Last Updated on : 2024-09-02 05:45:11download
T3-E2 module is a Wi-Fi 6 and Bluetooth Low Energy (LE) combo module developed by Tuya Smart. It is composed of a highly integrated radio-frequency identification (RFID) chip T3 and a few peripheral components. It can run in the station (STA) mode and access point (AP) mode.
T3-E2 has a built-in 32-bit MCU with a maximum running speed of 320 MHz, built-in 4 MB flash memory, and 640 KB SRAM. The module supports cloud connectivity, and the MCU’s extended instructions for signal processing enable it to efficiently implement audio encoding and decoding. Various peripherals are available, such as PWM, UART, SDIO, I2C, ADC, and SPI. Up to five channels of 32-bit PWM output make the chip ideal for high-quality LED control.
The T3-E2 dimensions are 13.2±0.35 mm (W) × 16.6±0.35 mm (L) × 2.6±0.15 mm (H). The figure below shows the dimensions of the T3-E2 module.
Pin No. | Symbol | I/O type | Description |
---|---|---|---|
1 | GND | P | Ground pin. |
2 | GND | P | Ground pin. |
3 | 3V3 | P | 3.3V power pin. |
4 | TX2 | I/O | UART_TX2 , corresponding to P41 (Pin 39) on the IC. |
5 | RX2 | I/O | UART_RX2 , corresponding to P40 (Pin 40) on the IC. |
6 | P18 | I/O | Support hardware PWM, corresponding to Pin 37 on the IC. |
7 | P19 | I/O | GPIO pin, corresponding to Pin 38 on the IC. |
8 | CEN | I/O | The reset pin, active low, and pulled up internally. Corresponding to Pin 26 on the IC. |
9 | NC | NC | NC. |
10 | NC | NC | NC. |
11 | GND | P | Ground pin. |
12 | P48 | I/O | GPIO pin, corresponding to Pin 10 on the IC. |
13 | P24 | I/O | Support hardware PWM, corresponding to Pin 11 on the IC. |
14 | GND | P | Ground pin. |
15 | NC | NC | NC. |
16 | P25 | I/O | GPIO pin, corresponding to Pin 12 on the IC. |
17 | NC | NC | NC. |
18 | P28 | I/O | GPIO pin, corresponding to Pin 13 on the IC. |
19 | P32 | I/O | Support hardware PWM, corresponding to Pin 14 on the IC. |
20 | P34 | I/O | Support hardware PWM, corresponding to Pin 15 on the IC. |
21 | P36 | I/O | Support hardware PWM, corresponding to Pin 16 on the IC. |
22 | RX1 | I/O | UART_RX1 , corresponding to P1 (Pin 17) on the IC. |
23 | TX1 | I/O | UART_TX1 to print logs, corresponding to P0 (Pin 18) on the IC. |
24 | NC | NC | NC. |
25 | NC | NC | NC. |
26 | P12 | I/O | A normal GPIO pin, corresponding to Pin 21 on the IC. |
27 | P13 | I/O | A normal GPIO pin, corresponding to Pin 22 on the IC. |
28 | NC | NC | NC. |
29 | NC | NC | NC. |
30 | RX0 | I/O | UART_RX0 to receive user data, corresponding to P10 (Pin 20) on the IC. |
31 | TX0 | I/O | UART_TX0 to send user data, corresponding to P11 (Pin 19) on the IC. |
32 | P14 | I/O | A normal GPIO pin, corresponding to Pin 33 on the IC. It can be reused as SPI_SCK . |
33 | P15 | I/O | A normal GPIO pin, corresponding to Pin 34 on the IC. It can be reused as SPI_CS . |
34 | P16 | I/O | A normal GPIO pin, corresponding to Pin 35 on the IC. It can be reused as SPI_MOSI . |
35 | P17 | I/O | A normal GPIO pin, corresponding to Pin 36 on the IC. It can be reused as SPI_MISO . |
36 to 53 | GND | P | Ground pin. |
P
indicates the power pin, and I/O indicates the input and output pin.For detailed usage, refer to the SDK instructions.
