ZSC Module Datasheet

Last Updated on : 2024-06-14 03:01:40download

ZSC is a Zigbee module that Tuya has developed. It consists of a highly integrated RF processing chip (EFR32MG21A020F1024IM32-B), a few peripherals, a built-in 802.15.4 PHY/MAC Zigbee network protocol stack, and rich library functions.

Product overview

ZSC is embedded with a low-power 32-bit ARM Cortex-M33 core, 1024 KB flash program memory, 96 KB RAM, and abundant peripheral resources. It integrates all function libraries of the Zigbee MAC and TCP/IP. You can develop embedded Zigbee products as required.


  • Embedded ARM Cortex-M33 processor having a low-power 32-bit CPU and having DSP instructions and uping-point units, which can also function as an application processor.
  • Clock rate: 80 MHz
  • Wide operating voltage: 2.0 to 3.8 V
  • Peripherals: 5 GPIOs, 1 UART, 2 ADC, SWDIO, and SWCLK
  • Zigbee connectivity
    • Support 802.15.4 MAC/PHY
    • Working channels 11 to 26 @2.400 to 2.483 GHz, air interface rate: 250 Kbps
    • Up to +20dBm output power
    • 60 μA/MHz power consumption during running; 5-μA sleep current
    • Operating temperature: -40℃ to 105℃
    • Support hardware encryption and AES 128/256


  • Intelligent building
  • Smart home and electrical appliances
  • Smart socket and light
  • Industrial wireless control
  • Baby monitor
  • Network camera
  • Intelligent bus

Module interfaces

Dimensions and footprint

ZSC has 3 lines of pins. The spacing of pins at the two sides is 1.5±0.1 mm, and the spacing of pins at the bottom is 1.5±0.1 mm.

The dimensions of the ZSC are 15±0.35 mm (L) × 8±0.35 mm (W) × 2.8±0.1 mm (H).

The dimensions of ZSC are as follows:

ZSC Module Datasheet

Pin definition

ZSC Module Datasheet

Pin number Symbol Type Function
2 RX I/O UART_RXD0, flashing authorization pin, correspond to PA06 (Pin 23) on the internal IC
3 TX I/O UART_TXD0, flashing authorization pin, correspond to PA05 (Pin 22) on the internal IC
4 PB01 I/O Support hardware PWM and correspond to PB01 (Pin 15) on the internal IC
5 PB00 I/O Support hardware PWM and correspond to PB00 (Pin 16) on the internal IC
6 PA00 I/O Support hardware PWM and correspond to PA00 (Pin 17) on the internal IC
7 PA03 I/O Support hardware PWM and correspond to PA03 (Pin 20) on the internal IC
8 PA04 I/O Support hardware PWM and correspond to PA04 (Pin 21) on the internal IC
9 GND P Power supply reference ground
10 VCC P Power supply pin (3.3V)
11 DIO I/O Flashing pin, SWDIO
12 CLK I/O Flashing pin, SWCLK
13 RST I/O Reset pin, low active, corresponding to RESETn (Pin 9) on the internal IC
  • P indicates a power supply pin and I/O indicates an input/output pin.
  • Pin 11 and 12 are the flashing pins, which can be used as ordinary I/O after the flashing is completed.

Electrical parameters

Absolute electrical parameters

Parameter Description Minimum value Maximum value Unit
Ts Storage temperature -50 150
VBAT Power supply voltage 2.0 3.8 V
ESD voltage (human body model) TAMB-25℃ - 2 KV
ESD voltage (machine model) TAMB-25℃ - 0.5 KV

Normal working conditions

Parameter Description Minimum value Typical value Maximum value Unit
Ta Operating temperature -40 - 105
VCC Operating voltage 2.0 3.3 3.8 V
VIL I/O low level input - - VDD*0.3 V
VIH I/O high level input VDD*0.7 - - V
VOL I/O low level output - - VDD*0.2 V
VOH I/O high level output VDD*0.8 - - V

