MD01 Module Datasheet

Product overview

MD01 is a low-power embedded Wi-Fi module that Tuya has developed. Built in with the Wi-Fi network protocol stack and rich library functions, it consists of a highly integrated wireless RF chip (RTL8710BN) and an external flash chip. With the maximum CPU clock rate of 125 MHz, MD01 also includes a low-power ARM CM4F, a WLAN MAC, a 1T1R WLAN module, a 256-KB SRAM, 2-MB flash memory, and rich peripherals.
MD01 is an RTOS platform that integrates all function libraries of the Wi-Fi MAC and TCP/IP. You can develop embedded Wi-Fi products as required.

Features

• with an embedded Wi-Fi network protocol stack and rich library functions
• The maximum clock rate: 125 MHz
• Operating voltage: 4.5 to 5.5V
• Peripherals: 1 UART
• Wi-Fi connectivity
  • 802.11 b/g/n20/n40
  • Channels 1 to 14@2.4Ghz (Channels 1 to 11 for US/CA, and Channels 1 to 13 for EU/CN)
  • Support WPA/WPA2 security mode
  • Up to + 20dBm output power in 802.11b mode
  • Support SmartConfig and AP network configuration manners for Android and IOS devices
  • Onboard PCB antenna and external antenna with an IPEX connector
  • Operating temperature: -20℃ to 85℃

Applications

• Intelligent building
• Smart household and home appliances
• Smart socket and light
• Intelligent bus

Change history

Update date	Updated content	Version after update
March 13, 2019	First release	V1.0.0
April 13, 2020	Updated data about power consumption in working mode	V1.0.1
July 3, 2020	Updated the formart	V2.0.0

Module interfaces

Dimensions and footprint

The electrical interface of the adapter board is the JC25-4P connector. The interval between every two pins is 2.54 mm.
The MD01 dimensions are 36±0.35 mm (W)×29.33±0.35 mm (L) ×4.5±0.15 mm (H). The thickness of the PCB is 1.0±0.1 mm. Its dimensions are shown in the following figure:

Pin definition

Pin number	Symbol	Type	Function
1	GND	P	Power supply reference ground
2	RXD	I/O	Receiving interface for communication of the module, input the level of 5V TTL
3	TXD	I/O	Transmitting interface for communication of the module, output the level of 5V TTL
4	5V	P	Power supply pin (5V)

Note: P indicates power supply pins and I/O indicates input/output pins.

Definitions on test pins

Pin number	Symbol	Type	Function
5	3.3V	P	Power supply pin inside the module (3.3V)
6	GND	P	Power supply reference ground
8	RX	I/O	Firmware authorization interface of the module
9	TX	I/O	Firmware authorization interface of the module
8	Log_TX	I/O	The interface for burning firmware or displaying information.
9	Log_RX	I/O	The interface for burning firmware or displaying information.
10	P3	I/O	Hardware reset pin

Note: P indicates a power supply pin and I/O indicates an input/output pin.

Electrical parameters

Absolute electrical parameters

Parameter	Description	Minimum value	Maximum value	Unit
Ts	Storage temperature	-40	125	℃
VBAT	Supply voltage	-0.3	5.5	V
ESD voltage (human body model)	TAMB-25℃	-	2	KV
ESD voltage (machine model)	TAMB-25℃	-	0.5	KV

Normal working conditions

Parameter	Description	Minimum value	Typical value	Maximum value	Unit
Ta	Working temperature	-20	-	85	℃
VBAT	Supply voltage	4.5	5.0	5.5	V
VIL	Voltage Input Low	-0.3	-	VCC*0.25	V
VIH	Voltage Input High	VCC*0.75	-	VCC	V
VOL	Voltage Output Low	-	-	VCC*0.1	V
VOH	Voltage Output High	VCC*0.8	-	VCC	V
Imax	Drive current	-	-	16	mA
Cpad	Input pin capacitance	-	2	-	pF