Pin No. | GPIO | Feature 1 | Feature 2 | Feature 3 | Feature 4 | Feature 5 |
---|---|---|---|---|---|---|
4 | P41 | UART2_RX | - | - | - | - |
5 | P40 | UART2_TX | - | - | - | - |
6 | P18 | SDIO_D2 | PWM0_0 | - | - | - |
7 | P19 | SDIO_D3 | - | - | - | - |
12 | P48 | - | - | - | - | - |
13 | P24 | - | PWM0_4 | ADC2 | - | - |
16 | P25 | IRDA | - | ADC1 | - | - |
18 | P28 | - | - | ADC4 | TOUCH2* | - |
19 | P32 | - | PWM1_0 | - | TOUCH6* | - |
20 | P34 | - | PWM1_2 | - | TOUCH8* | - |
21 | P36 | - | PWM1_4 | - | TOUCH10* | - |
22 | P1 | UART1_RX | I2C1_SDA | - | - | ADC13 |
23 | P0 | UART1_TX | I2C1_SCL | - | - | ADC12 |
26 | P12 | UART0_RTS | - | - | TOUCH0* | ADC14 |
27 | P13 | UART0_CTS | - | - | TOUCH1* | ADC15 |
30 | P10 | UART0_RX | - | - | - | - |
31 | P11 | UART0_TX | - | - | - | - |
32 | P14 | SDIO_CLK | SPI0_SCK | - | I2C1_SCL | - |
33 | P15 | SDIO_CMD | SPI0_CSN | - | I2C1_SDA | - |
34 | P16 | SDIO_D0 | SPI0_MOSI | - | - | - |
35 | P17 | SDIO_D1 | SPI0_MISO | - | - | - |
*
indicates this feature is not supported currently.
Parameter | Description | Minimum value | Maximum value | Unit |
---|---|---|---|---|
Ts | Storage temperature | -55 | 125 | °C |
VBAT | Supply voltage | -0.3 | 3.6 | V |
Electrostatic discharge voltage (human body model) | TAMB -25°C | -4 | 4 | kV |
Electrostatic discharge voltage (machine model) | TAMB -25°C | -200 | 200 | V |
Parameter | Description | Minimum value | Typical value | Maximum value | Unit |
---|---|---|---|---|---|
Ta | Operating temperature | -40 | - | 105 | °C |
VBAT | Supply voltage | 2.0 | 3.3 | 3.6 | V |
VIL | I/O low-level input | -0.3 | - | 0.3 VBAT | V |
VIH | I/O high-level input | 0.7 VBAT | - | VBAT + 0.3 | V |
VOL | I/O low-level output | - | - | 0.1 VBAT | V |
VOH | I/O high-level output | 0.9 VBAT - 0.3 | - | - | V |
Imax | I/O drive current | 5 | - | 20 | mA |
Operating status | Mode | Rate | Transmit/Receive power | Average value | Peak (Typical) value | Unit |
---|---|---|---|---|---|---|
Transmit | 802.11b | 11 Mbit/s | +17 dBm | 230 | 241 | mA |
Transmit | 802.11g | 54 Mbit/s | +15 dBm | 200 | 210 | mA |
Transmit | 802.11n | MCS7 | +14 dBm | 170 | 186 | mA |
Transmit | 802.11ax | MCS7 | +13 dBm | 160 | 170 | mA |
Receive | 802.11b | 11 Mbit/s | Continuous reception | 14 | 15 | mA |
Receive | 802.11g | 54 Mbit/s | Continuous reception | 14 | 15 | mA |
Receive | 802.11n | MCS7 | Continuous reception | 14 | 15 | mA |
Receive | 802.11ax | MCS7 | Continuous reception | 14 | 15 | mA |
The working mode. Valid values: | Status (Ta = 25°C) | Average value | Max (Typical) value | Unit |
---|---|---|---|---|
Quick pairing (Bluetooth) | The module is in EZ mode. The network status indicator blinks quickly. | 75 | 360 | mA |
Quick pairing (AP) | The module is in AP mode. The network status indicator blinks slowly. | 105 | 370 | mA |
Connected | The module is connected to the cloud. The network status indicator is steady on. | 45 | 300 | mA |
Weakly connected | The connection between the module and the hotspot is intermittent. The network status indicator is steady on. | 135 | 360 | mA |
Disconnected | The module is disconnected from the cloud. The network status indicator is steady off. | 47 | 320 | mA |
Module disabled | The module’s clock enable (CEN) pin is pulled down. | 330 | - | μA |
Parameter | Description |
---|---|
Operating frequency | 2.412 to 2.484 GHz |
Wi-Fi standard | IEEE 802.11b/g/n/ax (channels 1–14) |
Data transmission rate |
|
Antenna type | PCB antenna |
