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MD01 Module Datasheet

Last Updated on : 2021-09-11 06:57:12download

Product overview

MD01 is a low-power embedded Wi-Fi module that Tuya has developed. Built in with the Wi-Fi network protocol stack and rich library functions, it consists of a highly integrated wireless RF chip (RTL8710BN) and an external flash chip. With the maximum CPU clock rate of 125 MHz, MD01 also includes a low-power ARM CM4F, a WLAN MAC, a 1T1R WLAN module, a 256-KB SRAM, 2-MB flash memory, and rich peripherals.
MD01 is an RTOS platform that integrates all function libraries of the Wi-Fi MAC and TCP/IP. You can develop embedded Wi-Fi products as required.

Features

  • with an embedded Wi-Fi network protocol stack and rich library functions
  • The maximum clock rate: 125 MHz
  • Operating voltage: 4.5 to 5.5V
  • Peripherals: 1 UART
  • Wi-Fi connectivity
    • 802.11 b/g/n20/n40
    • Channels 1 to 14@2.4Ghz (Channels 1 to 11 for US/CA, and Channels 1 to 13 for EU/CN)
    • Support WPA/WPA2 security mode
    • Up to + 20dBm output power in 802.11b mode
    • Support SmartConfig and AP network configuration manners for Android and IOS devices
    • Onboard PCB antenna and external antenna with an IPEX connector
    • Operating temperature: -20℃ to 85℃

Applications

  • Intelligent building
  • Smart household and home appliances
  • Smart socket and light
  • Intelligent bus

Change history

Update date Updated content Version after update
March 13, 2019 First release V1.0.0
April 13, 2020 Updated data about power consumption in working mode V1.0.1
July 3, 2020 Updated the formart V2.0.0

Module interfaces

Dimensions and footprint

The electrical interface of the adapter board is the JC25-4P connector. The interval between every two pins is 2.54 mm.
The MD01 dimensions are 36±0.35 mm (W)×29.33±0.35 mm (L) ×4.5±0.15 mm (H). The thickness of the PCB is 1.0±0.1 mm. Its dimensions are shown in the following figure:
MD01 Module Datasheet
MD01 Module Datasheet

Pin definition

Pin number Symbol Type Function
1 GND P Power supply reference ground
2 RXD I/O Receiving interface for communication of the module, input the level of 5V TTL
3 TXD I/O Transmitting interface for communication of the module, output the level of 5V TTL
4 5V P Power supply pin (5V)

Note: P indicates power supply pins and I/O indicates input/output pins.

Definitions on test pins

Pin number Symbol Type Function
5 3.3V P Power supply pin inside the module (3.3V)
6 GND P Power supply reference ground
8 RX I/O Firmware authorization interface of the module
9 TX I/O Firmware authorization interface of the module
8 Log_TX I/O The interface for burning firmware or displaying information.
9 Log_RX I/O The interface for burning firmware or displaying information.
10 P3 I/O Hardware reset pin

Note: P indicates a power supply pin and I/O indicates an input/output pin.

Electrical parameters

Absolute electrical parameters

Parameter Description Minimum value Maximum value Unit
Ts Storage temperature -40 125
VBAT Supply voltage -0.3 5.5 V
ESD voltage (human body model) TAMB-25℃ - 2 KV
ESD voltage (machine model) TAMB-25℃ - 0.5 KV

Normal working conditions

Parameter Description Minimum value Typical value Maximum value Unit
Ta Working temperature -20 - 85
VBAT Supply voltage 4.5 5.0 5.5 V
VIL Voltage Input Low -0.3 - VCC*0.25 V
VIH Voltage Input High VCC*0.75 - VCC V
VOL Voltage Output Low - - VCC*0.1 V
VOH Voltage Output High VCC*0.8 - VCC V
Imax Drive current - - 16 mA
Cpad Input pin capacitance - 2 - pF

