T5-E1 Module Datasheet

Last Updated on : 2024-02-07 03:16:08download

T5-E1 is a highly integrated single-antenna single-band 2.4 GHz Wi-Fi 6 (IEEE 802.11b/g/n/ax) and Bluetooth 5.4 Low Energy (LE) combo IoT module. Featuring a multi-peripheral packaging and ultra-low-power chip, the T5-E1 module provides a highly integrated, efficient, secure, and lowest-power environment for IP cameras, HMI applications, smart locks, and other advanced IoT applications.

Features

CPU and on-chip memory

  • Built-in with Tuya’s custom T5QN88 chip, Armv8-M Star (M33F) processor, with clock frequency of up to 480 MHz
  • 4 MB Flash
  • 8 MB PSRAM
  • 640 KB Share SRAM
  • 64 KB ROM

Wi-Fi

  • IEEE 802.11b/g/n/ax compliant
  • 20 MHz and 40 MHz channel bandwidth
  • Support downlink multi-user multiple input, multiple output (DL MU-MIMO)
  • Support orthogonal frequency-division multiple access (OFDMA)
  • Support target wake time (TWT)
  • Integrated Bluetooth and Wi-Fi coexistence (packet traffic arbitration, PTA)
  • Transmit (TX) power up to +20 dBm
  • Receive (RX) sensitivity of -99 dBm

Bluetooth

  • Support Bluetooth LE 5.4 standard
  • Support Bluetooth LE 1 Mbit/s and 2 Mbit/s, long-range mode (125 Kbit/s and 500 Kbit/s)
  • TX power up to +15 dBm
  • RX sensitivity of -97 dBm

Peripherals

  • 48x GPIOs
  • 2x SPIs and 2x QSPIs
  • 3x UART interfaces: 1 channel has hardware flow control and supports flash download
  • 1x smart card controller
  • 1x SDIO interface, 2x I2C interfaces, and 1x CAN controller with CAN FD
  • 1x high-speed (HS) USB 2.0 interface
  • 1x display controller supporting RGB565 and 8080 interfaces
  • 1x segment LCD controller for up to 4 × 32 segments
  • 1x 8-bit CIS DVP interface
  • 1x 720p H.264 video encoder
  • 1x Ethernet MAC interface
  • 12x 32-bit PWM channels
  • 3x I2S interfaces
  • 2x audio ADCs and 1x audio DAC
  • 12-bit AUX ADC, up to 11 channels
  • 1x touch sensor, up to 16 touch sensing I/Os

Antenna type

  • Onboard antenna

Operating conditions

  • Operating/supply voltage range: 2.0V to 5.5V
  • Operating temperature range: -40°C to 105°C

Module certification

  • Wi-Fi & Bluetooth: FCC and CE
  • Environmental certification: REACH/RoHS
  • Bluetooth certification: BQB

Reliability test

  • High and low temperature, high temperature and high humidity, high temperature, and cold start tests
  • Salt spray and electrostatic discharge tests

Scope of applications

  • Human-machine interaction (HMI) application
  • Home appliance
    • Air conditioner
    • Refrigerator
    • Thermostat
    • Dishwasher
    • Robot vacuum
    • Smart socket
  • Smart lighting
  • Industrial wireless control
  • Baby monitor
  • IP camera and smart lock
  • Smart bus

Pin definition

Pin layout

The pin layout diagram shows the approximate location of the pins on the module. For the actual layout drawn to scale, refer to the module dimensional drawings. The top view looks like this:

T5-E1 Module Datasheet

Pin definition

The module has a total of 70 pins. For a detailed description, refer to the table below.

