: Peak temperature: 235 to 245°C

  • H: Ramp-down slope: 1 to 4°C/s

    Note: The above curve is just an example of the solder paste SAC305. For more details about other solder pastes, please refer to Recommended oven temperature curve in the solder paste specifications.

Storage conditions

TYZS4-IPEX Module Datasheet

MOQ and packaging information

Product number MOQ (pcs) Packing method Modules per reel Reels per carton
TYZS4-IPEX 2800 Tape reel 700 4

Appendix: Statement

FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this device.

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

Note: This device has been tested and found to comply with the limits for a Class B digital device, according to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This device generates, uses, and can radiate radio frequency energy and, if not installed and used following the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation.

If this device does cause harmful interference to radio or television reception, which can be determined by turning the device off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

  • Reorient or relocate the receiving antenna.
  • Increase the separation between the device and receiver.
  • Connect the device into an outlet on a circuit different from that to which the receiver is connected.
  • Consult the dealer or an experienced radio/TV technician for help.

Radiation Exposure Statement

This device complies with FCC radiation exposure limits set forth for an uncontrolled rolled environment. This device should be installed and operated with a minimum distance of 20cm between the radiator and your body.

Important Note

This radio module must not be installed to co-locate and operating simultaneously with other radios in the host system except following FCC multi-transmitter product procedures. Additional testing and device authorization may be required to operate simultaneously with other radios.

The availability of some specific channels and/or operational frequency bands are country dependent and are firmware programmed at the factory to match the intended destination. The firmware setting is not accessible by the end-user.

The host product manufacturer is responsible for compliance with any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.

The end-user manual shall include all required regulatory information/warnings as shown in this manual, including “This product must be installed and operated with a minimum distance of 20 cm between the radiator and user body”.

This device has got an FCC ID: 2ANDL-TYZS4-IPEX. The end product must be labeled in a visible area with the following: “Contains Transmitter Module FCC ID: 2ANDL-TYZS4-IPEX”.

This device is intended only for OEM integrators under the following conditions:

The antenna must be installed such that 20cm is maintained between the antenna and users, and the transmitter module may not be co-located with any other transmitter or antenna.

As long as the 2 conditions above are met, further transmitter tests will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed.

Declaration of Conformity European Notice

TYZS4-IPEX Module Datasheet

Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module product is in compliance with essential requirements and other relevant provisions of Directive 2014/53/EU,2011/65/EU. A copy of the Declaration of conformity can be found at https://www.tuya.com.

TYZS4-IPEX Module Datasheet

This product must not be disposed of as normal household waste, in accordance with the EU directive for waste electrical and electronic equipment (WEEE-2012/19/EU). Instead, it should be disposed of by returning it to the point of sale, or to a municipal recycling collection point.

The device could be used with a separation distance of 20cm to the human body.