Parameter | Minimum value | Typical value | Maximum value | Unit |
---|---|---|---|---|
RF average output power, 802.11b CCK mode, 11 Mbit/s | - | 17 | - | dBm |
RF average output power, 802.11g OFDM mode, 54 Mbit/s | - | 15 | - | dBm |
RF average output power, 802.11n OFDM mode, HT20 MCS7 | - | 14 | - | dBm |
RF average output power, 802.11n OFDM mode, HT40 MCS7 | - | 13 | - | dBm |
RF average output power, 802.11ax OFDMA mode, HE20 MCS7 | - | 14 | - | dBm |
RF average output power, 802.11ax OFDMA mode, HE40 MCS7 | - | 13 | - | dBm |
Frequency error | -20 | - | 20 | ppm |
Parameter | Minimum value | Typical value | Maximum value | Unit |
---|---|---|---|---|
PER < 8%, RX sensitivity, 802.11b DSSS mode, 11 Mbit/s | - | -89 | - | dBm |
PER < 10%, RX sensitivity, 802.11g OFDM mode, 54 Mbit/s | - | -76 | - | dBm |
PER < 10%, RX sensitivity, 802.11n OFDM mode, HT20 MCS7 | - | -75 | - | dBm |
PER < 10%,RX sensitivity, 802.11n OFDM Mode, HT40 MCS7 | - | -73 | - | dBm |
PER < 10%,RX sensitivity, 802.11ax OFDMA Mode, HE20 MCS7 | - | -74 | - | dBm |
PER < 10%,RX sensitivity, 802.11ax OFDMA Mode, HE40 MCS7 | - | -73 | - | dBm |
Parameter | Minimum value | Typical value | Maximum value | Unit |
---|---|---|---|---|
Operating frequency | 2402 | - | 2480 | MHz |
Transmission rate over the air | - | 1 | - | Mbit/s |
Transmission power | -20 | 6 | 15 | dBm |
Frequency error | -150 | - | 150 | KHz |
Parameter | Minimum value | Typical value | Maximum value | Unit |
---|---|---|---|---|
RX sensitivity | - | -96 | - | dBm |
Max RF signal input | -10 | - | - | dBm |
Intermodulation | - | - | -23 | dBm |
Adjacent-channel rejection ratio | - | 10 | - | dB |
The T3-E2 module uses an onboard PCB antenna.
When a PCB antenna is used on a Wi-Fi module, we recommend that the module antenna is at least 15 mm away from other metal components. This can optimize the Wi-Fi performance.
Make sure that the enclosure surrounding the antenna is not traced or filled with copper. Otherwise, the RF performance might be degraded.
Dimensions of the T3-E2 PCB are 13.2±0.35 mm (W) × 16.6±0.35 mm (L) × 0.8±0.1 mm (H).
The figure below shows the recommended footprint of the T3-E2 module.
The area indicated as keep-out in the diagram above does not require tinning and should not have any traces routed through it.
For the modules that can be packaged with the surface-mount technology (SMT) or in in-line form, you can select either of them according to the PCB design solutions of customers. If a PCB is designed to be SMT-packaged, package the module with the SMT. If a PCB is designed to use an in-line package, use wave soldering. Complete soldering within 24 hours after the module is unpacked. Otherwise, we recommend that you place the module in a drying cupboard with a relative humidity level below 10%, or pack the module in vacuum again. Then, record the packing time and duration of exposure. The total exposure time cannot exceed 168 hours.
A delivered module must meet the following storage requirements:
The moisture-proof bag must be placed in an environment where the temperature is below 40°C and the relative humidity is lower than 90%.
The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed.
A humidity indicator card (HIC) is put in the sealed package.
The module needs to be baked in the following cases:
The baking parameter settings are described below:
In the whole production process, take electrostatic discharge (ESD) protective measures.