No. Name I/O type Description
1 GND P Ground pin
2 3V3 P Power pin
3 RST I The low-level reset pin, active high, and pulled up internally
4 P20 I/O
  • GPIO20
  • I2C0_SCL
  • SWCLK
  • RGB_R6
  • I8080_D9
  • SEG10
5 P21 I/O
  • I2C0_SDA
  • SWDIO
  • ADC6
  • RGB_R5
  • I8080_D8
  • SEG9
6 P22 I/O
  • CLK26M
  • PWMG0_PWM2
  • ADC5
  • QSPI0_SCK
  • RGB_R4
  • I8080_CSX
  • SEG8
7 P23 I/O
  • PWMG0_PWM3
  • ADC3
  • QSPI0_CS
  • RGB_R3
  • I8080_RESET
  • SEG7
8 P24 I/O
  • LPO_CLK
  • PWMG0_PWM4
  • ADC2
  • QSPI0_IO0
  • RGB_G7
  • I8080_RSX
  • SEG6
9 P25 I/O
  • IRDA
  • PWMG0_PWM5
  • ADC1
  • QSPI0_IO1
  • RGB_G6
  • I8080_WRX
  • SEG5
10 P26 I/O
  • QSPI0_IO2
  • RGB_G5
  • I8080_RDX
  • SEG4
11 P28 I/O
  • I2S_MCLK
  • ADC4
  • TOUCH2
  • CLK_AUXS_CIS
  • SEG18
12 P1 I/O
  • UART1_RX
  • I2C1_SDA
  • SWDIO
  • SC_CLK
  • ADC13
  • LIN_RXD
13 DN I/O USB D-
14 DP I/O USB D+
15 P0 I/O
  • UART1_TX
  • I2C1_SCL
  • SWCLK
  • SC_IO
  • ADC12
  • LIN_TXD
16 P9 I/O
  • PWMG0_PWM3
  • I2S0_DOUT
  • DMIC_DAT
  • 32K_XI
17 P8 I/O
  • PWMG0_PWM2
  • I2S0_DIN
  • DMIC_CLK
  • ADC10
  • 32K_XO
18 P7 I/O
  • PWMG0_PWM1
  • I2S0_SYNC
  • QSPI1_IO3
19 P6 I/O
  • PWMG0_PWM0
  • I2S0_SCK
  • QSPI1_IO2
20 P5 I/O
  • SPI1_MISO
  • SDIO_DATA1
  • COM7
  • QSPI1_IO1
  • SEG31
21 P4 I/O
  • SPI1_MOSI
  • SDIO_DATA0
  • COM6
  • QSPI1_IO0
  • SEG30
22 P3 I/O
  • SPI1_CSN
  • SDIO_CMD
  • SC_VCC
  • QSPI1_CS
23 P2 I/O
  • SPI1_SCK
  • SDIO_CLK
  • SC_RSTN
  • LIN_SLEEP
  • QSPI1_SCK
24 P12 I/O
  • UART0_RTS
  • TOUCH0
  • ADC14
25 P13 I/O
  • UART0_CTS
  • TOUCH1
  • ADC15
26 P15 I/O
  • SDIO_CMD
  • SPI0_CSN
  • I2C1_SDA
  • RGB_DISP
  • I8080_D14
  • SEG15
27 P14 I/O
  • SDIO_CLK
  • SPI0_SCK
  • I2C1_SCL
  • RGB_DCLK
  • I8080_D15
  • SEG16
28 P16 I/O
  • SDIO_DATA0
  • SPI0_MOSI
  • RGB_DE
  • I8080_D13
  • SEG14
29 P17 I/O
  • SDIO_DATA1
  • SPI0_MISO
  • RGB_HSYNC
  • I8080_D12
  • SEG13
30 P18 I/O
  • SDIO_DATA2
  • PWMG0_PWM0
  • RGB_VSYNC
  • I8080_D11
  • SEG12
31 P19 I/O
  • SDIO_DATA3
  • PWMG0_PWM1
  • RGB_R7
  • I8080_D10
  • SEG11
32 P47 I/O
  • SPI0_MISO
  • ENET_MDC
  • TOUCH15
  • RGB_B3
  • I8080_D0
  • COM0
  • I2S2_DOUT
33 P46 I/O
  • CAN_STBY
  • SPI0_MOSI
  • ENET_PHY_INT
  • TOUCH14
  • RGB_B4
  • I8080_D1
  • COM1
  • I2S2_DIN
34 P45 I/O
  • CAN_RX
  • SPI0_CSN
  • RGB_B5
