TY004 Module Datasheet

Overview

TY004 module is a Wi-Fi and Bluetooth Low Energy (LE) combo module developed by Tuya Smart for the IoT field. It consists of a highly integrated wireless RF chip RTL8720CS with built-in Wi-Fi stacks and various library functions, and supports Bluetooth LE functionalities. Using ARM Cortex-M0 and M4 dual cores, it has rich peripheral interfaces.
On top of the above functionalities, TY004 can be used in IP camera products such as low power IP cameras, doorbells, and floodlight cameras.

The figure below shows the functional block diagram of the TY004 module.

Features

• Built-in ARM Cortex-M4 and M0 cores, clocked at 200 MHz and 20 MHz respectively.
• The design of big and small cores enables extremely low power consumption during deep sleep.
• Peripherals: one UART, one SPI controller/peripheral (50 MHz), one SPI controller (25 MHz), five PWMs, one I2C, one USB 2.0, and one I2S.
• Wi-Fi:
  • IEEE 802.11b/g/n (2.4 GHz, 1 × 1)
  • Support HT20/HT40 frequency bands
  • Support low power Tx/Rx connection
  • Support low power beacon listening mode
  • Support low power Rx mode
  • Support deep low power state (DLPS) mode
  • Operating temperature range: -20°C to +85°C.
• Bluetooth:
  • Support Bluetooth low energy
  • Support Bluetooth LE central and peripheral modes
  • Support high power mode
  • Built-in shared antenna for Bluetooth and Wi-Fi
  • Operating voltage range: 3.3 ± 0.3V

Scope of applications

• Low power IP camera, doorbell, and smart video lock
• Smart wireless floodlight camera
• Camera

Module interfaces

Dimensions and footprint

TY004 is a square with stamp holes on four sides and has 48 pins with a pin spacing of 0.9 mm.

The dimensions are 13.5 mm × 13.5 mm × 2.25 mm, as shown below.

Pin definition

The following table lists the pin definitions.

Pin No.	Function definition	Default status
2	RF	-
7	PA_12LP_UART_TXD, SPI1_MOSI, HS_PWM0, LP_PWM0, and I2S_MCLK	-
8	PA_13, LP_UART_RXD, SPI1_MISO, HS_PWM1, LP_PWM1, and I2S_SD_TX1	-
9	PA_14, LP_UART_RTS, SPI1_CLK, and I2S_SD_TX2	-
10	PA_15, LP_UART_CTS, and SPI1_CS	-
15	PA_27, NORMAL_MODE_SEL, and LP_UART_RTSSWD_DATA	Internal up output port. We recommend leaving it floating and not using it.
16	PA_30, SPS_SEL, HS_USI_SPI_CLK, HS_PWM7, LP_PWM1, and LCD_D6	External up, module internal 33 kΩ pull-up resistor.
17	PA_28, LP_UART_CTS, HS_USI_SPI_CS, HS_PWM6, LP_PWM0, LCD_D7, and RREF	USB mode, 12 kΩ reference resistor
18	PA_26, LP_UART_TXD, HS_USI_SPI_MISO, IR_RX, LP_I2C_SDA, HS_PWM5, LP_PWM5, LCD_D8, and USB_DP	-
19	PA_25, LP_UART_RXD, HS_USI_SPI_MOSI, IR_TX, LP_I2C_SCL, HS_PWM4, LP_PWM4, LCD_D9, and USB_DM	-
20	PB_2, LP_UART_RXD, DMIC_DATA, and ADC_CH5	-
21	PB_1, LP_UART_TXD, DMIC_CLK, and ADC_CH4	-
22	PB_3, SWD_CLK, and ADC_CH6	-
28	PB_14 and SPI_DATA0	-
29	PB_13 and SPI_CLK	-
30	PB16 and SPI_CS	-
31	PB_17 and SPI_DATA1	-
32	PB_20, HS_USI_UART_TXD, and HS_USI_I2C_SCL	-
33	PB_21, HS_USI_UART_RXD, and HS_USI_I2C_SDA	-
35	3.3V power pin	-
38	CHIP_EN	External up
39	PA_8 and UART_LOG_RXD	-
40	PA_7, UART_DOWNLOAD, and UART_LOG_TXD	-
1, 3, 11, 12, 13, 14, 24, 36, 37, 41, 42, and 43	GND	-
4, 5, 6, 23, 25, 26, 27, 34, 44, 45, 46, 47, and 48	NC	-

Electrical parameters

Absolute electrical parameters

Parameter	Description	Min value	Max value	Unit
Ts	Storage temperature	-20	105	°C
VDD	Supply voltage	-0.3	3.6	V
Electrostatic discharge voltage (human body model)	TAMB-25°C	-	2	kV
Electrostatic discharge voltage (machine model)	TAMB-25°C	-	0.5	kV

Operating conditions

Parameter	Description	Min value	Typical value	Max value	Unit
Ta	Operating temperature	0	-	70	°C
VCC	Operating voltage	3.0	3.3	3.6	V
VIL	I/O low-level input	-	0	0.9	V
VIH	I/O high-level input	2.0	3.3	3.6	V
VOL	I/O low-level output	0	-	0.33	V
VOH	I/O high-level output	2.97	-	3.3	V
Imax	I/O drive current	-	-	12	mA

Power consumption during continuous transmission and reception

2.4 GHz transmission and reception

Working status	Mode	Rate	Transmit/Receive power	Typical value	Unit
Transmit	802.11b	11 Mbit/s	+18 dBm	250	mA
Transmit	802.11g	54 Mbit/s	+17 dBm	180	mA
Transmit	802.11n-HT20	MCS7	+16 dBm	170	mA
Transmit	802.11n-HT40	MCS7	+16 dBm	150	mA
Receive	802.11b	11 Mbit/s	Continuous reception	70	mA
Receive	802.11g	54 Mbit/s	Continuous reception	72	mA
Receive	802.11n-HT20	MCS7	Continuous reception	70	mA
Receive	802.11n-HT40	MCS7	Continuous reception	73	mA

