T7-U-IPEX Module Datasheet

T7-U-IPEX module is a Wi-Fi and Bluetooth Low Energy (LE) combo dual-band Wi-Fi 6 module developed by Tuya Smart. It consists of a highly integrated RF chip T7 and a few peripheral components, with built-in Wi-Fi and Bluetooth network protocol stacks and various library functions.

Overview

The module is built around a low-power Armv8-MC1 MCU with 512 KB SRAM, built-in 4 MB flash memory, and various peripheral resources.

T7-U-IPEX is a real-time operating system (RTOS), integrated with all Wi-Fi MAC and TCP/IP libraries. All these resources can help you develop your own embedded Wi-Fi products.

Features

• Built-in low-power Armv8-MC1 CPU that also acts as an application processor.
• Clock rate of up to 240 MHz.
• Operating voltage: 3.3V.
• Peripherals: 14 general-purpose input/output (GPIO) pins, 1 universal asynchronous receiver/transmitter (UART), and 1 analog-to-digital converter (ADC) pin.
• Wi-Fi connectivity
  • IEEE 802.11a/b/g/n/ac/ax 1x1, 2.4 GHz and 5 GHz.
  • Channels 1 to 14 at 2.4 GHz, and 36-177 at 5 GHz.
  • Support security protocols, including WPA2, WPA2 PSK (AES), and WPA3.
  • The maximum output power is +18 dBm for IEEE 802.11b and +16 dBm for 802.11a transmission.
  • Support STA, AP, and STA + AP combo working modes. Except for UNII-2A/2C.
  • Two pairing modes are supported, namely Bluetooth and AP mode. Both modes are suitable for pairing with Android and iOS mobile phones.
  • External FPC-IPEX 2.4 GHz & 5GHz dual-band antenna.
  • Operating temperature range: -40°C to 105°C.
• Bluetooth connectivity
  • Support Bluetooth 5.4.
  • Up to +6.5 dBm output power.
  • Operating temperature range: -40°C to 105°C.

Scope of applications

• Smart building
• Smart home and electrical appliance
• Smart socket and light
• Industrial wireless control
• Baby monitor
• IP camera
• Smart bus

Module interfaces

Dimensions and footprint

T7-U-IPEX has three rows of pins. The pin spacing is 1.4 mm on both sides and 1.8 mm at the bottom.

The T7-U-IPEX dimensions are 15.8±0.35 mm (W) × 20.3±0.35 mm (L) × 2.6±0.15 mm (H).

The figure below shows the dimensions of the T7-U-IPEX module.

Pinout

Pin	Symbol	I/O type	Features
1	P18	I/O	GPIO_18. A GPIO that can be reused as SPI_SCK, corresponding to Pin 40 on the IC.
2	P19	I/O	GPIO_19. A GPIO that can be reused as SPI_MOSI, corresponding to Pin 1 on the IC.
3	RX2	I/O	GPIO_20. A GPIO that can be reused as the UART2_RXD for serial communication, corresponding to Pin 2 on the IC.
4	TX2	I/O	GPIO_21. A GPIO that can be reused as the UART2_TXD for serial communication, corresponding to Pin 3 on the IC.
5	ADC	I/O	GPIO_7, with ADC feature and 0-3.3V input voltage range, corresponding to Pin 16 on the IC.
6	RX1	I/O	GPIO_0, which can be reused as the UART1_Log_RXD pin to receive logs. It can be configured as a normal GPIO, corresponding to Pin 21 on the IC.
7	TX1	I/O	GPIO_1, which can be reused as the UART1_Log_TXD pin to send logs. After pulling it low, it will enter ATE mode when powered on. It can be configured as a normal GPIO, corresponding to Pin 20 on the IC.
8	P14	I/O	GPIO_14, which supports hardware PWM, corresponding to Pin 36 on the IC.
9	P6	I/O	GPIO_6, which supports hardware PWM, corresponding to Pin 17 on the IC.
10	P5	I/O	GPIO_5, which supports hardware PWM, corresponding to Pin 18 on the IC.
11	P4	I/O	GPIO_4, which supports hardware PWM, corresponding to Pin 19 on the IC.
12	P12	I/O	GPIO_12, which supports hardware PWM, corresponding to Pin 26 on the IC.
13	GND	P	Ground pin.
14	3V3	P	Power supply pin (3.3 V).
15	TX0	I/O	GPIO_11, which can be reused as the UART0_TXD pin for serial communication and firmware flashing, corresponding to Pin 25 on the IC.
16	RX0	I/O	GPIO_10, which can be reused as the UART0_RXD pin for serial communication and firmware flashing, corresponding to Pin 24 on the IC.
17	P22	I/O	GPIO_22, a GPIO pin, corresponding to Pin 28 on the IC.
18	CEN	I/O	The enable pin that is active low. The module has pulled up the high level, and users can control this pin externally.
19	P15	I/O	GPIO_15, a GPIO pin, corresponding to Pin 37 on the IC.
20	P16	I/O	GPIO_16. A GPIO that can be reused as SPI_MISO, corresponding to Pin 38 on the IC.
21	P17	I/O	GPIO_17. A GPIO that can be reused as SPI_CS, corresponding to Pin 39 on the IC.