  • I8080_D2
  • COM2
  • I2S2_SYNC
35 P44 I/O
  • CAN_TX
  • SPI0_SCK
  • RGB_B6
  • I8080_D3
  • COM3
  • I2S2_SCK
36 RXD I/O
  • DL_UART_RX
  • SDIO_DATA2
  • CLK_AUXS_CIS
  • UART0_RX
  • Flash firmware and authorize modules
37 TXD I/O
  • DL_UART_TX
  • UART0_TX
  • SDIO_DATA3
  • Flash firmware and authorize modules
38 P43 I/O
  • I2C1_SDA
  • I2S1_DOUT
  • SC_VCC
  • RGB_B7
  • I8080_D4
  • SEG0
39 P42 I/O
  • I2C1_SCL
  • I2S1_DIN
  • LIN_SLEEP
  • SC_RSTN
  • RGB_G2
  • I8080_D5
  • SEG1
40 GND P Ground pin
41 P27 I/O
  • CIS_MCLK
  • CLK_AUXS_CIS
  • ENET_PHY_INT
  • QSPI0_IO3
  • SEG17
42 P29 I/O
  • CIS_PCLK
  • ENET_MDC
  • TOUCH3
  • SEG19
43 GND P Ground pin
44 GND P Ground pin
45 P41 I/O
  • UART2_TX
  • I2S1_SYNC
  • LIN_TXD
  • SC_IO
  • RGB_G3
  • I8080_D6
  • SEG2
46 P31 I/O
  • CIS_VSYNC
  • UART2_TX
  • LIN_TXD
  • TOUCH5
  • SC_IO
  • SEG21
47 P30 I/O
  • CIS_HSYNC
  • UART2_RX
  • LIN_RXD
  • TOUCH4
  • SC_CLK
  • SEG20
48 P33 I/O
  • CIS_PXD1
  • PWMG1_PWM1
  • ENET_RXD0
  • TOUCH7
  • TOUCH7
  • SEG23
49 P32 I/O
  • CIS_PXD0
  • PWMG1_PWM0
  • ENET_MDIO
  • TOUCH6
  • SC_RSTN
  • SEG22
50 GND P Ground pin
51 P34 I/O
  • CIS_PXD2
  • PWMG1_PWM2
  • ENET_RXD1
  • TOUCH8
  • SPI0_CSN
  • SEG24
52 P35 I/O
  • CIS_PXD3
  • PWMG1_PWM3
  • ENET_RXDV
  • TOUCH9
  • SPI0_MOSI
  • SEG25
53 GND P Ground pin
54 GND P Ground pin
55 GND P Ground pin
56 P36 I/O
  • CIS_PXD4
  • PWMG1_PWM4
  • ENET_TXD0
  • TOUCH10
  • SPI0_MISO
  • SEG26
57 P37 I/O
  • CIS_PXD5
  • PWMG1_PWM5
  • ENET_TXD1
  • TOUCH11
  • SEG27
58 GND P Ground pin
59 GND P Ground pin
60 VIO AO GPIO LDO output
61 LN AO Audio left channel negative output
62 LP AO Audio left channel positive output
63 P38 I/O
  • CIS_PXD6
  • I2C1_SCL
  • ENET_TXEN
  • TOUCH12
  • COM4
  • SEG28
64 P39 I/O
  • CIS_PXD7
  • I2C1_SDA
  • ENET_REF_CLK
  • TOUCH13
  • COM5
  • SEG29
65 P40 I/O
  • UART2_RX
  • I2S1_SCK
  • LIN_RXD
  • SC_CLK
  • RGB_G4
  • I8080_D7
  • SEG3
66 MP1 AO Microphone 1 positive input
67 MN1 AO Microphone 1 negative input
68 MN2 AO Microphone 2 negative input
69 MP2 AO Microphone 2 positive input
70 MBS AO Microphone bias output
  • P indicates the power pin.
  • I/O indicates the input and output pin.
  • AI indicates the analog signal input pin.
  • AO indicates the analog signal output pin.

