T3-E2 Module Datasheet

Last Updated on : 2024-06-14 01:21:35download

T3-E2 module is a Wi-Fi 6 and Bluetooth Low Energy (LE) combo module developed by Tuya Smart. It is composed of a highly integrated radio-frequency identification (RFID) chip T3 and a few peripheral components. It can run in the station (STA) mode and access point (AP) mode.

Overview

T3-E2 has a built-in 32-bit MCU with a maximum running speed of 320 MHz, built-in 4 MB flash memory, and 640 KB SRAM. The module supports cloud connectivity, and the MCU’s extended instructions for signal processing enable it to efficiently implement audio encoding and decoding. Various peripherals are available, such as PWM, UART, SDIO, I2C, ADC, and SPI. Up to five channels of 32-bit PWM output make the chip ideal for high-quality LED control.

Features

  • Built-in low-power 32-bit CPU that also acts as an application processor.
  • Clock rate of 320 MHz.
  • Operating voltage range: 2.0V to 3.6V.
  • Peripherals: 5 PWM pins, 3 UART pins, 1 SDIO pin, 1 I2C pin, 7 ADC pins, and 1 SPI
  • Wi-Fi connectivity
    • IEEE 802.11b/g/n/ax.
    • Channels 1 to 14 at 2.4 GHz.
    • Support WEP, WPA/WPA2, WPA/WPA2 PSK (AES), and WPA3 security modes.
    • The maximum output power is +17 dBm for IEEE 802.11b transmission.
    • Support STA, AP, STA + AP combo, and direct working modes.
    • Two pairing modes are supported, namely Bluetooth and access point (AP) mode. Both modes are suitable for pairing with Android and iOS mobile phones.
    • The onboard PCB antenna has a peak gain of 0 dBi.
    • Operating temperature range: -40°C to 105°C.
  • Bluetooth connectivity
    • Bluetooth Core Specification v5.4.
    • The transmitter power in Bluetooth mode is 6 dBm.
    • Integral Wi-Fi and Bluetooth coexistence interface.
    • The onboard PCB antenna has a peak gain of 0 dBi.

Scope of applications

  • Smart building
  • Smart home and electrical appliance
  • Smart socket and light
  • Industrial wireless control
  • Baby monitor
  • IP camera
  • Smart bus

Module interfaces

Dimensions and footprint

The T3-E2 dimensions are 13.2±0.35 mm (W) × 16.6±0.35 mm (L) × 2.6±0.15 mm (H). The figure below shows the dimensions of the T3-E2 module.
T3-E2 Module Datasheet

Pin definition

Pin No. Symbol I/O type Description
1 GND P Ground pin.
2 GND P Ground pin.
3 3V3 P 3.3V power pin.
4 TX2 I/O UART_TX2, corresponding to P41 (Pin 39) on the IC.
5 RX2 I/O UART_RX2, corresponding to P40 (Pin 40) on the IC.
6 P18 I/O Support hardware PWM, corresponding to Pin 37 on the IC.
7 P19 I/O GPIO pin, corresponding to Pin 38 on the IC.
8 CEN I/O The reset pin, active low, and pulled up internally. Corresponding to Pin 26 on the IC.
9 NC NC NC.
10 NC NC NC.
11 GND P Ground pin.
12 P48 I/O GPIO pin, corresponding to Pin 10 on the IC.
13 P24 I/O Support hardware PWM, corresponding to Pin 11 on the IC.
14 GND P Ground pin.
15 NC NC NC.
16 P25 I/O GPIO pin, corresponding to Pin 12 on the IC.
17 NC NC NC.
18 P28 I/O GPIO pin, corresponding to Pin 13 on the IC.
19 P32 I/O Support hardware PWM, corresponding to Pin 14 on the IC.
20 P34 I/O Support hardware PWM, corresponding to Pin 15 on the IC.
21 P36 I/O Support hardware PWM, corresponding to Pin 16 on the IC.
22 RX1 I/O UART_RX1, corresponding to P1 (Pin 17) on the IC.
23 TX1 I/O UART_TX1 to print logs, corresponding to P0 (Pin 18) on the IC.
24 NC NC NC.
25 NC NC NC.
26 P12 I/O A normal GPIO pin, corresponding to Pin 21 on the IC.
27 P13 I/O A normal GPIO pin, corresponding to Pin 22 on the IC.
28 NC NC NC.
29 NC NC NC.
30 RX0 I/O UART_RX0 to receive user data, corresponding to P10 (Pin 20) on the IC.
31 TX0 I/O UART_TX0 to send user data, corresponding to P11 (Pin 19) on the IC.
32 P14 I/O A normal GPIO pin, corresponding to Pin 33 on the IC. It can be reused as SPI_SCK.
33 P15 I/O A normal GPIO pin, corresponding to Pin 34 on the IC. It can be reused as SPI_CS.
34 P16 I/O A normal GPIO pin, corresponding to Pin 35 on the IC. It can be reused as SPI_MOSI.
35 P17 I/O A normal GPIO pin, corresponding to Pin 36 on the IC. It can be reused as SPI_MISO.
36 to 53 GND P Ground pin.