Electrical parameters

Absolute electrical parameters

Parameter	Description	Minimum value	Maximum value	Unit
Ts	Storage temperature	-40	125	°C
VBAT	Supply voltage	2.2	3.6	V
Electrostatic discharge voltage (human body model)	TAMB -25°C	-	2	kV
Electrostatic discharge voltage (machine model)	TAMB -25°C	-	0.5	kV

Normal operating conditions

Parameter	Description	Minimum value	Typical value	Maximum value	Unit
Ta	Operating temperature	-40	-	105	°C
VBAT	Supply voltage	2.2	3.3	3.6	V
VIL	I/O low-level input	-0.3	-	0.3 VIO	V
VIH	I/O high-level input	0.7 VIO	-	VIO + 0.3	V
VOL	I/O low-level output	-	-	0.1 VIO	V
VOH	I/O high-level output	0.8 VIO	-	-	V
Imax	I/O drive current	-	-	12	mA

Power consumption during continuous transmission and reception

2.4 GHz transmission and reception

Operating status	Mode	Rate	Transmit/Receive power	Typical value	Unit
Transmit	802.11b	1 Mbit/s	+18 dBm	250	mA
Transmit	802.11b	11 Mbit/s	+18 dBm	258	mA
Transmit	802.11g	6 Mbit/s	+17 dBm	253	mA
Transmit	802.11g	54 Mbit/s	+16 dBm	230	mA
Transmit	802.11n-HT20	MCS0	+16 dBm	250	mA
Transmit	802.11n-HT20	MCS7	+15 dBm	215	mA
Transmit	802.11n-HT40	MCS0	+13 dBm	257	mA
Transmit	802.11n-HT40	MCS7	+12 dBm	230	mA
Transmit	802.11ax-HE20	MCS0	+13 dBm	245	mA
Transmit	802.11ax-HE20	MCS7	+12 dBm	220	mA
Receive	802.11b	1 Mbit/s	Continuous reception	41	mA
Receive	802.11b	11 Mbit/s	Continuous reception	41	mA
Receive	802.11g	6 Mbit/s	Continuous reception	41	mA
Receive	802.11g	54 Mbit/s	Continuous reception	41	mA
Receive	802.11n-HT20	MCS0	Continuous reception	41	mA
Receive	802.11n-HT20	MCS7	Continuous reception	41	mA
Receive	802.11n-HT40	MCS0	Continuous reception	44	mA
Receive	802.11n-HT40	MCS7	Continuous reception	44	mA
Receive	802.11ax-HE20	MCS0	Continuous reception	41	mA
Receive	802.11ax-HE20	MCS7	Continuous reception	41	mA

