T5-E1-IPEX Module Datasheet

T5-E1-IPEX is a highly integrated single-antenna single-band 2.4 GHz Wi-Fi 6 (IEEE 802.11b/g/n/ax) and Bluetooth 5.4 Low Energy (LE) combo IoT module. Featuring a multi-peripheral packaging and ultra-low-power chip, the T5-E1-IPEX module provides a highly integrated, efficient, secure, and lowest-power environment for IP cameras, HMI applications, smart locks, and other advanced IoT applications.

Features

CPU and on-chip memory

• Built-in with Tuya’s custom T5QN88 chip, Armv8-M Star (M33F) processor, with a clock frequency of up to 480 MHz
• 8 MB flash memory
• 16 MB PSRAM
• 640 KB shared SRAM
• 64 KB ROM

Wi-Fi

• IEEE 802.11b/g/n/ax compliant
• 20 MHz and 40 MHz channel bandwidth
• Support downlink multi-user multiple input, multiple output (DL MU-MIMO)
• Support orthogonal frequency-division multiple access (OFDMA)
• Support target wake time (TWT)
• Integrated Bluetooth and Wi-Fi coexistence (packet traffic arbitration, PTA)
• Transmit (TX) power up to +20 dBm
• Receive (RX) sensitivity of -99 dBm

Bluetooth

• Support Bluetooth LE 5.4 standard
• Support Bluetooth LE 1 Mbit/s and 2 Mbit/s, long-range mode (125 Kbit/s and 500 Kbit/s)
• TX power of +6 dBm
• RX sensitivity of -97 dBm

Peripherals

• 48x GPIOs
• 2x SPIs and 2x QSPIs
• 3x UART interfaces: 1 channel has hardware flow control and supports flash download
• 1x smart card controller
• 1x SDIO interface, 2x I2C interfaces, and 1x CAN controller with CAN FD
• 1x high-speed (HS) USB 2.0 interface
• 1x display controller supporting RGB565 and 8080 interfaces
• 1x segment LCD controller for up to 4 × 32 segments
• 1x 8-bit CIS DVP interface
• 1x 720p H.264 video encoder
• 1x Ethernet MAC interface
• 12x 32-bit PWM channels
• 3x I2S interfaces
• 2x audio ADCs and 1x audio DAC
• 12-bit AUX ADC, up to 11 channels
• 1x touch sensor, up to 16 touch sensing I/Os

Antenna type

• External antenna

Operating conditions

• Operating/supply voltage range: 2.0V to 3.6V
• Operating temperature range: -40°C to 85°C

Module certification

• Wi-Fi & Bluetooth: FCC and CE
• Environmental certification: REACH/RoHS
• Bluetooth certification: BQB

Reliability test

• High and low temperature, high temperature and high humidity, high temperature, and cold start tests
• Salt spray and electrostatic discharge tests

Scope of applications

• Human-machine interaction (HMI) application
• Home appliance
  • Air conditioner
  • Refrigerator
  • Thermostat
  • Dishwasher
  • Robot vacuum
  • Smart socket
• Smart lighting
• Industrial wireless control
• Baby monitor
• IP camera and smart lock
• Smart bus

Pin definition

Pin layout

The pin layout diagram shows the approximate location of the pins on the module. For the actual layout drawn to scale, refer to the module dimensional drawings. The top view looks like this:

Pin definition

The module has a total of 70 pins. For a detailed description, refer to the table below.