Electrical parameters

Absolute electrical parameters

Parameter Description Minimum value Maximum value Unit
Ts Storage temperature -55 125 °C
VBAT Supply voltage -0.3 5.5 V
Electrostatic discharge voltage (human body model) TAMB -25°C -4 4 kV
Electrostatic discharge voltage (machine model) TAMB -25°C -200 200 V

Normal operating conditions

Parameter Description Minimum value Typical value Maximum value Unit
Ta Operating temperature -40 - 105 °C
VBAT Supply voltage 2.0 3.3 5.5 V
VOL I/O low-level output VSS - VSS + 0.3 V
VOH I/O high-level output VBAT − 0.3 - VBAT V
Imax I/O drive current - 6 20 mA
θ Supply voltage slope 100 - - mV/ms

Radio frequency (RF) power

Operating status Mode Rate Transmit/Receive power Average value Peak (Typical) value Unit
Transmit 11B 11 Mbit/s +17 dBm TBD TBD mA
Transmit 11G 54 Mbit/s +15 dBm TBD TBD mA
Transmit 11N MCS7 +14 dBm TBD TBD mA
Transmit 11AX MCS9 +12 dBm TBD TBD mA
Receive 11B 11 Mbit/s Continuous reception TBD TBD mA
Receive 11G 54 Mbit/s Continuous reception TBD TBD mA
Receive 11N MCS7 Continuous reception TBD TBD mA
Receive 11AX MCS9 Continuous reception TBD TBD mA

In order to test the transmitting operating current, the module is in the state of sending packets at 100% duty cycle.

Operating current

Operating mode Status (Ta = 25°C) Average value Max (Typical) value Unit
Quick pairing (Bluetooth) The module is in EZ mode. The network status indicator blinks quickly. TBD TBD mA
Quick pairing (AP) The module is in AP mode. The network status indicator blinks slowly. TBD TBD mA
Quick pairing (EZ) The module is in EZ mode. The network status indicator blinks quickly. TBD TBD mA
Connected The module is connected to the cloud. The network status indicator is steady on. TBD TBD mA
Weakly connected The connection between the module and the hotspot is intermittent. The network status indicator is steady on. TBD TBD mA
Disconnected The module is disconnected from the cloud. The network status indicator is steady off. TBD TBD mA
Module disabled The module’s clock enable (CEN) pin is pulled down. TBD - μA

RF parameters

Basic RF features

Parameter Description
Operating frequency 2.412 to 2.484 GHz
Wi-Fi standard IEEE 802.11b/g/n/ax (channels 1–14)
Data transmission rate
  • IEEE 802.11b: 1, 2, 5.5, and 11 Mbit/s
  • IEEE 802.11g: 6, 9, 12, 18, 24, 36, 48, and 54 Mbit/s
  • IEEE 802.11n: HT20 MCS0–7
  • IEEE 802.11ax: VHT20 MCS0–9
Antenna type PCB antenna

Wi-Fi transmitter (TX) performance

Parameter Minimum value Typical value Maximum value Unit
RF average output power, 802.11b CCK mode, 11 Mit/s 15 17 19 dBm
RF average output power, 802.11g OFDM mode, 54 Mbit/s 13 15 17 dBm
RF average output power, 802.11n OFDM mode, MCS7 12 14 16 dBm
RF average output power, 802.11ax OFDM Mode, MCS9 10 12 14 dBm
Frequency error -20 - 20 ppm