RF parameters

Basic RF features

Parameter	Description
Operating frequency	2.412–2.484 GHz
Wi-Fi standard	IEEE 802.11b/g/n (channels 1–14)
Data transmission rate	IEEE 802.11b: 1, 2, 5.5, and 11 Mbit/s IEEE 802.11g: 6, 9, 12, 18, 24, 36, 48, and 54 Mbit/s IEEE 802.11n: HT20 MCS0-7 and HT40 MCS0-7
Antenna type	No antenna. The module only has RF pins and needs to be connected to the antenna on the corresponding motherboard.

Transmission performance

2.4 GHz continuous transmission performance

Parameter	Min value	Typical value	Max value	Unit
RF average output power, 802.11b CCK mode, 11M	-	17	-	dBm
RF average output power, 802.11g OFDM mode, 54M	-	16	-	dBm
RF average output power, 802.11n HT20 mode, MCS7	-	15	-	dBm
RF average output power, 802.11n HT40 mode, MCS7	-	14	-	dBm
Frequency error	-10	-	10	ppm
EVM@802.11b CCK 11 Mbit/s mode, 17.5 dBm	-	-	-10	dB
EVM@802.11g OFDM 54 Mbit/s mode, 14.5 dBm	-	-	-29	dB
EVM@802.11n OFDM MCS7 mode, 13.5 dBm	-	-	-30	dB

RX sensitivity

Parameter	Min value	Typical value	Max value	Unit
PER < 8%, RX sensitivity, 802.11b DSSS mode, 11M	-	-91	-	dBm
PER < 10%, RX sensitivity, 802.11g OFDM mode, 54M	-	-75	-	dBm
PER < 10%, RX sensitivity, 802.11n OFDM mode, HT20-MCS7	-	-72	-	dBm

Antenna information

Antenna type

The module can be connected to an external antenna through the half hole.

Packing and production instructions

Mechanical dimensions

Mechanical dimensions of the TY004 PCB are 13.5 mm (W) × 13.5 mm (L) × 2.6 mm (H).
The figure below shows the mechanical dimensions of TY004.

SMT package

Production instructions

1. Package the module with the SMT if Tuya’s module is designed to be SMT-packaged. After being unpacked, the module must be soldered within 24 hours. Otherwise, it needs to be put into a drying cupboard with a relative humidity level no greater than 10%, or pack the module in vacuum again. Then, record the packing time and duration of exposure. The total exposure time cannot exceed 168 hours.

   • Instruments or devices required for the SMT process:
     • Surface mount system
     • SPI
     • Reflow soldering machine
     • Thermal profiler
     • AOI
   • Instruments or devices required for the baking process:
     • Cabinet oven
     • Anti-electrostatic and heat-resistant trays
     • Anti-electrostatic and heat-resistant gloves

2. A delivered module must meet the following storage requirements:

   • The moisture-proof bag must be placed in an environment where the temperature is below 40°C and the relative humidity is lower than 90%.

   • The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed.

   • A humidity indicator card (HIC) is put in the sealed package.

     

3. The module needs to be baked in the following cases:

   • The vacuum packaging bag is damaged before unpacking.
   • After unpacking, no HIC is found in the packaging bag.
   • After unpacking, the HIC indicates a humidity level of 10% or higher. In this case, the circle turns pink on the HIC.
   • The total exposure time has lasted for over 168 hours since unpacking.
   • More than 12 months have passed since the first sealing of the bag.

4. The baking parameter settings are described below:

   • Baking temperature: 40°C for reel packaging with relative humidity ≤ 5%. And 125°C for tray packaging with relative humidity ≤ 5% (use the heat-resistant tray, rather than plastic containers).
   • Baking time: 168 hours for reel packaging and 12 hours for tray packaging.
   • Temperature for triggering an alert: 50°C for reel packaging and 135°C for tray packaging.
   • Production can begin after a module has cooled down to below 36°C under natural conditions.
   • If a module remains unused for over 168 hours after being baked, it needs to be baked again.
   • If a batch of modules is not baked after exposure for more than 168 hours, do not use wave soldering to solder them. Because these modules are level-3 moisture-sensitive devices, they are very likely to get damp when exposed beyond the allowable time. In this case, if they are soldered at high temperatures, device failure or poor soldering performance might occur.

5. In the whole production process, take electrostatic discharge (ESD) protective measures.

6. To guarantee the pass rate, we recommend that you use the SPI and AOI to monitor the quality of solder paste printing and mounting.

Recommended oven temperature curve

Set the temperature according to the following temperature curve of reflow soldering. The peak temperature is 245°C.

• A: temperature axis

• B: time axis

• C: alloy liquidus temperature from 217°C to 220°C

• D: ramp-up slope from 1°C/s to 3°C/s

• E: keep a constant temperature from 150°C to 200°C for a time period from 60s to 120s

• F: temperature above liquidus temperature for 50s to 70s

• G: peak temperature from 235°C to 245°C

• H: ramp-down slope from 1°C/s to 4°C/s

  The curve above is based on solder paste SAC305. For more information about other solder pastes, see the recommended oven temperature curve in the specified solder paste specifications.

Storage conditions

MOQ and packaging information

Product model	MOQ (pcs)	Shipping packaging	Modules per reel	Reels per carton
TY004	6,800	Tape and reel	1,700	4