Last Updated on : 2021-11-15 09:56:19download
ZSU-IPEX is a Zigbee module that Tuya has developed. It consists of a highly integrated RF processing chip (EFR32MG21A020F1024IM32-B), a few peripherals, a built-in 802.15.4 PHY/MAC Zigbee network protocol stack and rich library functions.
ZSU-IPEX is embedded with a low-power 32-bit ARM Cortex-M33 core, 1024-KB flash program memory, 96-KB RAM and abundant peripheral resources. It integrates all function libraries of the Zigbee MAC and TCP/IP. You can develop embedded Zigbee products as required.
|Update date||Updated content||Version after update|
|06/30/2021||This is the first release.||V1.0.0|
ZSU-IPEX has 3 lines of pins. The spacing of pins at the two sides is 1.4±0.1 mm, and the spacing of pins at the bottom is 1.8±0.1 mm.
The dimensions of ZSU-IPEX are 20.3±0.35 mm (L)×15.8±0.35 mm (W) ×3.0±0.15 mm (H).
The dimensions of ZSU-IPEX are as follows:
|1||PC04||I/O||Common I/O pin, which corresponds to PC04 (Pin 5) on the internal IC|
|2||PC05||I/O||Common I/O pin, which corresponds to PC05 (Pin 6) on the internal IC|
|3||PA02||I/O||Burning pin, SWDIO, which corresponds to PA02 (Pin 19) on the internal IC|
|4||PA01||I/O||Burning pin, SWCLK, which corresponds to PA01 (Pin 18) on the internal IC|
|5||PC01||I||ADC pin, which corresponds to PC01 (Pin 2) on the internal IC|
|6||PD03||I/O||Common I/O pin, which corresponds to PD03 (Pin 29) on the internal IC|
|7||PD04||I/O||Common I/O pin, which corresponds to PD04 (Pin 28) on the internal IC|
|8||PB01||I/O||Support hardware PWM and correspond to PB01 (Pin 15) on the internal IC|
|9||PB00||I/O||Support hardware PWM and correspond to PB00 (Pin 16) on the internal IC|
|10||PA00||I/O||Support hardware PWM and correspond to PA00 (Pin 17) on the internal IC|
|11||PA03||I/O||Support hardware PWM and correspond to PA03 (Pin 20) on the internal IC|
|12||PA04||I/O||Support hardware PWM and correspond to PA04 (Pin 21) on the internal IC|
|13||GND||P||Power supply reference ground|
|14||VCC||P||Power supply pin (3.3V)|
|15||TXD0||I/O||UART_TXD0, burning authorization pin, correspond to PA05 (Pin 22) on the internal IC|
|16||RXD0||I/O||UART_RXD0, burning authorization pin, correspond to PA06 (Pin 23) on the internal IC|
|17||PD02||I||ADC pin, which corresponds to PD02 (Pin 30) on the internal IC|
|18||NRST||I/O||Reset pin, low active, correspond to RESETn (Pin 9) on the internal IC|
|19||PD01||I/O||Common I/O pin, which corresponds to PD01 (Pin 31) on the internal IC|
|20||PC02||I/O||Common I/O pin, which corresponds to PC02 (Pin 3) on the internal IC|
|21||PC03||I/O||Common I/O pin, which corresponds to PC03 (Pin 4) on the internal IC|
Note: P indicates a power supply pin and I/O indicates an input/output pin.
|Parameter||Description||Minimum value||Maximum value||Unit|
|VBAT||Power supply voltage||2.0||3.8||V|
|ESD voltage (human body model)||TAMB-25℃||-||2||KV|
|ESD voltage (machine model)||TAMB-25℃||-||0.5||KV|
|Parameter||Description||Minimum value||Typical value||Maximum value||Unit|
|VIL||I/O low level input||-||-||VDD*0.3||V|
|VIH||I/O high level input||VDD*0.7||-||-||V|
|VOL||I/O low level output||-||-||VDD*0.2||V|
|VOH||I/O high level output||VDD*0.8||-||-||V|
|Working status||Mode||Rate||Transmit power/receive||Average value||Peak value (Typical value)||Unit|
|Transmit||-||250 Kbps||+10 dBm||62||65||mA|
|Transmit||-||250 Kbps||+0 dBm||27||29||mA|
|Working mode||Working status, Ta = 25°C||Average value||Maximum value (Typical value)||Unit|
|EZ mode||The module is in fast network connection state.||12||38||mA|
|Connected and busy||The module is connected to the network and in running state.||13||70||mA|
|Connected and idle||The module is connected to the network and in idle state.||12||14||mA|
|Deep sleep mode||Deep sleep mode, 64-KB flash memory reserved||5||-||uA|
|Working frequency||2.405 to 2.480 GHz|
|Zigbee standard||IEEE 802.15.4|
|Data transmission rate||250 Kbps|
|Antenna type||IPEX antenna with a gain of 3.1 dBi|
|Parameter||Minimum value||Typical value||Maximum value||Unit|
|Output power (250Kbps)||-30||15||20||dBm|
|Output power adjustment stepping||-||0.5||1||dBm|
|Output spectrum adjacent channel suppression||-||-31||-||dBc|
|Parameter||Minimum value||Typical value||Maximum value||Unit|
|PER<8%, RX sensitivity (250 Kbps)||-102||-101||-99||dBm|
The ZSU-IPEX uses a new generation of IPEX antenna bases. Its structure is shown below:
It is recommended that the antenna be at least 15 mm away from other metal parts.