P indicates the power pin, and I/O indicates the input and output pin.

Reuse of GPIO features

For detailed usage, refer to the SDK instructions.

Pin No. GPIO Feature 1 Feature 2 Feature 3 Feature 4 Feature 5
4 P41 UART2_RX - - - -
5 P40 UART2_TX - - - -
6 P18 SDIO_D2 PWM0_0 - - -
7 P19 SDIO_D3 - - - -
12 P48 - - - - -
13 P24 - PWM0_4 ADC2 - -
16 P25 IRDA - ADC1 - -
18 P28 - - ADC4 TOUCH2* -
19 P32 - PWM1_0 - TOUCH6* -
20 P34 - PWM1_2 - TOUCH8* -
21 P36 - PWM1_4 - TOUCH10* -
22 P1 UART1_RX I2C1_SDA - - ADC13
23 P0 UART1_TX I2C1_SCL - - ADC12
26 P12 UART0_RTS - - TOUCH0* ADC14
27 P13 UART0_CTS - - TOUCH1* ADC15
30 P10 UART0_RX - - - -
31 P11 UART0_TX - - - -
32 P14 SDIO_CLK SPI0_SCK - I2C1_SCL -
33 P15 SDIO_CMD SPI0_CSN - I2C1_SDA -
34 P16 SDIO_D0 SPI0_MOSI - - -
35 P17 SDIO_D1 SPI0_MISO - - -

* indicates this feature is not supported currently.

Electrical parameters

Absolute electrical parameters

Parameter Description Minimum value Maximum value Unit
Ts Storage temperature -55 125 °C
VBAT Supply voltage -0.3 3.6 V
Electrostatic discharge voltage (human body model) TAMB -25°C -4 4 kV
Electrostatic discharge voltage (machine model) TAMB -25°C -200 200 V

Normal operating conditions

Parameter Description Minimum value Typical value Maximum value Unit
Ta Operating temperature -40 - 105 °C
VBAT Supply voltage 2.0 3.3 3.6 V
VIL I/O low-level input -0.3 - 0.3 VBAT V
VIH I/O high-level input 0.7 VBAT - VBAT + 0.3 V
VOL I/O low-level output - - 0.1 VBAT V
VOH I/O high-level output 0.9 VBAT - 0.3 - - V
Imax I/O drive current 5 - 20 mA

Radio frequency (RF) power

Operating status Mode Rate Transmit/Receive power Average value Peak (Typical) value Unit
Transmit 802.11b 11 Mbit/s +17 dBm 230 241 mA
Transmit 802.11g 54 Mbit/s +15 dBm 200 210 mA
Transmit 802.11n MCS7 +14 dBm 170 186 mA
Transmit 802.11ax MCS7 +13 dBm 160 170 mA
Receive 802.11b 11 Mbit/s Continuous reception 14 15 mA
Receive 802.11g 54 Mbit/s Continuous reception 14 15 mA
Receive 802.11n MCS7 Continuous reception 14 15 mA
Receive 802.11ax MCS7 Continuous reception 14 15 mA

Operating current

The working mode. Valid values: Status (Ta = 25°C) Average value Max (Typical) value Unit
Quick pairing (Bluetooth) The module is in EZ mode. The network status indicator blinks quickly. 75 360 mA
Quick pairing (AP) The module is in AP mode. The network status indicator blinks slowly. 105 370 mA
Connected The module is connected to the cloud. The network status indicator is steady on. 45 300 mA
Weakly connected The connection between the module and the hotspot is intermittent. The network status indicator is steady on. 135 360 mA
Disconnected The module is disconnected from the cloud. The network status indicator is steady off. 47 320 mA
Module disabled The module’s clock enable (CEN) pin is pulled down. 330 - μA

RF parameters

Basic RF features

Parameter Description
Operating frequency 2.412 to 2.484 GHz
Wi-Fi standard IEEE 802.11b/g/n/ax (channels 1–14)
Data transmission rate
  • IEEE 802.11b: 1, 2, 5.5, and 11 Mbit/s
  • IEEE 802.11g: 6, 9, 12, 18, 24, 36, 48, and 54 Mbit/s
  • IEEE 802.11n: HT20 MCS0-7, HT40 MCS0-7
  • IEEE 802.11ax: HE20 MCS0-9, HE40 MCS0-9
Antenna type PCB antenna