No.	Name	I/O type	Description
1	GND	P	Ground pin
2	3V3	P	Power pin
3	RST	I	The low-level reset pin, active high, and pulled up internally
4	P20	I/O	GPIO20 I2C0_SCL SWCLK RGB_R6 I8080_D9 SEG10
5	P21	I/O	I2C0_SDA SWDIO ADC6 RGB_R5 I8080_D8 SEG9
6	P22	I/O	CLK26M PWMG0_PWM2 ADC5 QSPI0_SCK RGB_R4 I8080_CSX SEG8
7	P23	I/O	PWMG0_PWM3 ADC3 QSPI0_CS RGB_R3 I8080_RESET SEG7
8	P24	I/O	LPO_CLK PWMG0_PWM4 ADC2 QSPI0_IO0 RGB_G7 I8080_RSX SEG6
9	P25	I/O	IRDA PWMG0_PWM5 ADC1 QSPI0_IO1 RGB_G6 I8080_WRX SEG5
10	P26	I/O	QSPI0_IO2 RGB_G5 I8080_RDX SEG4
11	P28	I/O	I2S_MCLK ADC4 TOUCH2 CLK_AUXS_CIS SEG18
12	P1	I/O	UART1_RX I2C1_SDA SWDIO SC_CLK ADC13 LIN_RXD
13	DN	I/O	USB D-
14	DP	I/O	USB D+
15	P0	I/O	UART1_TX I2C1_SCL SWCLK SC_IO ADC12 LIN_TXD
16	P9	I/O	PWMG0_PWM3 I2S0_DOUT DMIC_DAT 32K_XI
17	P8	I/O	PWMG0_PWM2 I2S0_DIN DMIC_CLK ADC10 32K_XO
18	P7	I/O	PWMG0_PWM1 I2S0_SYNC QSPI1_IO3
19	P6	I/O	PWMG0_PWM0 I2S0_SCK QSPI1_IO2
20	P5	I/O	SPI1_MISO SDIO_DATA1 COM7 QSPI1_IO1 SEG31
21	P4	I/O	SPI1_MOSI SDIO_DATA0 COM6 QSPI1_IO0 SEG30
22	P3	I/O	SPI1_CSN SDIO_CMD SC_VCC QSPI1_CS
23	P2	I/O	SPI1_SCK SDIO_CLK SC_RSTN LIN_SLEEP QSPI1_SCK
24	P12	I/O	UART0_RTS TOUCH0 ADC14
25	P13	I/O	UART0_CTS TOUCH1 ADC15
26	P15	I/O	SDIO_CMD SPI0_CSN I2C1_SDA RGB_DISP I8080_D14 SEG15
27	P14	I/O	SDIO_CLK SPI0_SCK I2C1_SCL RGB_DCLK I8080_D15 SEG16
28	P16	I/O	SDIO_DATA0 SPI0_MOSI RGB_DE I8080_D13 SEG14
29	P17	I/O	SDIO_DATA1 SPI0_MISO RGB_HSYNC I8080_D12 SEG13
30	P18	I/O	SDIO_DATA2 PWMG0_PWM0 RGB_VSYNC I8080_D11 SEG12
31	P19	I/O	SDIO_DATA3 PWMG0_PWM1 RGB_R7 I8080_D10 SEG11
32	P47	I/O	SPI0_MISO ENET_MDC TOUCH15 RGB_B3 I8080_D0 COM0 I2S2_DOUT
33	P46	I/O	CAN_STBY SPI0_MOSI ENET_PHY_INT TOUCH14 RGB_B4 I8080_D1 COM1 I2S2_DIN
34	P45	I/O	CAN_RX SPI0_CSN RGB_B5 I8080_D2 COM2 I2S2_SYNC
35	P44	I/O	CAN_TX SPI0_SCK RGB_B6 I8080_D3 COM3 I2S2_SCK
36	RXD	I/O	DL_UART_RX SDIO_DATA2 CLK_AUXS_CIS UART0_RX Flash firmware and authorize modules
37	TXD	I/O	DL_UART_TX UART0_TX SDIO_DATA3 Flash firmware and authorize modules
38	P43	I/O	I2C1_SDA I2S1_DOUT SC_VCC RGB_B7 I8080_D4 SEG0
39	P42	I/O	I2C1_SCL I2S1_DIN LIN_SLEEP SC_RSTN RGB_G2 I8080_D5 SEG1
40	GND	P	Ground pin
41	P27	I/O	CIS_MCLK CLK_AUXS_CIS ENET_PHY_INT QSPI0_IO3 SEG17
42	P29	I/O	CIS_PCLK ENET_MDC TOUCH3 SEG19
43	P50	I/O	ENET_RXD1 RGB_R0
44	P49	I/O	ENET_RXD0 RGB_R1 I8080_D17
45	P41	I/O	UART2_TX I2S1_SYNC LIN_TXD SC_IO RGB_G3 I8080_D6 SEG2
46	P31	I/O	CIS_VSYNC UART2_TX LIN_TXD TOUCH5 SC_IO SEG21
47	P30	I/O	CIS_HSYNC UART2_RX LIN_RXD TOUCH4 SC_CLK SEG20
48	P33	I/O	CIS_PXD1 PWMG1_PWM1 ENET_RXD0 TOUCH7 TOUCH7 SEG23
49	P32	I/O	CIS_PXD0 PWMG1_PWM0 ENET_MDIO TOUCH6 SC_RSTN SEG22
50	P48	I/O	ENET_MDIO RGB_R2 I8080_D16
51	P34	I/O	CIS_PXD2 PWMG1_PWM2 ENET_RXD1 TOUCH8 SPI0_CSN SEG24
52	P35	I/O	CIS_PXD3 PWMG1_PWM3 ENET_RXDV TOUCH9 SPI0_MOSI SEG25
53	P53	I/O	ENET_TXD1 RGB_B2
54	P54	I/O	ENET_TXEN RGB_B1
55	P55	I/O	ENET_REF_CLK RGB_B0
56	P36	I/O	CIS_PXD4 PWMG1_PWM4 ENET_TXD0 TOUCH10 SPI0_MISO SEG26
57	P37	I/O	CIS_PXD5 PWMG1_PWM5 ENET_TXD1 TOUCH11 SEG27
58	P52	I/O	ENET_TXD0 RGB_G0
59	P51	I/O	ENET_RXDV RGB_G1
60	GND	P	Ground pin
61	LN	AO	Audio left channel negative output
62	LP	AO	Audio left channel positive output
63	P38	I/O	CIS_PXD6 I2C1_SCL ENET_TXEN TOUCH12 COM4 SEG28
64	P39	I/O	CIS_PXD7 I2C1_SDA ENET_REF_CLK TOUCH13 COM5 SEG29
65	P40	I/O	UART2_RX I2S1_SCK LIN_RXD SC_CLK RGB_G4 I8080_D7 SEG3
66	MP1	AO	Microphone 1 positive input
67	MN1	AO	Microphone 1 negative input
68	MN2	AO	Microphone 2 negative input
69	MP2	AO	Microphone 2 positive input
70	MBS	AO	Microphone bias output