The PCB dimensions are 20.3±0.35 mm (W)×15.8±0.35 mm (L) ×1.0±0.1 mm (H).
The moisture-proof bag must be placed in an environment in which the temperature is below 40°C and the relative humidity is lower than 90%.
The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed.
There is a humidity indicator card (HIC) in the packaging bag.
Select a proper soldering manner according to the process. For the SMT process, please refer to the recommended oven temperature curve of reflow soldering. For the wave soldering process, please refer to the recommended oven temperature curve of wave soldering. There are some differences between the set temperatures and the actual temperatures. All the temperatures shown in this module datasheet are obtained through actual measurements.
Manner 1: SMT process (Recommended oven temperature curve of reflow soldering)
Set oven temperatures according to the following curve.
A: Temperature axis
B: Time axis
C: Liquidus temperature: 217 to 220°C
D: Ramp-up slope: 1 to 3°C/s
E: Duration of constant temperature: 60 to 120s; the range of constant temperature: 150 to 200°C
F: Duration above the liquidus: 50 to 70s
G: Peak temperature: 235 to 245°C
H: Ramp-down slope: 1 to 4°C/s
Note: The above curve is just an example of the solder paste SAC305. For more details about other solder pastes, please refer to Recommended oven temperature curve in the solder paste specifications.
Manner 2: Wave soldering process (Oven temperature curve of wave soldering)
Set oven temperatures according to the following temperature curve of wave soldering. The peak temperature is 260°C±5°C.
|Suggestions on oven temperature curve of wave soldering||Suggestions on manual soldering temperature|
|Preheat temperature||80 to 130 °C||Soldering temperature||360±20°C|
|Preheat time||75 to 100s||Soldering time||＜3s/point|
|Peak contact time||3 to 5s||NA||NA|
|Temperature of tin cylinder||260±5°C||NA||NA|
|Product model||MOQ (pcs)||Packing method||Modules per reel||Reels per carton|
FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this device.
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.
Note: This device has been tested and found to comply with the limits for a Class B digital device, according to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This device generates, uses, and can radiate radio frequency energy and, if not installed and used following the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation.
If this device does cause harmful interference to radio or television reception, which can be determined by turning the device off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
Radiation Exposure Statement
This device complies with FCC radiation exposure limits set forth for an uncontrolled rolled environment. This device should be installed and operated with a minimum distance of 20cm between the radiator and your body.
This radio module must not be installed to co-locate and operate simultaneously with other radios in the host system except following FCC multi-transmitter product procedures. Additional testing and device authorization may be required to operate simultaneously with other radios.
The availability of some specific channels and/or operational frequency bands are country dependent and are firmware programmed at the factory to match the intended destination. The firmware setting is not accessible by the end-user.
The host product manufacturer is responsible for compliance with any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.
The end-user manual shall include all required regulatory information/warnings as shown in this manual, including “This product must be installed and operated with a minimum distance of 20 cm between the radiator and user body”.
This device has got an FCC ID: 2ANDL-ZSU-IPEX. The end product must be labelled in a visible area with the following: “Contains Transmitter Module FCC ID: 2ANDL-ZSU-IPEX”.
This device is intended only for OEM integrators under the following conditions:
The antenna must be installed such that 20cm is maintained between the antenna and users, and the transmitter module may not be co-located with any other transmitter or antenna.
As long as the 2 conditions above are met, further transmitter tests will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed.
Declaration of Conformity European Notice
Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module product is in compliance with essential requirements and other relevant provisions of Directive 2014/53/EU, 2011/65/EU. A copy of the Declaration of conformity can be found at https://www.tuya.com.
This product must not be disposed of as normal household waste, in accordance with the EU directive for waste electrical and electronic equipment (WEEE-2012/19/EU). Instead, it should be disposed of by returning it to the point of sale, or to a municipal recycling collection point.
The device could be used with a separation distance of 20cm to the human body.
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