TX and RX power consumption

Working status Mode Rate Transmit power/receive Average value Peak value (Typical value) Unit
Transmit - 250Kbps +20dBm 200 211 mA
Transmit - 250 Kbps +10 dBm 62 65 mA
Transmit - 250 Kbps +0 dBm 27 29 mA
Receive - 250Kbps Constantly receive 11 15 mA

Working current

Working mode Working status, Ta = 25°C Average value Maximum value (Typical value) Unit
EZ mode The module is in fast network connection state. 12 38 mA
Connected and busy The module is connected to the network and in running state. 13 70 mA
Connected and idle The module is connected to the network and in idle state. 12 14 mA
Deep sleep mode Deep sleep mode, reserve 64-KB flash 5 - μA

RF parameters

Basic RF features

Parameter Description
Working frequency 2.405 to 2.480 GHz
Zigbee standard IEEE 802.15.4
Data transmission rate 250 Kbps
Antenna type External monopole antenna

TX performance

TX performance

Parameter Minimum value Typical value Maximum value Unit
Output power (250Kbps) -30 18 20 dBm
Output power adjustment stepping - 0.5 1 dBm
Output spectrum adjacent channel suppression - -31 - dBc
Frequency error -15 - 15 ppm

RX performance

RX sensitivity

Parameter Minimum value Typical value Maximum value Unit
PER<8%, RX sensitivity (250 Kbps) -102 -101 -99 dBm

Antenna information

Antenna type

ZSC uses the PCB antenna.

Antenna interference reduction

To ensure optimal RF performance when the Zigbee module uses a PCB antenna, it is recommended that the antenna be at least 15 mm away from other metal parts.
To prevent adverse impact on the antenna radiation performance, avoid copper or traces within the antenna area on the PCB.

ZSC Module Datasheet

ZSC Module Datasheet

ZSC Module Datasheet

ZSC Module Datasheet

Packaging information and production instructions

Mechanical dimensions

The PCB dimensions are 15±0.35 mm (W)×8±0.35 mm (L) ×0.8±0.1 mm (H).

ZSC Module Datasheet

Side view

ZSC Module Datasheet

Schematic diagram of footprint

ZSC Module Datasheet

Production instructions

  1. If a PCB is designed to be SMT-packaged, package the module with the SMT. After being unpacked, the module must be soldered within 24 hours. Otherwise, it needs to be put into the drying cupboard where the relative humidity is not greater than 10%. Alternatively, it needs to be packaged again under vacuum and the exposure time needs to be recorded (the total exposure time cannot exceed 168 hours).

    • (SMT process) SMT devices:
      • Mounter
      • SPI
      • Reflow soldering machine
      • Thermal profiler
      • Automated optical inspection (AOI) equipment
    • Baking devices:
      • Cabinet oven
      • Anti-electrostatic and heat-resistant trays
      • Anti-electrostatic and heat-resistant gloves
  2. Storage conditions for a delivered module:

    • The moisture-proof bag must be placed in an environment in which the temperature is below 40°C and the relative humidity is lower than 90%.

    • The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed.

    • There is a humidity indicator card (HIC) in the packaging bag.

      ZSC Module Datasheet

  3. The module needs to be baked in the following cases:

    • The packaging bag is damaged before unpacking.
    • There is no humidity indicator card (HIC) in the packaging bag.
    • After unpacking, circles of 10% and above on the HIC become pink.
    • The total exposure time has lasted for over 168 hours since unpacking.
    • More than 12 months have passed since the sealing of the bag.
  4. Baking settings:

    • Temperature: 40°C and ≤ 5% RH for reel package and 125°C and ≤5% RH for tray package (please use the heat-resistant tray rather than plastic container)
    • Time: 168 hours for the reel package and 12 hours for the tray package
    • Alarm temperature: 50°C for reel package and 135°C for tray package
    • Production-ready temperature after natural cooling: < 36°C
    • Re-baking situation: If a module remains unused for over 168 hours after being baked, it needs to be baked again.
    • If a batch of modules is not baked within 168 hours, do not use reflow soldering or wave soldering to solder them. Because these modules are Level-3 moisture-sensitive devices, they are very likely to get damp when exposed beyond the allowable time. In this case, if they are soldered at high temperatures, it may result in device failure or poor soldering.
  5. In the whole production process, take electrostatic discharge (ESD) protective measures.

