T3AI-V Module Datasheet

T3AI-V is a voice module developed by Tuya Smart. It consists of a highly integrated radio frequency and voice SoC chip, T3AI, supporting combo Wi-Fi and Bluetooth Low Energy (LE) protocols.

Overview

T3AI-V is a Wi-Fi AI module that supports voice control. It integrates the Tuya AI platform, enables interaction through voice, and connects to major AI platforms via the Tuya AI Agent. It supports large language models such as Doubao, DeepSeek, Qwen, OpenAI, and Gemini. It features button wake-up, wake-word activation, and free talk capabilities, providing users with a vivid and engaging AI voice interaction experience. It is suitable for smart products in voice interaction scenarios.

Features

• Built-in low-power 32-bit CPU that also acts as an application processor.
• Clock rate of 480 MHz.
• Operating voltage range: 2.5V to 3.6V.
• Peripherals: 6×PWM, 1×I2S, 1×SDIO, 2×QSPI, 5×ADC, 2×UART, and 2×SPI.
• Wi-Fi connectivity
  • IEEE 802.11b/g/n/ax.
  • Channels 1 to 14 at 2.4 GHz.
  • Support WEP, WPA/WPA2, WPA/WPA2 PSK (AES), and WPA3 security modes.
  • The maximum output power is +17 dBm for IEEE 802.11b transmission.
  • Support STA, AP, STA + AP combo, and direct working modes.
  • Two pairing modes are supported, namely Bluetooth and access point (AP) mode. Both modes are suitable for pairing with Android and iOS mobile phones.
  • The onboard PCB antenna has a peak gain of 2.56 dBi.
  • Operating temperature range: -40°C to +85°C.
• Bluetooth connectivity
  • Bluetooth Core Specification v5.4.
  • The transmitter power in Bluetooth mode is 6 dBm.
  • Integral Wi-Fi and Bluetooth coexistence interface.
  • The onboard PCB antenna has a peak gain of 2.56 dBi.

Scope of applications

• AI-powered digital entertainment products
• Smart home and electrical appliance
• Smart socket and light

Module interfaces

Dimensions and footprint

The T3AI-V dimensions are 18±0.35 mm (W) × 30.2±0.35 mm (L) × 3.0±0.15 mm (H). The figure below shows the dimensions of the T3AI-V module.

Pinout

Pin No.	Symbol	I/O type	Description
1	GND	P	Ground pin.
2	P21	I/O	GPIO21 ADC I2C0_SDA
3	RST	I	Reset pin.
4	P0	I/O	Logging port, corresponding to Log TX on T3AI.
5	P1	I/O	Logging port, corresponding to Log RX on T3AI.
6	P22	I/O	GPIO22 ADC PWM2 QSPI0_SCK
7	TX0	I/O	Firmware flashing port, corresponding to P11 on T3AI.
8	RX0	I/O	Firmware flashing port, corresponding to P10 on T3AI.
9	P2	I/O	GPIO2 QSPI1_SCK SPI1_SCK
10	P3	I/O	GPIO3 QSPI1_CS SPI1_CSN
11	P4	I/O	GPIO4 QSPI1_IO0 SPI1_MOSI
12	P5	I/O	GPIO5 QSPI1_IO1 SPI1_MISO
13	P6	I/O	GPIO6 QSPI1_IO2
14	P7	I/O	GPIO7 QSPI1_IO3
15	VBAT	P	Power pin.
16	NC	-	NC
17	P20	I/O	GPIO20 I2C0_SCL
18	P26	I/O	GPIO26 QSPI0_IO2
19	GND	P	Analog ground pin.
20	MICN1	AI	Negative input of microphone 1.
21	MICP1	AI	Positive input of microphone 1.
22	MICP2	AI	Positive input of microphone 2.
23	MICN2	AI	Negative input of microphone 2.
24	AUDP	AO	Positive output of audio.
25	AUDN	AO	Negative output of audio.
26	GND	P	Ground pin.
27	P27	I/O	GPIO27 QSPI0_IO3
28	P41	I/O	GPIO41 I2S_SYNC
29	P40	I/O	GPIO40 I2S_SCK
30	P42	I/O	GPIO42 I2S_DIN I2C1_SCL
31	P43	I/O	GPIO43 I2S_DOUT I2C1_SDA
32	MBIAS	AO	Microphone bias voltage.
33	P15	I/O	GPIO15 SPI0_CSN SDIO_CMD
34	P17	I/O	GPIO17 SPI0_MISO SDIO_DATA1
35	P14	I/O	GPIO14 SPI0_SCK SDIO_CLK
36	P16	I/O	GPIO16 SPI0_MOSI SDIO_DATA0
37	P18	I/O	GPIO18 PWM0 SDIO_DATA2
38	P25	I/O	GPIO25 PWM5 IRDA ADC QSPI0_IO1
39	P19	I/O	GPIO19 PWM1 SDIO_DATA3
40	P23	I/O	GPIO23 PWM3 ADC QSPI0_CS
41	P24	I/O	GPIO24 PWM4 ADC QSPI0_IO0
42	GND	P	Ground pin.

