ZSLCB Module Datasheet

ZSLCB is a Zigbee module that Tuya has developed. It consists of a highly integrated wireless RF processor chip (EFR32MG21A020F768IM32-B), a few peripherals, a built-in 802.15.4 PHY/MAC Zigbee network protocol stack, and rich library functions.

Overview

ZSLCB is embedded with a low-power 32-bit ARM Cortex-M33 core, 768-KB flash program memory, 64-KB RAM, and rich peripheral resources.

ZSLCB integrates all function libraries of the Zigbee MAC. You can develop embedded Zigbee products as required.

Features

• Embedded with a low-power 32-bit CPU and ARM Cortex-M 33 processor and having the DSP instructions and floating-point unit, capable to function as an application processor
• Maximum clock rate: 80 MHz
• Wide operating voltage: 2.0 to 3.8 V
• Peripherals: 2 GPIOs
• Zigbee connectivity
  • Support 802.15.4 MAC/PHY
  • Working channels 11 to 26@2.400-2.483 Ghz Air interface rate: 250 Kbps
  • Up to +20 dBm output power
  • 60 μA/MHz running power consumption; 5μA sleep current
  • Monopole sub antenna with a high gain
  • Operating temperature: -20 to 105℃
  • Support hardware encryption and AES 128/256

Applications

• Intelligent building
• Smart household and home appliances
• Smart socket and light
• Industrial wireless control
• Baby monitor
• Network camera
• Intelligent bus

Module interfaces

Dimensions and footprint

• ZSLCB has two rows of pins with a spacing of 2.0 mm.

• The ZSLCB dimensions are 7.5±0.35 mm (W)×10.75±0.35 mm (L) ×2.3±0.15 mm (H). The thickness of the PCB is 1.0± 0.1 mm. The size of a pad of a single pin is 1.1 mm*2.1 mm. The dimensions of ZSLCB are as follows:

  

  

Pin definition

Pin number	Symbol	I/O type	Function
1	GND	P	The reference ground of the module
2	3.3 V	P	The power supply pin of the module (The typical power supply voltage: 3.3 V)
3	PA 04	I/O	Function as a GPIO and correspond to PA 04 (pin 21) of IC
4	ANT	I/O	A radio frequency interface; The pad is used to solder the antenna
5	PA 03	I/O	Function as a GPIO and correspond to PA 03 (pin 20) of IC

Note: P indicates power supply pins, I/O indicates input/output pins, and AI indicates analog input pins. The nRST pin is only a resetting pin of a module and cannot be used for clearing information about Zigbee network configuration.

Definitions of test points

Pin number	Symbol	I/O type	Function
TP1	SWDIO	I/O	JLINK SWDIO programming pin
TP2	SWDIO	I/O	JLINK SWDIO programming pin
TP3	U0RXD	I/O	UART0_RXD, the serial interface for receiving corresponds to PA 06 (pin 23) of IC
TP4	U0TXD	O	UART0_TXD, the serial interface for transmitting corresponds to PA 05 (pin 22) of IC
TP5	NRST	I	The module is reset at a low level. The module is at a high level in a normal state

Note: Test pins are not recommended.

Electrical parameters

Absolute electrical parameters

Parameter	Description	Minimum value	Maximum value	Unit
Ts	Storage temperature	-50	150	℃
VBAT	Power supply voltage	2.0	3.8	V
ESD voltage (human body model)	TAMB-25℃	-	2	KV
ESD voltage (machine model)	TAMB-25℃	-	0.5	KV

Normal working conditions

Parameter	Description	Minimum value	Typical value	Maximum value	Unit
Ta	Operating temperature	-40	-	105	℃
VBAT	Power supply voltage	3.0	3.3	3.6	V
VIL	IO low-level intput	-0.3	-	VCC*0.25	V
VIH	IO high-level input	VCC*0.75	-	VCC	V
VOL	IO low-level output	-	-	VCC*0.1	V
VOH	IO high-level output	VCC*0.8	-	VCC	V
Imax	IO drive current	-	-	12	mA

TX and RX power consumption

Working status	Mode	Rate	Transmit power/receive	Average value	Peak value (Typical value)	Unit
Transmit	-	250 Kbps	+20 dBm	181	183	mA
Transmit	-	250 Kbps	+11 dBm	66	67.5	mA
Transmit	-	250 Kbps	+0 dBm	26	27	mA
Receive	-	250 Kbps	Constantly receive	10	12	mA
Receive	-	250 Kbps	Constantly receive	10	12	mA
Receive	-	250 Kbps	Constantly receive	10	12	mA

Working current

Working mode	Working status, Ta = 25°C, network configuration power: 11 dbm	Average value	Maximum value (Typical value)	Unit
Quick connection network state	The module is in the fast network connection state	15.6	79	mA
Network connection state	The module is in the network connection idle state	11	13	mA
Network connection state	The module is connected to the network	12	81.5	mA
Deep sleep mode	Deep sleep mode, reserve 64-KB flash memory	5	-	μA

RF parameters

Basic RF features

Parameter	Description
Working frequency	2.405 to 2.480 GHz
Zigbee standard	IEEE 802.15.4
Data transmission rate	250 Kbps
Antenna type	Monopole sub antenna with a gain of 1 dBi

TX performance

TX performance:

Parameter	Minimum value	Typical value	Maximum value	Unit
Maximum output power (250Kbps)	-	20	-	dBm
Minimum output power (250Kbps)	-	-30	-	dBm
Output power adjustment stepping	-	0.5	1	dBm
Output spectrum adjacent channel suppression	-	-31	-	dBc
Frequency error	-15	-	15	ppm

RX performance

RX sensitivity:

Parameter	Minimum value	Typical value	Maximum value	Unit
PER<8%, RX sensitivity (250 Kbps)	-102	-101	-99	dBm

Antenna

Antenna type

The module uses an external antenna which is soldered on the ANT pad of the module in a soldering manner.
An antenna with a length of 28 mm is recommended.