  6. To guarantee the passing rate, it is recommended that you use the SPI and AOI to monitor the quality of solder paste printing and mounting.

Recommended oven temperature curve

Select a proper soldering manner according to the process. For the SMT process, please refer to the recommended oven temperature curve of reflow soldering. There are some differences between the set temperatures and the actual temperatures. All the temperatures shown in this module datasheet are obtained through actual measurements.

SMT process (Recommended oven temperature curve of reflow soldering)

Set oven temperatures according to the following curve.

ZSC Module Datasheet

  • A: Temperature axis

  • B: Time axis

  • C: Liquidus temperature: 217 to 220°C

  • D: Ramp-up slope: 1 to 3°C/s

  • E: Duration of constant temperature: 60 to 120s; the range of constant temperature: 150 to 200°C

  • F: Duration above the liquidus: 50 to 70s

  • G: Peak temperature: 235 to 245°C

  • H: Ramp-down slope: 1 to 4°C/s

    The above curve is just an example of the solder paste SAC305. For more details about other solder pastes, please refer to Recommended oven temperature curve in the solder paste specifications.

Storage conditions

ZSC Module Datasheet

MOQ and packaging information

Product model MOQ (pcs) Packing method Modules per reel Reels per carton
ZSC 6000 Tape reel 1500 4

Appendix: Statement

FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this device.

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

Note: This device has been tested and found to comply with the limits for a Class B digital device, according to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This device generates, uses, and can radiate radio frequency energy and, if not installed and used following the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation.

If this device does cause harmful interference to radio or television reception, which can be determined by turning the device off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

  • Reorient or relocate the receiving antenna.
  • Increase the separation between the device and receiver.
  • Connect the device to an outlet on a circuit different from that to which the receiver is connected.
  • Consult the dealer or an experienced radio/TV technician for help.

Radiation Exposure Statement

This device complies with FCC radiation exposure limits set forth for an uncontrolled rolled environment. This device should be installed and operated with a minimum distance of 20cm between the radiator and your body.

Important Note

This radio module must not be installed to co-locate and operate simultaneously with other radios in the host system except following FCC multi-transmitter product procedures. Additional testing and device authorization may be required to operate simultaneously with other radios.

The availability of some specific channels and/or operational frequency bands are country dependent and are firmware programmed at the factory to match the intended destination. The firmware setting is not accessible by the end-user.

The host product manufacturer is responsible for compliance with any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.

The end-user manual shall include all required regulatory information/warnings as shown in this manual, including “This product must be installed and operated with a minimum distance of 20 cm between the radiator and user body”.

This device has got an FCC ID: 2ANDL-ZSC. The end product must be labeled in a visible area with the following: “Contains Transmitter Module FCC ID: 2ANDL-ZSC”.

This device is intended only for OEM integrators under the following conditions:

The antenna must be installed such that 20cm is maintained between the antenna and users, and the transmitter module may not be co-located with any other transmitter or antenna.

As long as the 2 conditions above are met, further transmitter tests will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed.

Declaration of Conformity European Notice

ZSC Module Datasheet

Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module product is in compliance with essential requirements and other relevant provisions of Directive 2014/53/EU, 2011/65/EU. A copy of the Declaration of conformity can be found at https://www.tuya.com.

ZSC Module Datasheet

This product must not be disposed of as normal household waste, in accordance with the EU directive for waste electrical and electronic equipment (WEEE-2012/19/EU). Instead, it should be disposed of by returning it to the point of sale, or to a municipal recycling collection point.

The device could be used with a separation distance of 20cm from the human body.