Wi-Fi transmitter (TX) performance

Parameter Minimum value Typical value Maximum value Unit
RF average output power, 802.11b CCK mode, 11 Mbit/s - 17 - dBm
RF average output power, 802.11g OFDM mode, 54 Mbit/s - 15 - dBm
RF average output power, 802.11n OFDM mode, MCS7 (HT20) - 14 - dBm
RF average output power, 802.11ax OFDMA mode, MCS7 (HE20) - 13 - dBm
Frequency error -20 - 20 ppm

Wi-Fi receiver (RX) performance

Parameter Minimum value Typical value Maximum value Unit
PER < 8%, RX sensitivity, 802.11b DSSS mode, 11 Mbit/s - -89 - dBm
PER < 10%, RX sensitivity, 802.11g OFDM mode, 54 Mbit/s - -76 - dBm
PER < 10%, RX sensitivity, 802.11n OFDM mode, MCS7 (HT20) - -74 - dBm

Bluetooth transmitter (TX) performance

Parameter Minimum value Typical value Maximum value Unit
Operating frequency 2402 - 2480 MHz
Transmission rate over the air - 1 - Mbit/s
Transmission power -20 6 15 dBm
Frequency error -150 - 150 KHz

Bluetooth receiver (RX) performance

Parameter Minimum value Typical value Maximum value Unit
RX sensitivity - -96 - dBm
Max RF signal input -10 - - dBm
Intermodulation - - -23 dBm
Adjacent-channel rejection ratio - 10 - dB

Antenna information

Antenna type

The T3-E2 module uses an onboard PCB antenna.

Antenna interference reduction

When a PCB antenna is used on a Wi-Fi module, we recommend that the module antenna is at least 15 mm away from other metal components. This can optimize the Wi-Fi performance.

Make sure that the enclosure surrounding the antenna is not traced or filled with copper. Otherwise, the RF performance might be degraded.

Packing and production instructions

Mechanical dimensions

Dimensions of the T3-E2 PCB are 13.2±0.35 mm (W) × 16.6±0.35 mm (L) × 0.8±0.1 mm (H).

T3-E2 Module DatasheetT3-E2 Module Datasheet

The figure below shows the recommended footprint of the T3-E2 module.

T3-E2 Module Datasheet

Production instructions

  1. For the modules that can be packaged with the surface-mount technology (SMT) or in in-line form, you can select either of them according to the PCB design solutions of customers. If a PCB is designed to be SMT-packaged, package the module with the SMT. If a PCB is designed to use an in-line package, use wave soldering. Complete soldering within 24 hours after the module is unpacked. Otherwise, we recommend that you place the module in a drying cupboard with a relative humidity level below 10%, or pack the module in vacuum again. Then, record the packing time and duration of exposure. The total exposure time cannot exceed 168 hours.

    • Instruments or devices required for the SMT process:
      • Surface mount system
      • SPI
      • Reflow soldering machine
      • Thermal profiler
      • AOI
    • Instruments or devices required for the wave soldering process:
      • Wave soldering equipment
      • Wave soldering fixture
      • Constant-temperature soldering iron
      • Tin bar, tin wire, and flux
      • Thermal profiler
    • Instruments or devices required for the baking process:
      • Cabinet oven
      • Electro-static discharge (ESD) protection and heat-resistant trays
      • ESD protection and heat-resistant gloves
  2. A delivered module must meet the following storage requirements:

    • The moisture-proof bag must be placed in an environment where the temperature is below 40°C and the relative humidity is lower than 90%.

    • The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed.

    • A humidity indicator card (HIC) is put in the sealed package.

      T3-E2 Module Datasheet
  3. The module needs to be baked in the following cases:

    • The vacuum packaging bag is damaged before unpacking.
    • After unpacking, no HIC is found in the packaging bag.
    • After unpacking, the HIC indicates a humidity level of 10% or higher. In this case, the circle turns pink on the HIC.
    • The total exposure time has lasted for over 168 hours since unpacking.
    • More than 12 months have passed since the first sealing of the bag.
  4. The baking parameter settings are described below:

    • Baking temperature: 40°C for reel packaging with relative humidity ≤ 5%. And 125°C for tray packaging with relative humidity ≤ 5% (use the heat-resistant tray, rather than plastic containers).
    • Baking time: 168 hours for reel packaging and 12 hours for tray packaging.
    • Temperature for triggering an alert: 50°C for reel packaging and 135°C for tray packaging.
    • Production can begin after a module has cooled down to below 36°C under natural conditions.
    • If a module remains unused for over 168 hours after being baked, it needs to be baked again.
    • If a batch of modules is not baked after exposure for more than 168 hours, do not use reflow soldering or wave soldering to solder them. Because these modules are level-3 moisture-sensitive devices, they are very likely to get damp when exposed beyond the allowable time. In this case, if they are soldered at high temperatures, device failure or poor soldering performance might occur.
  5. In the whole production process, take electrostatic discharge (ESD) protective measures.