5 GHz transmission and reception

Operating status	Mode	Rate	Transmit/Receive power	Typical value	Unit
Transmit	802.11a	6 Mbit/s	+16 dBm	340	mA
Transmit	802.11a	54 Mbit/s	+15 dBm	308	mA
Transmit	802.11n-HT20	MCS0	+15 dBm	345	mA
Transmit	802.11n-HT20	MCS7	+14 dBm	297	mA
Transmit	802.11n-HT40	MCS0	+13 dBm	342	mA
Transmit	802.11n-HT40	MCS7	+12 dBm	294	mA
Transmit	802.11ac-VHT20	MCS0	+13 dBm	345	mA
Transmit	802.11ac-VHT20	MCS7	+12 dBm	297	mA
Transmit	802.11ax-HE20	MCS0	+13 dBm	345	mA
Transmit	802.11ax-HE20	MCS7	+12 dBm	297	mA
Receive	802.11a	6 Mbit/s	Continuous reception	45	mA
Receive	802.11a	54 Mbit/s	Continuous reception	45	mA
Receive	802.11n-HT20	MCS0	Continuous reception	45	mA
Receive	802.11n-HT20	MCS7	Continuous reception	45	mA
Receive	802.11n-HT40	MCS0	Continuous reception	47	mA
Receive	802.11n-HT40	MCS7	Continuous reception	47	mA
Receive	802.11ac-VHT20	MCS0	Continuous reception	45	mA
Receive	802.11ac-VHT20	MCS7	Continuous reception	45	mA
Receive	802.11ax-HE20	MCS0	Continuous reception	45	mA
Receive	802.11ax-HE20	MCS7	Continuous reception	45	mA

Operating current

Operating mode	Status (Ta = 25°C)	Average value	Max (Typical) value	Unit
Pairing over AP	The module is in Wi-Fi Easy Connect (EZ) mode. The Wi-Fi network status indicator blinks slowly.	48.7	486	mA
Pairing over Bluetooth	The module is pairing over Bluetooth. The network status indicator blinks quickly.	45.2	480	mA
Connected and idle mode	The module is connected to the cloud. The network status indicator is steady on.	41.7	472	mA
Connected and operating mode	The module is connected to the cloud. The network status indicator is steady on.	42.8	460	mA
Weakly connected mode	The module is operating in a weak wireless signal network. The network status indicator is steady off.	49.5	468	mA
Disconnected mode	The module is disconnected from the cloud. The network status indicator is steady off.	45.6	478	mA
Router powered off	The module is in a state where the router is powered off and disconnected from the internet. The network status indicator is steady off.	45.4	459	mA

RF parameters

Basic RF features

Parameter	Description
Operating frequency	2.412 to 2.484 GHz (Ch1-11 for US/CA and Ch1-13 for EU/CN), 5.180 to 5.825 GHz
Wi-Fi standard	IEEE 802.11 a/b/g/n/ac/ax (Ch1-11 for US/CA, Ch1-13 for EU/CN, Channels 36-177)
Bluetooth standard	Bluetooth LE 5.4
Data transmission rate	IEEE 802.11b: 1, 2, 5.5, and 11 Mbit/s IEEE 802.11a/g: 6, 9, 12, 18, 24, 36, 48, and 54 Mbit/s IEEE 802.11n: HT20 MCS0-7 and HT40 MCS0-7 IEEE 802.11ac: VHT20 MCS0-7 IEEE 802.11ax: HE20 MCS0-7 Bluetooth 5.4: 1 Mbit/s/2 Mbit/s
Antenna type	External FPC-IPEX dual-band antenna.