Wi-Fi receiver (RX) performance

Parameter Minimum value Typical value Maximum value Unit
PER < 8%, RX sensitivity, 802.11b DSSS mode, 11 Mbit/s - -88 - dBm
PER < 10%, RX sensitivity, 802.11g OFDM mode, 54 Mbit/s - -74 - dBm
PER < 10%, RX sensitivity, 802.11n OFDM mode, MCS7 - -73 - dBm
PER < 10%, RX sensitivity, 802.11ax OFDM Mode, MCS9 - TBD - dBm
PER < 10%, RX sensitivity, Bluetooth LE, 1 Mbit/s - -97 - dBm

Bluetooth transmitter (TX) performance

Parameter Minimum value Typical value Maximum value Unit
Operating frequency 2402 - 2480 MHz
Transmission rate over the air - - - Mbit/s
Transmission power -20 6 15 dBm
Frequency error -150 - 150 KHz

Bluetooth receiver (RX) performance

Parameter Minimum value Typical value Maximum value Unit
RX sensitivity - -97 - dBm
Max RF signal input -10 - - dBm
Intermodulation - - -23 dBm
Adjacent-channel rejection ratio - 10 - dB

Antenna information

Antenna type

The T5-E1 module uses an onboard PCB antenna.

Antenna interference reduction

When a PCB antenna is used on a Wi-Fi module, we recommend that the module antenna is at least 15 mm away from other metal components. This can optimize the Wi-Fi performance.

Make sure that the enclosure surrounding the antenna is not traced or filled with copper. Otherwise, the RF performance might be degraded. According to the antenna shape of the T5-E1 module, you can choose Position 3 or Position 4 (optimal) when using the module.

T5-E1 Module Datasheet

Packing and production instructions

Mechanical dimensions

The T5-E1 dimensions are 18.00±0.35 mm (W) × 25.50±0.35 mm (L) × 2.8±0.15 mm (H).

T5-E1 Module DatasheetT5-E1 Module Datasheet

T5-E1 Module Datasheet

Recommended footprint

T5-E1 Module Datasheet

Production instructions

  1. Package the module with the SMT if Tuya’s module is designed to be SMT-packaged. After being unpacked, the module must be soldered within 24 hours. Otherwise, it needs to be put into a drying cupboard with a relative humidity level no greater than 10%, or pack the module in vacuum again. Then, record the packing time and duration of exposure. The total exposure time cannot exceed 168 hours.

    • Instruments or devices required for the SMT process:
      • Surface mount system
      • SPI
      • Reflow soldering machine
      • Thermal profiler
      • AOI
    • Instruments or devices required for the baking process:
      • Cabinet oven
      • Electro-static discharge (ESD) protection and heat-resistant trays
      • ESD protection and heat-resistant gloves
  2. A delivered module must meet the following storage requirements:

    • The moisture-proof bag must be placed in an environment where the temperature is below 40°C and the relative humidity is lower than 90%.

    • The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed.

    • A humidity indicator card (HIC) is put in the sealed package.

      T5-E1 Module Datasheet
  3. The module needs to be baked in the following cases:

    • The vacuum packaging bag is damaged before unpacking.
    • After unpacking, no HIC is found in the packaging bag.
    • After unpacking, the HIC indicates a humidity level of 10% or higher. In this case, the circle turns pink on the HIC.
    • The total exposure time has lasted for over 168 hours since unpacking.
    • More than 12 months have passed since the first sealing of the bag.
  4. The baking parameter settings are described below:

    • Baking temperature: 40°C for reel packaging with relative humidity ≤ 5%. And 125°C for tray packaging with relative humidity ≤ 5% (use a heat-resistant tray, rather than plastic containers).
    • Baking time: 168 hours for reel packaging and 12 hours for tray packaging.
    • Temperature for triggering an alert: 50°C for reel packaging and 135°C for tray packaging.
    • Production can begin after a module has cooled down to below 36°C under natural conditions.
    • If a module remains unused for over 168 hours after being baked, it needs to be baked again.
    • If a batch of modules is not baked after exposure for more than 168 hours, do not use wave soldering to solder them. Because these modules are level-3 moisture-sensitive devices, they are very likely to get damp when exposed beyond the allowable time. In this case, if they are soldered at high temperatures, device failure or poor soldering performance might occur.
  5. In the whole production process, take electrostatic discharge (ESD) protective measures.