Electrical parameters

Absolute electrical parameters

Parameter	Description	Min value	Max value	Unit
Ts	Storage temperature	-55	125	°C
VBAT	Supply voltage	-0.3	3.6	V
Electrostatic discharge voltage (human body model)	TAMB -25°C	-4	4	kV
Electrostatic discharge voltage (machine model)	TAMB -25°C	-200	200	V

Normal operating conditions

Parameter	Description	Min value	Typical value	Max value	Unit
Ta	Operating temperature	-40	-	85	°C
VBAT	Supply voltage	2.0	3.3	3.6	V
VOL	I/O low-level output	VSS	-	VSS + 0.3	V
VOH	I/O high-level output	VBAT − 0.3	-	VBAT	V
Imax	I/O drive current	-	6	20	mA
θ	Supply voltage slope	100	-	-	mV/ms

Radio frequency (RF) power

Operating status	Mode	Rate	Transmit/Receive power	Average value	Peak (Typical) value	Unit
Transmit	11B	11 Mbit/s	+17 dBm	-	322	mA
Transmit	11G	54 Mbit/s	+15 dBm	-	275	mA
Transmit	11N	HT20 MCS7	+14 dBm	-	265	mA
Transmit	11AX	HE20 MCS7	+14 dBm	-	264	mA
Receive	11B	11 Mbit/s	Continuous reception	-	23	mA
Receive	11G	54 Mbit/s	Continuous reception	-	23	mA
Receive	11N	HT20 MCS7	Continuous reception	-	23	mA
Receive	11AX	HE20 MCS7	Continuous reception	-	23	mA

Operating current

Working mode	Status (Ta = 25°C)	Average value	Max (Typical) value	Unit
Bluetooth pairing	The module is pairing over Bluetooth. The network status indicator blinks quickly.	5.9	290	mA
Access point (AP) pairing	The module is pairing in AP mode. The network status indicator blinks slowly.	18	292	mA
Wi-Fi Easy Connect (EZ)	The module is pairing in EZ mode. The network status indicator blinks quickly.	TBD	TBD	mA
Connected	The module is connected to the cloud. The network status indicator is steady on.	5.6	286	mA
Weakly connected	The connection between the module and the access point is intermittent. The network status indicator is steady on.	5.8	290	mA
Disconnected	The module is disconnected from the cloud. The network status indicator is steady off.	24	287	mA
Module disabled	The module’s clock enable (CEN) pin is pulled down.	133	-	μA