Transmitter (TX) performance

2.4 GHz continuous transmission performance

Parameter	Minimum value	Typical value	Maximum value	Unit
RF average output power, 802.11b CCK mode, 1 Mbit/s	-	18	-	dBm
RF average output power, 802.11b CCK mode, 11 Mbit/s	-	18	-	dBm
RF average output power, 802.11g OFDM mode, 6 Mbit/s	-	17	-	dBm
RF average output power, 802.11g OFDM mode, 54 Mbit/s	-	16	-	dBm
RF average output power, 802.11n HT20 mode, MCS0	-	16	-	dBm
RF average output power, 802.11n HT20 mode, MCS7	-	15	-	dBm
RF average output power, 802.11n HT40 mode, MCS0	-	13	-	dBm
RF average output power, 802.11n HT40 mode, MCS7	-	12	-	dBm
RF average output power, 802.11ax HE20 mode, MCS0	-	13	-	dBm
RF average output power, 802.11ax HE20 mode, MCS7	-	12	-	dBm
RF average output power, Bluetooth LE 5.4, 1 Mbit/s and 2 Mbit/s	-	6.5	-	dBm
Frequency error	-10	-	10	ppm

5 GHz continuous transmission performance

Parameter	Minimum value	Typical value	Maximum value	Unit
RF average output power, 5G-802.11a mode, 6 Mbit/s	-	16	-	dBm
RF average output power, 5G-802.11a mode, 54 Mbit/s	-	15	-	dBm
RF average output power, 5G-802.11n HT20 mode, MCS0	-	15	-	dBm
RF average output power, 5G-802.11n HT20 mode, MCS7	-	14	-	dBm
RF average output power, 5G-802.11n HT40 mode, MCS0	-	13	-	dBm
RF average output power, 5G-802.11n HT40 mode, MCS7	-	12	-	dBm
RF average output power, 5G-802.11ac VHT20 mode, MCS0	-	13	-	dBm
RF average output power, 5G-802.11ac VHT20 mode, MCS7	-	12	-	dBm
RF average output power, 5G-802.11ax HE20 mode, MCS0	-	13	-	dBm
RF average output power, 5G-802.11ax HE20 mode, MCS7	-	12	-	dBm
Frequency error	-10	-	10	ppm

Receiver (RX) performance

RX sensitivity

Parameter	Minimum value	Typical value	Maximum value	Unit
PER < 8%, RX sensitivity, 802.11b CCK mode, 1 Mbit/s	-	-98	-	dBm
PER < 8%, RX sensitivity, 802.11b CCK mode, 11 Mbit/s	-	-89	-	dBm
PER < 10%, RX sensitivity, 802.11g OFDM mode, 6 Mbit/s	-	-92	-	dBm
PER < 10%, RX sensitivity, 802.11g OFDM mode, 54 Mbit/s	-	-76	-	dBm
PER < 10%, RX sensitivity, 802.11n mode, HT20-MCS0	-	-92	-	dBm
PER < 10%, RX sensitivity, 802.11n mode, HT20-MCS7	-	-75	-	dBm
PER < 10%, RX sensitivity, 802.11n mode, HT40-MCS0	-	-88	-	dBm
PER < 10%, RX sensitivity, 802.11n mode, HT40-MCS7	-	-72	-	dBm
PER < 10%, RX sensitivity, 802.11ax mode, HE20-MCS0	-	-92	-	dBm
PER < 10%, RX sensitivity, 802.11ax mode, HE20-MCS7	-	-73	-	dBm
PER < 10%, RX sensitivity, 5G-802.11a OFDM mode, 6 Mbit/s	-	-92	-	dBm
PER < 10%, RX sensitivity, 5G-802.11a OFDM mode, 54 Mbit/s	-	-76	-	dBm
PER < 10%, RX sensitivity, 5G-802.11n mode, HT20-MCS0	-	-92	-	dBm
PER < 10%, RX sensitivity, 5G-802.11n mode, HT20-MCS7	-	-74	-	dBm
PER < 10%, RX sensitivity, 5G-802.11n mode, HT40-MCS0	-	-87	-	dBm
PER < 10%, RX sensitivity, 5G-802.11n mode, HT40-MCS7	-	-72	-	dBm
PER < 10%, RX sensitivity, 5G-802.11ac mode, VHT20-MCS0	-	-91	-	dBm
PER < 10%, RX sensitivity, 5G-802.11ac mode, VHT20-MCS7	-	-72	-	dBm
PER < 10%, RX sensitivity, 5G-802.11ax mode, HE20-MCS0	-	-91	-	dBm
PER < 10%, RX sensitivity, 5G-802.11ax mode, HE20-MCS7	-	-71	-	dBm
PER < 30.8%, RX sensitivity, Bluetooth LE 5.4, 1 Mbit/s	-	-93	-	dBm
PER < 30.8%, RX sensitivity, Bluetooth LE 5.4, 2 Mbit/s	-	-90	-	dBm

