ZS24-U Module Datasheet

Last Updated on : 2023-02-27 02:49:17download

ZS24-U is a Zigbee module that Tuya has developed. It consists of a highly integrated RF processing chip EFR32MG24, a few peripherals, a built-in 802.15.4 PHY/MAC network protocol stack, and rich library functions.

Product overview

ZS24-U is embedded with a low-power 32-bit ARM Cortex-M33 core, 1024-KB flash program memory, 128-KB RAM, and abundant peripheral resources. It integrates all function libraries of the MAC and TCP/IP. You can develop embedded Zigbee products as required.


  • Embedded ARM Cortex-M33 processor having a low-power 32-bit CPU and DSP instructions and floating-point units, which can also function as an application processor.
  • Clock rate: 78 MHz
  • Wide operating voltage: 2.0 to 3.8 V
  • Peripherals: 9 GPIOs, 1 UART, 2 ADCs, and 5 PWMs
  • Zigbee connectivity
    • Support 802.15.4 MAC/PHY
    • Working channels 11 to 26 @2.400 to 2.483 GHz, air interface rate: 250 Kbps
    • Up to +10dBm output power
    • 35 μA/MHz power consumption during running; 5-μA sleep current
    • PCB antenna inside
    • Onboard antenna with a gain of 1.1 dBi
    • Operating temperature: -40°C to 105°C
    • Support hardware encryption and AES 128/256


  • Intelligent building
  • Smart household and home appliances
  • Smart socket and light
  • Industrial wireless control
  • Baby monitor
  • Network camera
  • Intelligent bus

Module interfaces

Dimensions and footprint

ZS24-U has 3 lines of pins. The spacing of pins at the two sides is 1.4±0.1 mm, and the spacing of pins at the bottom is 1.8±0.1 mm.

The dimensions of the ZS24-U are 20.3±0.35 mm (L) × 15.8±0.35 mm (W) × 2.5±0.1 mm (H).

The dimensions of ZS24-U are as follows:

ZS24-U Module Datasheet

Pin definition

ZS24-U Module Datasheet

Pin number Symbol Type Function
1 PB4 I/O Common I/O pin, which corresponds to PB04 on the internal IC
2 PB3 I/O Common I/O pin, which corresponds to PB03 on the internal IC
3 PA2 I/O Burning pin, SWDIO, which corresponds to PA02 on the internal IC
4 PA1 I/O Burning pin, SWCLK, which corresponds to PA01 on the internal IC
5 PB2 I ADC pin, which corresponds to PB02 on the internal IC
6 PA0 I/O Common I/O pin, which corresponds to PA00 on the internal IC
7 PB0 I/O Common I/O pin, which corresponds to PB00 on the internal IC
8 PC2 I/O Support hardware PWM and correspond to PC02 on the internal IC
9 PC1 I/O Support hardware PWM and correspond to PC01 on the internal IC
10 PA4 I/O Support hardware PWM and correspond to PA04 on the internal IC
11 PA5 I/O Support hardware PWM and correspond to PA05 on the internal IC
12 PA6 I/O Support hardware PWM and correspond to PA06 on the internal IC
13 GND P Power supply reference ground
14 VCC P Power supply pin (3.3V)
15 TX0 I/O UART_TXD0, burning authorization pin, which corresponds to PD03 on the internal IC
16 RX0 I/O UART_RXD0, burning authorization pin, which corresponds to PD02 on the internal IC
17 PA8 I ADC pin, which corresponds to PA08 on the internal IC
18 RST I/O Reset pin, low active, which corresponds to RESETn on the internal IC
19 PA7 I/O Common I/O pin, which corresponds to PA07 on the internal IC
20 PA3 I/O Common I/O pin, which corresponds to PA03 on the internal IC
21 PB1 I/O Common I/O pin, which corresponds to PB01 on the internal IC
  • P indicates a power supply pin and I/O indicates an input/output pin.
  • Pin 3, 4, 13, 14, and 18 are burning pins, which are not exposed by default. During routing, customers should bypass them.

Electrical parameters

Absolute electrical parameters

Parameter Description Minimum value Maximum value Unit
Ts Storage temperature -50 150 °C
VBAT Power supply voltage 2.0 3.8 V
ESD voltage (human body model) TAMB-25℃ - 2 KV
ESD voltage (machine model) TAMB-25℃ - 0.5 KV

Normal working conditions

Parameter Description Minimum value Typical value Maximum value Unit
Ta Operating temperature -40 - 105 °C
VCC Operating voltage 2.0 3.3 3.6 V
VIL I/O low level input - - VDD*0.3 V
VIH I/O high level input VDD*0.7 - - V
VOL I/O low level output - - VDD*0.2 V
VOH I/O high level output VDD*0.8 - - V

TX and RX power consumption

Working status Mode Rate Transmit power/receive Average value Peak value (Typical value) Unit
Transmit - 250 Kbps +10 dBm 19.3 20.6 mA
Transmit - 250 Kbps +0 dBm 9.3 11.6 mA
Receive - 250Kbps Constantly receive 5.9 7.9 mA