TX power consumption

Working status Mode Rate Transmit power Average value Peak value (typical value) Unit
Transmit 11b 11Mbps +18dBm 343 - mA
Transmit 11b 11Mbps +17dBm 295 - mA
Transmit 11g 54Mbps +15dBm 255 - mA
Transmit 11g 54Mbps +17.5dBm 267 - mA
Transmit 11n BW20 MCS7 +13dBm 244 - mA
Transmit 11n BW20 MCS7 +16.5dBm 257 - mA
Transmit 11n BW40 MCS7 +13dBm 220 - mA
Transmit 11n BW40 MCS7 +16.5dBm 230 - mA

TX power consumption

Working status Mode Rate Receive Average value Peak value (Typical value) Unit
Receive CPU Sleep 11Mbps Constantly receive 90 - mA
Receive CPU Active MCS7 BW20 Constantly receive 120 - mA

Power consumption in working mode

Working mode Working status, Ta = 25°C Average value Maximum value (Typical value) Unit
EZ The module is in fast connection state 115 305 mA
Idle state of network connection The module is in idle state of network connection 68 292 mA
Operation state of network connection The module is connecting to the network 120 327 mA
Disconnected state The module is disconnected 126 320 mA

Note: The peak lasts about 5 to 10ms. The above parameters may vary with different firmware functions.

RF parameters

Basic RF features

Parameter Description
Working frequency 2.412 to 2.484 GHz
Wi-Fi standard IEEE 802.11 b/g/n (channels 1 to 14)
Data transmission rate 11b: 1, 2, 5.5, and 11 (Mbps); 11g: 6, 9, 12, 18, 24, 36, 48, and 54 (Mbps); 11n: HT20 MCS 0 to 7; 11n: HT40 MCS 0 to 7
Antenna type Onboard PCB antenna

TX performance

TX performance

Parameter Minimum value Typical value Maximum value Unit
Average output power, 802.11b CCK Mode 11M - 17.5 - dBm
Average output power, 802.11g OFDM Mode 54M - 14.5 - dBm
Average output power, 802.11n OFDM Mode MCS7 - 13.5 - dBm
Frequency error -20 - 20 ppm

RX performance

RX sensitivity

Parameter Minimum value Typical value Maximum value Unit
PER<8%, RX sensitivity, 802.11b DSSS Mode 1M - -91 - dBm
PER<10%, RX sensitivity, 802.11g OFDM Mode 54M - -76 - dBm
PER<10%, RX sensitivity, 802.11n OFDM Mode MCS7 - -73 - dBm

Antenna information

Antenna type

MD01 supports two types of antennas: Onboard PCB antenna and external antenna. By default, the onboard PCB antenna is preferred.

Antenna interference reduction

To ensure optimal Wi-Fi performance when the Wi-Fi module uses an onboard PCB antenna, it is recommended that the antenna be at least 15 mm away from other metal parts.
To prevent adverse impact on the antenna radiation performance, avoid copper or traces within the antenna area of the PCB.
MD01 Module Datasheet
MD01 Module Datasheet

Packaging information and production instructions

Mechanical dimensions

MD01 Module Datasheet

Specifications of terminal
The terminal has 4 pins with a spacing of JC25-2. 54 mm. Detailed parameters are as follows:
MD01 Module Datasheet

Production instructions

Storage conditions for a delivered module are as follows:

  • The moisture-proof bag must be placed in an environment where the temperature is below 30°C and the RH is lower than 85%.
  • The shelf life of a dry-packaged product is 6 months from the date when the product is packaged and sealed.

    Caution:

    • In the production process, all operators must wear electrostatic rings.
    • During operation, strictly prevent the module from getting wet or dirty.

Recommended oven temperature curve

We mount the PCB with the SMT according to the following temperature curve. The peak temperature is 245°C.

MD01 Module Datasheet

Storage conditions

MD01 Module Datasheet

MOQ and packaging information

Product model MOQ (pcs) Shipping packaging method Modules per carton (pcs) Reels per carton (reel)
MD01 400 Bubble bags 200 2