Antenna information

Antenna type

T7-U-IPEX uses a first-generation IPEX antenna mount with the following structural dimensions:

Antenna interference reduction

The distance between the antenna and other mental components should be at least 15 mm to provide the best Wi-Fi performance.

Footprint and production instructions

Mechanical dimensions

The T7-U-IPEX module’s PCB dimensions are 15.8±0.35 mm (W) × 20.3±0.35 mm (L) × 1.0±0.1 mm (H).

The figure below shows the mechanical dimensions of T7-U-IPEX.

Recommended PCB footprint

Pin configuration of the T7-U-IPEX module:

PCB footprint of the T7-U-IPEX module:

Production instructions

• For the modules that can be packaged with the surface-mount technology (SMT) or in in-line form, you can select either of them according to your PCB design solutions. If a PCB is designed to be SMT-packaged, package the module with the SMT. If a PCB is designed to use an in-line package, use wave soldering. Complete soldering within 24 hours after the module is unpacked. Otherwise, we recommend that you place the module in a drying cupboard with a relative humidity level below 10%, or pack the module in vacuum again. Then, record the packing time and duration of exposure. The total exposure time cannot exceed 168 hours.

  • Instruments or devices required for the SMT process:
    • Surface mount system
    • SPI
    • Reflow soldering machine
    • Thermal profiler
    • Automated optical inspection (AOI) device
  • Instruments or devices required for the wave soldering process:
    • Wave soldering device
    • Wave soldering fixture
    • Constant-temperature soldering iron
    • Tin bar, tin wire, and flux
    • Thermal profiler
  • Instruments or devices required for the baking process:
    • Cabinet oven
    • Electrostatic discharge (ESD) protection and heat-resistant trays
    • ESD protection and heat-resistant gloves

• A delivered module must meet the following storage requirements:

  • The moisture-proof bag must be placed in an environment where the temperature is below 40°C and the relative humidity is lower than 90%.

  • The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed.

  • A humidity indication card (HIC) is put in the sealed package.

    

• The module needs to be baked in the following cases:

  • The vacuum packaging bag is damaged before unpacking.
  • After unpacking, no HIC is found in the packaging bag.
  • After unpacking, the HIC indicates a humidity level of 10% or higher. In this case, the circle turns pink on the HIC.
  • The total exposure time has lasted for over 168 hours since unpacking.
  • More than 12 months have passed since the first sealing of the bag.

• The baking parameter settings are described below:

  • Baking temperature: 40°C for reel packaging with relative humidity ≤ 5%. And 125°C for tray packaging with relative humidity ≤ 5% (use a heat-resistant tray, rather than a plastic container).
  • Baking time: 168 hours for reel packaging and 12 hours for tray packaging.
  • Temperature for triggering an alert: 50°C for reel packaging and 135°C for tray packaging.
  • Production can begin after a module has cooled down to below 36°C under natural conditions.
  • If a module remains unused for over 168 hours after being baked, it needs to be baked again.
  • If a batch of modules is not baked after exposure for more than 168 hours, do not use wave soldering to solder them. Because these modules are level-3 moisture-sensitive devices, they are very likely to get damp when exposed beyond the allowable time. In this case, if they are soldered at high temperatures, device failure or poor soldering performance might occur.

• In the whole production process, take electrostatic discharge (ESD) protective measures.