RF parameters

Basic RF features

Parameter	Description
Operating frequency	2.412 to 2.484 GHz
Wi-Fi standard	IEEE 802.11b/g/n/ax (channels 1–14)
Data transmission rate	IEEE 802.11b: 1, 2, 5.5, and 11 Mbit/s IEEE 802.11g: 6, 9, 12, 18, 24, 36, 48, and 54 Mbit/s IEEE 802.11n: HT20 MCS0-7 and HT40 MCS0-7 IEEE 802.11ax: HE20 MCS0-7 and HE40 MCS0-7
Antenna type	External antenna

Wi-Fi transmitter (TX) performance

Parameter	Min value	Typical value	Max value	Unit
RF average output power, 802.11b CCK mode, 11 Mit/s	15	17	19	dBm
RF average output power, 802.11g OFDM mode, 54 Mbit/s	13	15	17	dBm
RF average output power, 802.11n OFDM mode, HT20 MCS7	12	14	16	dBm
RF average output power, 802.11n OFDM mode, HT40 MCS7	11	13	15	dBm
RF average output power, 802.11ax OFDMA mode, HE20 MCS7	12	14	16	dBm
RF average output power, 802.11ax OFDMA mode, HE40 MCS7	11	13	15	dBm
Frequency error	-20	-	20	ppm

Wi-Fi receiver (RX) performance

Parameter	Min value	Typical value	Max value	Unit
PER < 8%, RX sensitivity, 802.11b DSSS mode, 11 Mbit/s	-	-88	-	dBm
PER < 10%, RX sensitivity, 802.11g OFDM mode, 54 Mbit/s	-	-74	-	dBm
PER < 10%, RX sensitivity, 802.11n OFDM mode, HT40 MCS7	-	-73	-	dBm
PER < 10%, RX sensitivity, 802.11ax OFDMA mode, HE40 MCS7	-	-73	-	dBm
PER < 10%, RX sensitivity, Bluetooth LE, 1 Mbit/s	-	-97	-	dBm

Bluetooth TX performance

Parameter	Min value	Typical value	Max value	Unit
Operating frequency	2402	-	2480	MHz
Transmission rate over the air	-	-	-	Mbit/s
Transmission power	-20	6	15	dBm
Frequency error	-150	-	150	KHz

Bluetooth RX performance

Parameter	Min value	Typical value	Max value	Unit
RX sensitivity	-	-97	-	dBm
Max RF signal input	-10	-	-	dBm
Intermodulation	-	-	-23	dBm
Adjacent-channel rejection ratio	-	10	-	dB

Antenna information

Antenna type

The T5-E1-IPEX module uses an external antenna.

Antenna interference reduction

The distance between the antenna and other mental components should be at least 15 mm to provide the best Wi-Fi performance.

Development guide

MCU integration

For more information about MCU general integration, see Hardware Design of CBx Series Modules.

Packing and production instructions

Mechanical dimensions

The T5-E1-IPEX dimensions are 18.00±0.35 mm (W) × 19.70±0.35 mm (L) × 2.8±0.15 mm (H).

Recommended footprint

Production instructions

1. Package the module with the SMT if Tuya’s module is designed to be SMT-packaged. After being unpacked, the module must be soldered within 24 hours. Otherwise, it needs to be put into a drying cupboard with a relative humidity level no greater than 10%, or pack the module in vacuum again. Then, record the packing time and duration of exposure. The total exposure time cannot exceed 168 hours.

   • Instruments or devices required for the SMT process:
     • Surface mount system
     • SPI
     • Reflow soldering machine
     • Thermal profiler
     • Automated optical inspection (AOI) equipment
   • Instruments or devices required for the baking process:
     • Cabinet oven
     • Electrostatic discharge (ESD) protection and heat-resistant trays
     • ESD protection and heat-resistant gloves

2. A delivered module must meet the following storage requirements:

   • The moisture-proof bag must be placed in an environment where the temperature is below 40°C and the relative humidity is lower than 90%.

   • The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed.

   • A humidity indication card (HIC) is put in the sealed package.

