ZSLC5 Module Datasheet

ZSLC5 is a Zigbee module that Tuya has developed. It consists of a highly integrated RF processor chip (EFR32MG21A020F768IM32-B) and several peripheral components, with an embedded 802.15.4 PHY/MAC Zigbee network protocol stack and rich library functions.

Overview

ZSLC5 is embedded with a 32-bit low-power Arm Cortex-M33 core, 768-KB flash memory, and 64-KB random-access memory (RAM), and has extensive peripherals.

ZSLC5 integrates all function libraries of the Zigbee MAC. You can develop embedded Zigbee products as required.

Features

• Embedded low-power 32-bit Arm Cortex-M33 processor, which provides a digital signal processor (DSP) instructions and floating-point units (FPUs) and can also function as an application processor
• Clock rate: 80 MHz
• Operating voltage: 2.0V-3.8V
• Peripherals: 3xPWMs
• Zigbee features:
  • Channels 11 to 26 at 2.405 GHz to 2.480 GHz, 250 kbit/s air interface rate
  • Maximum output power: +20 dBm
  • Runtime power consumption: 60 µA/MHz; current in sleep mode: 5 µA
  • External monopole antenna with the gain of 1.0dBi
  • Operating temperature:-20℃ to +105℃

Application scenarios

• Intelligent building
• Smart household and home appliances
• Smart socket and light
• Industrial wireless control
• Baby monitor
• Network camera
• Intelligent bus

Module interfaces

Dimensions and footprint

ZSLC5 has two lines of pins with a spacing of 2±0.1 mm.

ZSLC5 dimensions are 12.7±0.3mm (L)×8.5±0.3mm (W) ×2.3±0.15mm (H). The figure shows the ZSLC5 front and rear views.

Interface pin definition

Pin No.	Symbol	I/O type	Function
1	ANT	I/O	ANT Port
2	GND	P	Power supply reference ground pin, which must be properly grounded
3	PA00	I/O	Hardware PWM pin, which is connected to PA00 on the internal IC
4	PA03	I/O	Hardware PWM pin, which is connected to PA03 on the internal IC
5	PA04	I/O	Hardware PWM pin, which is connected to PA04 on the internal IC
6	3V3	P	Power supply pin (typical power supply voltage: 3.3 V)

Test pin definition

Pin No.	Symbol	I/O type	Function
TP1	SWDIO	I/O	JLINK SWDIO burning pin, which is connected to PA02 on the internal IC
TP2	SWCLK	I/O	JLINK SWCLK burning pin, which is connected to PA01 on the internal IC
TP3	U0RXD	I/O	Serial interface receiving pin (UART0_RXD), which is connected to PA06 on the internal IC
TP4	U0TXD	I/O	Serial interface transmission pin (UART0_TXD), which is connected to PA05 on the internal IC
TP5	RST	I	Hardware reset pin (The chip is reset when the level is low. The level is high in

Note: P indicates a power supply pin, and I/O indicates an input/output pin.

Electrical parameters

Absolute electrical parameters

Parameter	Description	Minimum value	Maximum value	Unit
Ts	Storage temperature	-50	150	℃
VCC	Power supply voltage	-0.3	3.8	V
ESD voltage (human body model)	TAMB-25℃	-	2	KV
ESD voltage (machine model)	TAMB-25℃	-	0.5	KV

Working conditions

Parameter	Description	Minimum value	Average value	Maximum value (Typical value)	Unit
Ta	Operating temperature	-40	-	105	℃
VCC	Power supply voltage	2.0	3.0	3.8	V
VIL	I/O low-level input	-	-	IOVDD*0.3	V
VIH	I/O high-level input	IOVDD*0.7	-	-	V
VOL	I/O low-level output	-	-	IOVDD*0.2	V
VOH	I/O high-level output	IOVDD*0.8	-	-	V

RF current consumption

Working status	Rate	TX power/Receive	Average value	Maximum value (Typical value)	Unit
TX	250Kbps	+20dBm	200	210	mA
TX	250Kbps	+10dBm	62	64	mA
TX	250Kbps	+0dBm	26	28	mA
RX	250Kbps	Constant receiving	10	12	mA

Working current

Working mode	Working status (Ta = 25°C)	Average value	Maximum value (Typical value)	Unit
EZ	The module is in EZ mode.	10	40	mA
Connected and idle	The module is connected to the network and in idle state.	12	14	mA
Connected and busy	The module is connected to the network and in operating state.	15	72	mA
Deep sleep mode	The module is in deep sleep mode, with 64-KB flash memory.	5	-	μA

RF features

Basic RF features

Parameter	Description
Frequency range	2.4GHz ISM band
Zigbee standard	IEEE 802.15.4
Data transmission rate	250kbps
Antenna type	External monopole antenna with a gain of 1 dBi

TX performance

Parameter	Minimum value	Average value	Maximum value (Typical value)	Unit
Output power	-30	20	-	dBm
Output power adjustment step	-	0.5	1	dB
Output spectrum adjacent-channel rejection ratio	-	-31	-	dB
Frequency error	-15	N/A	+15	dB

RX performance

Parameter	Minimum value	Typical value	Maximum value	Unit
PER<8%, RX sensitivity (250Kbps)	-102	-101	-99	dBm

Antenna

Antenna type

The module uses an external antenna which is soldered on the ANT pad of the module in a soldering manner.

An antenna with a length of 28 mm is recommended.

Antenna interference reduction

To ensure optimal Wi-Fi performance when the Wi-Fi module uses an onboard PCB antenna, it is recommended that the antenna be at least 15 mm away from other metal parts.