  6. To guarantee the pass rate, we recommend that you use the SPI and AOI to monitor the quality of solder paste printing and mounting.

Recommended oven temperature curve

Select a proper soldering technique according to the process. For more information, refer to the recommended oven temperature curve of either reflow soldering or wave soldering. The set temperatures might deviate from the actual temperature measurements. All temperatures shown in this module datasheet are obtained through actual measurements.

Technique 1: SMT process (recommended oven temperature curve of reflow soldering)

Set the oven temperatures according to the following curve.

T3-E2 Module Datasheet
  • A: temperature axis

  • B: time axis

  • C: alloy liquidus temperature from 217°C to 220°C

  • D: ramp-up slope from 1°C/s to 3°C/s

  • E: keep a constant temperature from 150°C to 200°C for a time period of 60s to 120s

  • F: temperature above liquidus temperature for 50s to 70s

  • G: peak temperature from 235°C to 245°C

  • H: ramp-down slope from 1°C/s to 4°C/s

    The curve above is based on solder paste SAC305. For more information about other solder pastes, see the recommended oven temperature curve in the specified solder paste specifications.

Technique 2: Wave soldering process (oven temperature curve of wave soldering)

Set the oven temperatures according to the following temperature curve of wave soldering. The peak temperature is 260°C±5°C.

T3-E2 Module Datasheet
Suggestions on wave soldering Suggestions on manual repair soldering
Preheat temperature 80°C to 130°C Soldering temperature 360°C ± 20°C
Preheat duration 75s to 100s Soldering duration Less than 3s/point
Contact duration at the peak 3s to 5s N/A N/A
Solder tank temperature 260°C ± 5°C N/A N/A
Ramp-up slope ≤ 2°C/s N/A N/A
Ramp-down slope ≤ 6°C/s N/A N/A

Storage conditions

T3-E2 Module Datasheet

MOQ and packaging information

Product model MOQ (pcs) Shipping packaging Modules per reel Reels per carton
T3-E2 4,400 Tape and reel 1,100 4

Appendix: Statement

FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this device. The module is limited to installation in mobile or fixed applications.

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

Note: This device has been tested and found to comply with the limits for a Class B digital device, according to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This device generates, uses, and can radiate radio frequency energy and, if not installed and used following the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation.

If this device does cause harmful interference to radio or television reception, which can be determined by turning the device off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

  • Reorient or relocate the receiving antenna.
  • Increase the separation between the device and receiver.
  • Connect the device to an outlet on a circuit different from that to which the receiver is connected.
  • Consult the dealer or an experienced radio/TV technician for help.

Radiation Exposure Statement

This device complies with FCC radiation exposure limits set forth for an uncontrolled rolled environment. This device should be installed and operated with a minimum distance of 20cm between the radiator and your body.

Important Note

This radio module must not be installed to co-locate and operate simultaneously with other radios in the host system except by following FCC multi-transmitter product procedures. Additional testing and device authorization may be required to operate simultaneously with other radios.

The availability of some specific channels and/or operational frequency bands are country dependent and are firmware programmed at the factory to match the intended destination. The firmware setting is not accessible to the end-user.

The host product manufacturer is responsible for compliance with any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed. The separate approval is required for all other operating configurations including portable configurations with respect to Part 2.1093 and different antenna configurations.

The end-user manual shall include all required regulatory information/warnings as shown in this manual, including “This product must be installed and operated with a minimum distance of 20 cm between the radiator and user body”. The OEM integrator is responsible for ensuring that the end-user has no manual instructions to remove or install the module.

This device has got an FCC ID: 2ANDL-T3-E2. The end product must be labeled in a visible area with the following: “Contains Transmitter Module FCC ID: 2ANDL-T3-E2”.

This device is intended only for OEM integrators under the following conditions:

The antenna must be installed such that 20cm is maintained between the antenna and users, and the transmitter module may not be co-located with any other transmitter or antenna.

As long as the 2 conditions above are met, further transmitter tests will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed.

Declaration of Conformity European Notice

T3-E2 Module Datasheet

Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module product is in compliance with essential requirements and other relevant provisions of Directive 2014/53/EU,2011/65/EU. A copy of the Declaration of Conformity can be found at https://www.tuya.com.

T3-E2 Module Datasheet

This product must not be disposed of as normal household waste, in accordance with the EU directive for waste electrical and electronic equipment (WEEE-2012/19/EU). Instead, it should be disposed of by returning it to the point of sale, or to a municipal recycling collection point.

The device could be used with a separation distance of 20cm from the human body.