ZS2S Module Datasheet

ZS2S is a Zigbee module that Tuya has developed. It consists of a highly integrated Zigbee chip (EFR32MG21A020F768IM32-B) and several peripheral components, with an embedded 802.15.4 PHY/MAC Zigbee network protocol stack and rich library functions.

Overview

ZS2S is embedded with a 32-bit low-power Arm Cortex-M33 core, 768-KB flash memory, and 64-KB random-access memory (RAM), and has extensive peripherals.

Features

• Embedded low-power 32-bit Arm Cortex-M33 processor, which provides digital signal processor (DSP) instructions and floating-point units (FPUs) and can also function as an application processor
• Clock rate: 80 MHz
• Operating voltage: 2.0V-3.8V
• Peripherals: 5 PWMs, 1 ADC and 1 UART
• Zigbee features
  • Channels 11 to 26 at 2.405 GHz to 2.480 GHz, 250 kbit/s air interface rate
  • Transmit power: +20 dBm
  • Runtime power consumption: 60 µA/MHz; current in sleep mode: 5 µA
  • Proactive device pairing for terminals
  • Onboard PCB antenna with a gain of 2.5 dBi
  • Operating temperature: -40℃ to +85℃

Application scenarios

• Intelligent building
• Smart household and home appliances
• Smart socket and light
• Industrial wireless control
• Baby monitor
• Network camera
• Intelligent bus

Module interfaces

Dimensions and footprint

ZS2S has two rows of pins with a spacing of 2 mm.
ZS2S dimensions are 14.99±0.35 mm (W)×17.90±0.35 mm (L) ×2.80±0.15 mm (H). The PCB thickness is 0.8±0.1 mm. The figures below show the front and rear views of ZS2S.

Pin definition

Pin number	Symbol	I/O type	Function
1	3V3	P	Power supply pin (typical power supply voltage: 3.3 V)
2	PA00	I/O	Hardware PWM pin, which is connected to PA00 on the internal IC
3	GND	P	Power supply reference ground pin, which must be properly grounded
4	PA03	I/O	Hardware PWM pin, which is connected to PA03 on the internal IC
5	RX	I/O	Serial interface receiving pin (UART0_RXD), which is connected to PA06 on the internal IC
6	PA04	I/O	Hardware PWM pin, which is connected to PA04 on the internal IC
7	TX	I/O	Serial interface transmission pin (UART0_TXD), which is connected to PA05 on the internal IC
8	ADC	AI	ADC, which is connected to PC01 on the internal IC
9	PB00	I/O	Hardware PWM pin, which is connected to PB00 on the internal IC
10	RST	I	Hardware reset pin (The chip is reset when the level is low. The level is high in
11	PB01	I/O	Hardware PWM pin, which is connected to PB01 on the internal IC

Test pin definition

Pin number	Symbol	I/O type	Function
12	V	P	Power supply pin (typical power supply voltage: 3.3 V)
13	D	I/O	JLINK SWDIO burning pin, which is connected to PA02 on the internal IC
14	C	I/O	JLINK SWCLK burning pin, which is connected to PA01 on the internal IC
15	G	P	Power supply reference ground pin, which must be properly grounded

Note: P indicates a power supply pin, and I/O indicates an input/output pin. If you have any special requirements on light colour controlled by PWM output, contact Tuya business personnel.

Electrical parameters

Absolute electrical parameters

Parameter	Description	Minimum value	Maximum value	Unit
Ts	Storage temperature	-50	150	℃
VCC	Power supply voltage	-0.3	3.8	V
ESD voltage (human body model)	TAMB-25℃	-	2	kV
ESD voltage (machine model)	TAMB-25℃	-	0.5	kV

Working conditions

Parameter	Description	Minimum value	Average value	Maximum value (Typical value)	Unit
Ta	Operating temperature	-40	-	85	℃
VCC	Power supply voltage	2.0	3.0	3.8	V
VIL	I/O low-level input	-	-	IOVDD*0.3	V
VIH	I/O high-level input	IOVDD*0.7	-	-	V
VOL	I/O low-level output	-	-	IOVDD*0.2	V
VOH	I/O high-level output	IOVDD*0.8	-	-	V

RF power consumption

Working status	Rate	TX power/Receiving	Average value	Maximum value (Typical value)	Unit
TX	250Kbps	+20dBm	200	210	mA
TX	250Kbps	+10dBm	62	64	mA
TX	250Kbps	+0dBm	26	28	mA
RX	250Kbps	Constant receiving	10	12	mA

Operating current

Working mode	Working status (Ta = 25°C)	Average value	Maximum value (Typical value)	Unit
EZ	The module is in EZ mode.	10	40	mA
Connected and idle	The module is connected to the network.	11	13	mA
Connected and work	The module is connected to the network.	12	70	mA
Deep sleep mode	The module is in deep sleep mode, with 64 KB flash memory.	5	-	μA

RF features

Basic RF features

Parameter	Description
Frequency range	2.4GHz ISM band
Zigbee standard	IEEE 802.15.4
Data transmission rate	250kbps
Antenna type	PCB antenna

TX performance

Parameter	Minimum value	Average value	Maximum value (Typical value)	Unit
Output power	-30	20	-	dBm
Output power adjustment step	-	0.5	1	dB
Output spectrum adjacent-channel rejection ratio	-	-31	-	dB
Frequency error	-15	N/A	+15	dB

RX performance

RX sensitivity

Item	Minimum value	Average value	Maximum value (Typical value)	Unit
RX sensitivity	250kbps	-	-102	-

Antenna information

Antenna type

ZS2S uses a PCB antenna with a gain of 2.5 dBi.