  6. To guarantee the pass rate, we recommend that you use the SPI and AOI to monitor the quality of solder paste printing and mounting.

Recommended oven temperature curve

Set the temperature according to the following temperature curve of reflow soldering. The peak temperature is 245°C.

T5-E1 Module Datasheet
  • A: temperature axis

  • B: time axis

  • C: alloy liquidus temperature from 217°C to 220°C

  • D: ramp-up slope from 1°C/s to 3°C/s

  • E: keep a constant temperature from 150°C to 200°C for a time period from 60s to 120s

  • F: temperature above liquidus temperature for 50s to 70s

  • G: peak temperature from 235°C to 245°C

  • H: ramp-down slope from 1°C/s to 4°C/s

    The curve above is based on solder paste SAC305. For more information about other solder pastes, see the recommended oven temperature curve in the specified solder paste specifications.

Storage conditions

T5-E1 Module Datasheet

MOQ and packaging information

Product model MOQ (pcs) Shipping packaging Modules per reel Reels per carton
T5-E1 3600 Tape and reel 900 4

Appendix: Statement

FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this device.

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

Note: This device has been tested and found to comply with the limits for a Class B digital device, according to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This device generates, uses, and can radiate radio frequency energy and, if not installed and used following the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation.

If this device does cause harmful interference to radio or television reception, which can be determined by turning the device off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

  • Reorient or relocate the receiving antenna.
  • Increase the separation between the device and receiver.
  • Connect the device into an outlet on a circuit different from that to which the receiver is connected.
  • Consult the dealer or an experienced radio/TV technician for help.

Radiation Exposure Statement

This device complies with FCC radiation exposure limits set forth for an uncontrolled rolled environment. This device should be installed and operated with a minimum distance of 20cm between the radiator and your body.

Important Note

This radio module must not be installed to co-locate and operate simultaneously with other radios in the host system except by following FCC multi-transmitter product procedures. Additional testing and device authorization may be required to operate simultaneously with other radios.

The availability of some specific channels and/or operational frequency bands are country-dependent and are firmware programmed at the factory to match the intended destination. The firmware setting is not accessible to the end-user.

The host product manufacturer is responsible for compliance with any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.

The end-user manual shall include all required regulatory information/warnings as shown in this manual, including “This product must be installed and operated with a minimum distance of 20 cm between the radiator and user body”.

This device has got an FCC ID: 2ANDL-T5-E1. The end product must be labeled in a visible area with the following: “Contains Transmitter Module FCC ID: 2ANDL-T5-E1”.

This device is intended only for OEM integrators under the following conditions:

The antenna must be installed such that 20cm is maintained between the antenna and users, and the transmitter module may not be co-located with any other transmitter or antenna.

As long as the 2 conditions above are met, further transmitter tests will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed.

Declaration of Conformity European Notice

T5-E1 Module Datasheet

Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module product is in compliance with essential requirements and other relevant provisions of Directive 2014/53/EU,2011/65/EU. A copy of the Declaration of Conformity can be found at https://www.tuya.com.

T5-E1 Module Datasheet

This product must not be disposed of as normal household waste, in accordance with the EU directive for waste electrical and electronic equipment (WEEE-2012/19/EU). Instead, it should be disposed of by returning it to the point of sale, or to a municipal recycling collection point.

The device could be used with a separation distance of 20cm from the human body.