Packaging information and production instructions

Mechanical dimensions

The PCB dimensions are 12.7±0.3mm (L)×8.5±0.3mm (W) ×1.0±0.1mm (H)

Recommended footprint

Recommended schematic encapsulation

Note: The default tolerance of module overall dimension is ± 0.35 mm, Key dimension tolerance is ± 0.1 mm. If the customer has clear requirements for key dimensions, please make clear calibration in the specification after communication.

Production instructions

1. For the Tuya in-line module, wave soldering is most preferred and manual soldering is less preferred. After being unpacked, the module must be soldered within 24 hours. Otherwise, it must be put into the drying cupboard where the RH is not greater than 10%; or it needs to be packaged under vacuum again and record the exposure time (the total exposure time cannot exceed 168 hours).
2. Wave soldering devices and materials:
   • Wave soldering equipment
   • Wave soldering fixture
   • Constant-temperature soldering iron
   • Tin bar, tin wire, and flux
   • Thermal profiler
3. Baking devices:
   • Cabinet oven
   • Anti-electrostatic and heat-resistant trays
   • Anti-electrostatic and heat-resistant gloves
4. The module needs to be baked in the following cases:
   • The packaging bag is damaged before unpacking.
   • There is no humidity indicator card (HIC) in the packaging bag.
   • After unpacking, circles of 10% and above on the HIC become pink.
   • The total exposure time has lasted for over 168 hours since unpacking.
   • More than 12 months have passed since the sealing of the bag.
5. Baking settings:
   • Temperature: 40°C and ≤ 5% RH for reel package and 125°C and ≤5% RH for tray package (please use the heat-resistant tray rather than plastic container).
   • Time: 168 hours for reel package and 12 hours for tray package.
   • Alarm temperature: 50°C for reel package and 135°C for tray package.
   • Production-ready temperature after natural cooling: < 36°C.
   • Re-baking situation: If a module remains unused for over 168 hours after being baked, it needs to be baked again.
   • If a batch of modules is not baked within 168 hours, do not use the wave soldering to solder them. Because these modules are Level-3 moisture-sensitive devices, they are very likely to get damp when exposed beyond the allowable time. In this case, if they are soldered at high temperatures, it may result in device failure or poor soldering.
6. In the whole production process, take electrostatic discharge (ESD) protective measures.
7. To guarantee the quality of products, you must pay attention to the following items: The amount of soldering flux, the height of the wave peak, whether the tin slag and copper content in the wave soldering tank exceed standards, whether the window and thickness of the wave soldering fixture are appropriate, and whether the wave soldering oven temperature curve is appropriate.

Recommended oven temperature curve and temperature

Set oven temperatures according to the following temperature curve of wave soldering. The peak temperature is 260°C±5°C.

Recommended soldering temperature:

Suggestions on oven temperature curve of wave soldering		Suggestions on manual soldering temperature
Preheat temperature	80 to 130 °C	Soldering temperature	360±20°C
Preheat time	75 to 100s	Soldering time	＜3s/point
Peak contact time	3 to 5s	NA	NA
Temperature of tin cylinder	260±5°C	NA	NA
Ramp-up slope	≤2°C/s	NA	NA
Ramp-down slope	≤6°C/s	NA	NA

Storage conditions

Storage conditions for a delivered module:

• The moisture-proof bag is placed in an environment where the temperature is below 40°C and the relative humidity is lower than 90%.

• The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed.

• There is a humidity indicator card (HIC) in the packaging bag.

  

  

MOQ and packaging information

Product model	MOQ（pcs）	Packaging method	Number of modules per reel	Number of reels per carton
ZSLC5	5600	Tape reel	1400	4

Appendix: Statement

FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this equipment.

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

Note: This equipment has been tested and found to comply with the limits for a Class B digital device, according to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used following the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and receiver.
• Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help.

Radiation Exposure Statement

This equipment complies with FCC radiation exposure limits set forth for an uncontrolled rolled environment. This equipment should be installed and operated with a minimum distance of 20cm between the radiator and your body.

Important Note

This radio module must not be installed to co-locate and operating simultaneously with other radios in the host system except following FCC multi-transmitter product procedures. Additional testing and equipment authorization may be required to operate simultaneously with other radios.

The availability of some specific channels and/or operational frequency bands are country dependent and are firmware programmed at the factory to match the intended destination. The firmware setting is not accessible by the end-user.

The host product manufacturer is responsible for compliance with any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.

The end-user manual shall include all required regulatory information/warning as shown in this manual, including: This product must be installed and operated with a minimum distance of 20 cm between the radiator and user body.

This device has got an FCC ID: 2ANDL-ZSLC5. The end product must be labeled in a visible area with the following: “Contains Transmitter Module FCC ID: 2ANDL-ZSLC5”

This device is intended only for OEM integrators under the following conditions:

1. The antenna must be installed such that 20cm is maintained between the antenna and users, and
2. The transmitter module may not be co-located with any other transmitter or antenna.

As long as the 2 conditions above are met, further transmitter tests will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed.

Declaration of Conformity European notice

Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module product is in compliance with essential requirements and other relevant provisions of Directive 2014/53/EU,2011/65/EU. A copy of the Declaration of conformity can be found at https://www.tuya.com

This product must not be disposed of as normal household waste, in accordance with the EU directive for waste electrical and electronic equipment (WEEE- 2012/19/EU). Instead, it should be disposed of by returning it to the point of sale, or to a municipal recycling collection point.

The device could be used with a separation distance of 20cm to the human body.