THP23-X-M Module Datasheet

Developed by Tuya, THP23-X-M is a core board for gateway development. It consists of a highly integrated smart high-definition display processor chip SSD202D and Tuya’s Wi-Fi module TY001. With rich peripheral interfaces, users can design peripheral circuits based on the core board for custom development. Moreover, if you have sufficient development capabilities, you can integrate with TuyaOS capabilities on top of THP23-X-M to meet more customization needs.

Demo block diagram

Features

• Operating voltage range: 3.14V to 3.46V
• Wi-Fi connectivity
  • IEEE 802.11b/g/n20
  • Channels 1–14@2.4 GHz (CH1–11 for US/CA and CH1–13 for EU/CN)
  • Support security protocols, including WEP, WPA, WPA2, and WPA2 PSK (AES)
  • The maximum output power is +19 dBm for IEEE 802.11b transmission
  • Operating temperature range: 0°C to 70°C
• Microcontroller frequency: 1.2 GHz
• Abundant interfaces: 2 UART ports, 2 USB 2.0 ports, 2 RJ45 ports (one of which requires an external interface chip), MIC, SPK, MIPI, and other interfaces

Scope of applications

• Outdoor recreational vehicles and yachts
• New energy
• Agriculture
• Smart home

Module interfaces

Electrical parameters

Absolute electrical parameters

Normal operating conditions

Working mode and power consumption

The table below shows the power consumption performance of the THP23-X-M core board.

RF parameters

For more information, see TY001 Module Datasheet.

Antenna information

Antenna type

The board can be connected to an external antenna through the half hole on the module, or to an IPEX antenna with the onboard IPEX connector. You can choose either one of the two.

Antenna interference reduction

The distance between the antenna and other mental components should be at least 15 mm to provide the best Wi-Fi performance.

Specifications of antenna connector

Packing and production instructions

Mechanical dimensions and packing

Mechanical dimensions of the THP23-X-M PCB are 35±0.35 mm (W) × 34±0.35 mm (L) × 2.9±0.1 mm (H). The figure below shows the mechanical dimensions of THP23-X-M.

Production instructions

1. Package the module with the SMT if Tuya’s module is designed to be SMT-packaged. After being unpacked, the module must be soldered within 24 hours. Otherwise, it needs to be put into a drying cupboard with a relative humidity level no greater than 10%, or pack the module in vacuum again. Then, record the packing time and duration of exposure. The total exposure time cannot exceed 168 hours.

   • Instruments or devices required for the SMT process:
     • Surface mount system
     • SPI
     • Reflow soldering machine
     • Thermal profiler
     • AOI
   • Instruments or devices required for the baking process:
     • Cabinet oven
     • Anti-electrostatic and heat-resistant trays
     • Anti-electrostatic and heat-resistant gloves

2. A delivered module must meet the following storage requirements:

   • The moisture-proof bag must be placed in an environment where the temperature is below 40°C and the relative humidity is lower than 90%.

   • The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed.

   • A humidity indicator card (HIC) is put in the sealed package.

     

3. The module needs to be baked in the following cases:

   • The vacuum packaging bag is damaged before unpacking.
   • After unpacking, no HIC is found in the packaging bag.
   • After unpacking, the HIC indicates a humidity level of 10% or higher. In this case, the circle turns pink on the HIC.
   • The total exposure time has lasted for over 168 hours since unpacking.
   • More than 12 months have passed since the first sealing of the bag.

4. The baking parameter settings are described below:

   • Baking temperature: 40°C for reel packaging with relative humidity ≤ 5%. And 125°C for tray packaging with relative humidity ≤ 5% (use the heat-resistant tray, rather than plastic containers).
   • Baking time: 168 hours for reel packaging and 12 hours for tray packaging.
   • Temperature for triggering an alert: 50°C for reel packaging and 135°C for tray packaging.
   • Production can begin after a module has cooled down to below 36°C under natural conditions.
   • If a module remains unused for over 168 hours after being baked, it needs to be baked again.
   • If a batch of modules is not baked after exposure for more than 168 hours, do not use wave soldering to solder them. Because these modules are level-3 moisture-sensitive devices, they are very likely to get damp when exposed beyond the allowable time. In this case, if they are soldered at high temperatures, device failure or poor soldering performance might occur.

5. In the whole production process, take electrostatic discharge (ESD) protective measures.

6. To guarantee the pass rate, we recommend that you use the SPI and AOI to monitor the quality of solder paste printing and mounting.

Recommended oven temperature curve

Set the temperature according to the following temperature curve of reflow soldering. The peak temperature is 245°C.

• A: temperature axis

• B: time axis

• C: alloy liquidus temperature from 217°C to 220°C

• D: ramp-up slope from 1°C/s to 3°C/s

• E: keep a constant temperature from 150°C to 200°C for a time period from 60s to 120s

• F: temperature above liquidus temperature for 50s to 70s

• G: peak temperature from 235°C to 245°C

• H: ramp-down slope from 1°C/s to 4°C/s

  The curve above is based on solder paste SAC305. For more information about other solder pastes, see the recommended oven temperature curve in the specified solder paste specifications.

Storage conditions

MOQ and packaging information