     

3. The module needs to be baked in the following cases:

   • The vacuum packaging bag is damaged before unpacking.
   • After unpacking, no HIC is found in the packaging bag.
   • After unpacking, the HIC indicates a humidity level of 10% or higher. In this case, the circle turns pink on the HIC.
   • The total exposure time has lasted for over 168 hours since unpacking.
   • More than 12 months have passed since the first sealing of the bag.

4. The baking parameter settings are described below:

   • Baking temperature: 40°C for reel packaging with relative humidity ≤ 5%. And 125°C for tray packaging with relative humidity ≤ 5% (use a heat-resistant tray, rather than plastic containers).
   • Baking time: 168 hours for reel packaging and 12 hours for tray packaging.
   • Temperature for triggering an alert: 50°C for reel packaging and 135°C for tray packaging.
   • Production can begin after a module has cooled down to below 36°C under natural conditions.
   • If a module remains unused for over 168 hours after being baked, it needs to be baked again.
   • If a batch of modules is not baked after exposure for more than 168 hours, do not use wave soldering to solder them. Because these modules are level-3 moisture-sensitive devices, they are very likely to get damp when exposed beyond the allowable time. In this case, if they are soldered at high temperatures, device failure or poor soldering performance might occur.

5. In the whole production process, take electrostatic discharge (ESD) protective measures.

6. To guarantee the pass rate, we recommend that you use the SPI and AOI to monitor the quality of solder paste printing and mounting.

Recommended oven temperature curve

Set the temperature according to the following temperature curve of reflow soldering. The peak temperature is 245°C.

• A: temperature axis

• B: time axis

• C: alloy liquidus temperature from 217°C to 220°C

• D: ramp-up slope from 1°C/s to 3°C/s

• E: keep a constant temperature from 150°C to 200°C for a time period from 60s to 120s

• F: temperature above liquidus temperature for 50s to 70s

• G: peak temperature from 235°C to 245°C

• H: ramp-down slope from 1°C/s to 4°C/s

  The curve above is based on solder paste SAC305. For more information about other solder pastes, see the recommended oven temperature curve in the specified solder paste specifications.

Storage conditions

MOQ and packaging information

Product model	MOQ (pcs)	Shipping packaging	Modules per reel	Reels per carton
T5-E1-IPEX	3,600	Tape and reel	900	4

Appendix: Statement

FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this device.

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

Note: This device has been tested and found to comply with the limits for a Class B digital device, according to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This device generates, uses, and can radiate radio frequency energy and, if not installed and used following the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation.

If this device does cause harmful interference to radio or television reception, which can be determined by turning the device off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

• Reorient or relocate the receiving antenna.
• Increase the separation between the device and receiver.
• Connect the device into an outlet on a circuit different from that to which the receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help.

Radiation Exposure Statement

This device complies with FCC radiation exposure limits set forth for an uncontrolled rolled environment. This device should be installed and operated with a minimum distance of 20cm between the radiator and your body.

Important Note

This radio module must not be installed to co-locate and operate simultaneously with other radios in the host system except by following FCC multi-transmitter product procedures. Additional testing and device authorization may be required to operate simultaneously with other radios.

The availability of some specific channels and/or operational frequency bands are country-dependent and are firmware programmed at the factory to match the intended destination. The firmware setting is not accessible to the end-user.

The host product manufacturer is responsible for compliance with any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.

The end-user manual shall include all required regulatory information/warnings as shown in this manual, including “This product must be installed and operated with a minimum distance of 20 cm between the radiator and user body”.

This device has got an FCC ID: 2ANDL-T5-E1. The end product must be labeled in a visible area with the following: “Contains Transmitter Module FCC ID: 2ANDL-T5-E1”.

This device is intended only for OEM integrators under the following conditions:

The antenna must be installed such that 20cm is maintained between the antenna and users, and the transmitter module may not be co-located with any other transmitter or antenna.

As long as the 2 conditions above are met, further transmitter tests will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed.

Declaration of Conformity European Notice

Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module product is in compliance with essential requirements and other relevant provisions of Directive 2014/53/EU,2011/65/EU. A copy of the Declaration of Conformity can be found at https://www.tuya.com.

This product must not be disposed of as normal household waste, in accordance with the EU directive for waste electrical and electronic equipment (WEEE-2012/19/EU). Instead, it should be disposed of by returning it to the point of sale, or to a municipal recycling collection point.

The device could be used with a separation distance of 20cm from the human body.