Electrical parameters

Absolute electrical parameters

Parameter	Description	Minimum value	Maximum value	Unit
Ts	Storage temperature	-55	125	°C
VBAT	Supply voltage	-0.3	3.9	V
Electrostatic discharge voltage (human body model)	TAMB -25°C	-4	4	kV
Electrostatic discharge voltage (machine model)	TAMB -25°C	-200	200	V

Normal operating conditions

Parameter	Description	Minimum value	Typical value	Maximum value	Unit
Ta	Operating temperature	-40	-	85	°C
VBAT	Supply voltage	2.5	3.3	3.6	V
VOL	I/O low-level output	VSS	-	VSS + 0.3	V
VOH	I/O high-level output	VBAT − 0.3	-	VBAT	V
Imax	I/O drive current	-	6	20	mA

Radio frequency (RF) power

Operating status	Mode	Rate	Transmit/Receive power	Average value	Peak (Typical) value	Unit
Transmit	11 b	11 Mbit/s	+17 dBm	230	310	mA
Transmit	11 g	54 Mbit/s	+15 dBm	210	280	mA
Transmit	11 n	HT20 MCS7	+14 dBm	210	260	mA
Transmit	11 ax	HE20 MCS7	+14 dBm	200	255	mA
Receive	11 b	11 Mbit/s	Continuous reception	37	50	mA
Receive	11 g	54 Mbit/s	Continuous reception	37	50	mA
Receive	11 n	HT20 MCS7	Continuous reception	37	50	mA
Receive	11 ax	HE20 MCS7	Continuous reception	37	50	mA

Operating current

Operating mode	Status (Ta = 25°C)	Average value	Max (Typical) value	Unit
Pairing over Bluetooth	The module is pairing over Bluetooth. The network status indicator blinks slowly.	75	360	mA
Pairing over AP	The module is pairing in AP mode. The network status indicator blinks slowly.	105	370	mA
Connected	The module is connected to the cloud. The network status indicator is steady on.	45	300	mA
Weakly connected	The connection between the module and the access point is intermittent. The network status indicator is steady on.	135	360	mA
Disconnected	The module is disconnected from the cloud. The network status indicator is steady off.	47	320	mA
Module disabled	The module’s clock enable (CEN) pin is pulled down.	330	-	μA

RF parameters

Basic RF features

Parameter	Description
Operating frequency	2.412 to 2.484 GHz
Wi-Fi standard	IEEE 802.11b/g/n/ax (channels 1–14)
Data transmission rate	IEEE 802.11b: 1, 2, 5.5, and 11 Mbit/s IEEE 802.11g: 6, 9, 12, 18, 24, 36, 48, and 54 Mbit/s IEEE 802.11n: HT20 MCS0-7, HT40 MCS0-7 IEEE 802.11ax: HE20 MCS0-7, HE40 MCS0-7
Antenna type	PCB antenna

Wi-Fi transmitter (TX) performance

Parameter	Minimum value	Typical value	Maximum value	Unit
RF average output power, 802.11b CCK mode, 11 Mbit/s	-	17	-	dBm
RF average output power, 802.11g OFDM mode, 54 Mbit/s	-	15	-	dBm
RF average output power, 802.11n OFDM mode, HT20 MCS7	-	14	-	dBm
RF average output power, 802.11n OFDM mode, HT40 MCS7	-	13	-	dBm
RF average output power, 802.11ax OFDMA mode, HE20 MCS7	-	14	-	dBm
RF average output power, 802.11ax OFDMA mode, HE40 MCS7	-	13	-	dBm
Frequency error	-20	-	20	ppm