Antenna interference reduction

To ensure optimal Zigbee performance when the Zigbee module uses a PCB antenna, it is recommended that the antenna be at least 15 mm away from other metal parts. To prevent adverse impact on the antenna radiation performance, avoid copper or traces along the antenna area on the PCB.

Packaging information and production instructions

Mechanical dimension

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ZS2S module adopts the in-line manner：

Note: The default dimensional tolerance is ± 0.35 mm, and the key dimension tolerance is ± 0.1 mm. If you have any other special requirements on key dimensions, please make them clear in the specification after communication.

Production instructions

1. For the Tuya in-line module, wave soldering is most preferred and manual soldering is less preferred. After being unpacked, the module must be soldered within 24 hours. Otherwise, it must be put into the drying cupboard where the RH is not greater than 10%; or it needs to be packaged under vacuum again and record the exposure time (the total exposure time cannot exceed 168 hours).
2. Wave soldering devices and materials:
   • Wave soldering equipment
   • Wave soldering fixture
   • Constant-temperature soldering iron
   • Tin bar, tin wire, and flux
   • Thermal profiler
3. Baking devices:
   • Cabinet oven
   • Anti-electrostatic and heat-resistant trays
   • Anti-electrostatic and heat-resistant gloves
4. The module needs to be baked in the following cases:
   • The packaging bag is damaged before unpacking.
   • There is no humidity indicator card (HIC) in the packaging bag.
   • After unpacking, circles of 10% and above on the HIC become pink.
   • The total exposure time has lasted for over 168 hours since unpacking.
   • More than 12 months have passed since the sealing of the bag.
5. Baking settings:
   • Temperature: 40°C and ≤ 5% RH for reel package and 125°C and ≤5% RH for tray package (please use the heat-resistant tray rather than a plastic container)
   • Time: 168 hours for reel package and 12 hours for tray package
   • Alarm temperature: 50°C for reel package and 135°C for tray package
   • Production-ready temperature after natural cooling: < 36°C
   • Re-baking situation: If a module remains unused for over 168 hours after being baked, it needs to be baked again.
   • If a batch of modules is not baked within 168 hours, do not use the wave soldering to solder them. Because these modules are Level-3 moisture-sensitive devices, they are very likely to get damp when exposed beyond the allowable time. In this case, if they are soldered at high temperatures, it may result in device failure or poor soldering.
6. In the whole production process, take electrostatic discharge (ESD) protective measures.
7. To guarantee the quality of products, you must pay attention to the following items: The amount of soldering flux, the height of the wave peak, whether the tin slag and copper content in the wave soldering tank exceed standards, whether the window and thickness of the wave soldering fixture are appropriate, and whether the wave soldering oven temperature curve is appropriate.

Recommended oven temperature curve and temperature

Set oven temperatures according to the following temperature curve of wave soldering. The peak temperature is 260°C±5°C.

Recommended soldering temperature:

Suggestions on oven temperature curve of wave soldering		Suggestions on manual soldering temperature
Preheat temperature	80 to 130 °C	Soldering temperature	360±20°C
Preheat time	75 to 100s	Soldering time	＜3s/point
Peak contact time	3 to 5s	NA	NA
Temperature of tin cylinder	260±5°C	NA	NA
Ramp-up slope	≤2°C/s	NA	NA
Ramp-down slope	≤6°C/s	NA	NA

Storage conditions

Storage conditions for a delivered module:

• The moisture-proof bag is placed in an environment where the temperature is below 40°C and the relative humidity is lower than 90%.

• The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed.

• There is a humidity indicator card (HIC) in the packaging bag.

  

  

MOQ and packaging information

Product model	MOQ（pcs）	Packaging method	Number of modules in per reel	Number of reels in per carton
ZS2S	4400	Tape reel	1100	4

Appendix: Statement

FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this device.

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

Note: This device has been tested and found to comply with the limits for a Class B digital device, according to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This device generates, uses, and can radiate radio frequency energy and, if not installed and used following the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation.

If this device does cause harmful interference to radio or television reception, which can be determined by turning the device off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

• Reorient or relocate the receiving antenna.
• Increase the separation between the device and receiver.
• Connect the device to an outlet on a circuit different from that to which the receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help.

Radiation Exposure Statement

This device complies with FCC radiation exposure limits set forth for an uncontrolled rolled environment. This device should be installed and operated with a minimum distance of 20cm between the radiator and your body.

Important Note

This radio module must not be installed to co-locate and operate simultaneously with other radios in the host system except FCC multi-transmitter product procedures. Additional testing and device authorization may be required to operate simultaneously with other radios.

The availability of some specific channels and/or operational frequency bands are country dependent and are firmware programmed at the factory to match the intended destination. The firmware setting is not accessible by the end-user.

The host product manufacturer is responsible for compliance with any other FCC rule that applies to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.

The end-user manual shall include all required regulatory information/warnings as shown in this manual, including “This product must be installed and operated with a minimum distance of 20 cm between the radiator and user body.”

This devicZS2Sve got an FCC ID: 2ANDL-ZS2S. The end product must be labeled in a visible area with the following: “Contains Transmitter Module FCC ID: 2ANDL-ZS2S”.

This device is intended only for OEM integrators under the following conditions:
The antenna must be installed such that 20cm is maintained between the antenna and users, and 2) The transmitter module may not be co-located with any other transmitter or antenna.
As long as the 2 conditions above are met, further transmitter tests will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed.

Declaration of Conformity European Notice

Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module product complies with essential requirements and other relevant provisions of Directive 2014/53/EU,2011/65/EU. A copy of the Declaration of conformity can be found at https://www.tuya.com.

This product must not be disposed of as normal household waste, under the EU directive for a waste electrical and electronic device (WEEE- 2012/19/EU). Instead, it should be disposed of by returning it to the point of sale, or to a municipal recycling collection point.

The device could be used with a separation distance of 20cm to the human body.