TX power consumption

Working status	Mode	Rate	Transmit power	Average value	Peak value (typical value)	Unit
Transmit	11b	11Mbps	+18dBm	343	-	mA
Transmit	11b	11Mbps	+17dBm	295	-	mA
Transmit	11g	54Mbps	+15dBm	255	-	mA
Transmit	11g	54Mbps	+17.5dBm	267	-	mA
Transmit	11n BW20	MCS7	+13dBm	244	-	mA
Transmit	11n BW20	MCS7	+16.5dBm	257	-	mA
Transmit	11n BW40	MCS7	+13dBm	220	-	mA
Transmit	11n BW40	MCS7	+16.5dBm	230	-	mA

TX power consumption

Working status	Mode	Rate	Receive	Average value	Peak value (Typical value)	Unit
Receive	CPU Sleep	11Mbps	Constantly receive	90	-	mA
Receive	CPU Active	MCS7 BW20	Constantly receive	120	-	mA

Power consumption in working mode

Working mode	Working status, Ta = 25°C	Average value	Maximum value (Typical value)	Unit
EZ	The module is in fast connection state	115	305	mA
Idle state of network connection	The module is in idle state of network connection	68	292	mA
Operation state of network connection	The module is connecting to the network	120	327	mA
Disconnected state	The module is disconnected	126	320	mA

Note: The peak lasts about 5 to 10ms. The above parameters may vary with different firmware functions.

RF parameters

Basic RF features

Parameter	Description
Working frequency	2.412 to 2.484 GHz
Wi-Fi standard	IEEE 802.11 b/g/n (channels 1 to 14)
Data transmission rate	11b: 1, 2, 5.5, and 11 (Mbps); 11g: 6, 9, 12, 18, 24, 36, 48, and 54 (Mbps); 11n: HT20 MCS 0 to 7; 11n: HT40 MCS 0 to 7
Antenna type	Onboard PCB antenna

TX performance

TX performance

Parameter	Minimum value	Typical value	Maximum value	Unit
Average output power, 802.11b CCK Mode 11M	-	17.5	-	dBm
Average output power, 802.11g OFDM Mode 54M	-	14.5	-	dBm
Average output power, 802.11n OFDM Mode MCS7	-	13.5	-	dBm
Frequency error	-20	-	20	ppm

RX performance

RX sensitivity

Parameter	Minimum value	Typical value	Maximum value	Unit
PER<8%, RX sensitivity, 802.11b DSSS Mode 1M	-	-91	-	dBm
PER<10%, RX sensitivity, 802.11g OFDM Mode 54M	-	-76	-	dBm
PER<10%, RX sensitivity, 802.11n OFDM Mode MCS7	-	-73	-	dBm

Antenna information

Antenna type

MD01 supports two types of antennas: Onboard PCB antenna and external antenna. By default, the onboard PCB antenna is preferred.

Antenna interference reduction

To ensure optimal Wi-Fi performance when the Wi-Fi module uses an onboard PCB antenna, it is recommended that the antenna be at least 15 mm away from other metal parts.
To prevent adverse impact on the antenna radiation performance, avoid copper or traces within the antenna area of the PCB.

Packaging information and production instructions

Mechanical dimensions

Specifications of terminal
The terminal has 4 pins with a spacing of JC25-2. 54 mm. Detailed parameters are as follows:

Production instructions

Storage conditions for a delivered module are as follows:

• The moisture-proof bag must be placed in an environment where the temperature is below 30°C and the RH is lower than 85%.
• The shelf life of a dry-packaged product is 6 months from the date when the product is packaged and sealed.

  Caution:

  • In the production process, all operators must wear electrostatic rings.
  • During operation, strictly prevent the module from getting wet or dirty.

Recommended oven temperature curve

We mount the PCB with the SMT according to the following temperature curve. The peak temperature is 245°C.

Storage conditions

MOQ and packaging information

Product model	MOQ (pcs)	Shipping packaging method	Modules per carton (pcs)	Reels per carton (reel)
MD01	400	Bubble bags	200	2