Wi-Fi receiver (RX) performance

Parameter	Minimum value	Typical value	Maximum value	Unit
PER < 8%, RX sensitivity, 802.11b DSSS mode, 11 Mbit/s	-	-89	-	dBm
PER < 10%, RX sensitivity, 802.11g OFDM mode, 54 Mbit/s	-	-76	-	dBm
PER < 10%, RX sensitivity, 802.11n OFDM mode, MCS7 (HT20)	-	-74	-	dBm
PER < 10%, RX sensitivity, Bluetooth LE, 1 Mbit/s	-	-96	-	dBm

Bluetooth TX performance

Parameter	Minimum value	Typical value	Maximum value	Unit
Operating frequency	2402	-	2480	MHz
Transmission rate over the air	-	1	-	Mbit/s
Transmission power	-20	7	20	dBm
Frequency error	-150	-	150	kHz

Bluetooth RX performance

Parameter	Minimum value	Typical value	Maximum value	Unit
RX sensitivity	-	-96	-	dBm
Max RF signal input	-10	-	-	dBm
Intermodulation	-	-	-23	dBm
Co-channel rejection ratio	-	10	-	dB

Antenna information

Antenna type

The T3AI-V module uses an onboard PCB antenna.

Antenna interference reduction

When a PCB antenna is used on a Wi-Fi module, we recommend that the module antenna is at least 15 mm away from other metal components. This can optimize the Wi-Fi performance.

Make sure that the enclosure surrounding the antenna is not traced or filled with copper. Otherwise, the RF performance might be degraded.

Footprint and production instructions

Mechanical dimensions

Dimensions of the T3AI-V PCB are 18±0.35 mm (W) × 30.2±0.35 mm (L) × 0.8±0.1 mm (H). The figure below shows the dimensions of the T3AI-V module.

The figure below shows the recommended footprint of the T3AI-V module.

Production instructions

• For the modules that can be packaged with the surface-mount technology (SMT) or in in-line form, you can select either of them according to the PCB design solutions of customers. If a PCB is designed to be SMT-packaged, package the module with the SMT. If a PCB is designed to use an in-line package, use wave soldering. Complete soldering within 24 hours after the module is unpacked. Otherwise, we recommend that you place the module in a drying cupboard with a relative humidity level below 10%, or pack the module in vacuum again. Then, record the packing time and duration of exposure. The total exposure time cannot exceed 168 hours.

  • Instruments or devices required for the SMT process:
    • Surface mount system
    • SPI
    • Reflow soldering machine
    • Thermal profiler
    • Automated optical inspection (AOI) equipment
  • Instruments or devices required for the wave soldering process:
    • Wave soldering device
    • Wave soldering fixture
    • Constant-temperature soldering iron
    • Tin bar, tin wire, and flux
    • Thermal profiler
  • Instruments or devices required for the baking process:
    • Cabinet oven
    • Electrostatic discharge (ESD) protection and heat-resistant trays
    • ESD protection and heat-resistant gloves

• A delivered module must meet the following storage requirements:

  • The moisture-proof bag must be placed in an environment where the temperature is below 40°C and the relative humidity is lower than 90%.

  • The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed.

  • A humidity indication card (HIC) is put in the sealed package.

    

• The module needs to be baked in the following cases:

  • The vacuum packaging bag is damaged before unpacking.
  • After unpacking, no HIC is found in the packaging bag.
  • After unpacking, the HIC indicates a humidity level of 10% or higher. In this case, the circle turns pink on the HIC.
  • The total exposure time has lasted for over 168 hours since unpacking.
  • More than 12 months have passed since the first sealing of the bag.

• The baking parameter settings are described below:

  • Baking temperature: 40°C for reel packaging with relative humidity ≤ 5%. And 125°C for tray packaging with relative humidity ≤ 5% (use the heat-resistant tray, rather than plastic containers).
  • Baking time: 168 hours for reel packaging and 12 hours for tray packaging.
  • Temperature for triggering an alert: 50°C for reel packaging and 135°C for tray packaging.
  • Production can begin after a module has cooled down to below 36°C under natural conditions.
  • If a module remains unused for over 168 hours after being baked, it needs to be baked again.
  • If a batch of modules is not baked after exposure for more than 168 hours, do not use reflow soldering or wave soldering to solder them. Because these modules are level-3 moisture-sensitive devices, they are very likely to get damp when exposed beyond the allowable time. In this case, if they are soldered at high temperatures, device failure or poor soldering performance might occur.