Working current

Working mode Working status, Ta = 25°C Average value Maximum value (Typical value) Unit Remark
EZ mode The module is in fast network connection state. 2.27 19.3 mA
Connected and busy The module is connected to the network and in running state. 2.05 18.6 mA
Connected and idle The module is connected to the network and in idle state. 3.5 - μA Low Power Firmware
Deep sleep mode Deep sleep mode 3.54 - μA

RF parameters

Basic RF features

Parameter Description
Working frequency 2.405 to 2.480 GHz
Zigbee standard IEEE 802.15.4
Data transmission rate 250 Kbps
Antenna type PCB antenna with a gain of 1.1 dBi

TX performance

TX performance

Parameter Minimum value Typical value Maximum value Unit
Output power (250Kbps) -30 15 10 dBm
Output power adjustment stepping - 0.5 1 dBm
Output spectrum adjacent channel suppression - -31 - dBc
Frequency error -15 - 15 ppm

RX performance

RX sensitivity

Parameter Minimum value Typical value Maximum value Unit
PER<8%, RX sensitivity (250 Kbps) -105 -105 -104 dBm

Antenna information

Antenna type

ZS24-U uses the PCB antenna.

Antenna interference reduction

To ensure optimal RF performance when the Zigbee module uses a PCB antenna, it is recommended that the antenna be at least 15 mm away from other metal parts.
To prevent adverse impact on the antenna radiation performance, avoid copper or traces within the antenna area on the PCB.

ZS24-U Module Datasheet

ZS24-U Module Datasheet

ZS24-U Module Datasheet

ZS24-U Module Datasheet

Packaging information and production instructions

Mechanical dimensions

The PCB dimensions are 20.3±0.35 mm (W) × 15.8±0.35 mm (L) × 1.0±0.1 mm (H).

ZS24-U Module Datasheet

Side view

ZS24-U Module Datasheet

Schematic diagram of footprint

ZS24-U Module Datasheet

Recommended footprint

ZS24-U Module Datasheet

Production instructions

  1. For the modules that can be packaged with the SMT or in an in-line way, you can select either of them according to the PCB design solutions of customers. If a PCB is designed to be SMT-packaged, package the module with the SMT. If a PCB is designed to be in-line-packaged, package the module in an in-line way. After being unpacked, the module must be soldered within 24 hours. Otherwise, it needs to be put into the drying cupboard where the relative humidity is not greater than 10%; or it needs to be packaged again under vacuum and the exposure time needs to be recorded (the total exposure time cannot exceed 168 hours).

    • (SMT process) SMT devices:
      • Mounter
      • SPI
      • Reflow soldering machine
      • Thermal profiler
      • Automated optical inspection (AOI) equipment
    • (Wave soldering process) Wave soldering devices
      • Wave soldering equipment
      • Wave soldering fixture
      • Constant-temperature soldering iron
      • Tin bar, tin wire, and flux
      • Thermal profiler
    • Baking devices:
      • Cabinet oven
      • Anti-electrostatic and heat-resistant trays
      • Anti-electrostatic and heat-resistant gloves
  2. Storage conditions for a delivered module:

    • The moisture-proof bag must be placed in an environment in which the temperature is below 40°C and the relative humidity is lower than 90%.

    • The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed.

    • There is a humidity indicator card (HIC) in the packaging bag.

      ZS24-U Module Datasheet

  3. The module needs to be baked in the following cases:

    • The packaging bag is damaged before unpacking.
    • There is no humidity indicator card (HIC) in the packaging bag.
    • After unpacking, circles of 10% and above on the HIC become pink.
    • The total exposure time has lasted for over 168 hours since unpacking.
    • More than 12 months have passed since the sealing of the bag.
  4. Baking settings:

    • Temperature: 40°C and ≤ 5% RH for reel package and 125°C and ≤5% RH for tray package (please use the heat-resistant tray rather than plastic container)
    • Time: 168 hours for reel package and 12 hours for tray package
    • Alarm temperature: 50°C for reel package and 135°C for tray package
    • Production-ready temperature after natural cooling: < 36°C
    • Re-baking situation: If a module remains unused for over 168 hours after being baked, it needs to be baked again.
    • If a batch of modules is not baked within 168 hours, do not use reflow soldering or wave soldering to solder them. Because these modules are Level-3 moisture-sensitive devices, they are very likely to get damp when exposed beyond the allowable time. In this case, if they are soldered at high temperatures, it may result in device failure or poor soldering.
  5. In the whole production process, take electrostatic discharge (ESD) protective measures.

  6. To guarantee the passing rate, it is recommended that you use the SPI and AOI to monitor the quality of solder paste printing and mounting.