Antenna Interference Reduction

To ensure optimal WiFi performance when the WiFi module uses an onboard PCB antenna, it is recommended that the antenna be at least 15 mm away from other metal parts.

Packaging information and production instructions

Mechanical dimensions

The ZSLCB dimensions are 7.5±0.35 mm (W)×10.75±0.35 mm (L) ×1.0±0.1 mm (H).

Schematic diagram of footprint

Diagram of PCB footprint

Since the module is designed to be a plugin as a whole, customers can also design a reasonable transfer structure based on samples.

Production instructions

1. For the Tuya in-line module, wave soldering is most preferred and manual soldering is less preferred. After being unpacked, the module must be soldered within 24 hours. Otherwise, it must be put into the drying cupboard where the RH is not greater than 10%; or it needs to be packaged under vacuum again and record the exposure time (the total exposure time cannot exceed 168 hours).
2. Wave soldering devices and materials:
   • Wave soldering equipment
   • Wave soldering fixture
   • Constant-temperature soldering iron
   • Tin bar, tin wire, and flux
   • Thermal profiler
3. Baking devices:
   • Cabinet oven
   • Anti-electrostatic and heat-resistant trays
   • Anti-electrostatic and heat-resistant gloves
4. The module needs to be baked in the following cases:
   • The packaging bag is damaged before unpacking.
   • There is no humidity indicator card (HIC) in the packaging bag.
   • After unpacking, circles of 10% and above on the HIC become pink.
   • The total exposure time has lasted for over 168 hours since unpacking.
   • More than 12 months have passed since the sealing of the bag.
5. Baking settings:
   • Temperature: 40°C and ≤ 5% RH for reel package and 125°C and ≤5% RH for tray package (please use the heat-resistant tray rather than a plastic container)
   • Time: 168 hours for reel package and 12 hours for tray package
   • Alarm temperature: 50°C for reel package and 135°C for tray package
   • Production-ready temperature after natural cooling: < 36°C
   • Re-baking situation: If a module remains unused for over 168 hours after being baked, it needs to be baked again.
   • If a batch of modules is not baked within 168 hours, do not use the wave soldering to solder them. Because these modules are Level-3 moisture-sensitive devices, they are very likely to get damp when exposed beyond the allowable time. In this case, if they are soldered at high temperatures, it may result in device failure or poor soldering.
6. In the whole production process, take electrostatic discharge (ESD) protective measures.
7. To guarantee the quality of products, you must pay attention to the following items: The amount of soldering flux, the height of the wave peak, whether the tin slag and copper content in the wave soldering tank exceed standards, whether the window and thickness of the wave soldering fixture are appropriate, and whether the wave soldering oven temperature curve is appropriate.

Recommended oven temperature curve and temperature

Set oven temperatures according to the following temperature curve of wave soldering. The peak temperature is 260°C±5°C.

Recommended soldering temperature:

Suggestions on oven temperature curve of wave soldering		Suggestions on manual soldering temperature
Preheat temperature	80 to 130 °C	Soldering temperature	360±20°C
Preheat time	75 to 100s	Soldering time	＜3s/point
Peak contact time	3 to 5s	NA	NA
Temperature of tin cylinder	260±5°C	NA	NA
Ramp-up slope	≤2°C/s	NA	NA
Ramp-down slope	≤6°C/s	NA	NA

Storage conditions

Storage conditions for a delivered module:

• The moisture-proof bag is placed in an environment where the temperature is below 40°C and the relative humidity is lower than 90%.

• The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed.

• There is a humidity indicator card (HIC) in the packaging bag.

  

  

MOQ and packaging information

Product model	MOQ(pcs)	Packing method	Number of modules per reel	Number of reels per carton
ZSLCB	8000	Tape reel	2000	4

Appendix: Statement

FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this equipment.

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

• Reorient or relocate the receiving antenna.

• Increase the separation between the equipment and receiver.

• Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.

• Consult the dealer or an experienced radio/TV technician for help.

Radiation Exposure Statement

This equipment complies with FCC radiation exposure limits set forth for an uncontrolled rolled environment. This equipment should be installed and operated with a minimum distance of 20cm between the radiator and your body.

Important Note

This radio module must not be installed to co-locate and operating simultaneously with other radios in the host system except in accordance with FCC multi-transmitter product procedures. Additional testing and equipment authorization may be required to operate simultaneously with other radios.

The availability of some specific channels and/or operational frequency bands are country dependent and are firmware programmed at the factory to match the intended destination. The firmware setting is not accessible by the end-user.

The host product manufacturer is responsible for compliance with any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.

The end-user manual shall include all required regulatory information/warning as shown in this manual, including: This product must be installed and operated with a minimum distance of 20 cm between the radiator and user body.

The RF module is considered as a limited modular transmitter according to FCC rules. Even though the RF module gets an FCC ID, the host product manufacturer can not use the FCC ID on the final product directly. In these circumstances, the host product manufacturer integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining the FCC authorization by a Class II permissive change application or a new application.

Declaration of Conformity European notice

Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module product is in compliance with essential requirements and other relevant provisions of Directive 2014/53/EU, 2011/65/EU. A copy of the Declaration of conformity can be found at https://www.tuya.com.

This product must not be disposed of as normal household waste, in accordance with the EU directive for waste electrical and electronic equipment (WEEE-2012/19/EU). Instead, it should be disposed of by returning it to the point of sale, or to a municipal recycling collection point.

The device could be used with a separation distance of 20 cm to the human body.