To guarantee the pass rate, we recommend that you use the SPI and AOI to monitor the quality of solder paste printing and mounting.
Select a proper soldering technique according to the process. For more information, refer to the recommended oven temperature curve of either reflow soldering or wave soldering. The set temperatures might deviate from the actual temperature measurements. All temperatures shown in this module datasheet are obtained through actual measurements.
Technique 1: SMT process (recommended oven temperature curve of reflow soldering)
Set the oven temperatures according to the following curve.
A: temperature axis
B: time axis
C: alloy liquidus temperature from 217°C to 220°C
D: ramp-up slope from 1°C/s to 3°C/s
E: keep a constant temperature from 150°C to 200°C for a time period of 60s to 120s
F: temperature above liquidus temperature for 50s to 70s
G: peak temperature from 235°C to 245°C
H: ramp-down slope from 1°C/s to 4°C/s
The curve above is based on solder paste SAC305. For more information about other solder pastes, see the recommended oven temperature curve in the specified solder paste specifications.
Technique 2: Wave soldering process (oven temperature curve of wave soldering)
Set the oven temperatures according to the following temperature curve of wave soldering. The peak temperature is 260°C±5°C.
Suggestions on wave soldering | Suggestions on manual repair soldering | ||
---|---|---|---|
Preheat temperature | 80°C to 130°C | Soldering temperature | 360°C ± 20°C |
Preheat duration | 75s to 100s | Soldering duration | Less than 3s/point |
Contact duration at the peak | 3s to 5s | N/A | N/A |
Solder tank temperature | 260°C ± 5°C | N/A | N/A |
Ramp-up slope | ≤ 2°C/s | N/A | N/A |
Ramp-down slope | ≤ 6°C/s | N/A | N/A |
Product model | MOQ (pcs) | Shipping packaging | Modules per reel | Reels per carton |
---|---|---|---|---|
T3-E2 | 4,400 | Tape and reel | 1,100 | 4 |
FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this device. The module is limited to installation in mobile or fixed applications.
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.
Note: This device has been tested and found to comply with the limits for a Class B digital device, according to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This device generates, uses, and can radiate radio frequency energy and, if not installed and used following the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation.
If this device does cause harmful interference to radio or television reception, which can be determined by turning the device off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
Radiation Exposure Statement
This device complies with FCC radiation exposure limits set forth for an uncontrolled rolled environment. This device should be installed and operated with a minimum distance of 20cm between the radiator and your body.
Important Note
This radio module must not be installed to co-locate and operate simultaneously with other radios in the host system except by following FCC multi-transmitter product procedures. Additional testing and device authorization may be required to operate simultaneously with other radios.
The availability of some specific channels and/or operational frequency bands are country dependent and are firmware programmed at the factory to match the intended destination. The firmware setting is not accessible to the end-user.
The host product manufacturer is responsible for compliance with any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed. The separate approval is required for all other operating configurations including portable configurations with respect to Part 2.1093 and different antenna configurations.
The end-user manual shall include all required regulatory information/warnings as shown in this manual, including “This product must be installed and operated with a minimum distance of 20 cm between the radiator and user body”. The OEM integrator is responsible for ensuring that the end-user has no manual instructions to remove or install the module.
This device has got an FCC ID: 2ANDL-T3-E2. The end product must be labeled in a visible area with the following: “Contains Transmitter Module FCC ID: 2ANDL-T3-E2”.
This device is intended only for OEM integrators under the following conditions:
The antenna must be installed such that 20cm is maintained between the antenna and users, and the transmitter module may not be co-located with any other transmitter or antenna.
As long as the 2 conditions above are met, further transmitter tests will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed.
Declaration of Conformity European Notice
Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module product is in compliance with essential requirements and other relevant provisions of Directive 2014/53/EU,2011/65/EU. A copy of the Declaration of Conformity can be found at https://www.tuya.com.
This product must not be disposed of as normal household waste, in accordance with the EU directive for waste electrical and electronic equipment (WEEE-2012/19/EU). Instead, it should be disposed of by returning it to the point of sale, or to a municipal recycling collection point.
The device could be used with a separation distance of 20cm from the human body.
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