  7. Due to the built-in crystal of the product, ordinary detergent or ultrasonic cleaning can be used in general, but in some cases, the vibration generated by the ultrasonic cleaning machine may cause damage to the internal structure of the crystal. If ultrasonic cleaning is used, it needs to be verified in advance to ensure that the internal crystal of the module will not be damaged after ultrasonic cleaning.

  8. Try to avoid using ultrasonic welding to install or process products. This processing method may cause excessive crystal vibration in the module and lead to crystal failure.

Recommended oven temperature curve

Select a proper soldering manner according to the process. For the SMT process, please refer to the recommended oven temperature curve of reflow soldering. For the wave soldering process, please refer to the recommended oven temperature curve of wave soldering. There are some differences between the set temperatures and the actual temperatures. All the temperatures shown in this module datasheet are obtained through actual measurements.

Manner 1: SMT process (Recommended oven temperature curve of reflow soldering)

Set oven temperatures according to the following curve.

ZS24-U Module Datasheet

  • A: Temperature axis

  • B: Time axis

  • C: Liquidus temperature: 217 to 220°C

  • D: Ramp-up slope: 1 to 3°C/s

  • E: Duration of constant temperature: 60 to 120s; the range of constant temperature: 150 to 200°C

  • F: Duration above the liquidus: 50 to 70s

  • G: Peak temperature: 235 to 245°C

  • H: Ramp-down slope: 1 to 4°C/s

    The above curve is just an example of the solder paste SAC305. For more details about other solder pastes, please refer to Recommended oven temperature curve in the solder paste specifications.

Manner 2: Wave soldering process (Oven temperature curve of wave soldering)

Set oven temperatures according to the following temperature curve of wave soldering. The peak temperature is 260°C±5°C.

ZS24-U Module Datasheet
Suggestions on oven temperature curve of wave soldering Suggestions on manual soldering temperature
Preheat temperature 80 to 130 °C Soldering temperature 360±20°C
Preheat time 75 to 100s Soldering time <3s/point
Peak contact time 3 to 5s NA NA
Temperature of tin cylinder 260±5°C NA NA
Ramp-up slope ≤2°C/s NA NA
Ramp-down slope ≤6°C/s NA NA

Storage conditions

ZS24-U Module Datasheet

MOQ and packaging information

Product model MOQ (pcs) Packing method Modules per reel Reels per carton
ZS24-U 4400 Tape reel 1100 4

Appendix: Statement

FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this device.
The module is limited to installation in mobile or fixed applications. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

Note: This device has been tested and found to comply with the limits for a Class B digital device, according to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This device generates, uses, and can radiate radio frequency energy and, if not installed and used following the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation.

If this device does cause harmful interference to radio or television reception, which can be determined by turning the device off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

  • Reorient or relocate the receiving antenna.
  • Increase the separation between the device and receiver.
  • Connect the device to an outlet on a circuit different from that to which the receiver is connected.
  • Consult the dealer or an experienced radio/TV technician for help.

Radiation Exposure Statement

This device complies with FCC radiation exposure limits set forth for an uncontrolled rolled environment. This device should be installed and operated with a minimum distance of 20cm between the radiator and your body. The OEM integrator is responsible for ensuring that the end-user has no manual instructions to remove or install the module.

Important Note

This radio module must not be installed to co-locate and operate simultaneously with other radios in the host system except following FCC multi-transmitter product procedures. Additional testing and device authorization may be required to operate simultaneously with other radios.

The availability of some specific channels and/or operational frequency bands are country dependent and are firmware programmed at the factory to match the intended destination. The firmware setting is not accessible to the end-user.

The host product manufacturer is responsible for compliance with any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed. The separate approval is required for all other operating configurations including portable configurations with respect to Part 2.1093 and different antenna configuration.

The end-user manual shall include all required regulatory information/warnings as shown in this manual, including “This product must be installed and operated with a minimum distance of 20 cm between the radiator and user body”.

This device has got an FCC ID: 2ANDL-ZS24-U. The end product must be labeled in a visible area with the following: “Contains Transmitter Module FCC ID: 2ANDL-ZS24-U”.

This device is intended only for OEM integrators under the following conditions:

The antenna must be installed such that 20cm is maintained between the antenna and users, and the transmitter module may not be co-located with any other transmitter or antenna.

As long as the 2 conditions above are met, further transmitter tests will not be required. However, the OEM integrator is still responsible for testing their end product for any additional compliance requirements required with this module installed.

Declaration of Conformity European Notice

ZS24-U Module Datasheet

Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module product is in compliance with essential requirements and other relevant provisions of Directive 2014/53/EU, 2011/65/EU. A copy of the Declaration of conformity can be found at https://www.tuya.com.

ZS24-U Module Datasheet

This product must not be disposed of as normal household waste, in accordance with the EU directive for waste electrical and electronic equipment (WEEE-2012/19/EU). Instead, it should be disposed of by returning it to the point of sale, or to a municipal recycling collection point.

The device could be used with a separation distance of 20cm from the human body.