• To guarantee the pass rate, we recommend that you use the SPI and AOI to monitor the quality of solder paste printing and mounting.

Recommended oven temperature curve

Select a proper soldering technique according to the process. For more information, refer to the recommended oven temperature curve of either reflow soldering or wave soldering. The set temperatures might deviate from the actual temperature measurements. All temperatures shown in this module datasheet are obtained through actual measurements.

Technique 1: SMT process (recommended oven temperature curve of reflow soldering)

Set the oven temperatures according to the following curve.

• A: temperature axis
• B: time axis
• C: alloy liquidus temperature from 217°C to 220°C
• D: ramp-up slope from 1°C/s to 3°C/s
• E: keep a constant temperature from 150°C to 200°C for a time period of 60s to 120s
• F: temperature above liquidus temperature for 50s to 70s
• G: peak temperature from 235°C to 245°C
• H: ramp-down slope from 1°C/s to 4°C/s

Technique 2: Wave soldering process (oven temperature curve of wave soldering)

Set the oven temperatures according to the following temperature curve of wave soldering. The peak temperature is 260°C±5°C.

Suggestions on wave soldering		Suggestions on manual repair soldering
Preheat temperature	80°C to 130°C	Soldering temperature	360°C ± 20°C
Preheat duration	75s to 100s	Soldering duration	Less than 3s/point
Contact duration at the peak	3s to 5s	N/A	N/A
Solder tank temperature	260°C ± 5°C	N/A	N/A
Ramp-up slope	≤ 2°C/s	N/A	N/A
Ramp-down slope	≤ 6°C/s	N/A	N/A

Storage conditions

MOQ and packaging information

Product model	MOQ (pcs)	Shipping packaging	Modules per reel	Reels per carton
T7-U-IPEX	4,400	Tape and reel	1,100	4

Appendix: Statement

FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this device. The module is limited to installation in mobile or fixed applications.

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

Note: This device has been tested and found to comply with the limits for a Class B digital device, according to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This device generates, uses, and can radiate radio frequency energy and, if not installed and used following the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation.

If this device does cause harmful interference to radio or television reception, which can be determined by turning the device off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

• Reorient or relocate the receiving antenna.
• Increase the separation between the device and receiver.
• Connect the device to an outlet on a circuit different from that to which the receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help.

Radiation Exposure Statement

This device complies with FCC radiation exposure limits set forth for an uncontrolled rolled environment. This device should be installed and operated with a minimum distance of 20cm between the radiator and your body.

Important Note

This radio module must not be installed to co-locate and operate simultaneously with other radios in the host system except following FCC multi-transmitter product procedures. Additional testing and device authorization may be required to operate simultaneously with other radios.

The availability of some specific channels and/or operational frequency bands are country dependent and are firmware programmed at the factory to match the intended destination. The firmware setting is not accessible by the end-user.

The host product manufacturer is responsible for compliance with any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.The separate approval is required for all other operating configurations including portable configurations with respect to Part 2.1093 and different antenna configuration.

The end-user manual shall include all required regulatory information/warnings as shown in this manual, including “This product must be installed and operated with a minimum distance of 20 cm between the radiator and user body”. The OEM integrator is responsible for ensuring that the end-user has no manual instructions to remove or install module.

The RF module is considered as a limited modular transmitter according to FCC rules. Even though the RF module gets an FCC ID, the host product manufacturer can not use the FCC ID on the final product directly. In these circumstances, the host product manufacturer integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining the FCC authorization by a Class II permissive change application or a new application.

Declaration of Conformity European Notice

Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module product is in compliance with essential requirements and other relevant provisions of Directive 2014/53/EU,2011/65/EU. A copy of the Declaration of conformity can be found at https://www.tuya.com.

This product must not be disposed of as normal household waste, in accordance with the EU directive for waste electrical and electronic equipment (WEEE-2012/19/EU). Instead, it should be disposed of by returning it to the point of sale, or to a municipal recycling collection point.

The device could be used with a separation distance of 20cm to the human body.