• In the whole production process, take electrostatic discharge (ESD) protective measures.

• To guarantee the pass rate, we recommend that you use the SPI and AOI to monitor the quality of solder paste printing and mounting.

Recommended oven temperature curve

Select a proper soldering technique according to the process. For more information, refer to the recommended oven temperature curve of either reflow soldering or wave soldering. The set temperatures might deviate from the actual temperature measurements. All temperatures shown in this module datasheet are obtained through actual measurements.

Technique 1: SMT process (recommended oven temperature curve of reflow soldering)

Set the oven temperatures according to the following curve.

• A: temperature axis

• B: time axis

• C: alloy liquidus temperature from 217°C to 220°C

• D: ramp-up slope from 1°C/s to 3°C/s

• E: keep a constant temperature from 150°C to 200°C for a time period of 60s to 120s

• F: temperature above liquidus temperature for 50s to 70s

• G: peak temperature from 235°C to 245°C

• H: ramp-down slope from 1°C/s to 4°C/s

  The curve above is based on solder paste SAC305. For more information about other solder pastes, see the recommended oven temperature curve in the specified solder paste specifications.

Technique 2: Wave soldering process (oven temperature curve of wave soldering)

Set the oven temperatures according to the following temperature curve of wave soldering. The peak temperature is 260°C±5°C.

Suggestions on wave soldering		Suggestions on manual repair soldering
Preheat temperature	80°C to 130°C	Soldering temperature	360°C ± 20°C
Preheat duration	75s to 100s	Soldering duration	Less than 3s/point
Contact duration at the peak	3s to 5s	N/A	N/A
Solder tank temperature	260°C ± 5°C	N/A	N/A
Ramp-up slope	≤ 2°C/s	N/A	N/A
Ramp-down slope	≤ 6°C/s	N/A	N/A

Storage conditions

MOQ and packaging information

Product model	MOQ (pcs)	Shipping packaging	Modules per reel	Reels per carton
T3AI-V	4,400	Tape and reel	1,100	4

Appendix: Statement

FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this device.

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

List of applicable FCC rules
This module has been granted modular approval as below listed FCC rule parts.

• FCC Rule parts 15C (15.247)

This device generates, uses, and can radiate radio frequency energy and, if not installed and used following the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this device does cause harmful interference to radio or television reception, which can be determined by turning the device off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
• Reorient or relocate the receiving antenna.
• Increase the separation between the device and receiver.
• Connect the device to an outlet on a circuit different from that to which the
receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help.

Radiation Exposure Statement

This device complies with FCC radiation exposure limits set forth for an uncontrolled rolled environment. This device should be installed and operated with a minimum distance of 20cm between the radiator and your body.

Important Note

This radio module must not be installed to co-locate and operate simultaneously with other radios in the host system except by following FCC multi-transmitter product procedures. Additional testing and device authorization may be required to operate simultaneously with other radios.

The availability of some specific channels and/or operational frequency bands are country dependent and are firmware programmed at the factory to match the intended destination. The firmware setting is not accessible to the end-user.

The host product manufacturer is responsible for compliance with any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed. The separate approval is required for all other operating configurations including portable configurations with respect to Part 2.1093 and different antenna configurations.

The end-user manual shall include all required regulatory information/warnings as shown in this manual, including “This product must be installed and operated with a minimum distance of 20 cm between the radiator and user body”. The OEM integrator is responsible for ensuring that the end-user has no manual instructions to remove or install the module.

This device has got an FCC ID: 2ANDL-T3AIV. The end product must be labeled in a visible area with the following: “Contains Transmitter Module FCC ID: 2ANDL-T3AIV”.

This device is intended only for OEM integrators under the following conditions:

The antenna must be installed such that 20cm is maintained between the antenna and users, and the transmitter module may not be co-located with any other transmitter or antenna.

As long as the 2 conditions above are met, further transmitter tests will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed.

Declaration of Conformity European Notice

Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module product is in compliance with essential requirements and other relevant provisions of Directive 2014/53/EU,2011/65/EU. A copy of the Declaration of Conformity can be found at https://www.tuya.com.

This product must not be disposed of as normal household waste, in accordance with the EU directive for waste electrical and electronic equipment (WEEE-2012/19/EU). Instead, it should be disposed of by returning it to the point of sale, or to a municipal recycling collection point.

The device could be used with a separation distance of 20cm from the human body.